JPH11330119A - Bump bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a bump bonding device capable of stably recognizing a position by a recognition camera, without sharply increasing cost and capable of stably feeding a bonding wire to a bonding work mechanism. SOLUTION: In this bump bonding device, a camera unit 40 provided with a recognition camera 24 capable of recognizing the position of an IC chip to be bonded, and a lens barrel for the camera 24 forms bumps on a wafer loaded on a bonding stage 10 by a bonding head 11 arranged on the upper part of the bonding work mechanism. In this case, the camera 24 is fixed on the upper part of a base material of the head 11, and the lens barrel is arranged coaxially on the front side of the camera 24 with the camera 24 and fixed on the base member by plural points, consisting of a point near to a base end part connected to the camera 24 and a prescribed point ahead of the nearby point.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bump bonding apparatus for forming a bump for electrical connection on an electrode portion of an IC chip by a bonding head by a wire bonding technique, and more particularly to a bump bonding apparatus in which a wafer before being divided into each IC chip. The present invention relates to a bump bonding apparatus for forming a bump.

[0002]

2. Description of the Related Art In recent years, in particular, focusing on portable devices,
Various electronic devices are required to be further reduced in size and weight, and accordingly, ICs built in these electronic devices are required.
Chips are also significantly reduced in size. Therefore, IC
When providing bumps on the electrode portions of the chip, each IC chip obtained by dividing the wafer by dicing is
Bump bonders that transfer individual chips to the bonding stage, position and perform bonding are inferior in production efficiency, and are not easy to handle when transferring IC chips or transporting them using trays. Various technical difficulties arise, such as difficulty in good positioning.

Therefore, it is conceivable to form bumps on each IC chip in a state of a wafer before the IC chips are separated into individual chips by dicing. But,
As described below, even when bumps are formed directly on the wafer in the state of a wafer, there are various technical problems that are different from the case of the separated individual IC chip. It is necessary to solve these problems. The inventor of the present application has made intensive studies on such a problem, and proposed a bump bonder and a bump forming method capable of effectively coping with these technical problems in Japanese Patent Application No. 3-323064.

When bumps are formed on a wafer using the above-described bump bonder, the tip of the bonding wire is positioned above the bonding target electrode portion of the IC chip on the wafer with the wafer fixed to the bonding stage. Ultrasonic vibration is applied to the ball formed by melting the tip of the wire using a horn of a bonding head, and the ball is thermocompression-bonded to the electrode to form a bump. The bonding head is provided with a recognition camera for recognizing the IC chip to be bonded and visually recognizing the bonding operation.

[0005] That is, as shown in FIG. 9, in the bonding head 61, the clamper 68 of the bonding wire 64 is located above the capillary 62 a provided at the tip of the ultrasonic horn 62. A camera unit 70 including a camera 74 and a lens barrel 71 for the camera 74 is arranged. At the front end of the lens barrel 71, a prism 72 that projects an IC chip to be recognized and a bonding operation to project the light on the recognition camera 74 side is attached.

The conventional bonding head 61 can be applied to either a long or short type lens barrel according to the specifications of the bonding operation and the like. The recognition camera 74 is fixed to an upper portion of a base member 75 of the bonding head 61 by an adapter 74. Have been. The lens barrel 71 is provided with the recognition camera 7.
The base member 7 is disposed coaxially with the camera 74 on the front side of the camera 4 and near the base end of the lens barrel 71 connected to the camera 74.
The cap 47 is fixed to an upper portion of the holder 47 integrally fastened and fixed to the holder 5.

[0007]

However, in the case of the conventional bonding head 61, the lens barrel 71 of the camera unit has a cantilever support structure supported at only one point near the base end as described above. Since it is supported, it is difficult to obtain a sufficiently stable support, and the lens barrel 71 swings even with a relatively small vibration input. Such shake becomes more noticeable as the lens barrel becomes longer. On the other hand, since the recognition camera 74 mounted on the bonding head 61 has to perform the position recognition of the IC chip with high accuracy, the visual field is usually narrow, and when the lens barrel 71 shakes, the shake becomes too large. If not, I should be aware
In some cases, the recognition location of the C chip may be out of the field of view of the camera 74. To cope with this, it is conceivable to cope with the problem by using a recognition camera having a relatively wide field of view. However, such a recognition camera having a wide field of view is very expensive, so that there is a problem that the cost is high.

Since the bonding operation is performed on the high-temperature bonding stage 80, the camera unit 70 of the bonding head 61 and the ultrasonic horn 62 are also heated by heat radiation from the bonding stage 80. Thereby, the lens barrel 71 for the recognition camera 74
The ultrasonic horn 62 expands due to thermal expansion. However, if the thermal expansion becomes too large, there is a problem that the recognition accuracy of the camera 74 and the positional accuracy in the bonding operation are greatly affected.

On the other hand, a bonding wire (generally a thin wire made of gold (Au)) supplied to a bonding portion is stored in a state wound around a reel, and is blown up in a curved state by air to give a predetermined tension, and is floated. In this process, the paper is fed toward the clamper 62 above the capillary 62a, but there is a problem that the paper is charged with static electricity in the feeding process and is easily cut.

Further, a feed detection sensor for detecting the feeding state of the bonding wire is disposed near the wire feeding path. This sensor is provided in a state where the wire is blown up in a curved shape. It is known that the most stable detection can be performed when it is located immediately below the vertex. However, the reel that stores the bonding wire in a wound state is preferably disposed as high as possible in order to minimize the influence of heat from the bonding stage side. In this case, there is a problem that it is difficult to set the apex and the sensor position in a curved state of the wire so as to be aligned on a vertical line.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems. Particularly, it is possible to stably recognize a position by a recognition camera without causing a significant increase in cost, and to provide a bonding wire to a bonding operation mechanism. The basic purpose is to make it possible to stably feed the food.

[0012]

According to the present invention, a camera unit including a recognition camera capable of recognizing the position of an IC chip to be bonded and a lens barrel for the camera is provided. In a bump bonding apparatus configured to form a bump on a wafer on a bonding stage by a bonding head disposed above a working mechanism, the recognition camera is fixed to an upper portion of a base member of the bonding head,
The lens barrel is disposed coaxially with the camera in front of the recognition camera, and the lens barrel is connected to the base at a plurality of points near the base end connected to the recognition camera and at a predetermined position in front of the base. It is characterized by being fixed to a member.

In this manner, the lens barrel is fixed to the base member at a plurality of points near the base end connected to the recognition camera and at a predetermined point in front of the base, thereby providing the base end. As compared with the conventional case in which the cantilever is supported only at one point in the vicinity, sufficiently stable support can be obtained, and the deflection of the lens barrel can be effectively suppressed.

According to a second aspect of the present invention, a camera unit including a recognition camera capable of recognizing the position of an IC chip to be bonded and a lens barrel for the camera is provided by an ultrasonic horn for bonding work. In a bump bonding apparatus in which bumps are formed on a wafer on a bonding stage by a bonding head disposed above, a heat shield for reducing heat radiated from the bonding stage below the ultrasonic horn. A mechanism is provided.

As described above, by providing the heat shielding mechanism for reducing the radiant heat input from the bonding stage below the ultrasonic horn of the bonding head, the radiant heat input from the bonding stage to the ultrasonic horn is provided. Can be effectively suppressed, and it is possible to prevent the positional accuracy in the bonding operation from being significantly adversely affected by the radiation heat input.

Further, according to a third aspect of the present invention, in the second aspect of the present invention, an air pipe for supplying cooling air is disposed substantially along the lens barrel, and at least the air pipe faces the lens barrel. A plurality of air ejection ports are provided substantially along the lens barrel on the side of the lens.

By adopting such a configuration, it is possible to blow cooling air from the air outlet of the air pipe toward the lens barrel, thereby effectively suppressing the thermal expansion of the lens barrel for the recognition camera and improving the recognition accuracy of the camera. Can be prevented from being greatly adversely affected.

Further, in the invention according to claim 4 of the present application, the bonding wire stored in the reel in the wound state is blown up in a curved state by air by a wire tensioner and is floatingly supported with a predetermined tension to perform a bonding operation. In a bump bonding apparatus in which bumps are formed on a wafer on a bonding stage by a bonding head configured to be fed to a mechanism, the bonding during feeding is performed between the reel and the bonding operation mechanism. It is characterized in that a ground rod is provided for contacting the wire and grounding the static electricity of the wire.

As described above, by providing the grounding rod between the reel and the bonding operation mechanism, it is possible to effectively prevent the bonding wire from being easily broken by static electricity carried in the feeding process.

Further, according to a fifth aspect of the present invention, in the fourth aspect of the present invention, a feed detecting sensor capable of detecting a feeding state of the bonding wire is provided between the reel and the wire tensioner. When the bonding wire is blown up in a curved shape, the ground rod is located at the base end of the curved portion on the reel side such that the feed detection sensor is located substantially directly below the vertex of the curved portion of the wire. Or, it is characterized by being set in the vicinity thereof.

By adopting such a configuration, the feed detection sensor can be positioned substantially directly below the vertex of the curved portion of the wire in a state where the bonding wire is blown up in a curved shape, and the feeding state of the bonding wire can be changed. Detection can be performed stably and with high accuracy.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A typical embodiment of the present invention will be described below with reference to FIGS. First, the overall arrangement of the bump bonding apparatus according to the present embodiment will be described with reference to FIG. 1. A loading station 2 into which a carrier containing a wafer 1 is loaded, and a loading side at which a wafer drawn from the carrier is positioned. A transfer station 3, a bonding station 4 for forming bumps, a transfer station 5 on the unloading side where the wafer 1 on which bumps are formed is positioned, and the wafer 1 on which bumps are formed are sequentially accommodated in a carrier and unloaded. And unloading stations 6 are arranged at equal intervals on the line. At the front of the wafer 1 transfer line, there are provided unloading means 7 for unloading the wafer 1 from the loading station 2 to the loading transfer station 3 and insertion means for inserting the wafer 1 from the unloading transfer station 5 to the unloading station 6. 8 are provided. Further, a transfer means 9 for transferring the wafer 1 from the loading-side transfer station 3 to the bonding station 4 and transferring the wafer 1 from the bonding station 4 to the unloading-side transfer station 5 is provided at the front thereof. I have.

In the bonding station 4, a bonding stage 10 composed of a heat stage is provided for bonding by ultrasonic thermocompression bonding, and a bonding head 11 is provided behind the bonding stage. The bonding head 11 is supported so as to be movable in the XY2 directions, and has an X-axis motor 12a and a Y-axis motor 1a.
2b, it is mounted on an XY table 12 which can be moved and positioned at any position in the X and Y directions.

As shown in FIG. 2, the wire supply mechanism of the bonding head 11 includes a wire reel 13 storing a bonding wire 14 made of, for example, a gold (Au) thin wire in a wound state, and a wire reel 13 from the wire reel 13. Wire 1
4 is passed from above, and a bonding work mechanism 15 for bonding to the wafer 1 which is a bonding object on the bonding stage 10, and a middle part of the wire 14 from the wire reel 13 to the bonding work mechanism 15 is an upwardly curved state. Blow up with air 16 to wire 14
Tensioner 17 (first wire tensioner) for applying a predetermined tension to the wire, and a wire guide 18a of a clamper 18 in the bonding operation mechanism 15.
And a wire tensioner 21 (second wire tensioner) that applies upward tension to the wire 14 by exposing the wire 14 to the upwardly blown air 20 directly above the wire 14.
At 6 and 20, it is configured to be able to supply to the bonding work mechanism 15 without difficulty while floatingly supporting it so as to maintain a predetermined supply path and tension.

The wire reel 13 is supported by, for example, a base plate 31 formed by pressing a steel plate. The wire reel 13 is provided at an intermediate portion of a bracket 32 provided so as to protrude forward from the base plate 31. The one wire tensioner 17 is attached, and the second wire tensioner 21 is attached to the distal end side of the bracket 32. Above the first wire tensioner 17, a stopper 34 for regulating the wire 14 blown up by the blowing air 16 and 20 is provided. Further, a feed detection sensor 33 for detecting a feeding state of the bonding wire 14 is provided directly below the stopper 34. Usually, the bonding wire 14 is moved by the blowing air 16, 20 to the stopper 34.
In this embodiment, as described above, the wire 14 that has fallen is discharged from the wire reel 13 every time the feed detection sensor 33 detects the wire 14 that has fallen. Is supplied to control the operation of supplying the wire 14 to the bonding operation mechanism 15. Further, a wire regulating rod 35 for preventing the wire 14 from drooping excessively when the feeding is stopped is protruded from the base plate 31 obliquely below the front side of the wire reel 13 in the wire feeding direction. The wire 14 wound around the reel 13 is
Pulled out through the upper side of the.

Furthermore, in the present embodiment, the reel 1 is provided diagonally above the front side of the wire regulating rod 35, that is, the reel 1
3 and the bonding work mechanism 15, the ground plate 36 that contacts the feeding bonding wire 14 and grounds the static electricity of the wire 14 so that the ground rod 36 is substantially parallel to the wire regulating rod 35. 31 fixedly provided. The bonding wire 14 pulled out from the wire reel 13 passes under the ground bar 36,
It is fed to the bonding work mechanism 15 while maintaining the state of contact with the earth rod 36. By providing the ground bar 36 between the wire reel 13 and the bonding operation mechanism 15 in this way, it is possible to effectively prevent the bonding wire 14 from being easily cut by static electricity carried during the feeding process.

As shown in FIG. 3, when the bonding wire 14 is blown up by the second wire tensioner 17 in a curved shape, the feed detection sensor 33 detects the grounding rod 36 in the upwardly curved portion of the wire 14. The reel 1 of this curved portion is positioned almost directly below the apex.
The position is set at or near the base end on the third side. When the ground bar 36 is not provided, as shown by a virtual line in FIG.
Is difficult to set so that it is located on the vertical line of the vertex of the upwardly curved portion of the wire 14, and it is difficult to stably perform highly accurate detection.

In the present embodiment, by adopting the above-described configuration, the feed detection sensor 33 is positioned almost directly below the vertex of the curved portion of the wire 14 in a state where the bonding wire 14 is blown up in a curved shape. Therefore, the feeding state of the bonding wire 14 can be detected stably and with high accuracy.

On the other hand, the bonding operation mechanism 15
As shown in FIGS. 2 and 4, a ball 14a (FIG. 5) having a clamper 18 for gripping the wire 14 and a capillary 22a at the tip of which the wire 14 is inserted is formed.
Horn 22 for applying ultrasonic vibration and a torch 23 for discharging. As can be seen from FIG. 4, a recognition camera 24 for visually recognizing the state of the bonding operation is provided at the upper part, and displays a recognition image on a recognition monitor (not shown) and a data processing device (not shown). It is configured to input a recognition signal and perform data processing. Further, there are provided a vertically moving electromagnetic drive unit 25 for reciprocatingly rotating the bonding work mechanism 15 around a fulcrum shaft (not shown) to move the tip vertically, and an opening / closing electromagnetic drive unit (not shown) for opening and closing the clamper 18. ing. In this embodiment, the horn 22 is made of titanium in order to increase the speed of ultrasonic vibration by reducing the weight of the horn.

The bonding operation will be described with reference to FIG. 5. The wire 14 is sent out through a capillary 22a, and each time the bonding head 11 moves to a position facing a predetermined electrode 27 of the wafer 1, the torch 23 is moved.
The tip portion is melted by the spark current from, and a ball 14a is formed as shown in FIG. The position of the wire 14 facing each electrode 27 is controlled with high precision under the visual recognition of the recognition camera 24. Formed ball 1
4a is bonded to the electrode 27 of the wafer 1 by thermocompression bonding and ultrasonic vibration as shown in FIG. The pressing force at this time is preferably about 30 g to 50 g, the ultrasonic vibration is applied in the horizontal direction, the amplitude is 0.5 μm, the frequency is 60 to
70KH _Z (specific examples include 63.5KH _Z) is preferred to be about. Next, the upward movement of the clamper 18 and the capillary 22a holding the wire 14 causes
The wire 14 is cut as shown in FIG.
And a ball 14a and 30 μm to 4
A bump 28 having a protrusion length of about 60 μm and a wire portion 14 b protruding to a height of about 0 μm is formed. As the wire 14, a wire having a high Young's modulus and a low thermal conductivity is used so that the above-mentioned cutting is reliably performed at a predetermined position.

FIGS. 4 and 6 are a perspective view and a plan view of the bonding head 11, respectively. In this bonding head 11, the bonding wire 1 is placed above a capillary 22 a provided at the tip of the ultrasonic horn 22.
Four clampers 18 are located, and a camera unit 40 including a recognition camera 24 and a lens barrel 41 for the camera is disposed above the clampers 18. The recognition camera 24 is for performing recognition of an IC chip to be bonded and visual recognition of a bonding operation.
A prism 42 for projecting the C chip and the bonding work and making light incident on the recognition camera 24 side is attached. In the present embodiment, a heat shielding member 37 surrounding the prism 42 is provided to protect the prism 42 from thermal influence from the bonding stage 10.
In the middle of the lens barrel 41, there is provided a coaxial illumination means 43 for transmitting illumination light for illuminating an object at the time of recognition by the camera.
Are connected. The bonding head 11 can be applied to any type of lens barrel, either long or short, depending on the specifications of the bonding operation and the like.

The lens barrel 41 is disposed coaxially with the camera 24 in front of the recognition camera 24, and
The vicinity of the base end connected to the base member 45 is fixed to the upper part of a holder 47 integrally fastened and fixed to the base member 45 by a first cap 48. Furthermore, this lens barrel 41
A predetermined portion in front of the vicinity of the base end is fixed to an upper portion of the holder 47 by a second cap 49. FIG. 7 is an exploded perspective view of the lens barrel 41 and a holder 47 for holding the lens barrel 41 fixedly. As described above, the lens barrel 41 is connected to a plurality of points (in the present embodiment, two points) in the vicinity of the base end connected to the recognition camera 24 and at a predetermined part in front thereof.
By fixing the base member 45 to the base member 45 at the point), it is possible to obtain a sufficiently stable support as compared with the related art in which only one point near the base end is cantilevered,
The deflection of the lens barrel 41 can be effectively suppressed. As a result, without replacing the recognition camera 24 with a very expensive type having a wide field of view, a problem such as the recognition position of the IC chip to be recognized being deviated from the field of view of the camera 24 due to the shake of the lens barrel 41 occurs. Can be prevented. That is, it is possible to maintain the accuracy of the position recognition in the bonding operation without causing a significant increase in cost due to the camera change.

In this embodiment, a heat shielding mechanism 38 is provided below the ultrasonic horn 22 as a means for reducing the heat radiated from the bonding stage 10. Thereby, the heat input from the bonding stage 10 to the ultrasonic horn 22 can be effectively suppressed, and it is possible to prevent the positional accuracy in the bonding operation from being significantly adversely affected by the heat input.

Further, as can be clearly seen from FIG. 6, an air pipe 39 for supplying cooling air substantially along the lens barrel 41.
Are provided, and a plurality of air ejection ports 39 a are provided substantially along the lens barrel 41 on the side of the air pipe 39 facing the lens barrel 41. Thereby, the air ejection port 3 of the air pipe 39
Cooling air can be blown from 9a toward the lens barrel 41, effectively suppressing the thermal expansion of the lens barrel 41 for the recognition camera 24, and preventing the recognition accuracy of the camera 24 from being significantly adversely affected. .

FIG. 8 shows a bonding head according to another embodiment of the present invention. This bonding head 51
In the above, a long type lens barrel 53 is used, and the lens barrel 53 is
A first cap 58 is fixed to an upper portion of a holder 57 integrally fastened and fixed to a base member 55 near a base end portion connected to the recognition camera 54. The lens barrel 53 is fixed to the holder 57 by second and third caps 59 and 60 at two predetermined portions ahead of the lens barrel 53, respectively. That is, in this embodiment, the lens barrel 53 is fixed to the base member 55 at three points. Thereby, even when the lens barrel is of a long type, sufficiently stable support can be obtained, and shake of the lens barrel can be effectively suppressed.

The present invention is not limited to the illustrated embodiment, and it goes without saying that various improvements and design changes can be made without departing from the gist of the present invention.

[0037]

According to the first aspect of the present invention, the recognition camera is fixed to the upper portion of the base member of the bonding head, and the lens barrel is disposed coaxially with the camera in front of the recognition camera. The lens barrel is located at a plurality of points near the base end connected to the recognition camera and at a predetermined portion in front of the base.
Since it is fixed to the base member, it is possible to obtain a sufficiently stable support as compared with the conventional case where the cantilever is supported only at one point only near the base end, and the deflection of the lens barrel is effectively reduced. Can be suppressed. As a result, without replacing the recognition camera with a very expensive type having a wide field of view, it is possible to prevent the occurrence of problems such as the recognition position of the IC chip to be recognized being out of the field of view of the camera due to the deflection of the lens barrel. . That is, the accuracy of position recognition in the bonding operation can be maintained without causing a significant increase in cost due to camera change.

According to the second aspect of the present invention, a camera unit including a recognition camera capable of recognizing the position of an IC chip to be bonded and a lens barrel for the camera is provided by an ultrasonic horn for bonding work. In a bump bonding apparatus in which bumps are formed on a wafer on a bonding stage by a bonding head disposed above, a heat shield for reducing heat radiated from the bonding stage below the ultrasonic horn. Since the mechanism is provided, the heat input from the bonding stage to the ultrasonic horn can be effectively suppressed, and it is possible to prevent the position accuracy in the bonding operation from being adversely affected by the heat input.

Further, according to the third aspect of the present invention, an air pipe for supplying cooling air is provided substantially along the lens barrel, and a plurality of air outlets are provided at least on the side of the air pipe facing the lens barrel. Is provided substantially along the lens barrel, so that cooling air can be blown from the air outlet of the air pipe toward the lens barrel, thereby effectively suppressing the thermal expansion of the lens barrel for the recognition camera. It is possible to prevent the recognition accuracy from being significantly adversely affected.

Further, according to the fourth invention of the present application,
The bonding wire stored on the reel in the wound state
A bump is formed on a wafer on a bonding stage by a bonding head configured to be blown up in a curved state by air by a wire tensioner and fed to a bonding work mechanism while being floatingly supported with a predetermined tension. In the bump bonding apparatus, since the grounding rod is provided between the reel and the bonding operation mechanism to contact the bonding wire being fed and ground the static electricity of the wire, the bonding wire is borne in the feeding process. It is possible to effectively prevent the film from being easily cut by static electricity.

Further, according to the fifth invention of the present application,
A feed detection sensor is provided between the reel and the wire tensioner to detect a feeding state of the bonding wire. The grounding rod is connected to the wire when the bonding wire is blown up in a curved shape. So that it is located just below the vertex of the curved part of
Since the position is set at or near the base end of the curved portion on the reel side, the feed detection sensor is positioned substantially directly below the vertex of the curved portion of the wire with the bonding wire blown up in a curved shape. Thus, the feeding state of the bonding wire can be detected stably and with high accuracy.

[Brief description of the drawings]

FIG. 1 is a plan view showing an overall arrangement of a bump bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a wire supply mechanism in the bonding head according to the embodiment of the present invention.

FIG. 3 is an explanatory diagram showing a state in which a bonding wire is blown up in a curved shape in the wire supply mechanism.

FIG. 4 is a perspective view of the bonding head.

5A and 5B show a bonding operation process according to the embodiment, wherein FIG. 5A is a sectional view of a ball forming process, FIG. 5B is a sectional view of a process of joining a ball to an electrode, and FIG. FIG. 5 is a cross-sectional view of a step of forming a bump by pressing.

FIG. 6 is a plan view of the bonding head.

FIG. 7 is an exploded perspective view of a lens barrel and a holder for holding the lens barrel in the bonding head.

FIG. 8 is a perspective view of a bonding head according to another embodiment of the present invention.

FIG. 9 is a perspective view of a conventional bonding head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Wafer 10 ... Bonding stage 11 ... Bonding head 13 ... Wire reel 14 ... Bonding wire 15 ... Bonding work mechanism 17, 21 ... Wire tensioner 22 ... Ultrasonic horn 24 ... Recognition camera 33 ... Feed detection sensor 36 ... Ground rod 38 ... Heat shielding mechanism 39 Air pipe 39a Air outlet 40 Camera unit 45 Base member

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shinji Kanayama 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (5)

[Claims] 1. A wafer mounted on a bonding stage by a bonding head having a recognition unit capable of recognizing the position of an IC chip to be bonded and a camera unit having a lens barrel for the camera disposed above a bonding operation mechanism. A bump bonding apparatus configured to form a bump with respect to the recognition camera, wherein the recognition camera is fixed to an upper portion of a base member of the bonding head, and the lens barrel is disposed coaxially with the camera in front of the recognition camera. A bump bonding apparatus, wherein the lens barrel is fixed to the base member at a plurality of points near a base end connected to a recognition camera and at a predetermined point in front of the base. 2. A bonding head having a camera unit having a recognition camera capable of recognizing the position of an IC chip to be bonded and a lens barrel for the camera, which is disposed above an ultrasonic horn for bonding work. In a bump bonding apparatus configured to form bumps on a wafer on a stage, a heat shielding mechanism for reducing heat input from the bonding stage is provided below the ultrasonic horn. Bump bonding equipment. 3. An air pipe for supplying cooling air substantially along the lens barrel, and a plurality of air ejection ports provided substantially along the lens barrel on at least a side of the air pipe facing the lens barrel. The bump bonding apparatus according to claim 2, wherein 4. A bonding apparatus in which a bonding wire stored in a reel in a wound state is blown up by air by a wire tensioner into a curved state, and is supplied to a bonding operation mechanism while being floatingly supported with a predetermined tension. In a bump bonding apparatus in which a head forms bumps on a wafer on a bonding stage, a contact is made between the reel and the bonding operation mechanism with a bonding wire being fed to ground the static electricity of the wire. A bump bonding apparatus comprising a ground rod. 5. A feed detecting sensor for detecting a feeding state of the bonding wire is provided between the reel and the wire tensioner, and the ground rod is provided in a state where the bonding wire is blown up in a curved shape. 5. The bump according to claim 4, wherein the feed detection sensor is positioned at or near a base end of the curved portion on the reel side so as to be located substantially directly below a vertex of the curved portion of the wire. Bonding equipment.