JPH11340729A - Antenna device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small-sized and thin antenna device of a low cost and having an electrically high gain by integrating the antenna and a power feeding circuit. SOLUTION: Elements 6 and 13 constituting the antenna and the power feeding circuit composed of power feeding lines 7 and 14 are printed on a sheet of film substrates 2 and 4, a through-hole for shielding is arranged around the power feeding circuit, and by using conductive adhesive materials 1a and 5a, the substrates 2 and 4 are integrated by being clamped with ground conductors 1, 3 and 5 is which conductive layers (1f, 1g, 3f, 3g and 5f and 5g) are adhered by plating to the entire surface of a resin molded part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna device mounted on, for example, satellite communication equipment.

[0002]

2. Description of the Related Art FIG.
This is a waveguide slot array antenna configured based on a conventional resin molded product disclosed in Japanese Patent Application Laid-Open Publication No. 2 (1994) -208. In the figure, 41 is a rectangular waveguide, 42 is a slot, 43 is a resin,
Reference numeral 44 denotes a metal layer, and an antenna is formed by arranging a large number of such layers. When operated as an antenna, a power supply circuit (not shown) is externally connected to the antenna to supply power from outside. This type of rectangular waveguide 41 has a main structure of a synthetic resin 43 and a metal layer 44 electrolessly plated on the surface thereof, so that the slot 42 can be processed by, for example, etching, and has the same quality. Has many advantages.

[0003]

However, in the prior art, as shown in FIG. 4, only the antenna is constituted by a resin molded product, so that it is necessary to add a feeder circuit to the antenna. There are problems that the handling is complicated, the cost is high, and the antenna device cannot be reduced in size and thickness. Conventionally, in Japanese Patent Application Laid-Open No. 4-284004, an antenna element and a feed line are integrally combined, but the antenna element and the feed line are individually stacked on separate dielectrics. Because they are integrated, many dielectrics are required and the overall thickness increases.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to obtain an antenna device which can be manufactured at a low cost, can be reduced in size and thickness, and has a high electrical gain. And

[0005]

According to the present invention, an antenna element and a feeder circuit connected to the antenna element are provided between a plurality of plate-like ground conductors while maintaining insulation from the ground conductor. Incorporated.

According to the invention of claim 2, each ground conductor is
The whole surface or the whole is provided with conductivity and shielded.

According to the third aspect of the present invention, each ground conductor is
A conductive layer was formed on the entire surface of the resin molded article by plating or by applying a conductive paint.

According to the invention of claim 4, each ground conductor is
The whole was made of a conductive resin molded product, a metal injection molded product or a die cast molded product, and was given conductivity.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 1 and 2, reference numeral 1 denotes a rectangular plate-shaped ground conductor, on which a film substrate 2, a ground conductor 3, a film substrate 4, and a ground conductor 5 of the same shape are successively bonded. Agents 1a, 3
a, 3b and 5a are interposed and integrated. Each of the above ground conductors 1, 3, and 5 is a conductive layer (metal layer) formed by performing electroless plating on all front, rear, left, right, and upper and lower peripheral surfaces of a plate made of a synthetic resin molded product.
1f, 3f, 3g, 5f, 5g are attached and shielded. On the surface of the film substrate 2, four rectangular island-shaped antenna elements (patches) 6 for a patch antenna are arranged back and forth, right and left, and each of the antenna elements 6 is a feed circuit composed of a lead-shaped feed line 7. It is connected to the.
In this case, the antenna element 6 and the feed line 7 are printed integrally on the surface of the film substrate 2, and the conductive adhesive is provided around these via a separating portion 8 for providing insulation. The agent 3a is applied on one side. A through-hole 10 is formed along the periphery of the antenna element 6 and the feed line 7 in the conductive adhesive 3a, and the conductive adhesive 3a on both sides and the back side thereof are formed by plating or the like through the through-hole 10 (not shown). A conductive layer (metal layer) 1 composed of a plating layer on the surface of the ground conductors 1 and 3 via the conductive adhesive 1a
f and 3f are conducted.

A concave portion 11 corresponding to the antenna element 6 and a groove 12 corresponding to the feed line 7 are formed on the surface of the ground conductor 1, and the concave portion 11 and the groove 12 can accommodate the separated portion 8. It has a shape. The back surface of the ground conductor 1 is a flat surface. A concave portion corresponding to the antenna element 6 and a groove corresponding to the feed line 7 are also formed on the back surface of the ground conductor 3, and the back surface of the ground conductor 3 has the same shape as the surface of the ground conductor 1.

On the surface of the film substrate 4, an antenna element (patch) 13 for a patch antenna arranged in the same shape and at the same position as the antenna element 6 is provided. A power supply line 14 connected with a circuit configuration different from that of the power supply circuit is attached, and the antenna element 13 and the power supply line 14 are also formed integrally by printing. Separation part 1
The conductive adhesive 5a is adhered to one surface through the surface 5. The antenna element 1 in the conductive adhesive 5a
3. A through hole 17 is formed along the periphery of the power supply line 14, and the conductive adhesive 5a and the conductive adhesive 3 on the lower surface are formed by plating or the like (not shown) through the through hole 17.
The conductive layers 3g and 5f on both sides are made conductive through b.

A concave portion 18 corresponding to the antenna element 13 and a groove 19 corresponding to the feed line 14 are formed on the surface of the ground conductor 3. The concave portion 18 and the groove 19 accommodate the separating portion 15. Shape.

A concave portion 18 corresponding to the antenna element 13 and a groove 19 corresponding to the feed line are also formed on the back surface of the ground conductor 5, and the back surface of the ground conductor 5 has a symmetric shape with the surface of the ground conductor 3. Has become. The surface of the ground conductor 5 has a slot 2 corresponding to the antenna element 13.
0 is formed. A slot 21 is formed on the bottom surface of each concave portion 18 of the ground conductor 3 and functions as a transmitting unit of a radio wave of an antenna.

In such a configuration, the antenna element 13 constituting the patch antenna in the upper printed circuit board 4
Is fed directly through the feed line 14, and a radio wave is radiated from the antenna element 13 through the slot 20. The antenna element 6 constituting the lower patch antenna is fed and radiated by being electromagnetically coupled to the upper antenna element 13 via the slot 21. Therefore, the feeder circuit composed of the feeder line 7 of the lower patch antenna is an antenna element (patch) based on the electromagnetic coupling.
6 is configured as a circuit that emits radio waves. According to such a configuration, a large amount of gain can be obtained because the amount of radio waves from flowing between the feed lines 7 and 14 is reduced. Also, between the ground conductor 1 and the ground conductor 3,
The antenna elements 6, 13 are provided between the ground conductor 3 and the ground conductor 5.
Since the power supply circuit including the power supply lines 7 and 14 is incorporated, it is not necessary to separately provide a power supply circuit, and the circuit can be reduced in size and thickness, and the cost can be reduced.

Embodiment 2 In the first embodiment, the antenna element (patch) constituting the patch antenna
And a power supply circuit are formed on one film substrate 2, 4, and the film substrate 2, 4 is connected between the ground conductor 1 and the ground conductor 3, and between the ground conductor 3 and the ground conductor 5 by a conductive adhesive. 1
a, 3a, 3b, and 5a, the present invention has been described as being integrated. However, as shown in FIG. 3, the antenna elements (patches) 6, 13 and the feed lines 7, 14 shown in FIGS.
Substrate 2 made of synthetic resin molded product in advance corresponding to
A support portion comprising concave portions 24, 26 and grooves 25, 27 is provided on the bases 2, 23, and this portion is filled with dielectrics 28, 29, so that the surfaces of the dielectrics 28, 29 correspond to the surfaces of the substrates 22, 23. The antenna elements (patches) 6 and 13 and the feed lines 7 and 14 are directly provided on the dielectrics 28 and 29.
And a concave portion 30 on the lower surface of the substrate 23, a dielectric 31 buried in a groove (not shown), and a concave portion 3 on the lower surface of the substrate 32.
3 and a dielectric 34 embedded in a bearing comprising a groove (not shown)
May be configured to cover from above. In this case,
Conductive layers (metal layers) 35, 36, 37, and 38 formed by electroless plating are applied and shielded over the entire surface of the substrates 22, 23, and 32. A slot 39 is formed in a portion corresponding to. Even in such a configuration, as in the first embodiment, by feeding power to the antenna element 13, radio waves can be radiated from the upper patch antenna, and radio waves can be radiated by electromagnetic coupling by the patch antenna including the lower antenna element 6. Radiation is enabled.

Embodiment 3 In the first embodiment, the resin molded product is subjected to the electroless plating treatment,
Although the description has been made on the assumption that the layers 3 and 5 are formed, the same effect can be obtained by forming a conductive layer by depositing aluminum on the surface of the resin molded product.

Embodiment 4 Further, in the first embodiment, the resin molded product is subjected to the electroless plating treatment,
Although description has been made on the assumption that the third and fifth layers are formed, similar effects can be obtained by using a conductive resin molded article while omitting the plating process.

Embodiment 5 In the first embodiment, the grounding conductors 1, 3, and 5 are formed by performing electroless plating on the resin molded product. However, the use of a metal injection molded product eliminates the plating process. While having the same effect.

Embodiment 6 FIG. In the first embodiment, the grounding conductors 1, 3, and 5 are formed by performing electroless plating on a resin molded product. However, the same applies to the case where a conductive paint is applied to the resin molded product. It works.

Embodiment 7 In the first embodiment, the grounding conductors 1, 3, and 5 are formed by performing electroless plating on the resin molded product. However, the plating process is omitted by using a die-cast molded product. While having the same effect.

[0021]

According to the first aspect of the present invention, an antenna element and a feed circuit connected to the antenna element are incorporated between a plurality of plate-like ground conductors while maintaining insulation from the ground conductor. It is small and thin, and at a low cost, a high gain can be obtained.

According to the invention of claim 2, each ground conductor is
Since the entire surface or the entire surface is provided with conductivity and shielded, there is no need to separately integrate a shielding member, so that the number of assembling steps can be reduced and the cost can be reduced.

According to the third aspect of the present invention, each ground conductor
Since the conductive layer is provided on the entire surface of the resin molded product by plating or applying a conductive paint, the conductive layer of the shield can be easily formed.

According to the fourth aspect of the present invention, each ground conductor
Since the entire structure is made of a conductive resin molded product, a metal injection molded product, or a die cast molded product and is provided with conductivity, a process for forming a conductive layer becomes unnecessary, and the number of assembling steps can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a laminated structure of an antenna device according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a laminated structure of the antenna device according to the first embodiment of the present invention.

FIG. 3 is a sectional view of a laminated structure of an antenna device according to a second embodiment of the present invention.

FIG. 4 is a perspective view showing a conventional antenna.

[Explanation of symbols]

1,3,5 Ground conductor, 2,4 Film substrate, 6,1
3 antenna element (patch), 7, 14 feed line, 1
a, 3a, 3b, 5a Adhesive, 1f, 1g, 3f, 3
g, 5f, 5g Conductive layer.

Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01Q 21/06 H01Q 21/06 (72) Inventor Toshio Tanaka 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation

Claims (4)

[Claims] An antenna device comprising a plurality of plate-like ground conductors, wherein an antenna element and a feed circuit connected to the antenna element are incorporated while maintaining insulation from the ground conductor. 2. The antenna device according to claim 1, wherein each of the ground conductors is formed of a shielded molded product having conductivity imparted to the entire surface or the whole. 3. The antenna device according to claim 2, wherein each ground conductor is provided with a conductive layer over the entire surface of the resin molded product by plating or applying a conductive paint. . 4. The antenna device according to claim 2, wherein each of the grounding conductors is formed of a conductive resin molded product, a metal injection molded product, or a die cast molded product, and is provided with conductivity as a whole. .