JPH11320086A - Clamp mechanism for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a clamping mechanism for a semiconductor device capable of preventing the positional deviation and the occurrence of floating of a base plate and dealing with the change of dimensions of the base plate. SOLUTION: This clamp mechanism is constituted of a means 19 for fixing a heat sink 31 for the purpose of positioning and soldering the base plate on which electronic parts are mounted to the heat sink, a movable plate 2 capable of relatively moving to/from the fixing means 19, and a clamp part 15 for holding the base plate that is movable from the center of the movable plate 2 in the radial direction and vice versa. The clamp part 15 is fixed to a shaft 14 having a guide roller 12, 13 which each engages with a slot 10 provided in the radial direction in the movable plate 2 and with a slot 7 formed in the guiding block 6 of the clamp part relatively movable against the movable plate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device clamping mechanism, and more particularly to a semiconductor device clamping mechanism capable of positioning a heat sink and a substrate with high precision and coping with a difference in substrate dimensions.

[0002]

2. Description of the Related Art Conventionally, a heat sink is mounted on a heater block, and solder and flux are applied thereon, and after the solder is melted, a substrate on which electronic components and leads are mounted is mounted on the heat sink, and the heat sink is mounted on the heat sink. After that, the substrate is gripped by a clamp jig, transferred to a transfer tray, and naturally cooled to manufacture a semiconductor device. And this process was performed manually.

[0003]

However, since the above process is performed manually, heat is radiated by the clamp jig when the clamp jig is used to solidify the solder.

[0004] Therefore, if the substrate is not accurately grasped by the clamp jig, there is a problem that the substrate is displaced and floated. Also, when the electronic components of the board are changed, the dimensions of the board may change.However, since the clamp jig can only position the board of a certain size, several types of clamp jigs corresponding to the dimensions of the board are required. It had to be prepared and it was complicated.

In view of the above, the present invention has been made in view of the above-mentioned problems in the prior art, and it is a semiconductor device capable of preventing displacement and lifting of a substrate and responding to a change in the dimensions of the substrate. It is an object to provide a clamping mechanism.

[0006]

According to the first aspect of the present invention,
A semiconductor device clamping mechanism for positioning and soldering a substrate on which an electronic component is mounted with respect to a heat sink, comprising: fixing means for fixing the heat sink; and a movable member relatively movable with respect to the fixing means. It is characterized by comprising a plate, and a clamp part for gripping the substrate movable in a radial direction from the center of the movable plate and in a direction opposite to the radial direction.

According to a second aspect of the present invention, the clamp portion is formed in a long hole extending in the radial direction in the movable plate and a clamp portion guiding block movable relative to the movable plate. It is fixed to a shaft having a guide roller engaged with each of the long holes.

According to a third aspect of the present invention, the clamp portion includes a stopper portion that can abut on a side surface of the heat sink.

According to a fourth aspect of the present invention, the movable plate includes an urging means for urging the substrate to the heat sink.

According to the first aspect of the present invention, a fixing means for fixing the heat sink, a movable plate movable relative to the fixing means, a radial direction from the center of the movable plate and the movable plate. Since it is composed of a clamp part for holding the substrate movable in the direction opposite to the radiation direction, the workability when positioning and soldering the substrate on which the electronic component is mounted with respect to the heat sink is improved. It can be improved and can cope with changes in the dimensions of the substrate.

According to the second aspect of the present invention, the clamp portion is formed in an elongated hole extending in the radial direction in the movable plate and a clamp portion guiding block movable relative to the movable plate. Fixed to a shaft having a guide roller engaged with each of the elongated holes, so that the clamp portion guiding block is relatively moved with respect to the movable plate, so that the clamp portion is moved to a central portion of the movable plate. In the radial direction and in the opposite direction to the radial direction.

According to the third aspect of the present invention, since the clamp portion has the stopper portion capable of contacting the heat sink, the positional relationship between the side surface of the substrate and the side surface of the heat sink is defined, and the dimensional accuracy is improved. Can be done.

According to the fourth aspect of the present invention, since the movable plate includes the urging means for urging the substrate to the heat sink, it is possible to perform soldering while pressing the substrate against the heat sink. It is possible to prevent the board from floating during soldering.

[0014]

Next, a specific example of an embodiment of a semiconductor device clamping mechanism according to the present invention will be described with reference to the drawings.

FIG. 2 is a schematic view showing a semiconductor device to which the semiconductor device clamping mechanism according to the present invention is applied.
The semiconductor device 30 includes a heat sink 31, an electronic component 32, and a substrate 33, and the heat sink 31 and the electronic component 32 are mounted on the substrate 33. The semiconductor device clamping mechanism according to the present invention is used for holding the substrate 33 and soldering the substrate 33 on which the electronic components 32 are mounted on the positioned heat sink 31.

FIG. 1 is an exploded perspective view showing a semiconductor device clamping mechanism according to the present invention. The semiconductor device clamping mechanism 1 includes a heat sink positioning claw 19 as fixing means for fixing a heat sink 31, A first plate 2 movable relative to the heat sink positioning claw 19 and a clamp portion 15 for gripping a substrate 33 movable in a radial direction from the center of the first plate 2 and in a direction opposite to the radial direction; Etc.

The first plate 2 is formed in a rectangular shape, and has first slide guides 4A, 4A near the upper side and the lower side, respectively.
B is provided.

The first slide guide 4A comprises a fixed portion 8A fixed to the first plate 2 and a slider 9A slidable along the fixed portion 8A. It is composed of a fixed part 8B and a slider 9B.

Clamp guide block 6 (6A, 6B)
Is a rectangular plate-like member, in which two long holes 7 each extending in the longitudinal direction are formed. The clamp guide blocks 6A and 6B are connected to the slider 9 described above.
A, fixed on 9B. That is, the upper part 6A 'of the clamp part guide block 6A is fixed to the slider 9A, and the lower part 6A "is fixed to the slider 9B. Thereby, the clamp guide blocks 6A and 6B can slide along the fixing portions 8A and 8B of the first slide guide 4 together with the sliders 9A and 9B.

The first plate 2 is formed with four elongated holes 10 extending from each corner toward the center.

Further, the first plate 2 is provided with four clamp members 11. This clamp member 11
A first guide roller 12 attached to a shaft 14;
It comprises a guide roller 13 and a clamp 15 provided at the lower end of the shaft 14.

The clamp member 11 is connected to the first plate so that the first guide roller 12 is engaged with the elongated hole 7 of the clamp guide block 6 and the second guide roller 13 is engaged with the elongated hole 10 of the first plate 2. The first guide roller 12 moves along the long hole 7 and the second guide roller 13 moves along the long hole 10 by being positioned and fixed with respect to the opening 2 and opening and closing the clamp guide block 6 right and left. Accordingly, the clamp 15 is configured to be able to move from each corner toward the center.

The two clamp members 11 including the clamp member 11A are provided with a stopper portion 20 at the lower end of a portion extending below the clamp portion 15.

On the back side of the first plate 2, an elastic silicon rubber 16 is provided as an urging means for urging the substrate to the heat sink.

On the other hand, the second plate 3 is formed in a frame shape having an opening 3a, and is provided with second slide guides 5 (5A, 5B) near its upper side and lower side.

The second slide guide 5A has a fixed portion 17A fixed to the second plate 3 and a fixed portion 17A.
Similarly, the first slide guide 5B includes a fixed portion 17B and a slider 1A.
8B. By attaching the first plate 2 to the sliders 18A and 18B, the first plate 2 can move in the horizontal direction along the fixing portions 17A and 17B.

The second plate 3 is provided with heat sink positioning claws 19 on the left and right back surfaces.

Next, the operation of the semiconductor device clamping mechanism 1 having the above configuration will be described with reference to FIGS.

First, the heat sink 31 is fixed by the heat sink positioning claws 19 provided on the second plate 3.

Next, when the clamp guide block 6 fixed on the first slide guide 4 attached to the first plate 2 is opened left and right, the first guide roller 12 moves along the long hole 7. At the same time, the second guide roller 13 moves along the long hole 10, and accordingly, the clamp 15 moves from the center of the first plate 2 toward each corner.

The substrate 33 is located below the first plate 2.
Is positioned, and the clamp guide block 6 is closed.
While the first guide roller 12 moves along the long hole 7, the second guide roller 13 moves along the long hole 10,
As shown in FIG. 3A, the clamp unit 15 moves in the X direction from each corner of the first plate 2 toward the center, and the substrate 33 is gripped by the clamp unit 15.

The first plate 2 is relatively moved with respect to the second plate 3 while the substrate 33 is being held by the clamp portion 15, and the substrate 33 is positioned with respect to the heat sink 31. At this time, since the two clamp members 11 are provided with the stopper portions 20 below the clamp portions 15, the stopper portions 20 come into contact with the side surfaces of the heat sink 31, and the side surfaces of the substrate 33 and the heat sink 31. And the dimensional accuracy can be improved.

When the positioning of the substrate 33 with respect to the heat sink 31 is completed, the substrate 33 is moved to the heat sink 31 by the silicon rubber 16 provided on the back surface of the first plate 2.
The substrate 33 is soldered to the heat sink 31 while applying pressure to the substrate 33. This can prevent the board 33 from floating during soldering.

The first plate 2 attached to the first plate 2
By opening and closing the clamp guide block 6 fixed on the slide guide 4, the clamp 15 moves from the center of the first plate 2 toward each corner or in the opposite direction to the first plate 2. Since the substrate 33 is gripped by the portion 15, it is possible to cope with a change in the dimensions of the substrate 33.

[0035]

As described above, according to the first aspect of the present invention, it is possible to improve the workability when positioning and soldering a substrate on which an electronic component is mounted to a heat sink. Further, it is possible to provide a semiconductor device clamping mechanism capable of coping with a change in the dimensions of a substrate.

According to the second aspect of the present invention, by moving the clamp guide block relative to the movable plate, the clamp is radiated from the center of the movable plate in the radial direction and in the opposite direction to the radial direction. Since the semiconductor device can be moved in the direction, a semiconductor device clamping mechanism capable of achieving the above-described effects with a simple configuration can be provided.

According to the third aspect of the present invention, it is possible to provide a semiconductor device clamping mechanism capable of improving the dimensional accuracy between the substrate and the heat sink.

According to the fourth aspect of the present invention, it is possible to provide a semiconductor device clamping mechanism capable of preventing the board from floating during soldering.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a semiconductor device clamping mechanism according to the present invention.

FIG. 2 is a schematic view showing a semiconductor device to which the semiconductor device clamping mechanism according to the present invention is applied.

3A and 3B are explanatory views of the operation of the semiconductor device clamping mechanism of FIG. 1, wherein FIG. 3A is a partially cutaway schematic plan view, and FIG. 3B is a schematic front view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device clamp mechanism 2 1st plate 3 2nd plate 4 1st slide guide 5 2nd slide guide 6 Clamp guidance block 7 Slot 8 Fixing part 9 Slider 10 Slot 11 Clamp member 12 First guide roller 13 Second Guide roller 14 Shaft 15 Clamp section 16 Silicon rubber 17 Fixing section 18 Slider 19 Heat sink positioning claw 20 Stopper section

Claims (4)

[Claims] 1. A semiconductor device clamping mechanism for positioning and soldering a substrate on which an electronic component is mounted with respect to a heat sink, comprising: fixing means for fixing the heat sink; A semiconductor comprising: a movable plate capable of relative movement; and a clamp portion for gripping the substrate movable in a radial direction from the center of the movable plate and in a direction opposite to the radial direction. Device clamping mechanism. 2. The clamp according to claim 1, wherein the clamp has a slot formed in the movable plate in the radial direction and a slot formed in a clamp guide block movable relative to the movable plate. 2. The semiconductor device clamping mechanism according to claim 1, wherein the semiconductor device clamping mechanism is fixed to a shaft having a guide roller to be engaged. 3. The semiconductor device clamping mechanism according to claim 1, wherein said clamp portion includes a stopper portion capable of contacting a side surface of said heat sink. 4. The semiconductor device clamping mechanism according to claim 1, wherein said movable plate includes an urging means for urging said substrate to said heat sink.