JPH11330335A - Method and device for manufacturing semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for manufacturing a semiconductor element wherein chipping and cracking, etc., of a package at release from a lead frame are reduced, eliminating fear of poor insulation or degraded characteristics of a formed one for improved reliability. SOLUTION: After a resin package 2 is molded so that an engagement projection 17 formed at a lead frame 11 of long copper thin-plate is inserted in a side wall part 24, holding by the engagement projection 17 is so released that a plurality of semiconductor elements 23 formed continuously from the lead frame 11 come to independent element, and, related to an elastic deformation part 16 provided at the lead frame 11, a tapered guide 31 of an engagement releasing mechanism 25 is made to rise in the direction orthogonal to the lead frame 11, elastic deformation is allowed using a tapered part 30 so that the engagement projection 17 recedes in the direction reverse to insert direction for releasing engagement with a resin package 22, and holding of the resin package 22 by the engagement projection 17 is released.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a semiconductor element used for detaching a semiconductor element having a package formed by, for example, resin molding from a lead frame.

[0002]

2. Description of the Related Art Conventionally, a plurality of semiconductor chips such as a transistor chip and a diode chip are continuously and repeatedly fixed to a long lead frame, and the semiconductor chip is sealed in a package formed by resin molding. The semiconductor element is manufactured by performing predetermined lead processing, releasing the holding of the package by the lead frame, and separating the package into individual components.

Hereinafter, a conventional method and apparatus for manufacturing a semiconductor device will be described with reference to FIGS. FIG. 9 is an enlarged plan view showing a main part of the lead frame, and FIG.
0 is a plan view of a lead frame in which the package is molded with resin, FIG. 11 is an enlarged plan view showing a main part of the lead frame in which the package is molded with resin, and FIG. 12 (a) is a side view showing a first step, FIG. 12 (b) is a side view showing a second step, FIG.
(C) is a side view showing the third step.

In FIGS. 9 to 12, reference numeral 1 denotes a lead frame made of a long conductive metal thin plate, 2 denotes an element forming portion which is repeatedly formed in the longitudinal direction of the lead frame 1, and 3 denotes an element forming portion. Chip mount part, which is the main part of 2,
4a and 4b are lead portions. 5 is an element forming part 2
Are locking projections formed on the lead frame 1 so as to be opposed to both side portions with a predetermined gap. Further, a semiconductor chip having a diode configuration (not shown) is mounted on the chip mount portion 3, and the upper surface of the semiconductor chip and the tip of one of the lead portions 4b are wire-bonded. Thereafter, the package 6 is formed of a synthetic resin material so as to seal the semiconductor chip having been subjected to the wire bonding, and the semiconductor element 7 connected to the lead frame 1 is formed. In the state where the package 6 is molded in this manner, the locking projections 5 are provided on both side wall portions 8 of the package 6.
Is in the fitted state.

[0005] The step of separating the individual semiconductor elements 7 from the lead frame 1 is performed as follows. That is, the elongate lead frame 1 with the semiconductor element 7 connected is mounted on a semiconductor element manufacturing apparatus, and the lead portions 4a, 4
b is cut at a position where it extends from the package 6 by a predetermined length.

Next, in a first step shown in FIG. 12A, a part of the lead frame 1 provided with the locking projections 5 fitted into both side walls 8 of the package 6 is removed.
The manufacturing apparatus is located between the upper clamper 9a and the lower clamper 9b. Subsequently, the lower clamper 9b is driven upward so as to lift the lead frame 1 from the lower surface side, and the upper clamper 9 is driven.
a of the lead frame 1 on both sides of the semiconductor element 7
, And fix it by supporting it from above and below.

Next, in a second step shown in FIG. 12B, the pusher 10 provided below the semiconductor element 7 with the lead frame 1 sandwiched between the upper clamper 9a and the lower clamper 9b is thereby removed. The semiconductor device 7 is operated so as to be pushed up.

Next, in a third step shown in FIG. 12C, the pusher 10 is further operated so as to be pushed up until the upper end projects above the lead frame 1. Due to the push-up operation by the pusher 10, the locking projection 5 fitted into the side wall portion 8 of the package 6 is detached so as to partially break the package 6, whereby the semiconductor element 7 is separated from the lead frame 1. Then, by repeating the above steps, the semiconductor elements 7 continuously formed in the longitudinal direction of the lead frame 1 are cut into individual elements.

However, in the above prior art,
When the semiconductor element 7 is separated from the lead frame 1, the pusher 10 pushes up the side wall 8 of the package 6.
Since the locking projection 5 fitted into the package 6 is removed by applying a force in a direction perpendicular to the fitting direction, the fitting portion of the side wall 8 of the package 6 is partially broken. At this time, in some cases, an excessive force is applied to the side wall portion 8 of the package 6, and there is a possibility that an unnecessary chip A or a crack B may be formed in the package 6 more than necessary. If the cracks B are formed, moisture may enter the inside of the package 6, causing insulation failure or deterioration of characteristics of the semiconductor element 7, lowering reliability, and reducing the appearance of the package 6. Was getting worse.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and when a semiconductor element is detached from a lead frame, the detachment is performed without causing chipping or cracking of the package. In addition, it is an object of the present invention to provide a method and an apparatus for manufacturing a semiconductor device, which eliminates the risk of insulation failure and deterioration of characteristics of a semiconductor device to be formed and improves reliability.

[0011]

SUMMARY OF THE INVENTION A method and an apparatus for manufacturing a semiconductor device according to the present invention include molding a package such that a locking projection formed on a lead frame is fitted into a side wall of the package by resin molding. In the method for manufacturing a semiconductor device having a step of releasing the semiconductor element from the lead frame by releasing the package from the lead frame after performing the holding, the release of the package is released by the elastic deformation portion provided on the lead frame. The method is characterized in that the locking projection is retracted in the direction opposite to the direction of fitting into the side wall by deformation to release the engagement with the package, and the lead frame is formed of a long thin plate. In addition, a plurality of packages are continuously formed in the longitudinal direction of the lead frame, and a plurality of packages are formed between adjacent packages in the longitudinal direction. The method is characterized in that an elastically deformable portion having a projection is provided, and furthermore, the adjacent packages are simultaneously released by elastically deforming the elastically deformable portion between them. Further, a locking projection provided on a lead frame fitted in a side wall portion of a resin molded package and protruding in a main surface direction of the lead frame is moved forward and backward in a direction orthogonal to the main surface of the lead frame. In a semiconductor device manufacturing apparatus in which the semiconductor device is detached from the lead frame by disengaging from the side wall of the package by the disengagement mechanism, the engagement disengagement mechanism causes the elastically deformable portion provided on the lead frame to move in the orthogonal direction. A taper guide that advances from the back side of the lead frame so as to be elastically deformed and retracts the locking projection in a direction opposite to the fitting direction. If, which is characterized in that it comprises a Ruzukuranpa disposed with a predetermined small gap above the surface of the lead frame, further, the tapered guide and Ruzukuranpa is,
A plurality of packages arranged in a longitudinal direction of a long lead frame are provided so as to be simultaneously released by a predetermined number of packages.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIG.
This will be described with reference to FIGS. FIG. 1 is a plan view of a lead frame, FIG. 2 is an enlarged plan view showing a main part of the lead frame, FIG. 3 is a plan view showing a lead frame obtained by resin-molding a package, and FIG. 5 is an enlarged plan view showing a main part of a lead frame formed by resin molding, FIG. 5 is a partially enlarged sectional view of a lead frame formed by resin molding of a package, and FIG. FIG. 7 is a plan view showing a state in which the engagement release mechanism is made to correspond, FIG. 7 is a view showing a step of detaching the resin molded package from the lead frame, FIG. 7A is a side view showing a first step, FIG. 7 (b) shows the second
7C is a side view showing the third step, and FIG. 8 is a perspective view of the semiconductor element.

1 to 8, reference numeral 11 denotes a long copper (C) having a width of about 70 mm and a plate thickness of about 0.12 mm.
u) A lead frame made of a conductive metal thin plate formed by subjecting the surface of a thin plate to solder plating or the like, and the lead frame 11 is elongated by pressing and forming two predetermined patterns in the width direction. A plurality of chips are repeatedly formed in the direction X, and a rectangular chip mount portion 13 serving as a main portion is formed in the element forming portion 12 of the pattern. 14a and 14b are lead portions, and one lead portion 14a is a chip mount portion 13 and a lead frame 11;
The other lead portion 14b extends from the edge portion of the lead frame 11 opposite to the one lead portion 14a so that the tip portion faces the chip mount portion 13. It is formed as follows.

Further, the lead frame 11 is provided with a notch portion 15 having a predetermined shape and length in the width direction between adjacent element forming portions 12 so that the elastic deformation portion 16 is formed.
Are formed. The element forming part 1 of the elastic deformation part 16
2, a locking projection 17 is formed so as to face the both sides of the element forming portion 12 with a predetermined gap therebetween and to project in the main surface direction of the lead frame 11. Reference numerals 18 and 19 denote feed pitch holes for feeding the lead frame 11 in order, so that processing can be performed by a semiconductor device manufacturing apparatus having different feed mechanisms.

A semiconductor chip 20 having a diode structure is mounted on the chip mount portion 13 by being fixed with a conductive adhesive material. The electrode portion on the upper surface of the mounted semiconductor chip 20 and the other lead portion are mounted. 14b
Both ends of the bonding wire 21 are respectively bonded to the tip portions of the bonding wires 21. Thereafter, a resin package 22 is molded with a synthetic resin material such as an epoxy resin so as to seal the semiconductor chip 20 to which the wire bonding is performed, and a semiconductor element 23 connected to and held by the lead frame 11 is formed. In a state where the resin package 22 is molded in this manner, the locking projections 17 are fitted into both side wall portions 24 of the resin package 22 in a direction parallel to the surface of the lead frame 11. In the state where the semiconductor element 23 is still connected to the lead frame 11, for example, the shape of the resin package 22 has a length of 1.6.
mm, a width of 0.8 mm, and a height of about 0.6 to 0.7 mm in a substantially rectangular parallelepiped shape, and lead portions 14a and 14b extend from both end surfaces in the longitudinal direction. Is 1.75 mm between adjacent resin packages 22
It has become about.

The step of separating the individual semiconductor elements 23 from the lead frame 11 is performed by the engagement release mechanism 25 of the semiconductor device manufacturing apparatus as described below. 4 arranged adjacent to each other in the width direction and the long direction X of
One semiconductor element 23 is configured to be separated at a time. The disengagement mechanism 25 described below will be described by exemplifying a configuration in which two semiconductor elements 23 adjacent to each other in the longitudinal direction X are separated, unless otherwise specified.

The engagement release mechanism 25 is connected to the lead frame 11.
Are opposed to each other in a pair across the processing space 26 which is sequentially fed in the longitudinal direction X. The first upper clamper 27a and the first lower clamper 27b are also opposed in a pair across the processing space 26. Second upper clamper 28a, second lower clamper 2
8b are provided at an interval between the two so that two semiconductor elements 23 adjacent in the longitudinal direction X can be arranged.
While the first upper clamper 27a and the second upper clamper 28a are stationary, the first lower clamper 27b and the second lower clamper 28b advance and retreat in a direction orthogonal to the main surface of the lead frame 11. It is supposed to work.

Between the first upper and lower clampers 27a and 27b and the second upper and lower clampers 28a and 28b provided at intervals in the longitudinal direction X, four loose clampers 29 are provided above the machining space 26. The elastic deformation portion 16 is provided at a position immediately above a portion where the locking projection 17 is formed on the side. Further, eight taper guides 31 each having a tapered portion 30 having a tapered upper end advance and retreat in the direction orthogonal to the main surface of the lead frame 11 near four corners of the lower surface of the semiconductor element 23 below the processing space 26. It is provided to operate.

That is, one loose clamper 29 is connected to one of the two semiconductor elements 23 adjacent in the longitudinal direction X.
And the first upper and lower clampers 27a, and the remaining two loose clampers 29 are connected to the adjacent semiconductor elements 23.
The other one loose clamper 29 is arranged between the other semiconductor element 23 and the second upper clamper 28a. The taper guides 31 are arranged so as to elastically deform the edge portions of the respective elastic deformation portions 16 on the side facing the semiconductor element 23 in the surface direction when the taper guides 31 move forward in the back surface direction of the lead frame 11.

Then, the semiconductor device 23 is separated from the lead frame 11 by the engagement release mechanism 25 of the semiconductor device manufacturing apparatus having the above-described structure by the steps described below. First, the long lead frame 11 with the semiconductor element 23 connected and held is mounted on a semiconductor device manufacturing apparatus, and the lead portions 14a and 14b are separated from the resin package 22 in the preceding step while being sequentially fed in the long direction X. Cut at the position where the length is extended. As a result, the semiconductor element 23 is held on the lead frame 11 only by the locking projection 17 engaged with the side wall 24 of the resin package 22.

Next, in a first step shown in FIG.
And the semiconductor element 23 is stopped. Subsequently, the first lower clamper 27b and the second lower clamper 28b are advanced from the lower side in the direction of the back surface of the lead frame 11 as shown by solid arrows, and are brought into contact with the lead frame 11. And
After the contact, the first lower clamper 27b and the second lower clamper 28b are further raised to push up the lead frame 11, and the first upper clamper 27a and the second upper clamper 2
The lead frame 11 is firmly supported and fixed so that the lead frame 11 does not move.

In the state of being supported and fixed in this manner, for example, about 10 mm is provided between the upper surface of the lead frame 11 and the lower end surface of the loose clamper 29 provided immediately above the elastic deformation portion 16.
A minute gap G of about μm is provided. The small gap G has such a dimension that when the elastic deformation portion 16 is elastically deformed in the next step, the elastic deformation portion 16 is smoothly displaced while restricting the torsion caused thereby.

Next, in a second step shown in FIG. 7 (b), the taper guide 31 is advanced from below toward the back side of the lead frame 11 as shown by the solid arrow,
The upper portion of the tapered surface of the tapered portion 30 of the tapered guide 31 is connected to the semiconductor element 23 of the elastically deforming portion 16.
To the edge portion on the side opposite to. Further, the taper guide 31 is raised, and the edge portion of the elastic deformation portion 16 is elastically deformed by the taper portion 30 so that the cutout portion 15 is narrowed in a direction parallel to the surface of the lead frame 11.

During this elastic deformation, the elastic deformation portion 16 is deformed so that only the edge portion on the side facing the semiconductor element 23 is twisted so as to be lifted upward, but is provided with a minute gap G therebetween. The torsion clamper 29 restricts the twist and minimizes the twist. Then, the elastic deformation portion 16 is deformed so that the cutout portion 15 is smoothly narrowed while being regulated by the loose clamper 29.

Next, in a third step shown in FIG. 7 (c), the taper guide 31 is further raised to elastically deform the elastically deformable portion 16, and the side wall portion 24 of the resin package 22 is formed.
The locking projection 17 that has been fitted into the fitting portion is retracted in the direction opposite to the fitting direction. Then, the engagement between the side wall portion 24 of the resin package 22 and the locking projection 17 is released, whereby the semiconductor element 23 held by the lead frame 11 is detached.
Let it separate. Further, by repeating the above steps, the semiconductor elements 23 continuously formed in the longitudinal direction of the lead frame 11 are simultaneously cut into four by four pieces,
The semiconductor device 23 is completed by being subjected to subsequent steps not shown.

The resin package 22 of the completed semiconductor element 23 is constructed as described above.
Only the recess 24 a, which is a trace of the engagement of the locking projection 17 in the side wall 24, is left out. The chipping of the resin package 22 that occurs when the semiconductor element 23 is detached from the lead frame 11 is removed. And cracks, etc. are greatly reduced, and there is no possibility that chips, cracks, etc. will reach the inside of the element, and insulation defects and characteristic defects will be greatly reduced, manufacturing yield will be improved, and characteristics will not deteriorate over time. And reliability is greatly improved. Further, the appearance of the resin package 22 is not deteriorated.

Further, since the loose clamper 29 of the engagement release mechanism 25 is disposed immediately above the elastically deforming portion 16 of the lead frame 11 with a small gap G having a predetermined dimension therebetween, the engagement by the locking projection 17 is provided. The twist generated in the elastically deforming portion 16 at the time of releasing the engagement is minimized, and a smooth engagement releasing operation is performed. Further, the disengagement mechanism 2
In the configuration No. 5, four semiconductor elements 23 adjacent in the width direction of the lead frame 11 and further adjacent in the longitudinal direction X are simultaneously separated and separated, so that the manufacturing efficiency is improved.

In the above embodiment, the semiconductor chip 20 sealed in the resin package 22 has a diode structure. However, the present invention is not limited to this. For example, a transistor structure or another composite structure chip may be used. Even in this case, only the configuration of the lead portions 14a and 14b is different, and the same operation and effect as in the above embodiment can be obtained as long as the resin package holding configuration is the same.

[0029]

As is apparent from the above description, according to the present invention, when the semiconductor element is detached from the lead frame, the resin package is not damaged, and the insulation failure and the element characteristic failure are greatly reduced. The effect is that the reliability of the element is greatly improved.

[Brief description of the drawings]

FIG. 1 is a plan view of a lead frame according to an embodiment of the present invention.

FIG. 2 is an enlarged plan view showing a main part of a lead frame according to one embodiment of the present invention.

FIG. 3 is a plan view showing a lead frame obtained by resin-molding a package according to an embodiment of the present invention.

FIG. 4 is an enlarged plan view showing a main part of a lead frame obtained by resin-molding a package according to an embodiment of the present invention.

FIG. 5 is a partially enlarged sectional view of a lead frame obtained by resin-molding a package according to an embodiment of the present invention.

FIG. 6 is a plan view showing a state in which a disengagement mechanism is associated with a lead frame to which a semiconductor element is connected according to an embodiment of the present invention.

7A and 7B are diagrams showing a step of detaching a resin-molded package from a lead frame according to an embodiment of the present invention. FIG. 7A is a side view showing a first step, and FIG.
Is a side view showing a second step, and FIG. 7C is a side view showing a third step.

FIG. 8 is a perspective view of a semiconductor device according to an embodiment of the present invention.

FIG. 9 is an enlarged plan view showing a main part of a lead frame according to the related art.

FIG. 10 is a plan view of a lead frame obtained by resin-molding a package according to the related art.

FIG. 11 is an enlarged plan view showing a main part of a lead frame obtained by resin-molding a package according to the related art.

FIG. 12 is a view showing a step of detaching a resin-molded package from a lead frame according to a conventional technique;
FIG. 12A is a side view showing a first step, and FIG.
FIG. 12C is a side view showing a third step.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... Lead frame 15 ... Notch part 16 ... Elastic deformation part 17 ... Locking projection 22 ... Resin package 24 ... Side wall part 25 ... Disengagement mechanism 29 ... Loose clamper 30 ... Taper part 31 ... Taper guide G ... Minute gap

Claims (5)

[Claims] After the package is molded so that the locking projection formed on the lead frame is fitted into the side wall of the package by resin molding, the holding of the package by the locking projection is released. In the method for manufacturing a semiconductor device having a step of detaching the semiconductor device from the lead frame, the release of the package is performed by fitting the locking protrusion into the side wall by elastic deformation of an elastic deformation portion provided on the lead frame. A method of manufacturing a semiconductor device, comprising retreating in a direction opposite to a direction to release engagement with the package. 2. A lead frame comprising a long thin plate, a plurality of packages formed continuously in a longitudinal direction of the lead frame, and locking between the packages adjacent in the longitudinal direction. The method according to claim 1, further comprising an elastic deformation portion having a protrusion. 3. The method of manufacturing a semiconductor device according to claim 2, wherein the adjacent packages are simultaneously released by elastically deforming an elastically deformable portion between them. 4. A locking projection, which is provided on a lead frame fitted into a side wall portion of a resin molded package and protrudes in a main surface direction of the lead frame, is provided in a direction orthogonal to the main surface of the lead frame. In a semiconductor device manufacturing apparatus in which the semiconductor device is detached from the lead frame by being detached from the side wall of the package by an engagement release mechanism that moves forward and backward, the engagement release mechanism is provided on an elastic member provided on the lead frame. A taper guide which advances the deformed portion in the direction perpendicular to the back side of the lead frame and elastically deforms it to retract the locking projection in a direction opposite to the fitting direction, and a predetermined guide above the surface of the lead frame. An apparatus for manufacturing a semiconductor device, comprising: a loose clamper provided with a minute gap. 5. A taper guide and a loose clamper,
5. The semiconductor device manufacturing apparatus according to claim 4, wherein a predetermined number of packages arranged in the longitudinal direction of the long lead frame are simultaneously released.