JPH11320593A - Manufacture of laminate and molding plate used for the manufacture - Google Patents

Manufacture of laminate and molding plate used for the manufacture

Info

Publication number
JPH11320593A
JPH11320593A JP10127193A JP12719398A JPH11320593A JP H11320593 A JPH11320593 A JP H11320593A JP 10127193 A JP10127193 A JP 10127193A JP 12719398 A JP12719398 A JP 12719398A JP H11320593 A JPH11320593 A JP H11320593A
Authority
JP
Japan
Prior art keywords
plate
laminate
molding
resin
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10127193A
Other languages
Japanese (ja)
Inventor
Haruji Kawasaki
治次 川崎
Masakazu Shimomura
正和 下村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP10127193A priority Critical patent/JPH11320593A/en
Publication of JPH11320593A publication Critical patent/JPH11320593A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To manufacture a laminate having a small warpage and to reuse a mold releasable material by using a metal plate having better thermal conductivity than that of a stainless steel as a molding plate brought into direct contact with a prepreg layer of the laminate, and coating a contact surface of the plate with a mold releasable resin. SOLUTION: A plurality of sets each sandwiching a layer 1 of a prepreg obtained by impregnating a sheet-like fiber base material with a thermosetting resin and drying it between molding plates 3 via a mold releasable resin film or a mold releasable metal foil 2 are provided. After the plural sets are inserted between heating platens in a superposed state on a carrier plate 4 via a cushioning material 5, it is heat pressure molded to manufacture the laminate. In this case, a metal plate made of an aluminum having good thermal conductivity than that of a stainless steel is used as the plate 3 in contact with the layer 1, and a surface of the plate 3 opposed to the layer 1 is coated with a mold releasable resin such as a silicone resin or the like. Thus, a warpage at the time of molding is prevented.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、シート状繊維基材
に熱硬化性樹脂を含浸乾燥して得たプリプレグの層を成
形用プレートで挟み、これを熱盤間で加熱加圧成形する
積層板の製造法に関する。積層板の片面又は両面には、
加熱加圧成形時に必要に応じて銅箔等の金属箔が一体化
されるが、本発明は、殊に、両面とも金属箔が一体化さ
れないか片面にだけ金属箔が一体化される積層板の製造
に適した方法である。また、このような積層板の製造に
使用する成形用プレートに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminate in which a prepreg layer obtained by impregnating and drying a sheet-like fiber base material with a thermosetting resin is sandwiched between molding plates and heated and pressed between hot plates. The present invention relates to a method for manufacturing a board. On one or both sides of the laminate,
A metal foil such as a copper foil is integrated as needed during the heat and pressure molding. However, the present invention is particularly applicable to a laminated plate in which the metal foil is not integrated on both surfaces or the metal foil is integrated only on one surface. It is a method suitable for the production of The present invention also relates to a molding plate used for manufacturing such a laminated board.

【0002】[0002]

【従来の技術】積層板は、シート状繊維基材に熱硬化性
樹脂を含浸乾燥して熱硬化性樹脂の硬化をBステージま
で進めたプリプレグを用意し、このプリプレグの層を成
形用プレートに挟み、これを熱盤間で加熱加圧成形して
製造される。図1は、熱盤間で複数枚の積層板を成形す
るときの様子を示している。1枚の積層板を製造するの
に必要な枚数だけ重ねたプリプレグの層1の両面に離型
性樹脂フィルムまたは離型性金属箔2を配置し、これ
を、対をなす成形用プレート3の間に挟む。その複数組
をキャリアプレート4上に重ねて熱盤間に投入しクッシ
ョン材5を介して加熱加圧成形する。成形用プレート
は、積層板表面に平滑性を付与するためのものであり、
通常、錆びず硬度の高いステンレス板からなっている。
また、積層板には、その加熱加圧成形時に必要に応じて
片面又は両面に銅箔等の金属箔が一体化されるが、両面
とも金属箔が一体化されないか片面にだけ金属箔が一体
化される積層板の製造では、図1に示したように、プリ
プレグの層上に離型性樹脂フィルムまたは離型性金属箔
を配置し、これにより、成形した積層板と成形用プレー
トとの貼付きが起こらないようにしている。
2. Description of the Related Art Laminated sheets are prepared by impregnating and drying a sheet-like fiber base material with a thermosetting resin to advance the curing of the thermosetting resin to a B stage, and applying the prepreg layer to a molding plate. It is manufactured by sandwiching and heating and pressing this between hot plates. FIG. 1 shows a state in which a plurality of laminated plates are formed between hot plates. A release resin film or a release metal foil 2 is disposed on both sides of a prepreg layer 1 which is stacked by a number necessary for manufacturing one laminate, and this is placed on a pair of forming plates 3. Between them. The plurality of sets are superimposed on the carrier plate 4, put between hot plates, and heated and pressed through the cushion material 5. The molding plate is for imparting smoothness to the surface of the laminate,
Usually, it is made of a stainless steel plate having high hardness without rusting.
In addition, a metal foil such as a copper foil is integrated on one or both sides of the laminate as needed during the heat and pressure molding, but the metal foil is not integrated on both sides or the metal foil is integrated only on one side. In the production of a laminated board to be formed, as shown in FIG. 1, a release resin film or a release metal foil is arranged on a prepreg layer, whereby the molded laminate and the molding plate are separated. It prevents sticking.

【0003】[0003]

【発明が解決しようとする課題】ステンレス板からなる
成形用プレートは熱伝導率が小さいので、これを熱盤間
に配置すると、積層方向の温度勾配が大きくなる。この
ような成形用プレートを用いて積層板を成形すると、加
熱・冷却時の熱歪みが積層板に残り、積層板が反りやす
くなる。また、離型性樹脂フィルムまたは離型性金属箔
は成形した積層板に密着するので、成形ごとに新たな離
型性樹脂フィルム又は離型性金属箔を必要とし、この離
型性樹脂フィルム又は離型性金属箔は成形後に積層板か
ら剥がして廃棄される。本発明が解決しようとする課題
は、ステンレス板からなる成形用プレートを使用せず、
また、離型性材料の繰り返し使用を可能にし、反りの小
さい積層板を製造することである。
Since a forming plate made of a stainless steel plate has a low thermal conductivity, if it is arranged between hot plates, the temperature gradient in the laminating direction becomes large. When a laminate is formed using such a molding plate, thermal distortion during heating and cooling remains in the laminate, and the laminate tends to warp. In addition, since the mold release resin film or mold release metal foil adheres to the molded laminate, a new mold release resin film or mold release metal foil is required for each molding, and the mold release resin film or The releasable metal foil is peeled off from the laminate after molding and discarded. The problem to be solved by the present invention is to use a forming plate made of a stainless steel plate,
Another object of the present invention is to manufacture a laminate having a small warpage, which enables repeated use of a release material.

【0004】[0004]

【課題を解決するための手段】上記課題を解決するため
に、本発明に係る積層板の製造法は、プリプレグの層と
直接当接する成形用プレートとして、ステンレスより熱
伝導の良い金属板を使用する。そして、使用する金属板
には、プリプレグの層と対向する面に離型性樹脂を塗布
しておく。成形用プレートとしてステンレスより熱伝導
の良い金属板を用いると、加熱・冷却時においてプリプ
レグやこれを成形した積層板の厚さ方向の温度差が小さ
くなり、積層板に熱歪みが残らないので、積層板の反り
や変形を小さく抑えることができる。金属板の表面に塗
布された離型性樹脂は、成形用プレートから容易に剥が
れることはないので繰り返し使用が可能である。
In order to solve the above-mentioned problems, a method of manufacturing a laminated board according to the present invention uses a metal plate having better heat conductivity than stainless steel as a forming plate directly in contact with a prepreg layer. I do. Then, the mold release resin is applied to the surface of the metal plate to be used which faces the prepreg layer. When a metal plate having better heat conductivity than stainless steel is used as a forming plate, the temperature difference in the thickness direction of the prepreg or the laminated plate formed by molding the prepreg during heating / cooling becomes small, and no thermal distortion remains in the laminated plate. Warpage and deformation of the laminate can be reduced. Since the release resin applied to the surface of the metal plate is not easily peeled off from the molding plate, it can be used repeatedly.

【0005】[0005]

【発明の実施の形態】本発明に係る方法で使用する成形
用プレートは、ステンレスより熱伝導の良いアルミニウ
ムや銅、あるいはこれらを含有する合金の板からなる。
成形用プレートの表面に塗布する離型性樹脂は、シリコ
ーン樹脂又はフッ素樹脂等である。積層板の製造は、プ
リプレグの層を成形用プレートで挟み、これを加熱加圧
成形して行なう。従って、成形用プレートには、プリプ
レグの層と対向する面に離型性樹脂を塗布しておけばよ
い。しかし、図1に示したように熱盤間で複数枚の積層
板を成形するときには、中ほどに位置する成形用プレー
トは、その両側に位置する積層板を成形するための成形
用プレートの役割を果たす。このような観点から、この
成形用プレートには、両面に離型性樹脂が塗布されてい
ると好都合である。成形用プレートの厚みが薄くなる
と、プリプレグに使用されているシート状繊維基材の地
合が転写し、積層板の表面に凹凸を生じて外観を損なう
ので、適宜板厚を選定する。アルミニウム板からなる成
形用プレートを採用する場合、成形用プレートの板厚
を、シート状繊維基材が織布のときは0.3mm以上に、
不織布のときは0.7mm以上にするのがよい。
BEST MODE FOR CARRYING OUT THE INVENTION The forming plate used in the method according to the present invention is made of aluminum, copper, or an alloy containing these, which has better heat conductivity than stainless steel.
The release resin applied to the surface of the molding plate is a silicone resin or a fluororesin. The production of the laminated board is performed by sandwiching a prepreg layer between molding plates, and then heating and press-molding the prepreg layers. Therefore, the mold release plate may be coated with the release resin on the surface facing the prepreg layer. However, when a plurality of laminated plates are formed between hot plates as shown in FIG. 1, the forming plate located in the middle serves as a forming plate for forming the laminated plates located on both sides thereof. Fulfill. From such a viewpoint, it is advantageous that the mold release plate is coated with a release resin on both sides. When the thickness of the molding plate is reduced, the formation of the sheet-like fiber base material used in the prepreg is transferred, and the surface of the laminated plate is unevenly formed to impair the appearance. When using a forming plate made of an aluminum plate, the thickness of the forming plate is set to 0.3 mm or more when the sheet-like fiber base material is a woven fabric,
In the case of a non-woven fabric, the thickness is preferably 0.7 mm or more.

【0006】積層板を製造するためには、まず、シート
状繊維基材に熱硬化性樹脂を含浸乾燥して、熱硬化性樹
脂の硬化をBステージまで進めたプリプレグを製造す
る。シート状繊維基材は、紙、天然繊維や有機合成繊維
や無機繊維等からなる織布や不織布やマットであり、特
に限定するものではない。また、熱硬化性樹脂は、フェ
ノール樹脂、エポキシ樹脂、ポリエステル樹脂等であっ
て、特に限定するものではない。
In order to manufacture a laminated board, first, a prepreg in which a thermosetting resin is impregnated and dried in a sheet-like fiber base material and curing of the thermosetting resin is advanced to a B stage is manufactured. The sheet-like fiber substrate is a woven fabric, a nonwoven fabric, or a mat made of paper, natural fibers, organic synthetic fibers, inorganic fibers, and the like, and is not particularly limited. The thermosetting resin is a phenol resin, an epoxy resin, a polyester resin, or the like, and is not particularly limited.

【0007】プリプレグの層の加熱加圧成形に際し、片
面だけに金属箔を一体化するか又は両面ともに金属箔を
一体化しない場合に上記成形用プレートを使用し、離型
性樹脂塗布面をプリプレグの層に直接当接する。
When the metal foil is integrated on only one side or the metal foil is not integrated on both sides when the prepreg layer is heated and pressed, the above-mentioned molding plate is used to form the prepreg coated surface with the release resin. Abut directly on the layer.

【0008】[0008]

【実施例】実施例 アルミニウム板(厚さ0.38mm,熱膨張係数12.8
PPM/℃, 熱伝導率0.00203BTU/秒)の
両面にシリコーン樹脂を厚さ20μmに塗布してなる成
形用プレートを用意した。ガラス織布にエポキシ樹脂ワ
ニスを含浸乾燥して得た樹脂含有量35重量%のプリプ
レグの層を前記成形用プレートに挟み、その複数組を、
図1に示したように熱盤間に投入して、圧力130kg/
cm2、温度165℃で180分間加熱加圧して積層板
(寸法:1000×1000×0.4mm)を製造した。
この成形用プレートを積層板製造に5回繰り返し使用し
た後も、積層板と成形用プレートとの離型性は良好であ
り、当初からの離型性低下は見られなかった。成形用プ
レートに塗布したシリコーン樹脂の塗膜の状態および成
形した積層板外観にも問題はなかった。そして、この成
形用プレートはさらに使用可能である。
EXAMPLE An aluminum plate (thickness 0.38 mm, coefficient of thermal expansion 12.8)
A molding plate was prepared by applying a silicone resin to a thickness of 20 μm on both surfaces having a PPM / ° C. and a thermal conductivity of 0.00203 BTU / sec. A prepreg layer having a resin content of 35% by weight obtained by impregnating and drying an epoxy resin varnish on a glass woven fabric is sandwiched between the molding plates, and a plurality of sets of the prepregs are
As shown in FIG.
cm 2, 180 minutes at a temperature 165 ° C. by heating and pressing the laminate (size: 1000 × 1000 × 0.4mm) was prepared.
Even after the forming plate was repeatedly used five times in the production of the laminated plate, the releasability of the laminated plate and the forming plate was good, and no decrease in the releasability from the beginning was observed. There was no problem with the state of the silicone resin coating film applied to the molding plate and the appearance of the molded laminate. And this molding plate can be further used.

【0009】従来例 SUS630(厚さ1.0mm,熱伝導率0.0014B
TU/秒)を成形用プレートとして使用し、実施例と同
様に積層板を製造した。成形用プレートとプリプレグの
層との間には離型性樹脂フィルムとしてポリプロピレン
フィルムを介在させた。
Conventional example SUS630 (thickness: 1.0 mm, thermal conductivity: 0.0014B)
(TU / sec) was used as a molding plate, and a laminate was produced in the same manner as in the example. A polypropylene film was interposed between the molding plate and the prepreg layer as a release resin film.

【0010】上記実施例と従来例により製造した積層板
の反りを測定した結果を表1に示す。これは、成形後の
積層板を平らな面におき、積層板四隅の平らな面からの
浮き上がり量を測定したものである。
Table 1 shows the results of measuring the warpage of the laminates manufactured according to the above embodiment and the conventional example. In this method, the formed laminate was placed on a flat surface, and the amount of lift from the flat surface at the four corners of the laminate was measured.

【0011】[0011]

【表1】 [Table 1]

【0012】上記実施例は、両表面に金属箔が一体化さ
れていない積層板を製造した例である。上記実施例にお
いて、片面に金属箔(銅箔)が一体化された積層板を同
様に製造したところ、成形用プレートは上記実施例と同
様に繰り返し使用が可能であった。
The above embodiment is an example of manufacturing a laminated board in which metal foils are not integrated on both surfaces. In the above example, when a laminated plate in which a metal foil (copper foil) was integrated on one side was similarly manufactured, the molding plate could be used repeatedly as in the above example.

【0013】[0013]

【発明の効果】上述のように、本発明に係る方法によれ
ば、積層板成形時の熱伝導を早めて熱分布を均一にし、
積層板の反りを小さく抑えることができる。また、表面
に離型性樹脂を塗布した成形用プレートを繰り返し用い
るので、成形サイクル毎に新たに離型性樹脂フィルム又
は離型性金属箔を用意する必要がない。また、ステンレ
ス板からなる成形用プレートは、離型性樹脂フイルム又
は離型性金属箔と共に用いられ、これらから汚れを転写
される。使用の都度、機械研磨をする必要があるために
板厚を1mm以上としている。一方、本発明に係る成形用
プレートは、使用の都度研磨をする必要のないので板厚
を薄くすることができる。その結果、熱盤間への投入枚
数を増やすことができ、成形効率と省エネルギの観点か
らも極めて効果大である。
As described above, according to the method of the present invention, the heat conduction during the molding of the laminate is accelerated to make the heat distribution uniform,
Warpage of the laminate can be suppressed to a small value. Further, since the molding plate having the surface coated with the release resin is used repeatedly, it is not necessary to newly prepare a release resin film or a release metal foil for each molding cycle. Further, a molding plate made of a stainless steel plate is used together with a release resin film or a release metal foil, from which dirt is transferred. The sheet thickness is set to 1 mm or more because it is necessary to perform mechanical polishing each time it is used. On the other hand, the molding plate according to the present invention does not need to be polished each time it is used, so that the plate thickness can be reduced. As a result, the number of sheets inserted between the hot plates can be increased, which is extremely effective from the viewpoint of molding efficiency and energy saving.

【図面の簡単な説明】[Brief description of the drawings]

【図1】熱盤間で複数枚の積層板を成形する従来技術の
様子を示す断面図である。
FIG. 1 is a cross-sectional view showing a state of a conventional technique for forming a plurality of laminated plates between hot plates.

【符号の説明】[Explanation of symbols]

1 プリプレグの層 2 離型性樹脂フィルム又は離型性金属箔 3 成形用プレート 4 キャリアプレート 5 クッション材 DESCRIPTION OF SYMBOLS 1 Pre-preg layer 2 Release resin film or release metal foil 3 Molding plate 4 Carrier plate 5 Cushion material

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】シート状繊維基材に熱硬化性樹脂を含浸乾
燥して得たプリプレグの層を成形用プレートに挟み、こ
れを熱盤間で加熱加圧成形する積層板の製造において、 プリプレグの層に直接当接する成形用プレートとして、
ステンレスより熱伝導の良い金属板を使用し、プリプレ
グの層と対向する当該プレートの面に離型性樹脂を塗布
しておくことを特徴とする積層板の製造法。
1. A prepreg in which a prepreg layer obtained by impregnating and drying a thermosetting resin in a sheet-like fiber base material is sandwiched between molding plates and heated and pressed between hot plates. As a molding plate that directly contacts the layer of
A method for manufacturing a laminate, comprising using a metal plate having better heat conductivity than stainless steel, and applying a release resin to a surface of the plate facing the prepreg layer.
【請求項2】ステンレスより熱伝導の良い金属板からな
り、少なくともその片面に離型性樹脂を塗布したことを
特徴とする積層板の製造に用いる成形用プレート。
2. A molding plate used for manufacturing a laminate, comprising a metal plate having better heat conductivity than stainless steel and having at least one surface coated with a release resin.
JP10127193A 1998-05-11 1998-05-11 Manufacture of laminate and molding plate used for the manufacture Pending JPH11320593A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10127193A JPH11320593A (en) 1998-05-11 1998-05-11 Manufacture of laminate and molding plate used for the manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10127193A JPH11320593A (en) 1998-05-11 1998-05-11 Manufacture of laminate and molding plate used for the manufacture

Publications (1)

Publication Number Publication Date
JPH11320593A true JPH11320593A (en) 1999-11-24

Family

ID=14954004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10127193A Pending JPH11320593A (en) 1998-05-11 1998-05-11 Manufacture of laminate and molding plate used for the manufacture

Country Status (1)

Country Link
JP (1) JPH11320593A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102469690A (en) * 2010-11-05 2012-05-23 三星电机株式会社 Apparatus for manufacturing printed circuit board and method for manufacturing printed circuit board using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102469690A (en) * 2010-11-05 2012-05-23 三星电机株式会社 Apparatus for manufacturing printed circuit board and method for manufacturing printed circuit board using the same
KR101167442B1 (en) * 2010-11-05 2012-07-19 삼성전기주식회사 Apparatus for manufacturing printed circuit board and method for manufacturing printed circuit board using the same

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