JPH11323151A - Resin composition for sealing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermosetting resin compsn. for sealing which has good filling properties and workability, hardly wears an apparatus in its molding process, and is suitable for transfer molding with a small internal stress by compounding a silica filler into a thermosetting resin. SOLUTION: This compsn. comprises a thermosetting resin and a silica filler. The filler comprises rounded fine silica particles prepd. by causing crushed silica particles to grind each other under pressure in gas or under mechanical stress, has a max. particle size of 200 μm or lower and an average particle size of 5-70 μm, and is compounded in an amt. of 100-2,000 pts.wt. into 100 pts.wt. thermosetting resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a synthetic resin composition used for sealing electronic parts such as semiconductors by transfer molding or the like. More specifically, the present invention relates to a synthetic resin composition containing silica fine powder particles having rounded corners suitable for a filler of a sealing resin composition and a thermosetting resin as main components.

[0002]

2. Description of the Related Art Electronic components such as semiconductors are sealed with a ceramic package or a resin package or the like in order to protect them from the external environment. A synthetic resin composition containing an inorganic filler has been widely used.

[0003] This synthetic resin composition is composed of a thermosetting resin such as an epoxy resin and an inorganic filler such as silica. However, these synthetic resin compositions have a small coefficient of thermal expansion and a good thermal conductivity. , Low moisture permeability, excellent mechanical properties, etc.
In addition, since a low-cost one is desirable, it is necessary to mix this inorganic filler in as large an amount as possible, as long as its moldability is allowed.

However, the inorganic powder used as a filler is mainly crushed into a powder having an appropriate size and distribution. When a sealing material is mixed with a resin, the fluidity is not sufficient, the filling property and the workability are poor, and the devices in the molding process have the drawback of being significantly worn. In addition, it has been reported that even for a semiconductor to be sealed, sharp sharp corners of the filler particles damage the surface of the semiconductor element, which causes a soft error.

Generally, when a thermosetting resin cures, a stress is generated due to shrinkage. In addition to this stress, heat generated from the semiconductor causes a difference in the coefficient of thermal expansion between the element semiconductor and the sealing resin composition. There is also a stress caused by the large. Of these internal stresses, in order to relieve the latter stress, it is usually desirable to fill the inorganic filler having a low coefficient of thermal expansion as much as possible. However, even in this aspect, in the case of a square filler produced by pulverization, if the filler is increased, the fluidity is extremely reduced, so that the amount must be limited, and the internal stress is reduced. Is not helpful enough.

In order to solve such a problem, for example, according to JP-A-58-145613 or JP-A-61-118131, silica fine powder is ejected from a nozzle together with a gas flow to form particles. There has been proposed a method for producing spherical fused fine powder silica by controlling dispersion, melting, cooling and the like of the powder under appropriate conditions. However, this method has the disadvantage of increasing costs.

On the other hand, a method for producing rounded silica fine powder of crystalline spherical silica is disclosed in
No. -60053 (Method for producing silica fine powder particles). However, this method has drawbacks such as an increase in the impurity ion concentration of the silica filler and an increase in the water content of the silica filler.

[0008]

SUMMARY OF THE INVENTION It is an object of the present invention to mix a silica filler with a thermosetting resin, to provide a good filling property and workability, to reduce the wear of equipment in a molding process, and to provide a semiconductor and the like. An object of the present invention is to provide a thermosetting resin composition having a small internal stress in an electronic component and suitable for transfer molding having a small internal stress.

[0009]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, the particles were crushed with each other in a mechanical stress or a gas so that the maximum particle diameter was 200 μm.
In the following, it has been found that silica fine powder having an average particle size of 5 μm or more and 70 μm or less has more excellent properties as a silica filler.

[0010] Further, the present invention is intended to improve the filling property and workability by mixing the silica fine powder particles having rounded corners with the thermosetting resin, to reduce the wear of the device in the molding process, and to seal the semiconductor. The present inventors have also found that a thermosetting resin composition suitable for transfer molding can be obtained with a small internal stress of an apparatus or the like, and the present invention has been completed.

That is, the present invention comprises a thermosetting resin and a silica filler, and the silica filler crushes the silica particles by mechanical stress or by grinding the particles in a gas to form corners of the silica particles. And a rounded silica fine powder having a maximum particle diameter of 200 μm or less and an average particle diameter of 5 μm.
μm or more and 70 μm or less and thermosetting resin 100
A sealing resin composition characterized in that the silica filler is blended in an amount of 100 to 2,000 parts by weight with respect to parts by weight.

Hereinafter, the present invention will be described in detail.

The silica used in the present invention may be either crystalline silica or fused silica. As the crystalline silica, natural high-purity silica, silica sand, quartz or the like is generally used. It is melted at high temperature to form an ingot. Usually, these are coarsely crushed by a jaw crusher, a roll crusher or the like, and these crushed products are further finely crushed by a ball mill or the like, and used as crushed silica in the present invention. The average particle size of the crushed silica obtained here must be slightly larger than that of the silica filler which is rounded at the corners of the final product.

Further, in the present invention, the corners of the crushed silica particles are formed by grinding the particles in a mechanical stress or in a gas, and for example, the pressing force applied to the roller from the outside is determined by a method of pressing by a machine. If the pressing force is too strong, not only the cornering but also the volume destruction of the particles occurs, and the pulverization proceeds and the cornering is hindered. Also, if it is too weak, the efficiency of the squaring will decrease, so the machine, raw material, variety (crystalline, non-crystalline)
It may be appropriately determined according to the situation. In addition, a crushed product having a size of several mm or less can be directly sent to the de-squaring step, and the de-sizing operation can be performed simultaneously with the pulverization to a desired particle size.

There are various methods for grinding the particles while applying a pressing force from the outside as described above, but a roller mill can be used most effectively from the viewpoint of cost and efficiency of energy and the like.

The silica filler used in the present invention contains the silica fine powder obtained as described above. The maximum particle size of the silica filler is 200 μm or less, preferably 100 μm or less. When the particle size exceeds 200 μm,
It cannot be used because clogging may occur in the resin sealing process of the semiconductor. Further, the average particle size is 5 μm or more and 70 μm
It is as follows. If it is less than 5 μm or more than 70 μm, good fluidity of the resin composition is impaired.

The above-mentioned silica filler having an average particle diameter of 5 to 70 μm can be obtained by appropriately adjusting the pressing force or the number of rotations.

The resin composition of the present invention is obtained by mixing the above-mentioned silica filler with a thermosetting resin.

The thermosetting resin used here includes, for example, urea resin, melamine resin, phenol resin, resorcinol resin, epoxy resin, polyurethane resin, vinyl acetate resin, polyvinyl alcohol resin, acrylic resin, vinyl urethane resin, silicone resin , Α-olefin maleic anhydride resin, polyamide resin, polyimide resin and the like, and these can be used alone or in combination of two or more. Among them, epoxy resins are industrially advantageously used. By mixing the silica filler of the present invention in an amount of 100 to 2,000 parts by weight with respect to 100 parts by weight of the thermosetting resin, a desired resin composition can be obtained. The amount of the curing agent and curing catalyst required for the thermosetting resin is included in 100 parts by weight of the thermosetting resin. When the amount of the silica filler is less than 100 parts by weight, the effect of lowering the internal stress is not observed, and when the amount exceeds 2,000 parts by weight, the fluidity of the resin is remarkably reduced. As a method of kneading the filler with the thermosetting resin, usually, a kneader, a roll mill, a mixer, or the like may be used.

The encapsulating resin composition of the present invention contains the above-mentioned silica filler and thermosetting resin as main components, but it does not deviate from the object of the present invention. Solvents, coupling agents, and other additives can be blended. As the solvent, dioxane, hexane, benzene, toluene, solvent naphtha, industrial gasoline, cellosolve acetate, ethyl cellosolve, butyl cellosolve acetate, butyl carbitol acetate,
Examples thereof include dimethylformamide, dimethylacetamide, N-methylpyrrolidone, and the like, and these can be used alone or in combination of two or more.

[0021]

According to the present invention, the encapsulating resin composition of the present invention can be obtained by blending a specific amount of a silica filler having rounded corners and a thermosetting resin. By using this resin composition, it is possible to perform transfer molding or the like with good filling properties and workability, with less wear of the apparatus in the molding process, and with small internal stress.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited to these examples.

EXAMPLE A silica fine powder obtained by grinding crushed silica particles in a gas to grind the particles together to round the silica particles, has a maximum particle diameter of 180 μm and an average particle diameter of 180 μm. 20μ
m of the silica filler A was mixed with 100 parts by weight of the epoxy resin in parts by weight shown in Table 1, kneaded by a roll mill, cooled and pulverized to obtain epoxy resin compositions 1 to 4.

Comparative Example A square silica fine powder having a maximum particle size of 120 μm
A silica filler B having an average particle diameter of 25 μm is blended with 100 parts by weight of the epoxy resin in parts by weight shown in Table 2,
After kneading with a roll mill, the mixture was cooled and pulverized to obtain epoxy resin compositions 5 to 8.

In order to check the fluidity of the epoxy resin compositions prepared in the above Examples and Comparative Examples, Koka flow viscosity and spiral flow were measured, and the results are shown in Tables 1 and 2, respectively. The resin compositions using the silica fillers A of Examples 1 to 4 are more excellent in fluidity than the resin compositions using the silica fillers B of Comparative Examples 5 to 8, and the resin composition even when the filler is highly filled. The product viscosity was low, the moldability and workability were excellent, and the effect of the present invention was confirmed.

[0026]

[Table 1] * 1: Cresol novolak epoxy resin-novolak phenol resin equivalent weight blend, organophosphorus catalyst. * 2: 175 ° C, load 10kg (Shimadzu flow tester CFT-500 type). * 3: Cured at 175 ° C for 2 minutes, according to EMMI Standard 1-166.

[0027]

[Table 2] * 1: Cresol novolak epoxy resin-novolak phenol resin equivalent weight blend, organophosphorus catalyst. * 2: 175 ° C, load 10kg (Shimadzu flow tester CFT-500 type). * 3: Curing at 175 ° C for 2 minutes, according to EMMI Standard 1-166

[0028]

By using the thermosetting resin composition containing the silica filler of the present invention for sealing electronic parts such as semiconductors, the fluidity and abrasion in the transfer molding step are improved and the sealing property is improved. It also helps to reduce the internal stress of the fastener and improves both workability and characteristics.

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Claims (2)

[Claims] Claims: 1. A silica filler comprising a thermosetting resin and a silica filler, wherein the silica filler crushes the silica particles by mechanical stress or by grinding the particles in a gas to form corners of the silica particles, thereby rounding the silica particles. Fused silica fine powder with a maximum particle size of 200 μm or less and an average particle size of 5 μm or more and 70 μm
m or less, and is added in a proportion of 100 to 2,000 parts by weight of the silica filler with respect to 100 parts by weight of the thermosetting resin. 2. The sealing resin composition according to claim 1, wherein the thermosetting resin is an epoxy resin.