JPH11325846A - Interference measuring method of large diameter plane - Google Patents

Interference measuring method of large diameter plane

Info

Publication number
JPH11325846A
JPH11325846A JP10138489A JP13848998A JPH11325846A JP H11325846 A JPH11325846 A JP H11325846A JP 10138489 A JP10138489 A JP 10138489A JP 13848998 A JP13848998 A JP 13848998A JP H11325846 A JPH11325846 A JP H11325846A
Authority
JP
Japan
Prior art keywords
plane
measurement
measured
scanning
laser light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10138489A
Other languages
Japanese (ja)
Other versions
JP3232340B2 (en
Inventor
Koji Tenjinbayashi
孝二 天神林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP13848998A priority Critical patent/JP3232340B2/en
Publication of JPH11325846A publication Critical patent/JPH11325846A/en
Application granted granted Critical
Publication of JP3232340B2 publication Critical patent/JP3232340B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To enable precise measurement of a large diameter plane, mike a reference plane unnecessary, and simplify the constitution of a measuring apparatus, by dividing a plane to be measured into many fine planes to be measured, and measuring all the fine planes to be measured by the scanning with a transverse shear interferometer. SOLUTION: A laser light outputted from a laser light source 7 is made a parallel light by a collimator lens 8, reflected by a plane 17 to be measured, reflected by the surface and the back of a parallel surface plate 9, and divided into a reference light wave surface A and an object light wave surface. These interfere with each other, and interference fringes are formed, which are detected by a detector 13. The width of an aperture 14 for measurement of a transversal shear interferometer head 4 is (d). The plane 17 is divided into fine planes 18 to be measured which have a width (d). The interferometer head 4 is made to approach the plane 17, and moved along a scanning rail, by every d/2 in the (x) direction and the (y) direction. As a result, the interference fringes are obtained on the whole surface of the plane to be measured. Each of the measurement results of the fine planes 18 is inputted in a control unit 5 and analyzed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】この発明は大口径平面干渉測定法
に関するものである。この発明は半導体産業や光学機械
産業において利用することができる。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a large-diameter plane interference measurement method. The present invention can be used in the semiconductor industry and the optical machine industry.

【0002】[0002]

【従来の技術】例えば半導体産業においては256Mb
itにおよぶメモリの集積化が進み、これに対して現状
でのマスクパタンの露光条件は直径30cmに及ぶシリ
コンウェ−ファ−に対して焦点深度±0.5ミクロンと
厳しくなり、それに対応する精度でウェ−ファ−の形状
を測定する必要がある。
2. Description of the Related Art In the semiconductor industry, for example, 256 Mb
On the other hand, the integration condition of the memory has progressed, and the exposure condition of the mask pattern under the current condition becomes strict with a depth of focus of ± 0.5 μm for a silicon wafer having a diameter of 30 cm, and the precision corresponding thereto It is necessary to measure the shape of the wafer.

【0003】このウェ−ファ−の場合を含めて平面の形
状を測定する場合には光干渉計は、、光学部品などの鏡
面などの被測定平面の形状を、非接触で、高精度に、し
かも全面同時に計測できるため、極めて有効な検査手段
となっている。通常、平面はフィゾ−干渉計によって計
測される。フィゾ−干渉計は直径10cm程度の鏡面の
平面度を非接触で高精度に計測することができ、既に国
内外の数社が装置を市販している。
When measuring the shape of a plane including this wafer, the optical interferometer is capable of measuring the shape of a plane to be measured such as a mirror surface of an optical component with high accuracy without contact. In addition, since the measurement can be performed on the entire surface at the same time, it is an extremely effective inspection means. Typically, the plane is measured by a Fizeau-interferometer. The Fizeau interferometer can measure the flatness of a mirror surface having a diameter of about 10 cm in a non-contact manner with high accuracy, and several companies in Japan and overseas have already marketed the apparatus.

【0004】[0004]

【解決すべき課題】しかし、このようなフィゾ−干渉計
で大きな平面を計測する場合、大口径高精度基準面と大
口径高精度レンズが必要で、特に前者は製作が大変難し
く、その結果装置も高価となり、また重量が大きくなり
装置も嵩張るため、問題となっている。また従来の小口
径フィゾ−干渉計を走査して、一部重複しながら部分的
に多数回測定して全体の形状を求める方法も考えられる
が、平面形状誤差の傾斜が大きい場合に、縞の本数が大
きくなりすぎて計測不能となってしまう。また走査時に
おける傾き誤差が不必要なティルト縞を生じ、その結果
縞の計測感度が場所によって変わることになり、計測精
度が悪くなる。
However, when measuring a large plane with such a Fizeau interferometer, a large-diameter high-precision reference plane and a large-diameter high-precision lens are required. Is expensive, and the weight is large and the device is bulky. A conventional method of scanning a small-diameter Fizeau-interferometer and partially measuring a plurality of times while partially overlapping to obtain the entire shape may be considered. The number becomes too large and measurement becomes impossible. In addition, an unnecessary tilt error at the time of scanning causes unnecessary tilt fringes, and as a result, the measurement sensitivity of the fringes changes depending on the location, and the measurement accuracy is deteriorated.

【0005】また大きな面積の平面度を測定する従来の
他の方法に斜入射干渉計があるが、これは全面同時に計
測できるが、感度がやや低いことと装置が嵩張るのが問
題である。
Another conventional method for measuring the flatness of a large area is a grazing incidence interferometer, which can simultaneously measure the entire surface, but has a problem in that the sensitivity is rather low and the apparatus is bulky.

【0006】このようなことから、高精度で大口径平面
の測定が可能であり、参照平面が不要であり、測定装置
の構成も簡単にすることができる大口径平面の測定技術
の開発が望まれている。
Accordingly, it is desired to develop a measuring technique for a large-diameter plane which can measure a large-diameter plane with high accuracy, does not require a reference plane, and can simplify the configuration of a measuring apparatus. It is rare.

【0007】この発明は上記の如き事情に鑑みてなされ
たものであって、高精度で大口径平面の測定が可能であ
り、参照平面が不要であり、測定装置の構成も簡単にす
ることができる大口径平面の干渉測定法を提供すること
を目的とするものである。
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is possible to measure a large-diameter plane with high accuracy, to eliminate the need for a reference plane, and to simplify the configuration of a measuring apparatus. It is an object of the present invention to provide a large-diameter plane interference measurement method that can be used.

【0008】[0008]

【課題を解決すべき手段】この目的に対応して、この発
明の大口径平面の干渉測定法は被測定平面を多数の微小
被測定面に区分し、横シア干渉計を前記被測定平面に走
査して前記全部の微小被測定面を横シア干渉により測定
し、微小被測定面についての測定結果を前記被測定平面
にわたって連結することを特徴としている。
To cope with this object, a large-diameter plane interference measuring method according to the present invention divides a plane to be measured into a large number of small planes to be measured, and attaches a lateral shear interferometer to the plane to be measured. The method is characterized in that scanning is performed to measure all the minute measurement surfaces by lateral shear interference, and the measurement results of the minute measurement surfaces are connected over the measurement surface.

【0009】また、この発明の横シア干渉計走査ヘッド
は、レ−ザ−光源と前記レ−ザ−光源から発したレ−ザ
−光を平行光にして測定用開口部を通して被測定平面に
照射する光学系と、前記被測定平面からの反射光を2分
割する平行平面板と、前記2分割された反射光の干渉縞
を検出する検出器とを取り付けており、かつ前記測定用
開口部を被測定平面と対向する部分に設けてあるフレ−
ムと、前記フレ−ムをガイドレ−ルに沿って移動させる
走査装置とを備えることを特徴としている。
In addition, the scanning head for a transverse shear interferometer according to the present invention converts a laser light source and laser light emitted from the laser light source into parallel light to pass through a measurement opening to a plane to be measured. An irradiating optical system, a plane-parallel plate that divides the reflected light from the plane to be measured into two parts, and a detector that detects interference fringes of the two-divided reflected lights, and the measurement opening Is provided on the part facing the plane to be measured.
And a scanning device for moving the frame along a guide rail.

【0010】[0010]

【実施の態様】以下、この発明の詳細を一実施例を示す
図面について説明する。図1において、1は干渉測定装
置である。干渉測定装置1は横シア干渉計2及び走査装
置3とを備えている。横シア干渉計2は横シア干渉計ヘ
ッド4及び制御装置5を備えている。横シア干渉計ヘッ
ド4はフレ−ム6内にレ−ザ−光源7、コリメ−タレン
ズ8、平行平面板9、結像レンズ11、フィルタ12及
びCCD画像検出器等の検出器13を備えている。フレ
−ム6には測定用開口部14が形成されていて、この測
定用開口部14を通して出射光及び反射光が出入りす
る。横シア干渉計ヘッド4は走査装置3の走査レ−ル1
5に沿って移動可能である。このような干渉測定装置1
を使用してこの発明の大口径平面の干渉測定法は次のよ
うにして行われる。横シア干渉法自体の平面測定の原理
は公知のものであるが、ここで略説すれば、レ−ザ光源
7から出射したレ−ザ光はコリメ−タレンズ8で平行光
となり、被測定平面17を照明して被測定平面17の影
響を受けて反射され、平行平面板9の表面と裏面で反射
されて基準光波面Aと物体光波面Bに2分割される。こ
れが干渉して形状誤差を表す干渉縞が形成され、この干
渉縞が検出器13で検出される。横シア干渉計ヘッド4
の測定用開口部14の幅をdとし、測定平面17を走査
方向の幅がdの多数の微小被測定面18に区分し、横シ
ア干渉計ヘッド4を測定対象物16の被測定平面17に
近接させ、走査レ−ル15に沿ってx方向にd/2ずつ
移動させて被測定平面全面について干渉縞画像を得る。
次に横シア干渉計ヘッド4を回転させてy方向にΔyの
大きさのシアを生じるようにし、同じくy方向にd/2
ずつ移動させて被測定平面全面について干渉縞画像を得
る。それぞれの微小被測定面18についての計測結果は
制御装置5に入力してこれらを解析することによって被
測定平面の平面度が検査できる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below with reference to the drawings showing one embodiment. In FIG. 1, reference numeral 1 denotes an interference measurement device. The interference measurement device 1 includes a lateral shear interferometer 2 and a scanning device 3. The lateral shear interferometer 2 includes a lateral shear interferometer head 4 and a control device 5. The transverse shear interferometer head 4 includes a laser light source 7, a collimator lens 8, a parallel plane plate 9, an imaging lens 11, a filter 12, and a detector 13 such as a CCD image detector in a frame 6. I have. A measurement opening 14 is formed in the frame 6, and outgoing light and reflected light enter and exit through the measurement opening 14. The transverse shear interferometer head 4 is the scanning rail 1 of the scanning device 3.
5 can be moved. Such an interference measuring device 1
The method for measuring the interference of a large-diameter plane according to the present invention is described below. Although the principle of the plane measurement of the transverse shear interferometry itself is known, the laser light emitted from the laser light source 7 is converted into parallel light by the collimator lens 8 and briefly described here. Is illuminated and reflected under the influence of the plane to be measured 17, reflected by the front and back surfaces of the plane-parallel plate 9, and divided into a reference light wavefront A and an object light wavefront B. This interferes to form an interference fringe representing a shape error, and this interference fringe is detected by the detector 13. Horizontal shear interferometer head 4
The width of the measurement opening 14 is d, the measurement plane 17 is divided into a number of minute measurement surfaces 18 having a width d in the scanning direction, and the horizontal shear interferometer head 4 is moved to the measurement surface 17 of the measurement object 16. In the x direction along the scanning rail 15 to obtain an interference fringe image over the entire surface to be measured.
Next, the lateral shear interferometer head 4 is rotated to generate a shear of Δy in the y direction, and d / 2 in the y direction.
The interference fringe image is obtained for the entire surface of the plane to be measured by moving it one by one. The measurement results of each minute measurement surface 18 are input to the control device 5 and analyzed to analyze the flatness of the measurement surface.

【0011】[0011]

【発明の効果】この発明の干渉測定法では従来のフィゾ
−干渉計ヘッドを走査する方法に比べて、参照面が不要
なこと、平面形状誤差の傾斜が大きい場合にも縞の本数
が多くなりすぎて計測不能とはなりにくいこと、走査時
における傾き誤差が不要なティルト縞を生ぜず、従って
縞の計測感度は場所によって変わることなく一定で、計
測精度が悪くならないという利点がある。例えばz=x
2+y2のような形状誤差を持っている平面を計測する
場合を考える。これを従来のフィゾ−干渉ヘッドを走査
する方法で計測すると、走査するにつれて(xが大きく
なるにつれて)だんだん干渉縞の密度が高くなってつい
には(x=xlim)検出器の解像力を越えて計測不能
となる。さらに走査に伴う微小傾き誤差でもいくつかの
縞が重ね合わされてx=xlimになる前に計測不能と
なる可能性がある。それにくらべ本方法は縞の間隔は一
定であるため、どこまでいっても計測可能である。また
走査に伴う微小な傾き誤差の影響はほとんど無い。
According to the interference measurement method of the present invention, as compared with the conventional method of scanning a Fizeau interferometer head, a reference surface is unnecessary and the number of stripes increases even when the inclination of the planar shape error is large. This is advantageous in that measurement is not likely to be impossible, and that tilt errors during scanning do not generate unnecessary tilt fringes. Therefore, the measurement sensitivity of the fringes is constant without changing depending on the location, and there is an advantage that the measurement accuracy does not deteriorate. For example, z = x
Consider a case where a plane having a shape error such as 2 + y2 is measured. When this is measured by a conventional method of scanning a Fizeau-interference head, the density of interference fringes gradually increases as the scanning is performed (as x increases), and finally, the resolution exceeds the resolution of the detector (x = xlim). Becomes impossible. Further, even with a small tilt error due to scanning, some stripes may be superimposed and measurement may not be possible before x = xlim. Compared to this, in the present method, the interval between the stripes is constant, so that it is possible to measure any distance. In addition, there is almost no influence of a slight tilt error caused by scanning.

【0012】このように、本発明であるシア干渉計を走
査させて、一部重複しながら部分的に多数回測定して全
体の形状を求める方法は、参照平面が不要なこと、平面
形状誤差の傾斜が大きい場合にも縞の本数が多くなりす
ぎて計測不能とはなりにくいこと、走査時における傾き
誤差が不要なティルト縞を生ぜず、従って縞の計測感度
は場所によって変わることなく一定で、計測精度が悪く
ならない。
As described above, the method of scanning the shear interferometer according to the present invention and partially measuring the number of times while partially overlapping to obtain the entire shape requires no reference plane and a planar shape error. When the inclination is large, it is difficult for the number of stripes to be too large to be unmeasurable, and the tilt error during scanning does not generate unnecessary tilt stripes, so that the measurement sensitivity of the stripes is constant without changing from place to place. The measurement accuracy does not deteriorate.

【0013】また大きな面積の平面度を測定する従来の
他の方法に斜入射干渉計があるが、これは全面同時に計
測できるが、感度がやや低いことと装置が嵩張るのが問
題である。また計測面積が極めて大きい場合計測できな
くなる。それに対して本装置は小型軽量ヘッドと走査装
置があればよく簡単な構造で、極めて大きな面積でも計
測できる。
Another conventional method for measuring the flatness of a large area is an oblique incidence interferometer, which can measure the entire surface at the same time. However, there is a problem in that the sensitivity is rather low and the apparatus is bulky. If the measurement area is extremely large, measurement cannot be performed. On the other hand, this apparatus requires only a small and light head and a scanning device, and has a simple structure, and can measure even an extremely large area.

【0014】本装置では、小さな横シア干渉ヘッドを走
査することにより、大きな面積の鏡面の平面度を計測で
きるようになる。その際、ヘッド走査における微小な傾
きや位置ずれ誤差が干渉縞にほとんど影響を与えないの
で、極めて大きな面積の鏡面の平面度が計測できる。こ
れは例えばシリコンウェ−ファ−や磁気ディスクのよう
な大きな面積の平面度を高精度に検査するのに有効とな
る。
In this apparatus, the flatness of a mirror surface having a large area can be measured by scanning a small transverse shear interference head. At this time, since a slight tilt or misalignment error in head scanning hardly affects the interference fringes, the flatness of a mirror surface having an extremely large area can be measured. This is effective for inspecting the flatness of a large area such as a silicon wafer or a magnetic disk with high accuracy.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明の干渉測定装置を示す構成説明図FIG. 1 is a configuration explanatory view showing an interference measuring apparatus according to the present invention;

【図2】被測定平面と微小被測定面の関係を示す平面説
明図
FIG. 2 is an explanatory plan view showing a relationship between a plane to be measured and a minute surface to be measured;

【符号の説明】[Explanation of symbols]

1 干渉測定装置 2 横シア干渉計 3 走査装置 4 横シア干渉計ヘッド 5 制御装置 6 フレ−ム 7 レ−ザ光源 8 コリメ−タレンズ 9 平行平面板 11 結像レンズ 12 フィルタ 13 検出器 14 測定用開口部 15 走査レ−ル 16 測定対象物 17 被測定平面 18 微小被測定面 A 基準光波面 B 物体光波面 DESCRIPTION OF SYMBOLS 1 Interferometer 2 Lateral shear interferometer 3 Scanning device 4 Lateral shear interferometer head 5 Controller 6 Frame 7 Laser light source 8 Collimator lens 9 Parallel plane plate 11 Imaging lens 12 Filter 13 Detector 14 Measurement Aperture 15 Scanning rail 16 Object to be measured 17 Plane to be measured 18 Small surface to be measured A Reference wavefront B Object wavefront

─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成11年5月6日[Submission date] May 6, 1999

【手続補正1】[Procedure amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】特許請求の範囲[Correction target item name] Claims

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【特許請求の範囲】[Claims]

【手続補正2】[Procedure amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0008[Correction target item name] 0008

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0008】[0008]

【課題を解決すべき手段】この目的に対応して、この発
明の大口径平面の干渉測定法は被測定平面を多数の微小
被測定面に区分し、横シア干渉計を前記被測定平面に走
査して測定箇所を一部重複させながら前記全部の微小被
測定面を横シア干渉により測定し、微小被測定面につい
ての測定結果を前記被測定平面にわたって連結すること
を特徴としている。
To cope with this object, a large-diameter plane interference measuring method according to the present invention divides a plane to be measured into a large number of small planes to be measured, and attaches a lateral shear interferometer to the plane to be measured. The method is characterized in that all the micro-measurement surfaces are measured by lateral shear interference while scanning to partially overlap the measurement locations, and the measurement results of the micro-measurement surfaces are connected over the measurement surface.

【手続補正3】[Procedure amendment 3]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0009[Correction target item name] 0009

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0009】また、この発明の大口径平面の干渉測定装
は、レーザー光源と前記レーザー光源から発したレー
ザー光を平行光にして測定用開口部を通して被測定平面
に照射する光学系と、前記被測定平面からの反射光を2
分割する平行平面板と、前記2分割された反射光の干渉
縞を検出する検出器とを取り付けており、かつ前記測定
用開口部を被測定平面と対向する部分に設けてあるフレ
ームと、前記フレームをガイドレールに沿って移動させ
る走査装置とを有する横シア干渉計走査ヘッドを備え
被測定平面を多数の微小被測定面に区分し、横シア干渉
計を前記被測定平面に走査して測定箇所を一部重複させ
ながら前記全部の微小被測定面を横シア干渉により測定
し、微小被測定面についての測定結果を前記被測定平面
にわたって連結することを特徴としている。
Further, the present invention provides a large-diameter plane interference measuring apparatus.
Location includes an optical system for irradiating the measured plane through the measurement opening in the laser light parallel light emitted from the laser light source and a laser light source, reflected light from the measured plane 2
A frame provided with a parallel plane plate to be split, and a detector for detecting interference fringes of the two-divided reflected light, and wherein the measurement opening is provided in a portion facing the plane to be measured; and A horizontal shear interferometer scan head having a scanning device for moving the frame along the guide rail ,
Divide the plane to be measured into many small planes to be measured,
The instrument scans the plane to be measured to partially overlap the measurement points.
While measuring all the micro-measured surfaces by lateral shear interference
The measurement result of the minute measurement target surface is
It is characterized by connecting over .

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】被測定平面を多数の微小被測定面に区分
し、横シア干渉計を前記被測定平面に走査して前記全部
の微小被測定面を横シア干渉により測定し、微小被測定
面についての測定結果を前記被測定平面にわたって連結
することを特徴とする大口径平面の干渉測定法
1. A micro-measurement method comprising: dividing a plane to be measured into a large number of micro-measurement surfaces; scanning a horizontal shear interferometer on said measurement surface to measure all said micro-measurement surfaces by lateral shear interference; A method for interferometric measurement of a large-diameter plane, characterized in that measurement results on a plane are connected over the plane to be measured.
【請求項2】前記横シア干渉計は前記微小被測定面の前
記走査方向の幅よりも小さい移動距離毎に前記測定をす
ることを特徴とする請求項1記載の大口径平面の干渉測
定法
2. The method for measuring interference of a large-diameter plane according to claim 1, wherein the lateral shear interferometer performs the measurement at every moving distance smaller than the width of the minute surface to be measured in the scanning direction.
【請求項3】レ−ザ−光源と前記レ−ザ−光源から発し
たレ−ザ−光を平行光にして測定用開口部を通して被測
定平面に照射する光学系と、前記被測定平面からの反射
光を2分割する平行平面板と、前記2分割された反射光
の干渉縞を検出する検出器とを取り付けており、かつ前
記測定用開口部を被測定平面と対向する部分に設けてあ
るフレ−ムと、前記フレ−ムをガイドレ−ルに沿って移
動させる走査装置とを備えることを特徴とする横シア干
渉計走査ヘッド。
3. An optical system for irradiating a laser light source and laser light emitted from said laser light source into parallel light and irradiating a plane to be measured through an opening for measurement, and A parallel plane plate that divides the reflected light into two, and a detector that detects interference fringes of the halved reflected light are attached, and the measurement opening is provided in a portion facing the plane to be measured. A transverse shear interferometer scan head, comprising: a frame; and a scanning device for moving the frame along a guide rail.
JP13848998A 1998-05-20 1998-05-20 Interferometry for large diameter planes Expired - Lifetime JP3232340B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13848998A JP3232340B2 (en) 1998-05-20 1998-05-20 Interferometry for large diameter planes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13848998A JP3232340B2 (en) 1998-05-20 1998-05-20 Interferometry for large diameter planes

Publications (2)

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JPH11325846A true JPH11325846A (en) 1999-11-26
JP3232340B2 JP3232340B2 (en) 2001-11-26

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Country Status (1)

Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008177561A (en) * 2003-10-09 2008-07-31 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP2008191036A (en) * 2007-02-06 2008-08-21 Topcon Corp Three-dimensional shape measuring apparatus and three-dimensional shape measurement method
DE10125008B4 (en) * 2000-05-22 2012-04-26 Mitutoyo Corp. Large area scanning surface shape analyzer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10125008B4 (en) * 2000-05-22 2012-04-26 Mitutoyo Corp. Large area scanning surface shape analyzer
JP2008177561A (en) * 2003-10-09 2008-07-31 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP2008191036A (en) * 2007-02-06 2008-08-21 Topcon Corp Three-dimensional shape measuring apparatus and three-dimensional shape measurement method

Also Published As

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