JPH11329884A - Sputtering film forming method and manufacture of magnetoresistive thin film magnetic head material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely prevent abnormal electric discharge from occurring in a sputtering process, where a magnetic film is formed so as to protect the mag netic film against defects caused by abnormal discharge in its characteristics or form. SOLUTION: An alumina film 2 is previously formed on the surface of an Al2 O3 .TiC board 1 to serve as a base. Furthermore, a conductive film 6 is previously formed on the alumina film 2. In a sputtering device, the board 1 is positioned and held by a board holder 3. The board holder 3 is made of metal and grounded. The peripheral surface and upside outer edge of the board 1 are pressed down by the board holder 3. In this state, a magnetic film 4 is formed on the alumina film 2 by sputtering. Then, electric charge accumulated on the magnetic film 4 is made to flow through a route, conductor material to board holder 3 to grounding, whereby abnormal discharge can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a film by sputtering and a method for manufacturing a material for a magnetoresistive (MR) type thin-film magnetic head, and more particularly, to a method in which an alumina film is sputtered on a substrate and a magnetic film is formed on the alumina film. The improvement of the process technology for sputtering.

[0002]

2. Description of the Related Art As is well known, the material of an MR type thin film magnetic head is manufactured by the following steps. That is, after forming an alumina film on the surface of the substrate by sputtering, a magnetic film is formed by sputtering. The magnetic film here is a sendust film.

An alumina film and a magnetic film are formed in multiple layers on a substrate having a large area, and a large number of MR thin-film magnetic head elements are produced using these materials. At this time, in order to mass-produce a high-performance magnetic head element with good yield, it is extremely important to form a uniform and defect-free magnetic film on the alumina film on the substrate surface.

As a conventional example of a manufacturing process of a magnetic film which is a main component of the present invention, as shown in FIG. 1, for example, sputtering is performed in a state where an alumina film 2 serving as a base is already formed on the surface of an Altic substrate 1. Attach to the device. That is, the Altic substrate 1 is positioned and held by the substrate holder 3. At this time, the substrate holder 3 is adjusted so as to press the outer peripheral surface and the outer peripheral upper surface of the substrate 1. In this state, the magnetic film 4 is formed on the alumina film 2 by sputtering.

[0005]

In the above-mentioned sputtering process for forming the magnetic film 4, there is a problem that static electricity causes defects in the characteristics and shape of the magnetic film 4 easily. When the growing magnetic film 4 is gradually charged and the amount of charge of the magnetic film 4 increases, an abnormal discharge occurs between the substrate holder 3 and the magnetic film 4. When such abnormal discharge occurs, the magnetic film 4 does not become a smooth film, but a bumpy defect occurs, and the magnetic characteristics are also deteriorated.

Conventionally, the following countermeasures have been taken in order to prevent a reduction in yield due to abnormal discharge in the sputtering process of the magnetic film 4. That is, as shown in FIG. 2A, the substrate holder 3 is made of metal and is connected to ground. In addition, a conductive material 5 is applied so as to extend over the inner peripheral edge of the holder 3 holding the substrate 1 and the upper surface of the substrate 1. By doing so, the electric charge charged on the magnetic film 4 is released from the conductive material 5 → the substrate holder 3 → the ground.

Although this measure is reasonably effective, it remains inadequate. That is, as shown in FIG. 2B, when the discharge path of the applied conductive material 5 is interrupted, the charge of the magnetic film 4 may not be discharged smoothly, and the charge amount may continue to increase. When the amount of charge of the magnetic film 4 increases, abnormal discharge occurs, and the abnormal discharge causes the conductive material to scatter, thereby further expanding the defects of the magnetic film 4.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to reliably prevent abnormal discharge in a sputtering process of a magnetic film and to cause a characteristic defect and a shape defect in the magnetic film due to the abnormal discharge. It is an object of the present invention to provide a sputtering film forming method and a method of manufacturing a material for a magnetoresistive thin-film magnetic head which can prevent the occurrence of cracks.

[0009]

In order to achieve the above object, a sputter film forming method according to the present invention is a sputter film forming method for forming a predetermined film by sputtering on a surface of a substrate. Requirements (1) to (4) are provided (claim 1). (1) As a pre-process, a conductive film is formed on the surface of the substrate. (2) In the process of forming the predetermined film on the conductive film, the substrate is positioned and held in a sputtering apparatus by a substrate holder made of a conductive member. (3) The substrate holder presses the substrate by abutting on a peripheral portion of the conductive film on the substrate surface. (4) The substrate holder is grounded.

Further, according to a method of manufacturing a material for a magnetoresistive thin film magnetic head according to the present invention, an alumina film is formed on a surface of a substrate by sputtering, and then a magnetic film is formed on the alumina film by sputtering. A method of manufacturing a material for a magnetic head, wherein the method has the following requirements (5) to (8). (5) In a process before forming the magnetic film, a conductive film is formed on the alumina film of the substrate. (6) In the process of forming the magnetic film on the conductive film, the substrate is positioned and held in a sputtering apparatus by a substrate holder made of a conductive member. (7) The substrate holder presses the substrate by contacting a peripheral portion of the conductive film on the substrate surface. (8) The substrate holder is grounded.

Since a conductive film is formed on the surface of the substrate and the substrate holder is in contact with the conductive film,
The substrate can be dropped from the conductive film to the ground via the substrate holder, and the electric charge does not accumulate in the film being formed, and is discharged through the above-described path.

[0012]

FIG. 3 shows an outline of a magnetic film sputtering process to which the present invention is applied. An alumina film 2 serving as a base is already formed on the surface of the Altic substrate 1. In addition, a conductive film 6 such as Ti is formed on the alumina film 2.
Is also formed in advance. The formation of this conductive film 6 in advance clearly shows the feature of the present invention. The conductive film 6 is formed on the entire surface of the Altic substrate 1. In this embodiment, the entire surface is used. However, as long as it covers at least the alumina film 2, it is not necessary to cover the entire surface of the Altic substrate 1.

In the sputtering apparatus, the Altic substrate 1 on which each of the above films is formed is positioned and held by the substrate holder 3. At this time, the substrate holder 3 presses the outer peripheral surface and the outer peripheral upper surface of the Altic substrate 1.
Further, the substrate holder 3 is made of metal and is grounded. Then, the conductive film 6 is formed on the entire surface of the Altic substrate 1.
Is formed, the entire surface of the substrate contact portion of the substrate holder 3 comes into contact with the conductive film 6.

In this state, the magnetic film 4 is formed on the alumina film 2.
Is formed by sputtering.

The magnetic film 4 grows on the conductive film 6, and the conductive film 6 has the substrate holder 3 as described above.
Are in contact with each other, the substrate holder 3 is grounded. Therefore, magnetic film 4 → conductive film 6 → substrate holder 3 →
Since there is a reliable discharge path connected to the ground, the magnetic film 4
Is not charged.

Further, in the above-described embodiment, an example in which the present invention is applied to a manufacturing process of a magnetoresistive thin-film magnetic head has been described.
Applicable to process.

[0017]

As described in detail above, according to the present invention, abnormal discharge in the sputtering step of the magnetic film can be reliably prevented, and characteristic defects and shape defects are generated in the magnetic film by the abnormal discharge. Can be prevented.
Therefore, the production yield of the magnetoresistive thin-film magnetic head and the like is improved.

[Brief description of the drawings]

FIG. 1 is a schematic explanatory view showing a conventional technique of a magnetic film forming process.

FIG. 2 is a diagram illustrating another conventional process.

FIG. 3 is a schematic explanatory view showing a magnetic film forming process to which the present invention is applied.

[Explanation of symbols]

 1 Altic substrate 2 Alumina film (underlying film) 3 Substrate holder 4 Magnetic film 6 Conductive film

Claims (2)

[Claims] 1. A method for forming a predetermined film by sputtering on a surface of a substrate, the method comprising:
To (4). (1) As a pre-process, a conductive film is formed on the surface of the substrate. (2) In the process of forming the predetermined film on the conductive film, the substrate is positioned and held in a sputtering apparatus by a substrate holder made of a conductive member. (3) The substrate holder presses the substrate by abutting on a peripheral portion of the conductive film on the substrate surface. (4) The substrate holder is grounded. 2. A material for a magnetoresistive thin-film magnetic head in which an alumina film is formed on a surface of a substrate by sputtering, and then a magnetic film is formed on the alumina film by sputtering while applying a magnetic field in a certain direction to the substrate. , Characterized by having the following requirements (5) to (8). (5) In a process before forming the magnetic film, a conductive film is formed on the alumina film of the substrate. (6) In the process of forming the magnetic film on the conductive film, the substrate is positioned and held in a sputtering apparatus by a substrate holder made of a conductive member. (7) The substrate holder presses the substrate by contacting a peripheral portion of the conductive film on the substrate surface. (8) The substrate holder is grounded.