JPH11330110A - Method for supplying solder and semiconductor assembling device - Google Patents
Method for supplying solder and semiconductor assembling deviceInfo
- Publication number
- JPH11330110A JPH11330110A JP15371198A JP15371198A JPH11330110A JP H11330110 A JPH11330110 A JP H11330110A JP 15371198 A JP15371198 A JP 15371198A JP 15371198 A JP15371198 A JP 15371198A JP H11330110 A JPH11330110 A JP H11330110A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- mounting
- powdery
- semiconductor
- supplying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半田供給方法及び
半導体組立装置に関し、特に半導体チップやセラミック
部品等の搭載部品を、パッケージ等の搭載対象上に供給
した半田で固定する際に利用する技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder supply method and a semiconductor assembling apparatus, and more particularly to a technique used when a mounted component such as a semiconductor chip or a ceramic component is fixed by solder supplied onto a mounting target such as a package. About.
【０００２】[0002]
【従来の技術】半導体チップやセラミック部品をパッケ
ージ上に実装する場合、従来の技術では、ＡｕＳｎ等の
半田片を半田リールより切り出してパッケージ上に供給
し、その上にチップ等の部品を位置決めした後に搭載
し、窒素雰囲気中にて加熱加圧して接合を行っている。2. Description of the Related Art When a semiconductor chip or a ceramic component is mounted on a package, in the conventional technique, a solder piece such as AuSn is cut out from a solder reel and supplied to a package, and a component such as a chip is positioned thereon. It is mounted later and joined by heating and pressing in a nitrogen atmosphere.
【０００３】図３は、従来の半導体組立装置を示す。こ
の装置は、半田片供給機構１４によって半田リール１９
の帯状半田をカッター１８にて所定長さに切り出し、半
田供給ヘッド１５の先端の半田吸着ノズル１６が移動機
構１２によって半田片供給機構１４上部へ移動している
状態で下降し、半田片１７を吸着して搭載ステージ４上
のセラミックパッケージ３へ移動機構１２によって移送
して供給を行う。FIG. 3 shows a conventional semiconductor assembly apparatus. This apparatus uses a solder piece supply mechanism 14 to control a solder reel 19.
Is cut out to a predetermined length by a cutter 18, and the solder suction nozzle 16 at the tip of the solder supply head 15 is moved down by the moving mechanism 12 to the upper portion of the solder piece supply mechanism 14, and the solder piece 17 is removed. It is sucked and transferred to the ceramic package 3 on the mounting stage 4 by the moving mechanism 12 and supplied.
【０００４】位置決めステージ９上の部品６を搭載ヘッ
ド５によって搭載ステージ４へ供給し、半田の融点以上
に加熱を行って半田を溶解しながら、部品６をセラミッ
クパッケージ３に対して平行なまま加圧して半田層を同
一の厚さにのばして接合を行う。[0004] The component 6 on the positioning stage 9 is supplied to the mounting stage 4 by the mounting head 5, and is heated above the melting point of the solder to melt the solder, while the component 6 is applied in parallel with the ceramic package 3. Pressure is applied to spread the solder layer to the same thickness for joining.
【０００５】このとき、窒素雰囲気形成機構１３により
窒素雰囲気が形成されているため、溶解した半田は酸化
皮膜を形成することなく接合を行うことができる。At this time, since the nitrogen atmosphere is formed by the nitrogen atmosphere forming mechanism 13, the melted solder can be joined without forming an oxide film.
【０００６】半田片１７が十分に溶解して広がった後、
セラミックパッケージ３全体を冷却して半田の融点以下
まで温度を下げて半田が凝固した後、搭載ヘッド５を上
昇させ接合が完了する。After the solder pieces 17 have sufficiently melted and spread,
After cooling the entire ceramic package 3 and lowering the temperature to below the melting point of the solder to solidify the solder, the mounting head 5 is raised to complete the joining.
【０００７】[0007]
【発明が解決しようとする課題】こうした従来の半導体
組立装置では、チップ等の部品６の大きさが微小化する
と、それにあわせて供給する半田量も少なくする必要が
あるが、微小な半田片１７を安定して供給することが難
しく供給過剰になりやすいという問題がある。In such a conventional semiconductor assembling apparatus, when the size of the component 6 such as a chip is reduced, the amount of solder to be supplied must be reduced accordingly. There is a problem that it is difficult to stably supply, and the supply tends to be excessive.
【０００８】また、微小な半田片を切断する工程、搬送
する工程を必要とするため、それらの工程において機械
的なミスが生じることがある上に、切断工程及び搬送工
程にも時間がかかり、能率的でないといった問題があ
る。Further, since a step of cutting and conveying a minute solder piece is required, a mechanical error may occur in those steps, and the cutting step and the conveying step take time. There is a problem that it is not efficient.
【０００９】よって、本発明は、安定した半田の供給を
行え、かつ、半田供給能率も良い半田供給方法及び半導
体組立装置を提供することを課題とする。Accordingly, an object of the present invention is to provide a solder supply method and a semiconductor assembling apparatus which can supply solder stably and have good solder supply efficiency.
【００１０】[0010]
【課題を解決するための手段】前記課題を解決するた
め、本発明では、半導体チップやセラミック部品等の搭
載部品を、パッケージ等の搭載対象上に供給した半田で
固定する際に、搭載対象上に粉末状半田を直接供給して
加熱する方法とした。その場合、供給すべき前記粉末状
半田を圧縮空気等の高圧気体の噴射によって吸引し、噴
射ノズルを用いて前記搭載対象上に噴射又は散布するこ
とにより供給することもできる。また、搭載対象を、予
め粉末状半田の融点付近まで加熱して置くこともでき
る。また、粉末状半田を供給する前に、必要な供給量を
計量してから供給することもできる。さらに、粉末状半
田の供給後に、その粉末状半田に超音波を印加すること
もできる。一方、本発明の半導体組立装置は、半導体チ
ップやセラミック部品等の搭載部品を供給する搭載ヘッ
ドと、パッケージ等の搭載対象上に粉末状半田を供給す
る噴射ノズルを有する半田噴射ヘッドと、搭載対象を加
熱する手段とを備えたことを特徴とする。ここで、半田
噴射ヘッドは、供給すべき粉末状半田を圧縮空気等の高
圧気体の噴射によって吸引する噴射ノズルを用いて搭載
対象上に噴射又は散布する機能を有する構成とすること
もできる。また、加熱手段は、搭載対象を、予め粉末状
半田の融点付近まで加熱する機能を有するのが好適であ
る。また、半田噴射ヘッドは、粉末状半田を供給する前
に、必要な供給量を計量してから供給するための計量供
給手段を有する構成とすることもできる。搭載ヘッド
は、搭載部品を搭載対象に対して平行な状態を維持した
まま接合を行う機能を有する構成とするのが好ましい。
さらに、搭載ヘッドは、搭載部品を搭載対象に対して加
圧したまま接合を行う機能を有する構成とするのがさら
に好ましい。また、搭載対象に対する搭載部品の接合時
に、半田の酸化を防止するための窒素雰囲気形成機構を
有する構成とするのが好ましい。In order to solve the above-mentioned problems, according to the present invention, when a mounting component such as a semiconductor chip or a ceramic component is fixed by solder supplied onto the mounting target such as a package, the mounting target is fixed. In this method, powdery solder was directly supplied to the substrate and heated. In this case, the powdery solder to be supplied may be suctioned by jetting a high-pressure gas such as compressed air or the like, and then supplied or sprayed onto the mounting target by using a jet nozzle. Also, the mounting target can be heated and placed in advance near the melting point of the powdery solder. Further, before supplying the powdery solder, a necessary supply amount can be measured and then supplied. Further, after supplying the powdery solder, an ultrasonic wave can be applied to the powdery solder. On the other hand, a semiconductor assembling apparatus of the present invention includes a mounting head for supplying a mounting component such as a semiconductor chip and a ceramic component, a solder injection head having an injection nozzle for supplying powdery solder onto a mounting target such as a package, And means for heating. Here, the solder ejection head may be configured to have a function of ejecting or dispersing the powdery solder to be supplied onto a mounting target by using an ejection nozzle that sucks the powdered solder by injection of a high-pressure gas such as compressed air. Further, it is preferable that the heating means has a function of preliminarily heating the mounting target to around the melting point of the powdery solder. Further, the solder ejecting head may be configured to have a metering / supplying unit for measuring and supplying a required supply amount before supplying the powdery solder. It is preferable that the mounting head has a function of joining the mounted components while keeping the mounted components parallel to the mounting target.
Further, it is more preferable that the mounting head has a function of performing the bonding while the mounting component is pressed against the mounting target. In addition, it is preferable to adopt a configuration having a nitrogen atmosphere forming mechanism for preventing the oxidation of the solder when the mounting component is joined to the mounting target.
【００１１】[0011]
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照して説明する。図１は半導体組立装置の要
部の拡大図で（ａ）は粉末状の半田を供給している状態
を示す一部断面正面図、（ｂ）は部品供給状態を示す正
面図、図２は半導体組立装置の全体構成を示す外観図で
ある。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an enlarged view of a main part of a semiconductor assembling apparatus, in which (a) is a partial cross-sectional front view showing a state in which powdery solder is supplied, (b) is a front view showing a component supply state, and FIG. FIG. 1 is an external view showing an overall configuration of a semiconductor assembling apparatus.
【００１２】（実施の形態１）本実施の形態に係る半導
体組立装置は、セラミックパッケージ上に光半導体素子
を実装したＳｉ基板等と同じく、光半導体素子を実装し
たセラミック部品を実装するための装置である。(Embodiment 1) A semiconductor assembling apparatus according to the present embodiment is an apparatus for mounting a ceramic component on which an optical semiconductor element is mounted, like a Si substrate or the like on which an optical semiconductor element is mounted on a ceramic package. It is.
【００１３】即ち、この装置は、上下の移動機構を有し
半田微粉末２−ａを一定量噴射することができる半田噴
射ヘッド１０と、半田微粉末を噴射する噴射ノズル１
と、セラミックパッケージ３を加熱するためのヒータ１
１と、適正な搭載位置へ移動することができるＸＹθ位
置補正機構８と、ヒータ１１及びＸＹθ位置補正機構８
を有する搭載ステージ４と、上下に移動する機構を有
し、半導体素子・セラミック部品６等を位置決めステー
ジ９から搭載ステージ４へ供給する搭載ヘッド５と、搭
載ヘッド５及び半田噴射ヘッド１０をＸ方向に移動させ
ることができる移動機構１２とを備える構成である。That is, this apparatus has a vertical movement mechanism and is capable of injecting a fixed amount of the solder fine powder 2-a, and an injection nozzle 1 for injecting the solder fine powder.
And a heater 1 for heating the ceramic package 3
1, an XYθ position correcting mechanism 8 capable of moving to an appropriate mounting position, a heater 11 and an XYθ position correcting mechanism 8
And a mounting head 5 that has a mechanism for moving up and down and supplies semiconductor elements and ceramic components 6 and the like from the positioning stage 9 to the mounting stage 4, and mounts the mounting head 5 and the solder ejection head 10 in the X direction. And a moving mechanism 12 that can move the moving mechanism 12.
【００１４】さらに、フラックス等を用いないで接合す
るために、ＡｕＳｎ半田粉末を用い、搭載ステージ４周
辺に搭載時のみ酸素濃度が１００ｐｐｍ以下となる窒素
雰囲気を形成するための窒素雰囲気形成機構１３を有す
る。Further, in order to perform bonding without using a flux or the like, a nitrogen atmosphere forming mechanism 13 for forming a nitrogen atmosphere having an oxygen concentration of 100 ppm or less around the mounting stage 4 using AuSn solder powder only during mounting is provided. Have.
【００１５】噴射ノズル１は、図５のように、圧縮空気
供給口２３より圧縮空気を送り込み、空気噴射ノズル２
１より圧縮空気を噴射すると、空気噴射ノズル２１周辺
部の圧力降下により半田供給口２２より半田微粉末を吸
い込む構造になっている。７は、位置計測用のＣＣＤカ
メラを示している。The injection nozzle 1 feeds compressed air from a compressed air supply port 23 as shown in FIG.
When the compressed air is injected from No. 1, the fine powder is sucked from the solder supply port 22 by the pressure drop around the air injection nozzle 21. Reference numeral 7 denotes a CCD camera for position measurement.
【００１６】次に、本実施の形態に係る半導体組立装置
の動作について説明する。まず、図２中の搭載ステージ
４上にセラミックパッケージ３を、位置決めステージ９
上に半導体素子、セラミック部品等の搭載部品（以下搭
載部品と称する）６をセットする。Next, the operation of the semiconductor assembling apparatus according to the present embodiment will be described. First, the ceramic package 3 is placed on the mounting stage 4 in FIG.
A mounting component (hereinafter, referred to as mounting component) 6 such as a semiconductor element and a ceramic component is set thereon.
【００１７】搭載部品６、セラミックパッケージ３の位
置をそれぞれＣＣＤカメラ７にて認識して位置を計測
し、ＸＹθ位置補正機構８にて位置補正を行う。The positions of the mounted component 6 and the ceramic package 3 are recognized by the CCD camera 7 to measure the positions, and the XYθ position correcting mechanism 8 corrects the positions.
【００１８】移動機構１２によって半田噴射ヘッド１０
をセラミックパッケージ３上の位置へ移動させ、半田噴
射ヘッド１０と共に噴射ノズル１を下降させる。The solder ejection head 10 is moved by the moving mechanism 12.
Is moved to a position on the ceramic package 3 and the ejection nozzle 1 is lowered together with the solder ejection head 10.
【００１９】ここで、噴射ノズル１は、圧縮空気供給口
２３より圧縮空気を送り込み、空気噴射ノズル２１より
圧縮空気を噴射すると、空気噴射ノズル２１周辺部の圧
力降下により半田供給口２２より半田微粉末を吸い込む
構造になっているので、圧縮空気の供給時間によって、
噴射ノズル１からの半田微粉末の供給量を変化させるこ
とができる。よって、この噴射ノズル１から一定量の半
田微粉末２−ａを噴射する。Here, the injection nozzle 1 sends compressed air from the compressed air supply port 23 and injects compressed air from the air injection nozzle 21. Because it has a structure that sucks powder, depending on the supply time of compressed air,
The supply amount of the solder fine powder from the injection nozzle 1 can be changed. Therefore, a fixed amount of the solder fine powder 2-a is injected from the injection nozzle 1.
【００２０】セラミックパッケージ３は、搭載ステージ
４に内蔵されたヒータ１１により半田の融点付近（融点
−１０〜２０℃程度）まで加熱されているため、半田微
粉末を噴射しＰＫＧ（パッケージ）に接触したときに半
田微粉末が軟化して２−ｂのようにＰＫＧ表面になじむ
ため、半田微粉末の飛散を防止することができる。Since the ceramic package 3 is heated to the vicinity of the melting point of the solder (the melting point is about -10 to 20 ° C.) by the heater 11 built in the mounting stage 4, the ceramic package 3 is sprayed with the solder fine powder to come into contact with the PKG (package). Then, the solder fine powder is softened and conforms to the PKG surface like 2-b, so that scattering of the solder fine powder can be prevented.
【００２１】搭載ヘッド５にて位置決めステージ９から
搭載部品６を吸着して、半田微粉末２−ｂ上にその搭載
部品６をセラミックパッケージ３に対して平行になるよ
うに下降させて搭載する。このとき、搭載部品６、及び
セラミックパッケージ３の周辺は窒素雰囲気形成機構１
３によって窒素雰囲気に形成されている。The mounting component 6 is sucked from the positioning stage 9 by the mounting head 5, and the mounting component 6 is lowered and mounted on the solder fine powder 2-b so as to be parallel to the ceramic package 3. At this time, the components 6 and the periphery of the ceramic package 3 are surrounded by the nitrogen atmosphere forming mechanism 1.
3 form a nitrogen atmosphere.
【００２２】半田の融点以上に加熱を行って半田を溶解
しながら、搭載部品６をセラミックパッケージ３に対し
て平行なまま加圧して半田層を同一の厚さにのばして接
合を行う。このとき、窒素雰囲気が形成されているた
め、溶解した半田は酸化皮膜を形成することなく接合を
行うことができる。While the solder is melted by heating to a temperature equal to or higher than the melting point of the solder, the mounting component 6 is pressed in parallel with the ceramic package 3 to extend the solder layer to the same thickness and to perform bonding. At this time, since the nitrogen atmosphere is formed, the melted solder can be joined without forming an oxide film.
【００２３】半田が十分に溶解して広がった後、セラミ
ックパッケージ３全体を冷却して半田の融点以下まで温
度を下げて半田が凝固した後、搭載ヘッド５を上昇させ
ることで接合が完了する。After the solder is sufficiently melted and spread, the entire ceramic package 3 is cooled, the temperature is lowered to the melting point of the solder or lower, and the solder is solidified. Then, the mounting head 5 is raised to complete the joining.
【００２４】本実施の形態によれば、噴射ノズル１から
噴射される半田微粉末２−ａの量で半田の供給量を制御
できるため、安定した半田供給を行うことができる。そ
して、このように半田微粉末で供給するので、微小な半
田片を切断する工程や、搬送する工程が不要になり、従
来のように切断時・搬送時に生じていた機械的なミスを
根本的になくすことが可能になる、さらに、半田微粉末
を直接供給するので、切断、搬送にかかっていた供給時
間を短縮して供給能率を格段に向上させることが可能に
なる。According to the present embodiment, the supply amount of the solder can be controlled by the amount of the solder fine powder 2-a injected from the injection nozzle 1, so that a stable supply of the solder can be performed. And since the solder powder is supplied in this way, the step of cutting and transporting minute solder pieces is not required, and the mechanical mistakes that occurred during cutting and transport as in the past are fundamentally eliminated. Furthermore, since the solder fine powder is directly supplied, the supply time required for cutting and transporting can be reduced, and the supply efficiency can be significantly improved.
【００２５】（実施の形態２）先の実施の形態１におい
て、半田による接合方法が熱圧着ではなく、図４のよう
に搭載部品６を吸着する搭載ヘッド部分を角錐型のコレ
ットにして、超音波印加による接合方法とすることも有
効である。(Embodiment 2) In Embodiment 1 described above, the bonding method using solder is not thermocompression bonding, but the mounting head portion for sucking the mounting component 6 is made into a pyramid-shaped collet as shown in FIG. It is also effective to use a bonding method by applying sound waves.
【００２６】即ち、本実施の形態では、図２における搭
載ヘッド５を、角錐コレット２０と超音波を発生する超
音波ユニットに代えた構成としたものである。その他の
構成については、図２で示した半導体組立装置の構成と
基本的に同様であるので、同一符号を付してその説明を
省略する。That is, in this embodiment, the mounting head 5 in FIG. 2 is replaced with a pyramid collet 20 and an ultrasonic unit for generating ultrasonic waves. The other configuration is basically the same as the configuration of the semiconductor assembling apparatus shown in FIG. 2, and thus the same reference numerals are given and the description is omitted.
【００２７】本実施の形態の動作について説明する。ま
ず、図４中の搭載ステージ４上にセラミックパッケージ
３を、位置決めステージ９上に半導体素子、セラミック
部品等の搭載部品６をセットする。搭載部品６、セラミ
ックパッケージ３の位置をそれぞれＣＣＤカメラ７にて
認識して位置を計測し、ＸＹθ位置補正機構８にて位置
補正を行う。The operation of this embodiment will be described. First, the ceramic package 3 is set on the mounting stage 4 in FIG. 4, and the mounting components 6 such as semiconductor elements and ceramic components are set on the positioning stage 9. The positions of the mounted component 6 and the ceramic package 3 are recognized by the CCD camera 7 to measure the positions, and the XYθ position correcting mechanism 8 performs position correction.
【００２８】移動機構１２によって噴射ノズル１をセラ
ミックパッケージ３上の位置へ移動させ、半田噴射ヘッ
ド１０を下降させて図１のように噴射ノズル１から一定
量の半田微粉末２−ａを噴射する。セラミックパッケー
ジ３は搭載ステージ４に内蔵されたヒータ１１により半
田の融点以上（融点＋１０〜２０℃程度）まで加熱され
ているため、半田微粉末を噴射しＰＫＧに接触したとき
に半田微粉末は溶解して２−ｃのようにＰＫＧ表面に付
着する。The injection nozzle 1 is moved to a position on the ceramic package 3 by the moving mechanism 12, and the solder injection head 10 is lowered to inject a predetermined amount of the solder fine powder 2-a from the injection nozzle 1 as shown in FIG. . Since the ceramic package 3 is heated by the heater 11 built in the mounting stage 4 to a temperature equal to or higher than the melting point of the solder (melting point + about 10 to 20 ° C.), the fine solder powder is melted when the fine solder powder is ejected and comes into contact with the PKG. Then, it adheres to the PKG surface like 2-c.
【００２９】搭載ヘッド５にて位置決めステージ９から
搭載部品６を吸着して、溶解した半田微粉末２−ｃ上に
搭載部品６をセラミックパッケージ３に対して平行にな
るように下降させて搭載する。搭載部品６をセラミック
パッケージ３に対して平行なまま加圧して超音波を印加
して半田層を同一の厚さにのばして接合を行う。The mounting component 6 is sucked from the positioning stage 9 by the mounting head 5, and the mounting component 6 is lowered and mounted on the melted solder fine powder 2-c so as to be parallel to the ceramic package 3. . The mounting component 6 is pressed in parallel to the ceramic package 3 and ultrasonic waves are applied to spread the solder layer to the same thickness and perform bonding.
【００３０】半田が十分に溶解して広がった後、セラミ
ックパッケージ３全体を冷却して半田の融点以下まで温
度を下げて半田が凝固した後、搭載ヘッド５を上昇させ
て接合を完了する。After the solder is sufficiently melted and spread, the entire ceramic package 3 is cooled and the temperature is lowered to the melting point or less of the solder to solidify the solder. Then, the mounting head 5 is raised to complete the joining.
【００３１】（実施の形態３）図６は、本発明で適用可
能な噴射ノズル１の他の実施の形態を示す断面図であ
る。同図から理解できるように、この噴射ノズル１は、
先の実施の形態で示した図５の吸引式の噴射ノズル１を
９０゜傾け（横に寝かせ）、噴射ノズル１の先端に下方
屈曲ノズル２４を取り付けた構成としたものである。こ
の場合、噴射ノズル１の移動時等における半田微粉末の
落下を減少または無くすことができる。(Embodiment 3) FIG. 6 is a sectional view showing another embodiment of the injection nozzle 1 applicable to the present invention. As can be understood from FIG.
The suction type injection nozzle 1 shown in FIG. 5 shown in the previous embodiment is inclined by 90 ° (side down), and the downwardly bent nozzle 24 is attached to the tip of the injection nozzle 1. In this case, it is possible to reduce or eliminate the fall of the solder fine powder when the spray nozzle 1 moves.
【００３２】（実施の形態４）また、図７のように、図
５のような噴射ノズル１において、圧縮空気の流量では
なく、半田微粉末の体積または重量を計量して噴射ノズ
ル１へと供給する計量供給手段２５を設け、計量した半
田微粉末を噴射ノズル１によって噴射する構成とするの
も大変有効である。これにより、半田微粉末の供給量を
さらに高精度に行うことが可能になる。(Embodiment 4) In addition, as shown in FIG. 7, in the injection nozzle 1 as shown in FIG. 5, the volume or weight of the solder fine powder is measured instead of the flow rate of the compressed air. It is also very effective to provide the metering / supplying means 25 for supplying and inject the measured solder fine powder by the injection nozzle 1. Thus, the supply amount of the solder fine powder can be more accurately performed.
【００３３】[0033]
【発明の効果】以上のように、本発明によれば、次のよ
うな効果が得られる。 （１） 噴射ノズルから噴射される半田微粉末の量で半
田の供給量を制御できため、安定した半田供給を行うこ
とができる。 （２） 微小なソルダ片を切断、搬送することがなくな
るため、切断時・搬送時の機械的なミスを防ぐことがで
る。 （３） 切断、搬送にかかっていた時間を短縮できる。As described above, according to the present invention, the following effects can be obtained. (1) Since the supply amount of the solder can be controlled by the amount of the solder fine powder injected from the injection nozzle, stable solder supply can be performed. (2) Since it is no longer necessary to cut and transport minute solder pieces, it is possible to prevent mechanical errors during cutting and transport. (3) The time required for cutting and transporting can be reduced.
【図１】本発明の実施の形態に係る半導体組立装置の要
部の拡大図で、（ａ）は半田供給状態を示す一部断面正
面図、（ｂ）は搭載部品搬送状態を示す正面図である。FIG. 1 is an enlarged view of a main part of a semiconductor assembling apparatus according to an embodiment of the present invention, wherein (a) is a partial cross-sectional front view showing a solder supply state, and (b) is a front view showing a mounted component transport state. It is.
【図２】本発明の実施の形態１に係る半導体組立装置の
全体構成図である。FIG. 2 is an overall configuration diagram of a semiconductor assembly device according to the first embodiment of the present invention.
【図３】従来の半導体組立装置を示す全体構成図であ
る。FIG. 3 is an overall configuration diagram showing a conventional semiconductor assembly device.
【図４】本発明の実施の形態２に係る半導体組立装置の
全体構成図である。FIG. 4 is an overall configuration diagram of a semiconductor assembling apparatus according to a second embodiment of the present invention.
【図５】本発明の実施の形態に係る噴射ノズルの断面図
である。FIG. 5 is a cross-sectional view of the injection nozzle according to the embodiment of the present invention.
【図６】本発明の実施の形態３に係る噴射ノズルの断面
図である。FIG. 6 is a sectional view of an injection nozzle according to Embodiment 3 of the present invention.
【図７】本発明の実施の形態４に係る半導体組立装置の
要部の構成図である。FIG. 7 is a configuration diagram of a main part of a semiconductor assembling apparatus according to a fourth embodiment of the present invention.
１ 噴射ノズル ２−ａ 半田微粉末 ２−ｂ、２−ｃ 軟化した半田微粉末 ３ セラミックパッケージ ４ 搭載ステージ ５ 搭載ヘッド ６ 搭載部品 ７ ＣＣＤカメラ ８ 位置補正機構 ９ 位置決めステージ １０ 半田噴射ヘッド １１ ヒータ １２ 移動機構 １３ 窒素雰囲気形成機構 １４ 半田片供給機構 １５ 半田供給ヘッド １６ 半田吸着ノズル １７ 半田片 １８ カッター １９ 半田リール ２０ 角錐コレット ２１ 空気噴射ノズル ２２ 半田供給口 ２３ 圧縮空気供給口 ２４ 屈曲ノズル ２５ 計量供給手段 DESCRIPTION OF SYMBOLS 1 Injection nozzle 2-a Solder fine powder 2-b, 2-c Softened solder fine powder 3 Ceramic package 4 Mounting stage 5 Mounting head 6 Mounting component 7 CCD camera 8 Position correction mechanism 9 Positioning stage 10 Solder injection head 11 Heater 12 Moving mechanism 13 Nitrogen atmosphere forming mechanism 14 Solder piece supply mechanism 15 Solder supply head 16 Solder suction nozzle 17 Solder piece 18 Cutter 19 Solder reel 20 Pyramid collet 21 Air injection nozzle 22 Solder supply port 23 Compressed air supply port 24 Bending nozzle 25 Metering supply means
Claims (12)
部品を、パッケージ等の搭載対象上に供給した半田で固
定する際に、搭載対象上に粉末状半田を直接供給して加
熱することを特徴とする、半田供給方法。When a mounting component such as a semiconductor chip or a ceramic component is fixed with solder supplied onto a mounting target such as a package, powdery solder is directly supplied onto the mounting target and heated. The solder supply method.
の高圧気体の噴射によって吸引し、噴射ノズルを用いて
前記搭載対象上に噴射又は散布することにより供給する
ことを特徴とする、請求項１記載の半田供給方法。2. The method according to claim 1, wherein the powdery solder to be supplied is sucked by jetting a high-pressure gas such as compressed air or the like, and is supplied by jetting or spraying onto the mounting target using an jet nozzle. Item 4. The solder supply method according to Item 1.
付近まで加熱して置くことを特徴とする、請求項１又は
２記載の半田供給方法。3. The solder supply method according to claim 1, wherein the mounting object is heated in advance to near the melting point of the powdery solder.
供給量を計量してから供給することを特徴とする、請求
項１〜３の何れかに記載の半田供給方法。4. The solder supply method according to claim 1, wherein a necessary supply amount is measured and supplied before supplying the powdery solder.
半田に超音波を印加することを特徴とする、請求項１〜
４の何れかに記載の半田供給方法。5. An ultrasonic wave is applied to the powdery solder after the supply of the powdery solder.
5. The method for supplying solder according to any one of 4.
部品を供給する搭載ヘッドと、パッケージ等の搭載対象
上に粉末状半田を供給する噴射ノズルを有する半田噴射
ヘッドと、搭載対象を加熱する手段とを備えたことを特
徴とする、半導体組立装置。6. A mounting head for supplying a mounting component such as a semiconductor chip or a ceramic component, a solder injection head having an injection nozzle for supplying powdery solder onto a mounting target such as a package, and a means for heating the mounting target. A semiconductor assembling apparatus comprising:
状半田を圧縮空気等の高圧気体の噴射によって吸引する
噴射ノズルを用いて前記搭載対象上に噴射又は散布する
機能を有することを特徴とする、請求項６記載の半導体
組立装置。7. The solder ejection head has a function of ejecting or dispersing the powdery solder to be supplied onto the mounting target by using an ejection nozzle that suctions the solder by injection of a high-pressure gas such as compressed air. The semiconductor assembly apparatus according to claim 6, wherein
粉末状半田の融点付近まで加熱する機能を有することを
特徴とする、請求項６又は７記載の半導体組立装置。8. The semiconductor assembling apparatus according to claim 6, wherein said heating means has a function of preheating the mounting object to a temperature near the melting point of the powdery solder.
給する前に、必要な供給量を計量してから供給するため
の計量供給手段を有することを特徴とする、請求項６〜
８の何れかに記載の半導体組立装置。9. The solder jet head according to claim 6, further comprising a metering / supplying unit for measuring a required supply amount before supplying the powdery solder and then supplying the measured amount.
9. The semiconductor assembling apparatus according to any one of 8.
載対象に対して平行な状態を維持したまま接合を行う機
能を有することを特徴とする、請求項６〜９の何れかに
記載の半導体組立装置。10. The semiconductor according to claim 6, wherein the mounting head has a function of performing bonding while keeping a mounted component parallel to the mounting target. Assembly equipment.
載対象に対して加圧したまま接合を行う機能を有するこ
とを特徴とする、請求項６〜９の何れかに記載の半導体
組立装置。11. The semiconductor assembly apparatus according to claim 6, wherein the mounting head has a function of performing bonding while pressing a mounted component on the mounting target.
接合時に、半田の酸化を防止するための窒素雰囲気形成
機構を有することを特徴とする、請求項６〜１１の何れ
かに記載の半導体組立装置。12. The semiconductor assembly apparatus according to claim 6, further comprising a nitrogen atmosphere forming mechanism for preventing oxidation of solder at the time of bonding the mounted component to the mounted object. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15371198A JP3119238B2 (en) | 1998-05-20 | 1998-05-20 | Solder supply method and semiconductor assembly device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15371198A JP3119238B2 (en) | 1998-05-20 | 1998-05-20 | Solder supply method and semiconductor assembly device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11330110A true JPH11330110A (en) | 1999-11-30 |
| JP3119238B2 JP3119238B2 (en) | 2000-12-18 |
Family
ID=15568435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15371198A Expired - Fee Related JP3119238B2 (en) | 1998-05-20 | 1998-05-20 | Solder supply method and semiconductor assembly device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3119238B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011003580A (en) * | 2009-06-16 | 2011-01-06 | Denso Corp | Mounting apparatus of semiconductor chip, and method of manufacturing semiconductor device |
-
1998
- 1998-05-20 JP JP15371198A patent/JP3119238B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011003580A (en) * | 2009-06-16 | 2011-01-06 | Denso Corp | Mounting apparatus of semiconductor chip, and method of manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3119238B2 (en) | 2000-12-18 |
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