JPH11337511A - Circuit inspection device, and method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make an inner local heating observable excellently and make circuits possible to be inspected within bounds without breaking circuit components when power is supplied to the circuit component and a heating state is observed by infrared photographing. SOLUTION: The circuit inspection device 21 supplies intermittently and repetitively power to a circuit component 2 to be an inspection object by a power supply means 25. Radiant heat of the circuit component 2 in this state is photographed by a component photographing means 22. The circuit component 2 is heated and cooled alternately and repetitively by intermittence of power supply. Even if thermal conductivity of a resin package of the circuit component 2 is good, heating of an inner circuit can be photographed excellently. It can be prevented that a heating temperature of the circuit component 2 exceeds a limit and breakage is generated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor IC (Integ
The present invention relates to a circuit inspection apparatus and method for inspecting products that generate heat during operation of rated circuits, resistance elements, relay contacts, and the like.

[0002]

2. Description of the Related Art When manufacturing circuit components such as ICs, it is necessary to determine the acceptability by operating the manufactured circuit components. When developing circuit components, the acceptability is determined by operating the prototype circuit components. There is a need to. Therefore, there is a circuit inspection device that visualizes the heat generation state of operating circuit components and can inspect the quality of the circuit components by observation.

Here, a conventional example of such a circuit inspection apparatus will be described below with reference to FIG. FIG. 1 is a schematic diagram showing the entire structure of the circuit inspection device.

[0004] Here, a circuit inspection apparatus 1 exemplified as a conventional example includes a holding stage 3 for holding an IC chip 2 which is a circuit component to be inspected. A heater unit (not shown) for heating to a predetermined temperature is built in.

[0005] The IC chip 2 includes, for example, a circuit board on which a semiconductor circuit is formed on the surface by a thin film technique, and an internal circuit as the semiconductor circuit is composed of a logic circuit. Since the power supply voltage, the bias voltage, and the logic signal are supplied as power during normal operation, such an IC chip 2 also has a terminal to which these are supplied from the outside.

The circuit inspection apparatus 1 includes an IC chip 2
A DC power supply 4 is provided as power supply means for supplying power to the IC chip 2. The DC power supply 4 is detachably connected to a power supply terminal of the IC chip 2 held by the holding stage 3. At a position facing the holding stage 3 from directly above, an infrared camera 5 corresponding to heat generation detecting means is arranged.
The infrared camera 5 captures the radiation heat of the IC chip 2 as infrared light.

The infrared camera 5 and the holding stage 3
The computer body 1 of the computer system 11
2 is connected to the computer main body 12,
Various devices such as a display 13, a keyboard 14, and a mouse 15 are connected.

The computer body 12 has a CPU (Cen
tral Processing Unit), ROM (Read Only Memory),
RAM (Random Access Memory), I / F (Interface),
And the like (not shown), and integrally controls each unit in accordance with software installed in advance.

For example, the computer main body 12 includes an image captured by the infrared camera 5, a keyboard 14 and a mouse 15.
, And controls the operation of displaying an image on the display 13, the temperature of heat generated by the heater unit of the holding stage 3, and the like.

In the RAM of the computer main body 12, for example, a database of image data of the IC chip 2 photographed by infrared rays is constructed. Image data when a specific defect occurs.

In the circuit inspection apparatus 1 having the above structure,
By observing the heat generation state of the IC chip 2, it is possible to inspect whether the operation is good or not. In this case, the IC chip 2 to be inspected is held on the holding stage 3, and the computer system 11 drives the heater unit of the holding stage 3 to heat the IC chip 2 to an appropriate temperature.

In such a state, the power of the power supply voltage is supplied from the DC power supply 4 to the power supply terminal of the IC chip 2 as a DC current,
The internal circuit of the IC chip 2 is driven to a predetermined state. Since the internal circuit of the IC chip 2 operating in this way generates heat,
The heat generation state is photographed by the infrared camera 5 from outside the IC chip 2.

The photographing data is output from the infrared camera 5 to the computer main body 12. The computer main body 12 performs data processing such as emissivity correction on the photographing data from the infrared camera 5, and generates the heat generation state of the IC chip 2. Is generated, and the image data is reflected in a satisfactory manner.

The image data generated in this manner is transferred to, for example, the display 13 for display and output. When an operator (not shown) views the displayed image, the IC chip is supplied with power. 2 can be confirmed by a two-dimensional image.

The computer main body 12 compares the image data generated as described above with image data of a non-defective product which is a reference in a database. May be determined, and the result of the determination may be displayed and output on the display 13.

[0016]

In the circuit inspection apparatus 1 as described above, since the IC chip 2 is driven by electric power and the operating state is observed by temperature, the inspection is performed without destroying the internal state of the IC chip 2. be able to.

However, in the above-described circuit inspection apparatus 1, the IC
Since a DC current is continuously supplied to the chip 2 as electric power, and the amount of heat steadily radiated from the IC chip 2 is only statically photographed in this state, a temporal change such as a transient response of heat generation of the IC chip 2 may be prevented. It is difficult to confirm.

In addition, continuous supply of DC current allows I
When the internal circuit of the C chip 2 is continuously heated, for example, when the heat conduction of the silicon resin forming the internal circuit is good, the heat generated in the internal circuit is diffused and averaged.
It is difficult to observe the local heat generation state of the internal circuit of the IC chip 2.

Furthermore, even if an attempt is made to inspect the IC chip 2 within a range that does not destroy the latch-up mode, which is the destruction mode of the IC chip 2, the temperature of the internal circuit rises sequentially due to the continuous supply of DC current, so that the temperature exceeds the limit. As a result, destruction of the IC chip 2 may occur.

The present invention has been made in view of the above-described problems, and has as its object to provide a circuit inspection apparatus and method capable of satisfactorily inspecting the heat generation state of the IC chip 2.

[0021]

A first circuit inspection apparatus according to the present invention comprises: a component photographing means for photographing radiant heat of a circuit component to be inspected; and a power supply for intermittently and repeatedly supplying power to the circuit component. Means.

Therefore, in the circuit inspection method using the circuit inspection apparatus of the present invention, power is intermittently and repeatedly supplied to the circuit component to be inspected by the power supply means, and radiant heat of the circuit component in this state is transmitted by the component photographing means. Be photographed. Since the supply of power to the circuit components is intermittently repeated, heat generation and cooling are alternately repeated in the circuit components, and even when the heat conduction of the circuit components is good, the heat generated in the internal circuit is diffused and averaged. Is prevented, and it is also prevented that the heat generation temperature of the circuit component exceeds the limit and breakage occurs.

According to a second circuit inspection apparatus of the present invention, there is provided a component photographing means for continuously photographing the radiant heat of a circuit component to be inspected at a predetermined frame cycle, and synchronizing with the frame cycle of the component photographing means. Power supply means for intermittently and repeatedly supplying power to the circuit components.

Accordingly, in the circuit inspection method using the circuit inspection apparatus of the present invention, the power is supplied intermittently and repeatedly by the power supply means to the circuit component to be inspected, and the radiant heat of the circuit component in this state is transmitted by the component photographing means. Be photographed. Since the supply of power to the circuit component is intermittently repeated, a temporal change such as a transient response of heat generation of the circuit component is photographed.
In particular, since the repetition period of the power supply is synchronized with the frame period of the photographing, for example, it is possible to repeatedly photograph the heat generation state of the circuit component at the time when a predetermined time has elapsed from the start of the power supply. . In addition, since heat generation and cooling are alternately repeated in the circuit components due to the intermittent supply of power, even if the heat conduction of the circuit components is good, the heat generation in the internal circuit is prevented from being diffused and averaged, It is also possible to prevent the heat generation temperature of the circuit component from exceeding the limit and causing breakage.

In the above-described circuit inspection apparatus, for example, the power supply means includes a phase varying means for varying a phase of a power supply repetition cycle with respect to a frame cycle of the component photographing means. It is also possible to do. In this case, the phase of the repetition cycle of the power supply by the power supply means is changed by the phase variable means with respect to the phase of the frame cycle of the component photographing means. The heat generation state of the component is repeatedly photographed.

In the above-described circuit inspection apparatus, for example, the power supply means may include a phase varying means for sequentially shifting the phase of the power supply repetition cycle with respect to the frame cycle of the component photographing means. It is also possible to have. In this case, the phase of the repetition period of the power supply by the power supply unit is sequentially shifted by the phase variable unit with respect to the phase of the frame period of the component photographing unit. The heat generation state is photographed in a time sharing manner.

Further, in the above-described circuit inspection apparatus, for example, the power supply means can modulate the power supplied to the circuit component during normal operation. In this case, since the power during normal operation is repeatedly and intermittently supplied to the circuit components by the power supply means, the circuit components repeat the heat generation state in the normal operation.

Further, in the above-described circuit inspection apparatus, for example, the power supply means can superimpose modulated power on power supplied to the circuit component during normal operation. In this case, since the power during normal operation and the modulated power are superimposed and supplied to the circuit component by the power supply means, the circuit component changes its heat generation state based on the heat generation state during normal operation.

Further, in the above-described circuit inspection apparatus, for example, the power supply means can modulate the power supplied to the circuit component in a pulsed manner. In this case, since the power supplied to the circuit component is modulated in a pulse shape by the power supply means, power having a constant waveform is repeatedly supplied to the circuit component.

In the above-described circuit inspection apparatus, for example, the power supply means uses at least one of a power supply voltage of the circuit component, a bias voltage of the circuit component, and a logic signal of the circuit component as power. It can also occur. In this case, at least one of the power supply voltage, the bias voltage, and the logic signal is intermittently and repeatedly supplied to the circuit component by the power supply unit.

The various means referred to in the present invention only need to be formed so as to realize their functions. For example, dedicated hardware, a computer provided with appropriate functions by a program, a computer provided by an appropriate program , The functions realized inside, and the combination thereof are allowed.

The circuit component may be any component having a circuit that generates heat when operated by supplying power. For example, an IC chip or the like in which a semiconductor circuit is formed on a circuit board by a thin film technique is allowed. As power for driving such circuit components, for example, a power supply voltage, a bias voltage, a logic signal, and the like are allowed.

[0033]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. However, the same portions as those of the conventional example described above with respect to the present embodiment are denoted by the same names and reference numerals, and detailed description thereof is omitted. In addition,
FIG. 1 is a schematic diagram showing the entire structure of the circuit inspection device of the present embodiment, and FIG. 2 is a time chart showing a waveform of electric power supplied by the circuit inspection device to an IC chip as a circuit component.

The circuit inspection apparatus 21 of the present embodiment also has the configuration shown in FIG.
As shown in FIG. 2, an IC chip 2 which is a circuit component to be inspected
Is provided, and an infrared camera 22 corresponding to heat generation detecting means is disposed directly above the holding stage 3, and these are connected to a computer main body 24 of a computer system 23. .

An element driving circuit 25 is connected to the computer main body 24 as power supply means. The element driving circuit 25 is detachably connected to a power supply terminal of the IC chip 2. The element drive circuit 25 supplies power to the IC chip 2 by being connected as described above. However, unlike the DC power supply 4 of the circuit inspection apparatus 1 described above as a conventional example, the element drive circuit 25 is shown in FIG. As described above, the power supply is formed so as to intermittently and repeatedly supply power to the IC chip 2.

The computer main body 24 is the computer main body 12 of the circuit inspection apparatus 1 described above as a conventional example.
Similarly to the above, data input such as a photographed image by the infrared camera 22, an input operation by the keyboard 14 and the mouse 15, and the like, image display by the display 13, heat generation temperature by the heater unit of the holding stage 3, and the like are simply controlled. Here, the operation of the power supply of the element drive circuit 25 is also controlled here.

In the RAM of the computer main body 24, for example, a database of image data obtained by infrared photographing of the IC chip 2 is constructed. Image data when a specific defect occurs.

Note that the computer main unit 24 stores the IC chip 2 as various data displayed on the display 13.
Infrared radiation "Radiance", infrared emissivity "Emissivit"
y ”and the surface temperature“ Temperture ”are generated from the output data of the infrared camera 22.

In this case, as described above, the emissivity correction depending on the material properties and the shape of the IC chip 2 can be executed. For example, as the display data of the surface temperature, a pseudo color coded by temperature region is used. A color image can be generated. Further, the infrared camera 22 is capable of changing the magnification from 100 times to 300 times, and has a resolution of 5 to 10 (μm).
It is.

In the above-described configuration, the circuit inspection method using the circuit inspection apparatus 21 of the present embodiment also observes the heat generation state of the IC chip 2 in the same manner as the circuit inspection apparatus 1 of the related art, and The quality of the operation is checked.

In this case, similarly to the conventional circuit inspection apparatus 1, power is supplied from the element driving circuit 25 to the power supply terminal of the IC chip 2 to be inspected which is held by the holding stage 3 and photographed by the infrared camera 22. However, as shown in FIG. 2, unlike the conventional circuit inspection apparatus 1, the element drive circuit 25 supplies power intermittently and repeatedly.

More specifically, the element driving circuit 25 includes an IC
The same voltage as the power supplied to the chip 2 during normal operation is turned on and off, a rectangular pulse voltage having a one-to-one duty ratio is generated and supplied to the IC chip 2.

Heat generation and cooling are alternately repeated in the IC chip 2 by the intermittent supply of the electric power. Therefore, even if the heat conduction of the silicon resin forming the internal circuit of the IC chip 2 is good, the heat generation in the internal circuit is not affected. Can be prevented from being diffused and averaged, so that the local heat generation state inside the IC chip 2 can be favorably observed from the outside.

Further, since it is possible to prevent the IC chip 2 from being destroyed due to the heat generation temperature exceeding the limit, it is possible to thermally observe a state such as thermal runaway or latch-up within a range where the IC chip 2 is not destroyed. Can be. Further, the computer main body 24 can take a photograph of a temporal change such as a transient response of heat generation of the IC chip 2 by controlling a photographing timing of the infrared camera 22 in accordance with a power supply timing of the element driving circuit 25. It is.

In addition, the element driving circuit 25 is
Since the power supplied to the IC chip 2 is modulated in a pulse shape, the power having a constant waveform can be repeatedly supplied to the IC chip 2.
The same heat generation state can be repeatedly generated in the C chip 2. Further, since the element drive circuit 25 modulates the power supplied to the IC chip 2 during normal operation, the IC chip 2 can repeat the heat generation state during normal operation.

The present invention is not limited to the above-described embodiment, but allows various modifications without departing from the gist of the present invention. For example, in the above embodiment, the element drive circuit 25 supplies the power supply voltage to the power supply terminal of the IC chip 2 as the power intermittently repeated.
It can be supplied to the signal terminal of the C chip 2 as a logic signal, and can also be supplied as a bias voltage.

Further, in the above embodiment, the element drive circuit 25 sets the voltage to be turned on and off to a predetermined voltage and “0” by the IC chip 2.
Is shown as an example, but as shown in FIG.
It is also possible to supply such a voltage to the IC chip 2 in a state of being superimposed on a predetermined bias voltage.
It is also possible to supply voltages of various waveforms as shown in FIG.

In the above embodiment, the element drive circuit 25 modulates and supplies the power supplied to the IC chip 2 during normal operation. However, the modulated power is superimposed on such power. It is also possible to supply. In this case, since the heat generation state of the IC chip 2 is changed based on the heat generation state in the normal operation, the tolerance of the latch-up can be observed.

Furthermore, in the above-described embodiment, the various units of the circuit inspection apparatus 21 are exemplified as being formed as dedicated hardware. However, for example, the circuit inspection may be performed by installing appropriate software on a computer and operating the computer. It is also possible to realize various means of the device 21, and it is also possible to realize a part by software and to form a part as hardware.

In the above embodiment, the computer main body 24
Controls the operation timing of the infrared camera 22 in accordance with the operation timing of the element drive circuit 25,
Although it has been exemplified that the temporal change of the heat generation of the IC chip 2 can be photographed, the infrared camera 2
2 and the element drive circuit 25 are preferably devised.

Such a circuit inspection apparatus will be briefly described below as a modification. First, as the infrared camera 22, a movie camera that continuously shoots the radiant heat of the IC chip 2 at a predetermined frame cycle such as 60 frames per second is adopted.
The synchronization signal of the frame period is transmitted to the computer main body 24.

As shown in FIG. 4, the element drive circuit 31 is provided with an input terminal 32 to which a synchronization signal is externally input from the computer main body 23. The input terminal 32 is provided with first and second oscillators 33 and 34. Connecting. The first oscillator 33 is
The second oscillator 34 generates a sine wave in synchronization with the externally input synchronization signal, and generates a rectangular pulse in synchronization with the externally input synchronization signal.

A plurality of power supply circuits 35 are connected in parallel to the first oscillator 33, and these plurality of power supply circuits 35 are individually connected to a plurality of output terminals 36. One capacitor 37 is connected to the second oscillator 34, and this capacitor 37 is connected to one output terminal 38. Output terminal 36 is IC chip 2
The output terminal 38 is connected to a desired signal terminal of the IC chip 2.

In the circuit inspection method using the circuit inspection apparatus having the above-described configuration, the power is intermittently and repeatedly supplied to the IC chip 2 to be inspected by the element driving circuit 31, and the radiant heat of the IC chip 2 in this state is reduced. When the image is taken by the infrared camera 22, as shown in FIG. 5, the repetition period of the power supply is synchronized with the frame period of this photographing, so that a temporal change such as a transient response of heat generation of the IC chip 2 is observed in the taken image. can do.

As described above, the element driving circuit 3 is synchronized with the frame period of the photographing by the infrared camera 22 as described above.
The power supplied by the power supply 1 can also be the power supply voltage of the IC chip 2, a logic signal, or a bias voltage, and the voltage can have various waveforms as shown in FIG.

Further, here, it is assumed that the start time of the photographing frame of the infrared camera 22 and the start time of the power supply of the element driving circuit 31 are matched.
It is also possible to provide a delay circuit or the like as a phase varying means in 1 and to vary the phase of the repetition cycle of power supply by the element drive circuit 31 with respect to the phase of the frame cycle of the infrared camera 22.

In this case, since the phase of the repetition cycle of the power supply by the element driving circuit 31 is varied with respect to the phase of the frame cycle of the infrared camera 22, as shown in FIG. It is possible to repeatedly photograph the heat generation state of the IC chip 2 at the time when the time has elapsed.

Even when the power supply phase is made variable as described above, the voltage can have various waveforms as shown in FIGS. 7 and 8, and the voltage waveform can be changed in this manner. By changing it, it is possible to observe the transient response of various heat generation states of the IC chip 2.

However, in this case, since the same time point of the transient response of the heat generation state of the IC chip 2 is repeatedly photographed, it is difficult to continuously observe the temporal change. Therefore, when such a need arises, the phase of the power supply repetition cycle is sequentially shifted with respect to the phase of the frame cycle of the infrared camera 22 by the phase variable circuit that is the phase variable means of the element drive circuit 31. Is preferred.

As a method of sequentially shifting the phase, there is a so-called sampling scope method, which is described in “Pulse, Digital and Switching Waveforms Mill”.
MANand TAUB International Student Edition pp.664
-667 ".

For example, as shown in FIGS. 9 (a) and 9 (b), a staircase wave whose voltage sequentially increases in synchronization with the frame period of photographing is generated, and as shown in FIGS. 9 (c) and 9 (d), This is superimposed on a triangular wave to generate a sawtooth wave whose voltage sequentially increases. Assuming that the intersection of the sawtooth wave and a fixed threshold voltage is a sampling timing, the phase of this timing is sequentially shifted with respect to the phase of the imaging frame period.

Therefore, at this timing, the element driving circuit 3
When power is supplied to the IC chip 2 from 1, the heat generation state of the IC chip 2, which changes with time from the start of the power supply, is photographed in a time-division manner, and the change with time of the heat generation state of the IC chip 2 is well observed. can do.

If the staircase wave is repeated at a constant period, the phase shift is also repeated at this period, so that it is possible to repeatedly observe the change over time in the heat generation state of the IC chip 2 as shown in FIG. The number of repetitions can be set variously.

[0064]

Since the present invention is configured as described above, it has the following effects.

In the circuit inspection method using the first circuit inspection apparatus of the present invention, power is intermittently and repeatedly supplied to the circuit component to be inspected by the power supply means. As a result, the heat generation and the cooling are alternately repeated in the circuit parts due to the intermittent supply of the power, so that even if the heat conduction of the circuit parts is good, the heat generation in the internal circuit is diffused and averaged. It is also possible to take a good picture of the local heat generation of the internal circuit of the circuit component from the outside, and to prevent the temperature of the circuit component from exceeding the limit and causing destruction. Various inspections can be performed within a range not destroyed.

In the circuit inspection method according to the second circuit inspection apparatus of the present invention, the power is supplied intermittently and repeatedly by the power supply means to the circuit parts to be inspected, and the radiant heat of the circuit parts in this state is used as the part photographing means. Since the repetition period of the power supply is synchronized with the frame period of the photographing, for example, the heat generation state of the circuit component at the time when a predetermined time has elapsed from the start of the power supply is photographed repeatedly. It is possible to observe changes over time, such as the transient response of the heat generation state of the circuit components due to power supply, and the intermittent supply of power causes heat generation and cooling to be alternately repeated in the circuit components. As a result, even if the heat conduction of the circuit components is good, it is possible to prevent the heat generated in the internal circuit from being diffused and averaged out. Can be taken, since it is possible to prevent the heat generation temperature of the circuit component breakdown exceeds the limit occurs, it is possible to perform various inspection in a range that does not destroy the circuit components.

In the circuit inspection apparatus as described above, by changing the phase of the repetition cycle of the power supply by the power supply means with respect to the phase of the frame cycle of the component photographing means by the phase variable means, for example, It is possible to repeatedly photograph the heat generation state of the circuit component when a predetermined time has elapsed from the start of the supply of the circuit component, and it is possible to observe the transient response of the heat generation state of the circuit component at a desired timing.

In the circuit inspection apparatus as described above, the phase of the repetition cycle of the power supply by the power supply means is sequentially shifted by the phase variable means with respect to the phase of the frame cycle of the component photographing means. The heat generation state of the circuit component that changes with time from the start of power supply can be photographed in a time-division manner, and the transient response of the heat generation state of the circuit component can be observed as a whole.

Further, in the above-described circuit inspection apparatus, the power supply means intermittently repeatedly supplies the power during normal operation to the circuit components, thereby causing the circuit components to repeat the heat generation state during the normal operation. Thus, it is possible to observe the heat generation state of the circuit components in the normal operation.

Also, in the above-described circuit inspection apparatus, the power during normal operation and the modulated power are superimposed and supplied to the circuit components by the power supply means.
The heat generation state can be changed based on the heat generation state of the circuit component in the normal operation, and the heat generation state such as when noise enters the circuit component in the normal operation can be observed.

Further, in the above-described circuit inspection apparatus, the power supplied to the circuit component is modulated in a pulse shape by the power supply means, so that the power having a constant waveform can be repeatedly supplied to the circuit component. The same heat generation state can be repeated in the component.

In the above-described circuit inspection apparatus, at least one of the power supply voltage, the bias voltage, and the logic signal is intermittently and repeatedly supplied to the circuit component by the power supply means, so that various types of heat generation of the circuit component are generated. The state can be observed.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing the overall structure of a circuit inspection device according to an embodiment of the present invention.

FIG. 2 is a time chart illustrating a waveform of electric power supplied from an element driving circuit as an electric power supply unit to an IC chip as a circuit component.

FIG. 3 is a time chart showing various modifications of the waveform of the power supplied to the IC chip by the element driving circuit.

FIG. 4 is a block diagram illustrating an internal structure of an element driving circuit that is a power supply unit according to a modified example.

FIG. 5 is a time chart showing a waveform of power supplied to an IC chip by an element driving circuit.

FIG. 6 is a time chart showing a power waveform according to another modification.

FIG. 7 is a time chart showing a power waveform according to another modification.

FIG. 8 is a time chart showing a power waveform according to another modification.

FIG. 9 is a time chart showing a power waveform according to another modification.

FIG. 10 is a time chart showing a power waveform according to another modification.

FIG. 11 is a schematic diagram showing the entire structure of a circuit inspection device of a conventional example.

[Explanation of symbols]

 2 IC chip as a circuit component 21 Circuit inspection device 22 Infrared camera corresponding to component photographing means 23 Element driving circuit as power supply means 35 Element driving circuit as power supply means

Claims (12)

[Claims] 1. A circuit inspection apparatus comprising: a component photographing unit for photographing radiant heat of a circuit component to be inspected; and a power supply unit for intermittently and repeatedly supplying power to the circuit component. 2. A component photographing means for continuously photographing radiant heat of a circuit component to be inspected at a predetermined frame cycle, and power is intermittently repeated to the circuit component in synchronization with a frame cycle of the component photographing means. Power supply means for supplying;
A circuit inspection device comprising: 3. The circuit inspection apparatus according to claim 2, wherein said power supply means includes a phase varying means for varying a phase of a power supply repetition cycle with respect to a phase of a frame cycle of said component photographing means. . 4. The circuit inspection according to claim 2, wherein said power supply means includes a phase variable means for sequentially shifting a phase of a power supply repetition cycle with respect to a phase of a frame cycle of said component photographing means. apparatus. 5. The circuit inspection apparatus according to claim 1, wherein the power supply unit modulates power supplied to the circuit component during normal operation. 6. The circuit inspection apparatus according to claim 1, wherein the power supply unit superimposes modulated power on power supplied to the circuit component during normal operation. 7. The circuit inspection device according to claim 5, wherein the power supply unit modulates the power supplied to the circuit component into a pulse shape. 8. The power supply unit according to claim 1, wherein at least one of a power supply voltage of the circuit component, a bias voltage of the circuit component, and a logic signal of the circuit component is generated as power. The circuit inspection device according to the above. 9. A circuit inspection method in which electric power is intermittently and repeatedly supplied to a circuit component to be inspected, and radiant heat of the circuit component to which the electric power is repeatedly supplied is photographed. 10. A circuit in which radiant heat of a circuit component to be inspected is continuously photographed at a predetermined frame period, and power is intermittently and repeatedly supplied to the circuit component in synchronization with the frame period of the photographing. Inspection methods. 11. The circuit inspection method according to claim 9, wherein the phase of the power supply repetition cycle is freely variable with respect to the phase of the imaging frame cycle. 12. The circuit inspection method according to claim 9, wherein the phase of the power supply repetition cycle is sequentially shifted with respect to the phase of the imaging frame cycle.