JPH1131673A - Apparatus and method for cleaning substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for the cleaning of a substrate, in which particles on the substrate can be surely removed. SOLUTION: A substrate W is sucked and held onto a turning and holding part 1, which sucks and holds the outer circumferential part on the rear of the substrate W, it surface is spin-coated with pure water, and a thin pure-water film is formed. Liquid nitrogen is discharged to the rear of the turning and holding part 1 from a cooling nozzle 16, the substrate W is cooled indirectly, the water film is frozen, and an ice film is formed. High-pressure pure water is discharged from a pure-water supply nozzle 12, the ice film which contains particles is exfoliated from the substrate W, so as to be removed. The particles are removed from the substrate, together with the ice film.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning substrates such as semiconductor wafers, glass substrates for liquid crystal display devices, and photomask substrates.

[0002]

2. Description of the Related Art As a method of cleaning particles such as dust adhering to the surface of a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device, a method called a brush scrub method is generally adopted. In this method, a substrate is placed on a substrate support and rotated, and particles are removed by rubbing the surface of the substrate with a brush such as nylon while supplying cleaning water to the surface of the substrate.

[0003]

However, in the brush scrubbing method described above, for example, when particles attached to an oxide film on a semiconductor wafer are removed, static electricity is generated due to friction between the brush and the oxide film, and the static electricity is temporarily generated by the static electricity. However, there is an inconvenience that the removed particles adhere to the semiconductor wafer again.

[0004] Particles also adhere to the brush due to static electricity generated by friction between the brush and the oxide film. If the next cleaning of the surface of the semiconductor wafer is performed using the brush to which the particles adhere, there is also a disadvantage that the particles of the brush adhere to the semiconductor wafer and contaminate the semiconductor wafer.

[0005] Further, dust is generated from the bristles of the brush due to friction with the semiconductor wafer, and the brush itself becomes a source of particles.

Further, in the case of the brush scrub method, it is easy to remove relatively large particles of about 0.2 μm. However, fine particles of 0.1 μm or less are required to pass through the gap of the brush. Its removal becomes difficult.

On the other hand, as an alternative to the brush scrub method, a method has been proposed in which fine particles such as ice fine particles and carbon dioxide gas are sprayed on a substrate surface, and particles are crushed and removed by utilizing kinetic energy due to the collision. I have. However, in this method, it is necessary to control the temperature and pressure of ice, carbon dioxide, and the like, and the equipment for that purpose becomes large. Also,
The substrate is damaged by the collision of the fine particles with the substrate surface.

An object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method capable of reliably removing particles on a substrate.

[0009]

Means for Solving the Problems and Effects of the Invention A substrate cleaning apparatus according to a first aspect of the present invention comprises: a rotation holding unit that holds a substrate and is driven to rotate; a cooling unit that cools the rotation holding unit below freezing; Removing means for removing an ice film formed on the surface of the substrate on the cooled rotation holding unit.

In the substrate cleaning apparatus according to the first aspect of the present invention, the cooling means cools the spin holder to below freezing, whereby the substrate on the spin holder is indirectly cooled, and the surface of the substrate to which particles adhere is ice A film is formed. And
Particles are removed from the substrate surface together with the ice film by removing the ice film by the removing means. Thereby, fine particles are also removed from the substrate surface together with the ice film, and the substrate surface can be cleaned in a clean state.

A substrate cleaning apparatus according to a second aspect of the present invention is the substrate cleaning apparatus according to the first aspect, wherein the cooling means comprises:
The rotation holding unit includes a cooling medium discharge nozzle that discharges a cooling medium below freezing.

By discharging the cooling medium below the freezing point from the cooling medium discharge nozzle to the rotation holding section, the rotation holding section is cooled below the freezing point. As a result, the substrate on the rotation holding unit is indirectly cooled to a temperature below the freezing point, and an ice film is formed so as to enclose particles on the surface thereof. Therefore, particles can be removed from the substrate surface by removing the ice film from the substrate.

A substrate cleaning apparatus according to a third aspect of the present invention is the substrate cleaning apparatus according to the second aspect of the present invention, wherein the rotation holding section rotates the substrate in a horizontal posture, and the cooling medium discharge nozzle rotates and holds the rotation. It is provided movably below the section.

By moving the cooling medium discharge nozzle to discharge the cooling medium to the rotation holding unit, the entire rotation holding unit can be rapidly cooled to below freezing. Thus, an ice film can be quickly and uniformly formed on the surface of the substrate.

According to a fourth aspect of the present invention, there is provided the substrate cleaning apparatus according to the second or third aspect of the present invention, wherein the storage unit for storing the cooling medium discharged from the cooling medium discharge nozzle of the cooling means; A cup surrounding the holding portion and provided with a discharge port, a recovery conduit for collecting the cooling medium discharged to the rotation holding portion from the discharge port of the cup and guiding the cooling medium to the storage portion, and provided in the recovery conduit. And a temperature adjusting unit for adjusting the temperature of the cooling medium to a temperature below freezing.

In this case, the cooling medium discharged to the rotation holding unit passes through a recovery pipe, is adjusted to a temperature below freezing in the temperature adjustment unit, is collected in the storage unit, and is used repeatedly. Thus, the rotation holding unit can be cooled by using the cooling medium economically and efficiently.

According to a fifth aspect of the present invention, there is provided a substrate cleaning apparatus comprising:
In the configuration of the substrate cleaning apparatus according to any one of the fourth aspects of the present invention, the substrate cleaning apparatus further includes a water supply unit that supplies water for forming an ice film on the surface of the substrate held by the rotation holding unit.

Water is supplied to the surface of the substrate by the water supply means. The cooling unit indirectly cools the substrate via the rotation holding unit, and freezes the supplied moisture to form an ice film. Then, by removing the ice film, particles on the surface of the substrate are removed together with the ice film, and the surface of the substrate can be washed.

According to a sixth aspect of the present invention, in the substrate cleaning apparatus according to the fifth aspect, the water supply means includes a pure water supply nozzle for supplying pure water to the surface of the substrate.

Thus, an ice film is formed by cooling the pure water on the surface of the substrate, and the surface of the substrate can be cleaned by removing the ice film.

According to a seventh aspect of the present invention, there is provided a substrate cleaning apparatus comprising:
In the configuration of the substrate cleaning apparatus according to any one of the sixth inventions, the removing unit includes a liquid discharge nozzle that discharges a liquid onto the ice film.

When the liquid discharge nozzle discharges the liquid to the ice film, the ice film is peeled off from the surface of the substrate by the collision pressure of the liquid and removed outward. Thereby, the surface of the substrate can be cleaned by removing the ice film containing particles.

The substrate cleaning apparatus according to the eighth invention comprises
In the configuration of the substrate cleaning apparatus according to any one of the seventh inventions, the rotation holding unit is provided on a surface of the disk-shaped member that is driven to rotate in a horizontal posture, and a peripheral edge of a back surface of the substrate. And a suction holding unit for suction holding.

In this case, the disk-shaped member is arranged close to the back surface of the substrate, and the peripheral portion of the back surface of the substrate is held by the suction holding unit. When the rotation holding unit is cooled by the cooling means, the substrate is cooled through the suction holding unit or indirectly from the surface of the disk-shaped member, and an ice film is formed on the surface of the substrate. In particular, when the cooling medium is discharged from the cooling medium discharge nozzle, the cooling medium is discharged to the disk-shaped member and is prevented from being directly discharged to the substrate. This prevents condensation from occurring on the substrate.

According to a ninth aspect of the present invention, there is provided a substrate cleaning method for cleaning a surface of a substrate held by a spin holder, wherein the spin holder is cooled below freezing to form an ice film on the surface of the substrate. The method includes a step of forming and a step of removing the ice film from the substrate.

In the substrate cleaning method according to the ninth aspect, the substrate is cooled below the freezing point by cooling the rotation holding unit, and an ice film is formed on the surface of the substrate. The ice film is formed including particles on the substrate. Then, by removing the ice film from the substrate, all particles are removed from the surface of the substrate together with the ice film, and the surface of the substrate can be cleaned. Thus, all particles can be removed from the surface of the substrate without damaging the substrate.

According to a tenth aspect of the present invention, there is provided a substrate cleaning method comprising:
In the configuration of the substrate cleaning method according to the invention, the cooling medium is discharged to the rotation holding section to indirectly cool the substrate held by the rotation holding section.

As a result, dew condensation on the substrate due to the discharge of the cooling medium directly to the substrate is prevented, and an ice film can be uniformly formed on the surface of the substrate.

[0029] The substrate cleaning method according to the eleventh aspect of the present invention comprises the following steps:
In the configuration of the substrate cleaning method according to the present invention, pure water is supplied to the surface of the substrate to form a film of pure water on the surface of the substrate before discharging the cooling medium to the rotation holding unit.

By forming a pure water film on the surface of the substrate, the periphery of the particles can be covered with pure water.
Then, by cooling the rotation holding unit in this state, the pure water film is frozen, and a uniform ice film containing particles can be formed.

According to a twelfth aspect of the present invention, there is provided a substrate cleaning method comprising the steps of:
In the configuration of the substrate cleaning method according to any one of the first to eleventh aspects, the step of removing the ice film includes discharging a liquid onto the surface of the ice film to remove the ice film from the surface of the substrate.

When the liquid is discharged onto the ice film, the ice film is peeled off from the surface of the substrate by the collision pressure of the liquid and removed outward.
Thereby, the ice film containing particles is removed from the surface of the substrate, and the surface of the substrate is cleaned in a clean state.

According to a thirteenth aspect of the present invention, there is provided a substrate cleaning method comprising:
In the configuration of the substrate cleaning method according to the second aspect, the liquid is high-pressure pure water.

By discharging high-pressure pure water onto the ice film, the ice film can be instantaneously removed from the surface of the substrate.

[0035]

FIG. 1 is a schematic sectional view of a substrate cleaning apparatus according to an embodiment of the present invention. FIG. 2 is a partially cutaway plan view of a rotation holding unit in the substrate cleaning apparatus of FIG.
FIG. 3 is a sectional view taken along line XX of FIG.

In FIG. 1, the substrate cleaning apparatus includes a rotation holder 1 which holds and rotates the substrate W in a horizontal posture. The rotation holding unit 1 is attached to the tip of the rotation shaft 2 of the motor 3 and is driven to rotate around a vertical axis. The rotating shaft 2 has a hollow portion 4 inside, and is inserted into a sleeve 5.

The rotation holding unit 1 is made up of a disc-shaped member 6. A cylindrical shaft mounting portion 6a is provided at the center of the back surface of the disk-shaped member 6.
The rotating shaft 2 of the motor 3 is fitted to the shaft mounting portion 6a. Further, a suction holding portion 7 projecting annularly is formed on the outer peripheral portion of the surface of the disk-shaped member 6.

As shown in FIG. 2, a plurality of radial passages 8 extending from the center to the outer periphery are formed inside the disk-shaped member 6. The plurality of radial passages 8 communicate with the hollow portion 4 of the rotating shaft 2 of the motor 3.

The suction holding section 7 has an annular suction port 9 formed therein. The annular suction port 9 communicates with the radial passage 8.
The suction holding portion 7 protrudes from the surface of the disk-shaped member 6,
This supports the peripheral edge of the back surface of the substrate W.

The hollow portion 4 in the rotating shaft 2 of the motor 3 is connected to a suction means (not shown) such as a vacuum pump, and the hollow portion 4 in the rotating shaft 2 and the disk-shaped member 6 are connected by the suction means. The peripheral edge of the back surface of the substrate W is sucked through the radial passage 8 and the annular suction port 9 of the suction holding unit 7. Thus, the peripheral portion of the substrate W is suction-held by the suction holding section 7. The annular suction port 9 sucks and holds a portion inside the outer peripheral edge of the substrate W so as not to interfere with the linear notch or the notch of the substrate W.

A scattering prevention cup 11 is provided so as to surround the periphery of the substrate W held by the rotation holding unit 1. An opening is provided on the upper side of the cup 11, and a drainage port 14 and a plurality of exhaust ports (not shown) are provided on a lower part.

A hole 11a is provided on the side surface of the cup 11, and a cooling nozzle 16 for discharging a cooling medium to the back surface of the disk-shaped member 6 through the hole 11a is provided below the disk-shaped member 6. Have been. The cooling nozzle 16 is provided so as to be movable in the radial direction of the disk-shaped member 6 by an air cylinder 17 as shown by an arrow R. Note that a motor may be used instead of the air cylinder 17 to move the cooling nozzle 16.

The cooling medium is supplied to the cooling nozzle 16 from a cooling medium storage tank 18 through a filter 19 and an on-off valve 15. As the cooling medium, liquid nitrogen or cryogenic nitrogen gas is used. A cooling material is provided in a pipe from the cooling medium storage tank 18 to the cooling nozzle 16, thereby preventing the temperature of the cooling medium passing through the pipe from rising. Further, the filter 19 prevents particles generated in the cooling medium from being discharged from the cooling nozzle 16 and adhering to the disk-shaped member 6. The cooling nozzle 16 is
A plurality may be provided to quickly cool the entire back surface of the disk-shaped member 6, or a nozzle opening may be formed in a slit shape.

The cooling medium guided to the drain port 14 of the cup 11 is guided to the low-temperature processing section 21 through the recovery pipe 22.
The low-temperature processing unit 21 reprocesses the collected cooling medium to an extremely low temperature and supplies it to the cooling medium storage tank 18. This allows
A recovery path for the cooling medium is configured.

Outside the cup 11, a pure water supply nozzle 12 for supplying pure water to the substrate W on the rotation holding unit 1 is arranged. The pure water supply nozzle 12 is configured to be movable between a standby position outside the cup 11 and a predetermined position on the rotation holding unit 1, and discharges pure water to the surface of the substrate W.

Further, a brush arm (not shown) for cleaning the surface of the substrate W is disposed outside the cup 11. The brush arm is provided movably between a standby position outside the cup 11 and a predetermined position on the rotation holding unit 1.

The control unit 20 controls the number of rotations of the motor 3, the timing of discharging pure water from the pure water supply nozzle 12 by the on-off valve 13, the movement of the cooling nozzle 16 by the air cylinder 17,
The discharge timing of the cooling medium from the cooling nozzle 16 by the on-off valve 15 is controlled.

As shown in FIGS. 2 and 3, the disc-shaped member 6 is provided with a plurality of through holes 13. Each through hole 1
A closing sheet member 15 made of a stretchable material such as rubber is attached to the upper surface of 3. A hole having a lid that can be opened and closed is provided on the bottom surface of the cup 11 below each through hole 13.

Below the hole of the cup 11, a lifting pin 14 is provided.
Are provided so as to be movable up and down. When the substrate W is loaded and unloaded, the elevating pins 14 move up and pass through holes (not shown) of the cup 11 and through holes 13 of the disc-shaped member 6 to contact the back surface of the substrate W. At this time, the closing sheet member 1
Since the member 5 has elasticity, the lifting pins 14 can extend the closing sheet member 15 to lift the substrate W upward. The closing sheet member 15 prevents particles from adhering to the back surface of the substrate W through the through holes 13 of the disk-shaped member 6.

Here, the cooling nozzle 16 corresponds to the cooling means and the cooling medium discharge nozzle of the present invention, the cooling medium storage tank 18 corresponds to the storage section, the recovery pipe 22 corresponds to the recovery pipe, The processing unit 21 corresponds to a temperature adjustment unit. Further, the pure water supply nozzle 12 corresponds to the removing unit, the water supply unit, and the pure water supply nozzle of the present invention.

Next, the cleaning operation of the substrate cleaning apparatus will be described. FIGS. 4A and 4B are flowcharts showing the cleaning operation of the substrate cleaning apparatus. FIG. 4A mainly shows the operation of the rotation holding unit 1, and FIG. 4B mainly shows the substrate cleaning operation. Also,
FIG. 6 is a schematic diagram of the state of cleaning the substrate.

First, the substrate W is transferred to the rotation holding unit 1 by a substrate transfer device provided outside (step S1).
The outer peripheral portion of the back surface of the substrate W is suction-held by the suction holding portion 7 of the rotation holding portion 1. As shown in FIG. 6A, it is assumed that particles 25 adhere to the surface of the transferred substrate W. (Step S2).

Next, the motor 3 rotates at a low speed, and the rotation holding unit 1 and the substrate W are rotated at a low speed (step S).
3).

The pure water supply nozzle 12 is moved onto the rotation holding unit 1, and a fixed amount of pure water is discharged onto the surface of the substrate W (Steps S4 and S5). As shown in FIG. 6B, the pure water discharged onto the substrate W is thinly stretched over the entire surface by the rotation of the substrate W, and a pure water film 26 including the particles 25 is formed (Step S6).

In this state, the on-off valve 15 is opened, and the cooling medium 27 is discharged from the cooling nozzle 16 to the back surface of the disk-shaped member 6 (Step S7). As a result, the disk-shaped member 6 and the substrate W are rapidly cooled below the freezing point, the pure water film 26 on the surface of the substrate W is frozen, and a thin ice film 28 is formed as shown in FIG. . As the thickness of the ice film 28 increases, it becomes more difficult to separate the ice film 28 from the surface of the substrate W. Therefore, the ice film 2
8 is preferably formed relatively thin (step S
8). When the ice film 28 is formed, the on-off valve 15 is closed, and the supply of the cooling medium 27 is stopped (Step S9).

Next, the number of rotations of the motor 3 is increased and the substrate W
Is rotated at a high speed (step S10). Then, pure water 29 is ejected from the pure water supply nozzle 12 to the surface of the substrate W rotating at high speed (step S11), and the ice film 28 is instantaneously peeled off from the surface of the substrate W. It is desirable that the pure water be jetted at a high pressure from the center of the substrate W toward the outer periphery. As a result, the ice film 28 including the particles 25 is separated from the surface of the substrate W and scattered outside the substrate. The temperature of the pure water is preferably a low temperature close to zero degrees. If the temperature is high, the ice film 28 is easily melted, and it becomes difficult to completely remove the particles 25 from the surface of the substrate W (step S12).

When the ice film 28 is removed from the surface of the substrate W, the rotation speed of the motor 3 is reduced, and the substrate W is rotated at a low speed (step S13). At this time, pure water is continuously supplied from the pure water supply nozzle 12 to the surface of the substrate W. Then, the brush arm is moved onto the substrate W, and the surface of the substrate W is cleaned by brush scrub cleaning. Note that, instead of the brush scrub cleaning, substrate cleaning using high-pressure water, ultrasonic cleaning called megasonic cleaning, or the like may be performed. If the surface of the substrate W is clean, this cleaning step may be omitted (Step S14).

Next, the number of rotations of the motor 3 is increased and the substrate W
Is rotated at high speed (step S15). At the same time, the supply of pure water to the surface of the substrate W is stopped, and the high-speed rotation of the substrate W
Shaking off drying is performed (step S16).

When the drying of the substrate W is completed, the motor 3 is stopped (step S17), and the suction of the substrate W is released (step S18). Then, the cleaned substrate W is carried out to the outside (step S19).

Through the above steps, the particles 25 on the substrate W are removed, and the surface of the substrate W is cleaned.

In the step of removing the ice film 28 shown in steps S11 and S12, alcohol may be jetted onto the ice film 28 instead of pure water. For example, methanol having a low melting point may be cooled to −20 ° C. and discharged. Thus, the ice film 28 can be separated from the surface of the substrate W without melting.

In the above-described substrate cleaning step, it is desirable that the exhaust amount from the cup 11 is made larger than that in the case of the usual brush scrub processing. Thereby, it is possible to prevent the cooling medium discharged to the rotation holding unit 1 from leaking out of the cup 11.

Further, in the above substrate cleaning process, the substrate W
The disk-shaped member 6 of the rotation holding unit 1 is close to the back surface of the disk. For this reason, the cooling medium is prevented from being sprayed directly on the back surface of the substrate W, dew formation is prevented on the substrate W, and the ice film 28 separated from the surface of the substrate W is prevented.
Is prevented from wrapping around and adhering to the back surface of the substrate W.

The rotation holding unit 1 is shown in FIGS.
In addition to the one that holds the outer peripheral portion of the rear surface of the substrate W by suction, the conventional suction-type rotation holding unit (suction type spin chuck) that suctions and holds the central portion of the rear surface of the substrate W, For example, a mechanical rotation holding unit (mechanical spin chuck) supported by a shape member may be used. In this case, the cooling medium discharged from the cooling nozzle 16 is adjusted so as to be discharged only to the rotation holding unit.

FIG. 5 is a flowchart showing another example of the substrate cleaning process. The substrate cleaning step shown in FIG. 5 differs from the substrate cleaning step shown in FIG. 4 in the timing of starting cooling of the rotation holding unit 1, and the other steps are the same. Therefore, FIG.
In, the same steps are denoted by the same step numbers as in FIG. 4, and description thereof will not be repeated.

In step S4, discharge of pure water from the pure water supply nozzle 12 to the surface of the substrate W rotating at a low speed is started. Then, while supplying pure water, a cooling medium is discharged from the cooling nozzle 16 to the back surface of the rotation holding unit 1,
The cooling process of the rotation holding unit 1 and the substrate W is started (Step S20). Thereafter, the discharge of the pure water is stopped in a state where the pure water is spread over the entire surface of the substrate W (step S2).
5). Thus, a thin ice film 28 is formed on the surface of the substrate W (Step S8).

As described above, the ice film 28 can be formed on the entire surface of the substrate W even when the cooling process of the rotation holding unit 1 is started while discharging pure water. Further, the subsequent processing is the same as the case shown in FIG.

In the above embodiment, FIG.
Steps S4 to S6 and step S in FIG.
4 and the step of forming the pure water film 26 shown in S5 may be omitted. That is, the atmosphere around the substrate W contains moisture. Therefore, the rotation holding unit 1 is cooled by the cooling medium 27.
Is cooled, moisture in the atmosphere freezes on the surface of the substrate W to form an ice film 28.

Further, the step of discharging the above pure water (FIG. 4)
Instead of (b) and step S4) of FIG. 5B, air containing mist may be blown to the surface of the substrate W.
Thereby, the mist adheres to the surface of the substrate W. Then, by cooling this, the ice film 28 is formed on the surface of the substrate W.
Can be formed.

In the above embodiment, an example in which the pure water supply nozzle 12 is used to form the pure water film 26, remove the ice film 28, and perform brush scrub cleaning has been described.
Different liquids such as pure water or alcohol may be supplied using different nozzles.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a substrate cleaning apparatus according to an embodiment of the present invention.

FIG. 2 is a partially cutaway plan view of a rotation holding unit in the substrate cleaning apparatus of FIG.

FIG. 3 is a sectional view taken along line XX of FIG. 2;

FIG. 4 is a flowchart illustrating a cleaning operation of the substrate cleaning apparatus.

FIG. 5 is a flowchart illustrating another example of the cleaning operation of the substrate cleaning apparatus.

FIG. 6 is a schematic diagram of a state of cleaning the substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Rotation holding part 2 Rotating shaft 3 Motor 6 Disc-shaped member 7 Suction holding part 11 Cup 11a Hole 12 Pure water supply nozzle 14 Drainage port 16 Cooling nozzle 17 Cylinder 18 Cooling medium storage tank 21 Low temperature processing part 22 Recovery pipe Road

Claims (13)

[Claims] A rotating unit configured to hold and rotate the substrate; a cooling unit configured to cool the rotating unit to below freezing; and ice formed on a surface of the substrate on the cooled rotating unit. A substrate cleaning apparatus, comprising: a removing unit that removes a film. 2. The substrate cleaning apparatus according to claim 1, wherein the cooling unit includes a cooling medium discharge nozzle for discharging a sub-zero cooling medium to the rotation holding unit. 3. The rotation holding section for rotating a substrate in a horizontal posture, and the cooling medium discharge nozzle is provided movably below the rotation holding section. Substrate cleaning equipment. 4. A storage section for storing a cooling medium discharged from the cooling medium discharge nozzle of the cooling means, a cup surrounding the rotation holding section and provided with a discharge port, and discharging to the rotation holding section. A recovery pipe for recovering the cooling medium from the outlet of the cup and guiding the cooling medium to the storage section, and a temperature adjustment section provided in the recovery pipe, for re-adjusting the temperature of the cooling medium to below freezing. The substrate cleaning apparatus according to claim 2, further comprising: 5. The apparatus according to claim 1, further comprising a water supply unit for supplying water for forming the ice film on a surface of the substrate held by the rotation holding unit. A substrate cleaning apparatus according to claim 1. 6. The substrate cleaning apparatus according to claim 5, wherein said water supply means includes a pure water supply nozzle for supplying pure water to a surface of said substrate. 7. The apparatus according to claim 1, wherein said removing means includes a liquid discharge nozzle for discharging a liquid to said ice film.
7. The substrate cleaning apparatus according to any one of 6. 8. A disk-shaped member that is driven to rotate in a horizontal posture, a suction holding unit that is provided on a surface of the disk-shaped member, and suction-holds a peripheral edge of a back surface of the substrate. The substrate cleaning apparatus according to any one of claims 1 to 7, further comprising: 9. A substrate cleaning method for cleaning a surface of a substrate held by a rotation holding unit, comprising: a step of cooling the rotation holding unit below freezing to form an ice film on the surface of the substrate; Removing the substrate from the substrate. 10. The method according to claim 9, wherein the step of forming the ice film indirectly cools the substrate held by the rotation holding unit by discharging a cooling medium to the rotation holding unit. Substrate cleaning method. 11. A pure water film is formed on the surface of the substrate by supplying pure water to the surface of the substrate before discharging the cooling medium to the rotation holding unit. Substrate cleaning method. 12. The method according to claim 9, wherein in the step of removing the ice film, a liquid is discharged to a surface of the ice film to remove the ice film from a surface of the substrate. Substrate cleaning method. 13. The method according to claim 12, wherein the liquid is high-pressure pure water.