JPH11340187A - Device and method for cleaning and drying - Google Patents

Abstract

PROBLEM TO BE SOLVED: To uniformly achieve steam dry within much shorter time while using an organic medium or the like. SOLUTION: Just after an object to be cleaned such as a semiconductor substrate 13 is cleaned inside a cleaning and drying chamber 12, medium steam for dry such as isopropyl alcohol is sprayed to the rotating semiconductor substrate 13. Thus, liquid in the form of drop of water on the object to be cleaned is removed from the object to be cleaned and speedy drying is realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a washing and drying apparatus and a washing and drying method, as well as a steam drying apparatus and a steam drying method.

[0002]

2. Description of the Related Art In recent years, a spin dryer for drying moisture on the surface of a semiconductor wafer using centrifugal force has been replaced by a steam dryer for static drying using an organic solvent. Hereinafter, a conventional example of the steam drying apparatus (described in JP-A-6-97149) will be described with reference to FIG.

This steam drying apparatus includes a resistance heater 3 disposed at the bottom of a quartz chamber 1.
The liquefied drying medium 2 is stored at the bottom of the tank 2 so that the resistance heater 3 is immersed therein. A steam spray plate 5 is provided at an upper portion of the chamber 1, and an external steam source 6 is connected to the steam spray plate 5. On the steam spray plate 5, a cooling pipe 7 for cooling the drying medium is provided.

Next, a conventional steam drying method will be described.

[0005] First, a wet semiconductor substrate 4 as an object to be cleaned, which has been cleaned by another cleaning apparatus, is transferred into the quartz chamber 1. The liquefied drying medium 2 at the bottom of the quartz chamber 1 is heated in advance by the resistance heater 3 and boils to generate the drying medium vapor 8. Semiconductor substrate 4
Is inserted into the quartz chamber 1, and the inside and outside of the tank are isolated by the steam spray plate 5, the drying medium steam 10 is generated from the external steam source 6, and the drying medium steam 10 is transferred from the steam spray plate 5 into the tank 1. Inject. The drying medium vapor 8 and the drying medium vapor 10 dissolve in the remaining liquid in the form of droplets on the semiconductor substrate 4. As a result, the contact angle (contact angle) between the droplet-shaped liquid and the semiconductor substrate 4 is increased, so that the adhesive force between the droplet-shaped liquid and the semiconductor substrate 4 is reduced. Thus, the liquid in the form of water drops flows downward from the semiconductor substrate 4 due to gravity, and the semiconductor substrate 13 is vapor-dried. After the steam drying is achieved, the semiconductor substrate 4 is taken out of the chanava 1.

[0006]

However, according to the above-mentioned prior art, after the step of cleaning the semiconductor substrate 13 to be cleaned is completed, the wet semiconductor substrate 13 must be transferred from the cleaning device to the steam drying device. Therefore, there is a problem that the time required for transport decreases the throughput. Further, particles may adhere to the object to be cleaned while the semiconductor substrate 13 is being transported. Further, since the semiconductor substrate 13 is exposed to the air during transportation, the semiconductor substrate 13
There is a possibility that natural drying occurs partially and a watermark is formed. In addition, according to the above-described related art, there is a possibility that drying proceeds unevenly between the upper portion and the lower portion of the semiconductor substrate 13.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a cleaning / drying apparatus and a cleaning / drying method capable of executing a cleaning / drying step with high throughput.

Another object of the present invention is to provide a steam drying apparatus and a steam drying method for achieving uniform drying.

[0009]

A cleaning and drying apparatus according to the present invention comprises a cleaning chamber, a holder for rotatably holding an object to be cleaned in the cleaning chamber, and a driving unit for rotating the holder together with the object to be cleaned. A cleaning liquid supply device that supplies a cleaning liquid to the object to be cleaned on the holder; and a drying medium that supplies drying steam for drying the liquid on the object to be cleaned on the holder into the cleaning chamber. And a supply device.

[0010] A steam generator may be provided which vaporizes the volatile chemical liquid by heating to generate the drying steam and supplies the drying steam to the drying medium supply device.

The steam generator includes a tank for storing the volatile chemical liquid, a passage connecting the tank and the drying medium supply device, and a heater for heating at least a part of the passage. Is preferred.

It is preferable that the drying medium supply device has at least one nozzle for injecting the drying steam to the object to be cleaned.

An inert gas supply unit for injecting an inert gas for drying a liquid remaining on the object to be cleaned on the holder after the cleaning is completed, onto the object to be cleaned on the holder; You may.

It is preferable that another heater for heating the inert gas be provided.

The holder may be arranged so as to be rotatable in a plane substantially parallel to the horizontal direction, or may be arranged so as to be rotatable in a plane substantially parallel to the vertical direction.

It is preferable that a controller is provided for supplying the drying steam into the chamber by the drying medium supply device while rotating the holder together with the object to be cleaned by the driving section.

Another cleaning / drying apparatus according to the present invention includes a cleaning chamber, a holder for holding the object to be cleaned in the cleaning chamber, a cleaning liquid supply device for supplying a cleaning liquid to the object to be cleaned on the holder, A drying medium supply device for supplying drying steam for drying the liquid remaining on the object to be cleaned on the holder after completion of the drying into the cleaning chamber.

A step of cleaning the object to be cleaned; and a step of supplying a drying vapor for drying the liquid on the object to be cleaned to the object to be cleaned while rotating the object to be cleaned. Is preferred.

A step of supplying a cleaning liquid to the object to be cleaned while rotating the object to be cleaned; and a step of supplying the cleaning liquid to the object to be cleaned while drying the object to be cleaned while rotating the object to be cleaned. A step of supplying both to the object to be cleaned and a step of supplying the drying steam to the object to be cleaned while the supply of the object to be cleaned is stopped while rotating the object to be cleaned. Is also good.

In the step of supplying the drying steam to the object to be cleaned, it is preferable that an inert gas is injected to the object to be cleaned.

It is preferable that the drying steam is alcohol vapor.

The steam drying apparatus according to the present invention comprises: a drying chamber; a holder for rotatably holding the object to be cleaned in the drying chamber; a driving unit for rotating the holder together with the object to be cleaned; A drying medium supply unit that supplies drying steam for drying the liquid on the object to be cleaned into the cleaning chamber.

In the steam drying method according to the present invention, while rotating the object to be cleaned, drying steam for drying the liquid on the object to be cleaned is supplied to the object to be cleaned.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. (Embodiment 1) A first embodiment of a cleaning and drying apparatus according to the present invention will be described with reference to FIG.

The cleaning and drying apparatus of this embodiment holds a cleaning chamber 12 made of quartz or Teflon having chemical resistance and a rotatable object (semiconductor substrate) 13 in the cleaning chamber 12. Holder 1
And cleaning liquid supply devices 17 and 18 for supplying a cleaning liquid to the semiconductor substrate 13 on the holder 14. The cleaning chamber 12 is used not only for cleaning but also for drying as described later. The holder 14 holds an object to be cleaned by a mechanism such as a vacuum chuck. In the present embodiment, since an 8-inch silicon wafer is used as an object to be cleaned, a holder 14 having a size capable of firmly fixing such a silicon wafer is employed. Cleaning liquid supply unit 17 used here
And 18 are two nozzles (inner diameter at the tip: 0.1 to 5)
mm). The cleaning liquid supply devices 17 and 18 are not limited to those having a nozzle shape, and the number thereof is not limited to two. Instead of the nozzle, an instrument having a plurality of fine openings may be used, and the cleaning liquid may be ejected from the instrument in a shower shape. The holder 14 is rotated by a drive motor 15 arranged outside the chamber 12.
In the present embodiment, an arrangement is adopted in which the holder 14 rotates in a plane substantially parallel to the horizontal direction.

During the cleaning process, the cleaning liquid supply 17
The cleaning of the semiconductor substrate 13 is performed by the cleaning liquid supplied to the semiconductor substrate 13 from and 18. Thereafter, following the cleaning step, a drying step is performed in the same cleaning chamber 12. For this reason, the cleaning chamber 12
Functions as a washing and drying chamber.

The cleaning liquid supply devices 17 and 18 are connected to a pump 20 via introduction pipes 21 and 22, respectively, and are finally connected to a cleaning liquid tank 19. The introduction tubes 21 and 22 are formed of, for example, quartz, and have an inner diameter of, for example, 1 to 30 mm. Pump 2
As 0, those having a particle removal filter can be suitably used.

In the cleaning chamber 12, nozzle-shaped drying medium feeders 23 and 24 are also arranged. The drying medium supply devices 23 and 24 are connected to a steam generator that generates drying medium vapor. The steam generator heats and vaporizes the volatile chemical liquid, thereby generating drying steam and supplying it to the drying medium supply units 23 and 24. The steam generator includes a tank 25 for storing a volatile chemical such as isopropyl alcohol, and a passage (introduction pipe) 2 connecting the tank 25 and the drying medium supply devices 23 and 24.
7 and 28, and a set of heaters 29 for heating the passages 27 and 28. The drying medium is not limited to isopropyl alcohol, and a solvent that can be replaced with water, for example, an organic solvent such as ethyl alcohol, methyl alcohol, or 2-propanol is suitably used. Each superheater 29
A heater 30 is disposed therein to heat a part of the passage 27 or 28 to change these drying media from liquid to gas. It is preferable that the temperature of the heating portions of the passages 27 and 28 be as close as possible to the boiling point of the drying steam. When isopropyl alcohol is used, it is preferable to raise the temperature of the heated portion of the passages 27 and 28 to, for example, 82 to 100 ° C. The distance from the heated portion to the tip of the drying medium supply devices 23 and 24 is, for example, 10 to 100.
mm. As the heating device, instead of using heater heating, lamp heating, high-frequency heating, or the like may be used. This apparatus preferably includes an inert gas supply unit 31 that injects an inert gas onto the semiconductor substrate 13 after the cleaning is completed. Further, another heater (29, 30) for heating the inert gas may be provided.

Next, an embodiment of the washing and drying method of the present invention using the washing and drying apparatus of FIG. 1 will be described.

First, the semiconductor substrate 13 is inserted into the chamber 12 from an opening / closing door (not shown) provided in the chamber 12, and the semiconductor substrate 13 is fixed to the holder 14. After that, the power of the motor 15 is transmitted to the holder 14 through the rotation shaft 16, and the semiconductor substrate 13 is rotated together with the holder 14. The cleaning liquid stored in the cleaning liquid tank 19 is transported in the introduction pipes 21 and 22 by the pump 20 and is jetted from the cleaning liquid supply devices 17 and 18 to the rotating semiconductor substrate 13. At this time, the rotation speed of the semiconductor substrate 13 is, for example, 10 to 60 r. p. m. Is set to As the cleaning liquid, for example, NH ₄ OH / H ₂ O ₂ / H ₂
O, H ₂ SO ₄ / H ₂ O ₂ / H ₂ O, HF / H ₂ O, etc. are appropriately selected according to the application.

When the cleaning has been sufficiently performed, the jetting of the cleaning liquid is stopped. After that, the vapor of the drying medium is jetted from the drying medium supply devices 23 and 24 to the semiconductor substrate 13. The vapor of the drying medium is supplied from the drying medium stored in the drying medium tank 25 to the inlet pipe 27 by the pump 26.
And 28, which are converted into steam by being heated by the heater wire 30 of the heating device 29 during the transportation.

The drying medium vapor is uniformly jetted onto the semiconductor substrate 13 because the semiconductor substrate 13 is rotating. The drying medium vapor dissolves into the liquid adhering to the semiconductor substrate 13, and the liquid is centrifugally directed from the center of the semiconductor substrate 13 in the circumferential direction to the semiconductor substrate 13.
Removed from Thus, drying of the semiconductor substrate 13 is achieved. After stopping the ejection of the drying medium vapor, the rotation of the semiconductor substrate 13 is stopped. After that, the semiconductor substrate 13 is taken out of the cleaning chamber 12.

Although not shown, the chamber 12 is provided with an exhaust / drainage device for exhausting the liquid and gas in the chamber 12 to the outside. By adjusting the operation of the exhaust device, the pressure in the chamber 12 may be made positive or negative compared to the atmospheric pressure.

According to the present embodiment, by spraying the drying medium vapor while rotating the semiconductor substrate 13,
The entire semiconductor substrate 13 is exposed to the drying medium vapor in a short time, and the semiconductor substrate surface is uniformly dried. Further, cleaning and drying are performed in the same container, and the semiconductor substrate 13 is dried.
Since the time required for transporting the paper can be omitted, a high throughput can be realized. Further, since the semiconductor substrate 13 is rotated, drying using centrifugal force and steam drying are performed at the same time, so that high-speed drying becomes possible. The required time can be reduced to about 20 to 50% as compared with a case where the semiconductor substrate is not rotated.

In the present embodiment, a semiconductor substrate is taken as an example of an object to be cleaned, but it is also possible to clean and dry a substrate other than the semiconductor substrate, for example, a glass substrate. This means
The same applies to the other embodiments described below.

In this embodiment, the cleaning liquid nozzle 17
And 18 and the drying medium nozzles 23 and 24 are arranged one by one above and below the semiconductor substrate 13, respectively.
The arrangement and number of the nozzles are not limited to this.

(Embodiment 2) Next, another embodiment of the washing and drying method of the present invention will be described. The washing / drying apparatus used is the apparatus shown in FIG.

A semiconductor substrate 13 is inserted into the chamber 12 from an opening / closing door (not shown) provided in the chamber 12,
The semiconductor substrate 13 is fixed to the holder 14. After that, the power of the motor 15 is given to the holder 14 through the rotating shaft 16, and the semiconductor substrate 13 is rotated together with the holder 14. The cleaning liquid stored in the cleaning liquid tank 19 is transported through the introduction pipes 21 and 22 by the pump 20 and is rotated from the cleaning liquid supply devices 17 and 18 by the semiconductor substrate 13.
It is gushing. The rotation speed at this time is, for example, 10 to 1
00r. p. m. It is.

After the cleaning is sufficiently performed, the drying medium is supplied to the drying medium supply device 2 without stopping the ejection of the cleaning liquid.
3 and 24 are ejected to the semiconductor substrate 13 in a vapor state. For a certain period of time, for example, 1 to 10 seconds, the ejection of the cleaning liquid and the ejection of the drying medium vapor are simultaneously performed.

Thereafter, the ejection of the cleaning liquid is stopped without stopping the ejection of the drying medium vapor. The drying medium vapor is uniformly sprayed onto the rotating semiconductor substrate 13,
Dissolves in liquid adhering to. Then, the semiconductor substrate 13 is removed from the semiconductor substrate by centrifugal force, and drying of the semiconductor substrate 13 is achieved. Thereafter, the ejection of the drying medium vapor is stopped, and the rotation of the semiconductor substrate 13 is also stopped. Then, the semiconductor substrate 13 is taken out of the chamber 12 to the outside.

According to the present embodiment, since the step of ejecting the cleaning liquid and the step of ejecting the vapor of the drying medium are performed in time, the drying is performed without exposing the surface of the semiconductor substrate to the atmosphere. Exposure to vapour media. For this reason, it is possible to prevent oxides from being formed on the surface of the semiconductor substrate due to oxygen in the atmosphere and particles from adhering to the surface of the semiconductor substrate, thereby suppressing formation of watermarks and the like.

(Embodiment 3) Next, an embodiment of another washing and drying method of the present invention will be described. The washing / drying apparatus used is the apparatus shown in FIG.

A semiconductor substrate 13 is inserted into the chamber 12 from an opening / closing door (not shown) provided in the chamber 12,
The semiconductor substrate 13 is fixed to the holder 14. After that, the power of the motor 15 is given to the holder 14 through the rotating shaft 16, and the semiconductor substrate 13 is rotated together with the holder 14. The cleaning liquid stored in the cleaning liquid tank 19 is transported through the introduction pipes 21 and 22 by the pump 20 and is rotated from the cleaning liquid supply devices 17 and 18 by the semiconductor substrate 13.
It is gushing. The rotation speed at this time is, for example, 10 to 6
00r. p. m. It is.

After the cleaning is sufficiently performed, the drying medium is supplied to the drying medium supply device 2 without stopping the ejection of the cleaning liquid.
3 and 24 are ejected to the semiconductor substrate 13 in a vapor state. For a certain period of time, for example, 1 to 10 seconds, the ejection of the cleaning liquid and the ejection of the drying medium vapor are simultaneously performed. At this time, nitrogen heated to a temperature close to the boiling point of the drying steam by the heater 30 in the heating device 29 is blown from the nitrogen blowing nozzle 31 onto the surface of the semiconductor substrate 13.

Thereafter, the ejection of the cleaning liquid is stopped without stopping the ejection of the drying medium vapor and the heated nitrogen. The drying medium vapor is uniformly sprayed on the rotating semiconductor substrate 13,
It dissolves in the liquid adhering to the semiconductor substrate 13. At the same time, the liquid on the semiconductor substrate is quickly removed from the semiconductor substrate with high efficiency by spraying nitrogen, and the semiconductor substrate 13 is dried. Thereafter, the ejection of the drying medium vapor is stopped. Next, stop blowing the heated nitrogen,
After the rotation of the semiconductor substrate 13 is also stopped, the semiconductor substrate 13 is taken out of the chamber 12 to the outside.

According to the present embodiment, since the step of ejecting the cleaning liquid and the step of ejecting the drying medium vapor are performed in a timely manner, the surface of the semiconductor substrate is dried without being exposed to the atmosphere. Exposure to vapour media.

Further, since the heated nitrogen is blown, the semiconductor substrate surface temperature is prevented from lowering due to the evaporation of the drying steam, and the semiconductor substrate temperature can be maintained at a high temperature. for that reason,
The time required for drying the semiconductor substrate can be reduced. In addition, since the spray of nitrogen scatters the liquid, the drying can be completed in a shorter time than in the case of the second embodiment.

As the gas to be blown to increase the temperature of the semiconductor substrate, another inert gas may be used instead of dry nitrogen.

(Embodiment 4) Another embodiment of the washing and drying apparatus according to the present invention will be described with reference to FIG. FIG.
Of the washing and drying apparatus will be described, and the description of the common parts will not be repeated.

This cleaning / drying apparatus employs an arrangement in which the holder 14 is rotated in a plane substantially parallel to the vertical direction (vertical direction) in FIG. Therefore, the normal line set in the element formation region of the semiconductor substrate 13 is substantially horizontal. According to the present embodiment, the liquid on the semiconductor substrate 13 receives gravity in the vertical direction. For this reason, the removal efficiency of the liquid is improved by the centrifugal force and the gravity caused by the rotation.

(Embodiment 5) Another embodiment of the washing and drying apparatus according to the present invention will be described with reference to FIG. FIG.
Of the washing and drying apparatus will be described, and the description of the common parts will not be repeated.

In this cleaning / drying apparatus, the support surface of the holder 14 is oriented substantially vertically (the direction toward the center of the earth). Therefore, when the semiconductor substrate 13 is supported by the holder 14 as an object to be cleaned, the element formation region of the semiconductor substrate 13 extends in the extension direction. Since the earth exists ahead of the normal line formed in the element formation region of the semiconductor substrate 13, even if particles generated in the chamber 12 fall due to gravity, the particles will not fall on the semiconductor substrate 13.
Does not adhere to the element formation region. According to the present embodiment, in a series of steps of taking the semiconductor substrate 13 out of the chamber 12 through the cleaning step and the drying step, the problem of particle adhesion can be avoided, and a reduction in manufacturing yield can be prevented.

(Embodiment 5) An embodiment of a drying apparatus according to the present invention will be described with reference to FIG.

The steam drying apparatus of this embodiment includes a quartz chamber 51 and a resistance heater 53 arranged at the bottom of the quartz chamber 51. The drying section which is in a liquefied state at room temperature is provided at the bottom of the quartz chamber 51. Medium 2 is stored. The resistance heater 53 is immersed in the liquefied drying medium 52. A holder 14 for holding an object to be cleaned such as the semiconductor substrate 13 is rotatably supported in the quartz chamber 51, and is connected to a rotation motor 15 outside the quartz chamber 51 via a rotation shaft 16. A steam spray plate 55 is provided above the quartz chamber 51, and an external steam source 56 is connected to the steam spray plate 55. On the steam spray plate 55, a cooling pipe 57 for cooling the drying medium is provided.

Next, the steam drying method according to the present embodiment will be described.

First, a wet semiconductor substrate 13 as an object to be cleaned, which has been cleaned by another cleaning apparatus, is placed in a quartz chamber 5.
1 and held by the holder 14. next,
The holder 14 and the semiconductor substrate 13 are driven by the motor 15.
To rotate. The liquefied drying medium 52 at the bottom of the quartz chamber 51 is heated in advance by a resistance heater 53 and boils to generate a drying medium vapor 58. After inserting the semiconductor substrate 13 into the quartz chamber 51 and isolating the inside and outside of the tank with the steam spray plate 55, the external steam source 5
A drying medium vapor 60 is generated from 6, and the drying medium vapor 10 is injected from the vapor spray plate 5 into the tank 51.
The drying medium vapor 58 and the drying medium vapor 60 dissolve in the remaining liquid in the form of droplets on the semiconductor substrate 13. As a result, the contact angle between the droplet-shaped liquid and the semiconductor substrate 13 increases, so that the adhesive force between the droplet-shaped liquid and the semiconductor substrate 13 decreases. In this manner, the liquid is quickly removed from the semiconductor substrate 13 by gravity and centrifugal force, and the semiconductor substrate 13 is vapor-dried. After the steam drying is achieved, the rotation of the holder 14 by the motor 15 is stopped,
The semiconductor substrate 13 is taken out of the tank 51.

According to the present embodiment, since the semiconductor substrate 13 is exposed to the drying vapor while rotating, it is possible to eliminate unevenness in the drying state and the drying end time of the lower and upper portions of the semiconductor substrate, and the entire surface of the semiconductor substrate 13 And uniform drying can be achieved.

[0058]

According to the cleaning / drying apparatus and the cleaning / drying method of the present invention, it is not necessary to transport a wet cleaning target from the cleaning apparatus to the steam drying apparatus after the cleaning step of the cleaning target. Therefore, the throughput can be improved by the time required for transport. Further, there is no possibility that particles adhere to the object to be cleaned while the object to be cleaned is being conveyed. Further, since the object to be cleaned does not come into contact with the atmosphere, formation of a watermark can be prevented. In addition, since the object to be cleaned is rotated, uniform drying can be achieved in a shorter time.

According to the steam drying apparatus and the steam drying method of the present invention, since the object to be cleaned is rotated, uniform drying can be achieved in a short time.

[Brief description of the drawings]

FIG. 1 is a schematic view of an embodiment of a cleaning / drying apparatus according to the present invention.

FIG. 2 is a schematic view of another embodiment of the cleaning / drying apparatus according to the present invention.

FIG. 3 is a schematic view of still another embodiment of the cleaning / drying apparatus according to the present invention.

FIG. 4 is a schematic view of still another embodiment of the cleaning / drying apparatus according to the present invention.

FIG. 5 is a schematic view of a conventional steam drying device.

DESCRIPTION OF SYMBOLS 1, 12 chamber 2 liquefied drying medium 3 resistance heating device 4, 13 object to be cleaned (semiconductor substrate) 5 steam spray plate 6 external steam source 7 cooling pipe 8, 10 drying medium steam 21, 22, 27, 28 Introducing pipe 29 Heating device 30 Heater wire 20, 26 Pump 12 Container 14 Holder 15 Rotary motor 16 Rotary shaft 17, 18 Cleaning liquid supply unit 19 Cleaning liquid tank 23, 24 Medium supply unit for drying 25 Medium drying unit tank

Claims (16)

[Claims] A cleaning chamber; a holder for rotatably holding the object to be cleaned in the cleaning chamber; a driving unit for rotating the holder together with the object to be cleaned; and a cleaning liquid for the object to be cleaned on the holder. And a drying medium supply unit for supplying drying steam for drying the liquid on the object to be cleaned on the holder into the cleaning chamber. 2. The steam generator according to claim 1, further comprising a steam generator that evaporates the volatile chemical solution by heating, generates the drying steam, and supplies the drying steam to the drying medium supply device. Washing and drying equipment. 3. The steam generator, comprising: a tank for storing the volatile chemical liquid; a passage connecting the tank and the drying medium supply device; and a heater for heating at least a part of the passage. The washing and drying apparatus according to claim 2, comprising: 4. The cleaning / drying apparatus according to claim 3, wherein the drying medium supply device has at least one nozzle for injecting the drying steam to the object to be cleaned. 5. An inert gas supply device for injecting an inert gas for drying a liquid remaining on the object to be cleaned on the holder after completion of the cleaning onto the object to be cleaned on the holder. The washing / drying apparatus according to claim 1, further comprising: 6. The cleaning and drying apparatus according to claim 5, further comprising another heater for heating the inert gas. 7. The cleaning and drying apparatus according to claim 1, wherein the holder is rotatable in a plane substantially parallel to a horizontal direction. 8. The cleaning and drying apparatus according to claim 1, wherein the holder is rotatable in a plane substantially parallel to a vertical direction. 9. A control device for supplying the drying vapor into the chamber by the drying medium supply device while rotating the holder together with the object to be cleaned by the driving unit. The washing and drying apparatus according to any one of the above. 10. A cleaning chamber; a holder for holding an object to be cleaned in the cleaning chamber; a cleaning liquid supply device for supplying a cleaning liquid to the object to be cleaned on the holder; A cleaning / drying apparatus comprising: a drying medium supply device that supplies drying steam for drying a liquid remaining on a cleaning object into the cleaning chamber. 11. A step of cleaning the object to be cleaned, and a step of supplying a drying vapor for drying a liquid on the object to be cleaned to the object to be cleaned while rotating the object to be cleaned. Washing and drying methods including. 12. A step of supplying a cleaning liquid to the object to be cleaned while rotating the object to be cleaned, and a step of drying the cleaning liquid and the cleaning liquid to the object to be cleaned while rotating the object to be cleaned. A step of supplying both of the steam to the object to be cleaned; and a step of supplying the drying steam to the object to be cleaned while the supply of the object to be cleaned is stopped while rotating the object to be cleaned. Washing and drying methods including. 13. The cleaning and drying method according to claim 12, wherein, in the step of supplying the drying steam to the object to be cleaned, an inert gas is injected to the object to be cleaned. 14. The cleaning and drying method according to claim 11, wherein the drying steam is alcohol vapor. 15. A drying chamber; a holder for rotatably holding the object to be cleaned in the drying chamber; a driving unit for rotating the holder together with the object to be cleaned; A drying medium supply device that supplies drying steam for drying the liquid into the cleaning chamber. 16. A steam drying method for supplying drying steam for drying a liquid on the object to be cleaned to the object to be cleaned while rotating the object to be cleaned.