JPH11316814A - Production of non-contact ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a production method for non-contact IC card where nonwoven fabric can be fixed in the case of a method to insert the nonwoven fabric, where an antenna coil and an IC chip are inserted, between front and rear sheets. SOLUTION: One sheet 14 is inserted into a cavity 4 of a fixed mold 2 and a fixing pin 15 is inserted through a positioning hole 12, and the other sheet 13 is inserted into a cavity 5 of a mobile die 3, and nonwoven fabric 16 where the antenna coil and the IC chip are inserted is inserted between both sheets 13 and 14, and sheets 13 and 14 are subjected to vacuum suction and the mobile die 3 and the fixed die 2 are closed. And the fixing pin 15 on the fixed die 2 side is pressed to the nonwoven fabric 15 facing the positioning hole 12 of the sheet 13 on the mobile die 2 side to fix it, and fused resin 17 is injected to a space between sheets 13 and 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card having a built-in CPU and a memory function, and more particularly to a method of manufacturing the same.

[0002]

2. Description of the Related Art I is receiving attention as a next-generation card.
The C card has a built-in CPU and a memory function, and is classified into a contact type and a non-contact type. As a method of manufacturing such an IC card, for example, in a non-contact type IC card, a laminating method of inserting an IC chip and an antenna coil between thin resin sheets and bonding them is adopted.

[0003]

However, the conventional method of manufacturing a non-contact type IC card has the following problems. For example, the antenna coil in the non-contact type IC card has various shapes depending on the function of the IC chip. In the above-described manufacturing method, it is necessary to match the thickness of the intermediate sheet and the shape of the hole to be punched out. It is necessary to prepare various plastic sheets according to the shape of the chip. It is also necessary to fill the gap with the adhesive after the chip holder. Further, since the front and back sheets are bonded in a sandwich shape, the number of steps is large, and since there is a bonding step and the like, automation is difficult.

[0004] As a method of solving the drawback of such a manufacturing method, an antenna coil and an IC chip are fixed to one of front and back sheets having a size capable of forming a plurality of non-contact type IC cards, and both sheets are fixed. It was inserted into a mold consisting of a movable mold and a fixed mold, fixed by vacuum suction and fixed, the molten resin was injected into the gap between the two sheets, the mold was compressed and molded, and the molded product was taken out of the mold Thereafter, a manufacturing method has been considered in which a plurality of non-contact type IC cards are punched out of the molded article to form the same.

However, in such a conventional manufacturing method using insert injection molding, in the case of inserting a non-woven fabric having an antenna coil and an IC chip interposed between both sheets, the non-woven fabric cannot be fixed. Cannot be adopted.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a method of inserting a nonwoven fabric having an antenna coil and an IC chip sandwiched between both front and back sheets is used to fix the nonwoven fabric. It is an object of the present invention to provide a method of manufacturing a non-contact type IC card capable of performing the method.

[0007]

For this reason, the invention according to claim 1 is formed so as to be larger than the shape of one non-contact type IC card and to be located at a peripheral position outside the non-contact type IC card-shaped portion. One of the front and back sheets on which a plurality of positioning holes are respectively formed is inserted into a fixed mold cavity of a mold composed of a movable mold and a fixed mold, and the fixed pin on the fixed mold side is inserted. Through a positioning hole of the one sheet, insert the other sheet into the cavity of the movable mold, and insert a non-woven fabric between the antenna coil and the IC chip between the two sheets, A step of vacuum-sucking the sheet to fix the movable mold and the fixed mold, respectively, and closing the movable mold and the fixed mold, and fixing the fixed pin on the fixed mold side through the positioning hole of the sheet on the movable mold side. To Applying the molten resin into the mold cavity, filling the gap between the two sheets with the molten resin, compressing the mold, and molding the molded product. A method for manufacturing a non-contact IC card includes a step of removing the molded article from the mold and a step of punching the molded article into a single non-contact IC card.

The invention according to claim 2 is characterized in that each of the front and back sheets is punched out of a sheet member into a predetermined shape together with a plurality of positioning holes.

The invention according to claim 3 is that, before injecting the molten resin into the cavity of the mold, the mold is minutely opened in advance, and then the molten resin is injected at a low pressure, so that the gap between the two sheets of the molten resin is formed. During or after filling the gap, the molten resin in the cavity of the mold is compressed under pressure.

According to this structure, in the invention according to claim 1, the non-woven fabric is pressed and fixed by the fixing pin, and after molding, one non-contact type IC card-shaped portion located at the central portion of the molded product is punched out. Thus, a non-contact type IC card is completed.

In the invention according to claim 2, each of the front and back sheets is punched out of the sheet member into a predetermined shape together with a plurality of positioning holes, and a plurality of positioning holes are formed in the sheet member in a predetermined shape in advance. The obtained front and back sheets can be obtained easily and efficiently.

According to the third aspect of the present invention, a uniform compressive force is applied to the entire surface of the molten resin in the mold cavity, and internal stress and orientation distortion accompanying the flow of the molten resin are less likely to occur.
A molded article with few defects such as warpage can be obtained.

[0013]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. First, the configuration of a mold in an apparatus for performing the method for manufacturing a non-contact type IC card according to the present invention will be described with reference to FIGS. The mold 1 includes a fixed mold 2 and a movable mold 3. The mold 1 has a configuration capable of forming two non-contact type IC cards.
The fixed mold 2 and the movable mold 3 are respectively formed with two cavities 4 and 5 arranged in parallel in the longitudinal direction.

On the outer wall portion of the mold 1 between the two cavities 4 on the movable mold 3 side, a molten resin communicating with the inside of the mold cavity formed by the cavities 5 and 4 of the movable mold 3 and the fixed mold 2 is provided. Is formed. A vacuum suction port 7 is formed in the bottom wall of the cavity 4 of the fixed mold 2, and the suction port 7 communicates with a vacuum passage hole 8 formed in the fixed mold 2.

Further, a plurality of fixing pins 15 are provided on the periphery of the bottom wall of the cavity 4 of the fixed mold 2 so as to protrude inward. In this case, the fixing pins 15 are formed at positions corresponding to the position positioning holes formed on the front and back sheets described later, and two fixing pins 15 are respectively provided at four corner portions of the bottom wall of the cavity 4 in the longitudinal direction. They are formed in parallel. As shown in FIG. 3, a plurality of positioning pins 1 are provided around the bottom walls of the cavities 4 and 5 of the fixed mold 2 and the movable mold 3.
9 are provided to protrude inward. This pin 19
The cavities 4 and 5 of the bottom wall are formed at positions corresponding to the position positioning holes formed on the front and back sheets described later.
Two corner portions are formed in parallel in the longitudinal direction. The fixing pin 15 and the positioning pin 19 are both formed so as to be movable in the axial direction against the spring force of the spring 20.

On the other hand, a vacuum suction port 10 is formed in the bottom wall of the cavity 5 of the movable mold 3.
Is communicated with a vacuum passage hole 11 formed in the movable mold 3.

Next, an embodiment of a method for manufacturing a non-contact type IC card according to the present invention will be described with reference to FIGS. The method for manufacturing a non-contact type IC card of the present invention includes the following (1) to
It comprises the step (7).

(1) A plurality of positioning holes 12 are formed at a peripheral portion outside the non-contact type IC card-shaped portion and are formed larger than the shape of one non-contact type IC card. Sheet 1 of each of sheets 13 and 14
4 is inserted into the cavity 4 of the fixed mold 2 of the mold 1 including the movable mold 3 and the fixed mold 2, and the fixed pin 15 and the positioning pin 19 on the fixed mold 2 side are inserted into the one sheet 1.
4 and the other sheet 13 is inserted into the cavity 5 of the movable mold 3 so that the positioning pin 19 on the movable mold 3 side is inserted into the one sheet 13.
The nonwoven fabric 16 in which the antenna coil and the IC chip are interposed is inserted into the positioning holes 12 of
Step of inserting between 3 and 14 (FIG. 1 (A) and FIG. 3)
(A)).

(2) Step of vacuum-sucking both sheets 13 and 14 to fix them to movable mold 3 and fixed mold 2 (FIG. 1B)
reference).

(3) The movable mold 3 and the fixed mold 2 are closed, and the fixed pins 15 of the fixed mold 2 are moved to the seat 1 of the movable mold 3.
Step 3 of pressing against and fixing the nonwoven fabric 16 facing the positioning hole 12 (see FIGS. 1C and 3B).

(4) A step of injecting the molten resin 17 into the gap between the sheets 13 and 14 (see FIG. 1D).

(5) A step of compressing and molding the mold 1 (see FIG. 1E).

(6) Step of taking out the molded product 18 from the mold 1 (see FIG. 1 (F)).

(7) A step of punching the molded product 18 into a single non-contact IC card.

Here, the front and back sheets 13 and 14 are used.
Is formed in a rectangular shape as shown in FIG. 2, and a plurality of (for example, two as shown in the figure) side by side positioning holes 12 are formed in the four corner portions in parallel with each other. . Each of the front and back sheets 13 and 14 is formed by punching out a large sheet member into a predetermined shape together with a plurality of positioning holes 12.

In the step (7), one non-contact type IC card-shaped portion A located at the center of the molded product
By punching (see FIG. 2), a portion B (see FIG. 2) in which a plurality of positioning holes 12 are formed in a peripheral portion outside the non-contact type IC card-shaped portion is removed.

Further, in the manufacturing method of the present embodiment, the mold 1
Before injecting the molten resin into the cavity of
, The molten resin is injected at a low pressure, and the molten resin in the cavity of the mold 1 is pressurized and compressed during or after filling the gap between the sheets 13 and 14 with the molten resin. .

According to the method for manufacturing a non-contact type IC card described above, it is possible to mold various antenna coils and an IC card having an IC chip with the same mold by means of insert molding, and to perform injection. By applying compression molding, low pressure molding is possible and the antenna coil and the IC chip are not damaged. Of course, there is an advantage that the nonwoven fabric 16 is pressed and fixed by the fixing pin 15, and after molding, the molded product is formed. Since the non-contact type IC card is finished by punching out one non-contact type IC card-shaped portion located at the center portion, the non-woven fabric 16 in which the antenna coil and the IC chip are sandwiched between the two sheets 13, 14
It becomes easy to manufacture an IC card by a method of inserting between them.

Particularly, in the present embodiment, before injecting the molten resin into the cavity of the mold, the mold is slightly opened in advance, and then the molten resin is injected at a low pressure, so that the two sheets 13 and 14 of the molten resin are injected. During or after filling into the gap between the molds, the molten resin in the cavity of the mold 1 is pressurized and compressed, so that a uniform compressive force is applied to the entire surface of the molten resin in the mold cavity, and internal stress and It is possible to obtain a molded product in which alignment distortion due to the flow of the molten resin is less likely to occur, and which has few defects such as sink marks and warpage.

[0030]

As described above, according to the first aspect of the present invention, the non-woven fabric in which the non-woven fabric in which the antenna coil and the IC chip are sandwiched is inserted between the front and back sheets is fixed. And a method of manufacturing a non-contact type IC card which can perform the above-mentioned steps.

According to the second aspect of the present invention, each of the front and back sheets is punched out of the sheet member into a predetermined shape together with a plurality of positioning holes. It is possible to easily and efficiently obtain the front and back sheets in which the holes are formed in advance.

According to the third aspect of the present invention, before injecting the molten resin into the cavity of the mold, the mold is opened slightly beforehand, and then the molten resin is injected at a low pressure, so that the molten resin is interposed between the two sheets. During or after the filling of the gap, the molten resin in the cavity of the mold is pressurized and compressed, so that a molded product with few defects such as sink marks and warpage can be obtained.

[0033]

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an embodiment of a method for manufacturing a non-contact type IC card according to the present invention, wherein (A) is an insert step, (B) is a sheet fixing step, (C) is a nonwoven fabric fixing step, D) shows an injection step, (E) shows a molding step, and (F) shows an extraction step.

FIG. 2 is a plan view of a sheet.

3A and 3B are cross-sectional views illustrating a state of a fixing process of a nonwoven fabric, wherein FIG. 3A is a cross-sectional view in which a mold is opened, and FIG.

FIG. 4 is a front sectional view illustrating a configuration of a mold in an apparatus for performing the method for manufacturing a non-contact type IC card according to the present invention.

FIG. 5 is a plan view of a fixed mold of the above-mentioned mold.

FIG. 6 is a plan view of a movable mold of the above-mentioned mold.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 mold 2 fixed mold 3 movable mold 4,5 cavity 12 positioning hole 13,14 sheet 15 fixing pin 16 nonwoven fabric 17 molten resin 18 molded product 19 positioning pin 20 spring

Claims (3)

[Claims] 1. A front and back side each having a plurality of positioning holes formed at a peripheral portion outside a non-contact type IC card-shaped portion and formed larger than a single non-contact type IC card. One of the sheets is inserted into a cavity of a fixed mold of a mold composed of a movable mold and a fixed mold, and a fixed pin on the fixed mold side is inserted into a positioning hole of the one sheet, and Inserting the sheet into the cavity of the movable mold and inserting the nonwoven fabric between which the antenna coil and the IC chip are sandwiched between the two sheets, and fixing both sheets to the movable mold and the fixed mold by vacuum suction Closing the movable mold and the fixed mold, pressing the fixed pin on the fixed mold side against the nonwoven fabric facing the positioning hole of the sheet on the movable mold side to fix the fixed pin, and melting the mold into the mold cavity. A step of injecting the molten resin to fill the gap between the two sheets with the molten resin; a step of compressing and molding the mold; a step of removing the molded article from the mold; A method of punching into the shape of a single non-contact IC card. 2. The method for manufacturing a non-contact type IC card according to claim 1, wherein each of the front and back sheets is punched out of a sheet member into a predetermined shape together with a plurality of positioning holes. 3. Before injecting the molten resin into the cavity of the mold, the mold is slightly opened in advance, and then the molten resin is injected at a low pressure to fill the gap between the two sheets of the molten resin or 3. The method for manufacturing a non-contact type IC card according to claim 1, wherein after filling, the molten resin in the cavity of the mold is compressed under pressure.