JPH11330322A - Semiconductor device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely dissipate the heat generated from a semiconductor element mounted on a wiring board. SOLUTION: Through holes 26 and a heat dissipating layer 25 are formed in a printed board 21 and the heat generated from an IC chip 22 mounted on the board 21 is dissipated from the heat dissipating layer 25 through the holes 26. A highly heat conductive area 28 is formed through the board 21 and connected to the heat dissipating layer 25 in a heat transferable state. In addition, a heat dissipating member 29 is mounted on the board 21 to surround the IC chip 22 and stuck to the highly heat conductive area 28. Therefore, the heat dissipating efficiency of a semiconductor device can be improved, because the heat generated from the IC chip 22 is radiated through the through holes 26, heat dissipating layer 25, and heat dissipating member 29.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is to provide a semiconductor device having improved means for radiating heat of a semiconductor element mounted on a wiring board and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, various means have been proposed as means for radiating heat of a semiconductor element mounted on a wiring board.

[0003]

As one example of this kind of means, when a semiconductor element is used for high power in a structure in which a semiconductor element is mounted on a wiring board, the semiconductor substrate has a large thermal resistance. Heat dissipation from the element to the surroundings becomes a problem. To address this problem, Japanese Patent Laid-Open No.
79097 and JP-A-9-69592. These are formed by forming through holes 2 with good heat conduction in the wiring board 1 as shown in FIG. 20 or providing a high heat conduction region 3 with good heat conduction in the wiring board 1 as shown in FIG. The semiconductor element 4 is mounted on the wiring board 1, and the heat generated from the semiconductor element 4 is transferred to the heat dissipation layer 5 provided on the back surface of the wiring board 1 through the through hole 2 or the high heat conduction region 3 having good heat conduction. By releasing the heat, the heat dissipation is improved.

However, in such a configuration, since the heat radiation layer 5 is provided on the back surface side of the wiring board 1, there is a problem that components such as a capacitor or a resistor cannot be mounted in that region. Further, as shown in FIG. 22, a heat radiation layer 5 is provided in the wiring board 1, and an insulating layer 6 is provided on both front and back surfaces.
In the case of the configuration in which is formed, although components can be mounted on the back surface, there is a problem that the heat dissipation is reduced by the insulating layer 6.

On the other hand, as means for improving the heat dissipation of the wiring board, as shown in FIG. 23, a heat sink 7 is bonded on the wiring board 1 with an adhesive, and the semiconductor element 4 is bonded on the heat sink 7 with an adhesive. There is a way. In order to further improve the heat radiation, there is one disclosed in JP-A-4-179298. In this embodiment, as shown in FIG. 24, a square hole 8 is formed in the wiring board 1, and a heat sink 9 is mounted in the square hole 8. As a method for attaching the heat sink 9, a silicone-based adhesive is used, and a flange of 0.2 to 0.5 mm is provided on the upper part of the heat sink 9 to prevent the adhesive from falling off. In this case, the lower surfaces of the wiring board 1 and the heat sink 9 are set on the same plane, and the heat radiation is improved by attaching a large heat sink 10 to the back surface of the substrate 1. The semiconductor element 4 is mounted on the heat sink 9 with an adhesive, and the semiconductor element 4 is electrically connected to a wiring pattern on the wiring board 1 by wires 11.

However, in such a configuration, since the heat sink 9 is larger than the semiconductor element 4, the wire 1
1 must be connected while avoiding the heat sink 9, and the mounting area becomes large. In addition, since the flange for preventing falling off is formed integrally with the heat sink 9, there is a problem that the cost of the heat sink 9 is high.

On the other hand, as means for improving the heat dissipation of the wiring board, as disclosed in Japanese Patent Application Laid-Open No. 8-78795,
There has been proposed a structure in which a through hole is formed in a wiring board and heat of the semiconductor element is released to the back surface of the wiring board.

However, most of the through-holes formed by the usual method of manufacturing a wiring board are hollow, only the inner wall of a hole of about 0.3 to 1.0 mm is plated with copper of about 10 to 20 μm. And the effect of heat conduction is small. In this case, it is desirable to enhance the heat conduction by filling the through hole with, for example, solder.However, although the solder can be filled in the through hole in a process of mounting the semiconductor element or other components on the wiring board, Solder cannot completely fill the through hole. In other words, in the configuration in which the semiconductor element is soldered to the wiring board, the solder can be filled into the through-hole by solder paste printing as in the case of other surface mount components, but the amount of solder supplied in one printing is The thickness is usually about 100 μm, which is not enough to completely fill the through hole. For this reason, in order to supply a sufficient amount of solder, it is necessary to perform additional printing of the paste or supply of solder by dispensing, which leads to an increase in the number of processes.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor device and a method for manufacturing the same, which can surely radiate heat of a semiconductor element mounted on a wiring board. is there.

[0010]

According to the first aspect of the present invention, the heat of the semiconductor element is radiated through the high heat conduction region provided in the wiring board. However, since the high heat conduction area is provided in the wiring board, components can be mounted on the back side of the wiring board, but the heat dissipation is lower than in the configuration where the high heat conduction area is exposed on the front side. doing. In this case, a heat-dissipating member is provided on the wiring board, and the heat-dissipating member is thermally conductively connected to the high heat conduction region, so that heat of the semiconductor element is efficiently dissipated through the heat-dissipating member. be able to.

According to the second aspect of the present invention, since the heat radiating member is formed in a shape surrounding the semiconductor element, it is possible to prevent the sealing member of the semiconductor element from flowing, thereby reducing the sealing area. be able to.

According to the third aspect of the present invention, first, a heat sink is joined to the lower surface of the semiconductor element. At this time, a part of the semiconductor element protrudes from the heat sink. Subsequently, the heat sink is inserted into the hole formed in the wiring board. At this time, the protruding portion of the semiconductor element from the heat sink is hooked on the wiring board, and the heat sink can be positioned, so that the protruding portion of the semiconductor element is bonded to the wiring board. Therefore, it is not necessary to provide a flange portion on the heat sink, and the shape of the heat sink can be simplified, and the bonding wire area can be reduced, so that the mounting area can be reduced.

According to the fourth aspect of the present invention, since the metal film is formed on the inner peripheral surface of the hole of the wiring board, when the solder flow is performed with the heat sink inserted into the hole of the wiring board, the heat sink and the hole are formed. The solder rises in the gap with the inner peripheral surface. Thus, the heat sink can be fixed to the wiring board, and the heat radiation efficiency of the heat sink can be increased.

According to the fifth aspect of the present invention, when the solder paste is applied to the tip of the heat sink and inserted into the hole of the wiring board, the solder paste diffuses in the gap between the heat sink and the hole of the wiring board. By reflowing the wiring board, it is possible to fill the gap between the heat sink and the hole of the wiring board with solder. Thus, the heat sink can be fixed to the wiring board, and the heat radiation efficiency of the heat sink can be increased.

According to the sixth aspect of the present invention, when the solder flows through the wiring board, the solder rises and fills the through holes. When the semiconductor element is mounted on the wiring board, the heat of the semiconductor element is efficiently radiated through the solder filled in the through holes.

According to the present invention, when the heat sink is bonded to the wiring board, the groove formed on the lower surface of the heat sink communicates with the through hole of the wiring board. When the solder flows through the wiring board, the solder rises and fills the through holes, and the solder spreads and fills the grooves of the heat sink. Thereby, the heat of the semiconductor element mounted on the heat sink is efficiently radiated through the solder filled in the groove and the through hole of the heat sink.

According to the present invention, when the semiconductor element is mounted on the wiring board, a gap is formed between the semiconductor element and the wiring board by the space member. Then, when the solder flows through the wiring board, the solder rises and fills the through holes, and the solder wets and spreads and fills the gap between the semiconductor element and the wiring board. Thereby, the heat of the semiconductor element is efficiently radiated through the solder filled in the gap between the semiconductor element and the wiring board and the through hole.

According to the ninth to twelfth aspects of the invention, when the heat sink is mounted on the wiring board, a gap is formed between the heat sink and the wiring board by the space member.
Then, when the solder flows through the wiring board, the solder rises and fills the through holes, and the solder wets and spreads and fills the gap between the heat sink and the wiring board. Thereby, the heat of the semiconductor element is efficiently radiated through the solder filled in the gap between the heat sink and the wiring board and the through hole.

According to the thirteenth aspect of the present invention, although the solder is melted and spreads by dissolving the solder paste, the metal pattern to which the solder paste is applied is provided separately from the metal pattern bonded to the through hole. Therefore, the solder does not spread to the through hole and the gap can be reliably formed between the semiconductor element or the heat sink and the wiring board.

According to the fourteenth aspect, the present invention relates to an IC
It can be applied to packages.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A first embodiment of the present invention will be described below with reference to FIG. FIG.
Schematically shows a cross section of the semiconductor device. In FIG. 1, the printed circuit board 21 (corresponding to a wiring board) has an I
C chip 22 (corresponding to a semiconductor element) is made of high heat conductive adhesive 2
3, and the IC chip 22 and the electrodes 24 on the printed circuit board 21 are connected by wires 25.

The printed circuit board 21 is a multi-layer board.
Are formed, and a plurality of through holes 27 are formed in the printed circuit board 21 so as to penetrate the heat radiation layer 26 (corresponding to a high heat conduction region).

Here, a high heat conduction region 28 is formed in the printed board 21 near the electrode 24 for the wire 25 so as to penetrate the heat radiation layer 26, and protrudes from the printed board 21 in the high heat conduction region 28. A heat dissipating member 29 made of a high heat conductive member such as a metal is attached to the portion by using a high heat conductive adhesive or solder. In this case, the heat dissipating member 29 is formed in a shape surrounding the IC chip 22, and the inside thereof is filled with a sealing resin 30 for protecting the IC chip 22.

With such a configuration, the heat generated in the IC chip 22 is diffused to the heat radiation layer 26 through the through hole 27 and is radiated from the high heat conduction region 28 to the air through the heat radiation member 29, so that the heat radiation characteristic is high. Can be obtained.

Furthermore, since insulating layers are provided on both the front and back surfaces of the printed circuit board 21 and a wiring pattern can be formed thereon, parts can be formed on the printed circuit board 21 on the surface opposite to the mounting portion of the IC chip 22. It can be mounted, and the component mounting density can be increased.

The heat dissipating member 29 is also used as a member for preventing the sealing resin 30 (generally, liquid resin) from flowing out of the IC chip 22, and can regulate the end position of the sealing resin 30. Therefore, the sealing area can be reduced. Therefore, compared to a configuration in which the IC chip is surrounded by a high-viscosity sealing resin and a low-viscosity sealing resin is applied to an inner region thereof, the sealing area can be reduced while achieving a high heat dissipation structure. The high heat conduction region 28 may have the same structure as the through hole 27.

(Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 2 is a cross-sectional view of the semiconductor device, and FIG. 3 is a perspective view of the semiconductor device. 2 and 3, the printed circuit board 3
A hole 32 is formed in 1 (corresponding to a wiring board), and a heat sink 34 integrated with an IC chip 33 is inserted into the hole 32. The hole 32 is provided in the heat sink 3
4 and smaller than the IC chip 33. The electrodes on the IC chip 33 and the electrodes on the printed board 31 are connected by wires 35, and the entire IC chip 33 is sealed with a sealing resin 36.

Here, a method of manufacturing the semiconductor device having the above configuration will be described. First, as shown in FIG. 4, the heat sink 34 and the IC chip 33 formed about 0.05 mm smaller than the hole 32 of the printed circuit board 31 are bonded in advance with a high thermal conductive adhesive or solder. In the form in which the IC chip 33 and the heat sink 34 are integrated as described above,
A part of the IC chip protrudes from the heat sink.

Then, with the heat sink 34 inserted into the hole 32 of the printed circuit board 31, the portion of the IC chip 33 protruding from the heat sink 34 is adhered to the printed circuit board 31 with an adhesive. At this time, the projecting portion of the IC chip 33 functions as a flange, and the heat sink 34
Can be prevented from dropping off from the printed circuit board 31.

Subsequently, after the electrodes on the IC chip 33 and the electrodes on the printed circuit board 31 are connected by wires 35, the wires 35 and the entire IC chip 33 are filled with a sealing resin 36 and protected.

According to such a configuration, the heat sink 3
Since 4 is smaller than the IC chip 33, the bonding wire area of the wire 35 can be set to a small area, and the heat dissipation can be enhanced while the range of the sealing resin 36 is narrowed.

(Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIG. 5. The same parts as those of the second embodiment are denoted by the same reference numerals. Description is omitted.
The third embodiment is characterized in that a heat sink is joined to a printed circuit board by soldering.

That is, the holes 3 formed in the printed circuit board 31
Metal plating 37 is applied to the inner peripheral wall of the second. Also,
A copper foil wiring 38 is provided on the inner layer of the printed board 31, and is electrically connected to the metal plating 37 of the hole 32.

Using such a printed board 31, I
The IC chip 33 is bonded to the printed circuit board 31 with the heat sink 34 integrated with the C chip 33 inserted into the hole 32 of the printed circuit board 31, and then the wires 35 are connected and sealed with the sealing resin 36.

Since a gap is formed between the heat sink 34 and the inner peripheral surface of the hole 32, when the printed circuit board 31 is subjected to a solder flow, the solder rises into the gap due to surface tension to fill the gap. Is done. Thereby, the heat sink 34 and the metal plating 37 of the hole 32 are joined by the solder, and the heat conduction between them can be enhanced.

According to such a configuration, the heat sink 3
4 and the wiring 38 of the printed circuit board 31 can be joined by solder, so that the heat from the IC chip 33 can be efficiently spread to the wiring 38 of the copper foil which is the inner layer of the printed circuit board 31 through the heat sink 34, The performance is improved. In this case, since a solder flow process for mounting the lead component on the printed circuit board 31 is inherently necessary, the number of processes does not increase.

In the third embodiment, since the solder flow is used, the heat sink 34 is used.
The gap between the hole and the inner peripheral surface of the hole 32 may not be completely filled, and a void may be generated.

Therefore, as shown in FIG.
Solder paste 39 is attached to the lower part of the heat sink 34 to which the solder paste 3 is attached, and the solder paste 39 is inserted into the hole 32 of the printed circuit board 31, and then the solder flow is performed. In this case, since the solder paste 39 is diffused throughout the gap, the heat sink 34 and the metal plating 37 of the hole 32 can be completely joined by solder by flowing the solder paste 39, thereby further improving heat dissipation. Can be.

In the second to fourth embodiments, a heat sink 34 larger than the IC chip 33 may be used. That is, as shown in FIG. 7, the bonding directions of the wires 35 in the IC chip 33 are aligned, for example, in the vertical direction in the figure, and the longitudinal direction of the long heat sink 34 is set in the horizontal direction in the figure. By joining the IC chip 33 in an inclined state with respect to the IC chip 33, the shape of the heat sink 34 can be increased without expanding the application range of the sealing resin 36, so that the heat dissipation can be improved.

The lower portion of the heat sink 34 may project from the lower surface of the printed circuit board 31 as shown in FIG. 9, and the heat dissipation is further improved by forming the surface of the projecting portion in an uneven shape. can do.

Further, as shown in FIG. 10, a large heat dissipating metal member 40 is adhered to the lower portion of the heat sink 34 or the back surface of the printed circuit board 31, so that the heat dissipation can be further enhanced.

(Fourth Embodiment) Next, a fourth embodiment of the present invention will be described with reference to FIGS. FIG. 11 schematically shows a cross section of the semiconductor device. In FIG. 11, a heat radiating layer 42 of an inner layer wiring is formed on a printed board 41, and a through hole 43 is formed to penetrate the heat radiating layer 42. The inside of the through hole 43 is almost completely filled with the solder 44 without voids.

In the printed circuit board 41, the through holes 4
An IC chip 45 is mounted at a position above the IC chip 3, and the IC chip 45 and the printed board 41 are connected by wires 46. The entire IC chip 45 is filled with a sealing resin 47. With such a configuration, I
The heat of the C chip 45 is transmitted to the back surface of the printed circuit board 41 and the heat radiation layer 42 through the solder 44 filled in the through hole 43.
The heat can be dissipated effectively.

FIG. 12 shows a manufacturing process of the semiconductor device having the above configuration. (A) First, the surface mount component 4 is mounted on the surface of the printed circuit board 41.
8 is soldered by reflow soldering using a solder printing method. (B) Next, the leads 49a of the lead components 49 are inserted into the through holes of the printed board 41, and soldered from the back surface of the printed board 41 by a solder flow. At this time, I
The solder 44 rises and fills in the through hole 43 for heat radiation at the portion where the C chip 45 is to be mounted due to surface tension. (C) After that, the IC chip 45 is mounted at a position on the through hole 43 of the printed circuit board 41, and the electrodes on the IC chip 45 and the electrodes on the printed circuit board 41 are connected by wires 46, and then the sealing resin Fill 47. Thus, COB (Chip On Board) mounting is completed.

According to such a structure, the IC chip 4 is soldered on the through hole 43 by the solder flow.
5 is not mounted, the opening of the through hole 43 on the substrate surface side is maintained, the solder can be smoothly filled into the through hole 43, and the generation of voids is prevented. Can be.

In this case, in the structure having the through holes 43, since the soldering by the solder flow is necessarily required, the number of steps does not increase. Although this embodiment is a process in the case of a component configuration as shown in FIG. 11, any other process may be used as long as the opening of the through-hole 43 is maintained during solder filling. The process order can be set.

(Fifth Embodiment) Next, a fifth embodiment of the present invention will be described with reference to FIGS. The fifth embodiment is characterized in that the through holes are filled with the solder without voids without changing the manufacturing order of the semiconductor substrate.

That is, in the fourth embodiment, the mounting process of the surface mounting component 48 and the IC chip 45 is performed in a separate process, but mounting these components in the same process or in a continuous process is more convenient on the line. Is often good. In particular, when both are mounted by soldering, both can be mounted by one-time solder printing, which is efficient. In addition, COB mounting on a relatively large component such as a lead component has a difficulty in a wire bonding process or the like, and therefore, it may be preferable to avoid it in some cases.

However, when such a configuration is adopted, the process order shown in FIG. 12 is (a) → (c) → (b)
During the solder flow, the opening of the through-hole 43 is closed by the IC chip 45, so that the solder does not rise through the through-hole 43 during the solder flow,
Voids are generated.

Therefore, in the fifth embodiment, the IC
A heat sink 50 was used below the chip 45. This heat sink 50 is also used in a conventional structure for temporarily absorbing heat when the IC chip 45 generates a large amount of power in a short time. When such an IC chip 45 is mounted, a new heat sink 50 is used. It is not an additional constituent material. However, the conventional heat sink has a generally box shape, but the heat sink of the present embodiment employs a structure in which a groove 51 is provided on the lower surface so as not to close the opening of the through hole 43.

In this case, when the heat sink 50 is bonded to the printed circuit board 41 and the IC chip 45 is bonded to the heat sink 50, the solder flow is performed.
The through hole 43 of the printed circuit board 41 is a heat sink 5
Since the opening is formed through the groove 51, the solder rises through the through hole 43 during the flow of the solder.
At this time, since the solder also spreads and fills the groove 51 of the heat sink 50, the heat conducting effect and the heat absorbing effect of the heat sink 50 are also improved.

According to such a configuration, the through hole 43 and the heat sink 5 can be formed while employing the conventional manufacturing method.
Since the groove 51 can be filled with the solder without voids, the heat dissipation of the IC chip 45 can be easily increased.

In this case, the shape of the heat sink 50 is not limited to the shapes shown in FIGS. 13 and 14, and may be any shape as long as it forms a passage for the opening of the through hole 43. Good. In the present embodiment, the sealing resin 47 needs to be applied so as not to close the passage of the through hole 43 by the groove 51 of the heat sink 50.

(Sixth Embodiment) Next, a sixth embodiment of the present invention will be described with reference to FIG. 15, which schematically shows a cross section of a semiconductor device. In the fifth embodiment, processing such as forming a groove in the heat sink is performed. However, the present embodiment is characterized in that a conventional heat sink having a simple box shape is used.

That is, by forming a convex portion 52 (corresponding to a spacer member) partially on the surface of the printed board 41 and mounting the heat sink 53 thereon, a gap is formed between the printed board 41 and the heat sink 53. A portion is formed, and a passage for the through hole 43 is formed through the gap. The projection 52 can be formed by dam silk printing. This dam silk printing is used in the ordinary COB mounting structure, and is used to form a frame formed by printing around the IC chip to stop the flow of the liquid sealing resin, and the height is It is about several tens μm to several hundred μm. By simultaneously printing the projections 52 during the dam silk printing, the steps and costs do not increase. Of course, the projection 52 may be formed by ordinary silk printing, but in this case, the height of the projection 52 is reduced.

According to such a configuration, the same function and effect as in the fifth embodiment can be obtained. In addition, the convex portion 52
Printed circuit board 4 by bonding small insulating parts
1 may be provided.

Since the lower surface of the heat sink 53 may be flat, the present invention can be applied to a configuration in which the IC chip 45 is directly mounted on the printed circuit board 41 without using the heat sink 53. In this case, if the lower surface of the IC chip 44 is made of a material that can be solder-bonded, the solder by flow solder is directly bonded to the IC chip 45, so that the heat conduction effect is enhanced.

Further, a gap may be formed between the IC chip 45 and the printed board 41 by forming a bump on the lower surface of the IC chip 45. Further, the heat sink 53 or the IC chip 45 is attached to the printed circuit board 41.
In this case, if the opening of the through hole 43 is not closed, it may be bonded to the convex portion, or may be directly bonded to the surface of the printed circuit board 41.

When the heat sink 53 or the IC chip 45 is connected to the printed circuit board 41 by soldering,
Solder can be joined only to the electrodes on the printed circuit board 41, but if the height of the projections 52 is sufficiently high and the height of the printed solder paste is lower than that, it is possible to join only by printing on the electrodes. Therefore, as shown in FIG. 16, the solder paste 54 (corresponding to a spacer member) protrudes onto the projection 52 and is printed. At this time, it is necessary to prevent the solder paste 54 from blocking the through hole 43.

Further, a gap may be formed between the IC chip 45 and the printed board 41 by using a solder or an adhesive (corresponding to a spacer member). That is, FIG.
As shown in FIG. 7, the solder (or the adhesive) 55 is partially applied or printed so as not to block the opening of the through hole 43 and is reflowed in a state where the IC chip 45 is mounted, thereby joining to the printed circuit board 41. I do.

At this time, the solder (or the adhesive) 55 does not spread over the entire surface of the IC chip 45 and a gap is formed, and the height of the gap is secured by the bonding height of the solder or the adhesive. .

According to such a configuration, the through hole 43 can be filled with the solder without voids without using a specially shaped heat sink or joining a special component on the printed circuit board 41. Therefore, the heat dissipation of the IC chip 45 can be improved.

When the IC chip 45 is soldered to the printed circuit board 41, the molten solder has a property of spreading laterally on the electrodes, so that the electrode pattern on the printed circuit board is formed as shown in FIG. It is desirable to separate and form the electrode 56 connected to 43 and the electrode 57 (corresponding to a metal pattern) to which the solder is joined. Also, in any of the configurations, the sealing resin needs to be applied so as not to block the through hole of the through hole as in the fifth embodiment.

(Seventh Embodiment) Next, a seventh embodiment in which the present invention is applied to a molded IC will be described with reference to FIG. 19 schematically showing a cross section of a semiconductor device. That is, the IC chip 45 is mounted on the heat sink 50 having the same shape as that of the fifth embodiment via the lead frame 58, and the electrodes on the IC chip 45 are connected to the lead frames 59 and 60 by the wires 45. Have been.

Here, the entire IC chip 45 is packaged with resin, and the molded IC 61 having such a configuration is formed.
The lower surface of the heat sink 50 is exposed from the lower surface of the substrate. In this case, in a state where the mold IC 61 is mounted on the printed board 41, the through holes 43 formed in the printed board 41 communicate with the grooves 51 of the heat sink 50.

Then, the mold IC 6 having such a configuration is formed.
When the solder 1 flows, the solder rises in the through hole 43 and spreads and fills the groove 51 of the heat sink 50.

According to such a configuration, the mold IC 6
Since the solder flow can be performed in a state where 1 is mounted on the printed circuit board 41, the same operation and effect as in the sixth embodiment can be obtained. Note that even when the molded IC 61 does not have a heat sink, a similar effect can be obtained by providing a groove or the like on the lower surface of the molded IC 61 itself.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a cross section of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a schematic view showing a cross section of a semiconductor device according to a second embodiment of the present invention;

FIG. 3 is a perspective view of a semiconductor device.

FIG. 4 is a side view of an integrated IC chip and a heat sink.

FIG. 5 is a schematic view showing a cross section of a semiconductor device according to a third embodiment of the present invention.

FIG. 6 is a side view showing an IC chip and a heat sink in a modified embodiment.

FIG. 7 is a plan view of an IC chip and a heat sink in a modified embodiment.

FIG. 8 is a view corresponding to FIG. 7, showing a modified embodiment.

FIG. 9 is a diagram corresponding to FIG. 5, showing a modified embodiment.

FIG. 10 is a diagram corresponding to FIG. 5, showing a modified embodiment.

FIG. 11 is a schematic view showing a cross section of a semiconductor device according to a fourth embodiment of the present invention.

FIG. 12 is a view showing a manufacturing process.

FIG. 13 is a perspective view showing a semiconductor device according to a fifth embodiment of the present invention.

FIG. 14 is a schematic view illustrating a cross section of a semiconductor device.

FIG. 15 is a schematic view showing a cross section of a semiconductor device according to a sixth embodiment of the present invention.

FIG. 16 is a schematic view showing a cross section of a printed circuit board according to a modified embodiment.

FIG. 17 is a schematic view showing a cross section of a printed circuit board according to a modified embodiment.

FIG. 18 shows an electrode.

FIG. 19 is a schematic view showing a cross section of a mold IC according to a seventh embodiment of the present invention.

FIG. 20 is a schematic view showing a cross section of a semiconductor device in a conventional example.

FIG. 21 is a diagram corresponding to FIG. 20, showing another conventional example.

FIG. 22 is a diagram corresponding to FIG. 20, showing another conventional example.

FIG. 23 is a diagram corresponding to FIG. 20, showing another conventional example.

FIG. 24 is a diagram corresponding to FIG. 20 showing another conventional example.

[Explanation of symbols]

21 is a printed circuit board (wiring board), 22 is an IC chip (semiconductor element), 26 is a heat dissipation layer (high heat conduction area), 27
Is a through hole, 28 is a high heat conduction area, 29 is a heat dissipating member, 31 is a printed board (wiring board), 33 is an IC chip (semiconductor element), 34 is a heat sink, 41 is a printed board (wiring board), and 43 is a through board. A hole, 44 is solder, 45 is an IC chip (semiconductor element), 50 is a heat sink, 52 is a projection (spacer member), 53 is a heat sink, 54 is a solder paste (spacer member), 55 is a solder (spacer member), 56 Is an electrode (metal pattern),
61 is a mold IC.

Claims (14)

[Claims] 1. A semiconductor device having a configuration in which heat of a semiconductor element mounted on a wiring board is radiated through a high heat conduction area provided in the wiring board, wherein heat is transferred to the high heat conduction area on the wiring board. A semiconductor device comprising: a heat-dissipating member provided in a semiconductor device. 2. The heat radiation member is formed in a shape surrounding the semiconductor element.
13. The semiconductor device according to claim 1. 3. A method of manufacturing a semiconductor device having a configuration in which heat of a semiconductor element mounted on a wiring board is radiated through a heat sink, wherein a part of the semiconductor element protrudes from a lower surface of the semiconductor element. A method of manufacturing a semiconductor device, comprising: bonding a heat sink; and adhering a portion of the semiconductor element protruding from the heat sink to the wiring substrate in a state where the heat sink is inserted into a hole formed in the wiring substrate. . 4. A method of forming a metal film on an inner peripheral surface of a hole of the wiring board, and soldering the wiring board instead of bonding a protruding portion of the heat sink in the semiconductor element to the wiring board. 4. The method according to claim 3, wherein the gap between the heat sink and the inner peripheral surface of the hole is filled with solder. 5. A metal film is formed on an inner peripheral surface of a hole of the wiring board, and instead of bonding a protruding portion of the heat sink in the semiconductor element to the wiring board, a solder paste is provided on a tip end of the heat sink. 4. A gap between the heat sink and the inner peripheral surface of the hole is filled with solder by reflowing the wiring board after inserting the wiring board into the hole of the wiring board in a state where the solder is applied. Of manufacturing a semiconductor device. 6. A method of manufacturing a semiconductor device having a configuration in which heat of a semiconductor element mounted on a wiring board is radiated through a through hole of the wiring board. A method for manufacturing a semiconductor device, wherein the semiconductor device is mounted on the wiring board after filling. 7. A method for manufacturing a semiconductor device having a configuration in which heat of a semiconductor element mounted on a wiring board via a heat sink is radiated through the heat sink and through holes of the wiring board, wherein the heat sink is provided on a lower surface of the heat sink. The method is characterized in that the formed groove is bonded to the wiring board in a state of communicating with the through hole of the wiring board, and then the wiring board is subjected to a solder flow to fill the grooves of the through hole and the heat sink with solder. Manufacturing method of a semiconductor device. 8. A method of manufacturing a semiconductor device having a configuration in which heat of a semiconductor element mounted on a wiring board is radiated through through holes of the wiring board, wherein a gap is provided between the semiconductor element and the wiring board by a spacer member. A method of manufacturing the semiconductor device, wherein the solder is filled in the through-hole and the gap between the semiconductor element and the wiring board by solder-flowing the wiring board after mounting in a state where a portion is formed. . 9. A method for manufacturing a semiconductor device having a configuration in which heat of a semiconductor element mounted on a wiring board via a heat sink is radiated through the heat sink and through holes of the wiring board. After mounting with a gap formed between the wiring board and the board, the gap between the through hole and the heat sink and the wiring board is filled with solder by performing a solder flow on the wiring board. A method for manufacturing a semiconductor device. 10. The method of manufacturing a semiconductor device according to claim 8, wherein said spacer member is a protrusion provided on said wiring board or on a lower surface of said semiconductor element. 11. The method according to claim 8, wherein the spacer member is an adhesive. 12. The semiconductor device according to claim 12, wherein the spacer member is a solder paste, and the semiconductor element or the heat sink is held in a state in which a gap is formed between the spacer and the wiring board by reflowing the wiring board. Claim 8
Or a method for manufacturing a semiconductor device according to item 9. 13. The metal pattern to which the solder paste is applied is provided separately from the metal pattern connected to the through hole.
3. The method for manufacturing a semiconductor device according to item 2. 14. The semiconductor device according to claim 7, wherein the semiconductor element is molded in a state of being thermally integrated with the heat sink, and the heat sink is exposed to the outside from the molded package. A method for manufacturing a semiconductor device according to claim 9.