JPH11312562A - Connector for mounting on board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount a connector closely adhering and rigidly to a board. SOLUTION: A shell 4 provided at an insulator 1 has a pair of shell holding parts 4a mounted along a pair of exterior wall surfaces 1g, the shell holding part 4a having a pin 4b extending in a perpendicular direction to the installation surface of the insulator 1. The pin 4b has a pin connection 4h extending outside of the installation surface and inserted into a through-hole 11a formed in a board 11. The length of the pin connection 4h extending outside of the installation surface is set equal to or less than half the thickness of the board 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board mounting connector mounted on a board and connected to a mating connector.

[0002]

2. Description of the Related Art Conventionally, the number of signals handled by a device is one step of increasing as the performance of the device becomes higher. In addition, as the size of the device is reduced, the density of the connector for connecting the substrates is an essential condition.

FIG. 20 shows a connector as prior art 1.
(A), FIG. 20 (B) and FIG. 20 (C),
It has an insulator 51 and a conductive contact 53 held by the insulator 51. The insulator 51 has a fitting part 51a that houses the contact part of the contact 53, and a pair of fixing parts 51b connected to both ends in the longitudinal direction of the fitting part 51a.

This connector is mounted on a board 55. An intermediate portion of the plurality of contacts 53 extending from the fitting portion 51a is bent at a right angle between the pair of fixing portions 51b, and continuously extends below the fixing portion 51b. Contact 5
Reference numeral 3 denotes a terminal portion 53c at the tip end extending downward from the fixing portion 51b. The terminal portion 53c is inserted into a through hole 55a formed in the substrate 55, and is connected to a circuit on the substrate 55 by soldering.

[0005] As prior art 2, FIG.
(B) and FIG. 21 (C) show FIGS. 20 (A) to 20
The connector shown in (C) is replaced with an SMT (Surface Mount Technology) surface mount technology. In this connector, the terminal portion 53c of the contact 53 is connected to the circuit of the substrate 55 shown in FIG. 20C by cream solder.

As prior art 3, FIG. 22 shows an example in which two connectors are mounted from above and below a board. This connector has two insulators 61 and a conductive contact 63 held on each of the insulators 61. The insulator 61 has a fitting portion 61a that houses the contact portion of the contact 63, and a pair of fixing portions 61b connected to both ends in the longitudinal direction of the fitting portion 61a.

[0007] The two connectors are mounted above and below the board 65. A fitting portion 61a is provided between the pair of fixing portions 61b.
An intermediate portion of the plurality of contacts 63 extending from the contact 63 is bent at a right angle. The contact 63 has a terminal portion 63c at the tip end extending to the fixing portion 61b. Also in such a connector, the terminal portions 63c are formed on the conductive patterns provided on the upper and lower surfaces of the substrate 65 by cream solder.
Can be connected.

[0008]

However, according to the method of mounting the connector on the board 55 in the prior art 1, the connector could be mounted on only one side of the board 55. In addition, in order to protect the connection between the board 55 and the connector when an external force is applied to the connector, a method of providing a fixing portion 51b wider than the width of the connector has been adopted. This method has a problem that the mounting density of the connector cannot be increased.

Further, by adopting the SMT method as the prior art 2, it is possible to mount a pair of connectors on both upper and lower surfaces of the board 55, but in the SMT method of the prior art 2, the board 55 is connected to the terminal of the connector. In the type sandwiched between the portions 53c, when the connector is mounted on the substrate 55,
There is a problem that the cream solder applied to the conductive pads of the substrate 55 is peeled off, and good soldering cannot be performed.

[0010] Further, in the connector according to the prior art 3,
Although it can be mounted from above and below the board 65, the terminal 6
If the fixing portion 61b is provided to protect the 3c, there is a problem that the fixing portion 6b becomes a dead space and the mounting density of the connector cannot be increased.

SUMMARY OF THE INVENTION An object of the present invention is to provide a board mounting connector which can be mounted on both sides of a board at a high density without any gaps and can eliminate the shortage of the number of cores between the boards.

[0012]

According to the present invention, there is provided an insulator having a fitting portion to be fitted to a mating connector, a conductive contact held by the insulator, and a conductive shell mounted on the insulator. Wherein the insulator has an installation surface for installation facing the substrate, and a pair of outer wall surfaces facing each other in a direction perpendicular to the installation surface, and the contact is the mating contact A contact portion accommodated in the fitting portion so as to contact the contact portion, a holding portion extending from one end of the contact portion and held in the insulator by the insulator, and the substrate extending from the holding portion to the installation surface. A board mounting connector having a terminal portion connected to the conductive pattern provided thereon, wherein the shell is formed of the pair of outer wall surfaces. A pair of shell holders mounted along the shell, the shell holders having pins extending in a direction perpendicular to the mounting surface, the pins extending out of the mounting surface. A pin connecting portion inserted into a through hole formed in the substrate, wherein the length of the pin connecting portion extending outside the installation surface is less than half the thickness of the substrate; Thus, a board mounting connector characterized in that:

[0013]

According to the board mounting connector of the present invention, the pins have the same width as the mounting width of the board mounting connector and alternately protrude, so that the insulator is tightly and firmly mounted on the board.

[0014] Further, cream solder is applied from above the through hole of the substrate, a pin is inserted into the cream solder, heat is applied in a solder bath to melt the solder, and the pin is soldered in the through hole and the land. A firm fixation is performed on the substrate in a normal SMT process. Since the length of the pins is less than half the thickness of the board, connectors can be mounted on the top and bottom of the board, and can be fixed by a firm fixing portion.

Further, since the diagonal dimension of the pin is slightly larger than the inner diameter of the through hole, even if the connector is mounted on the back surface of the board, it does not come out, and can be fixed at a predetermined position and soldered. is there.

As described above, the connector can be closely mounted on the surface of the board and mounted on both sides of the board with high density and strength. In addition, even if the terminal portion has the SMT configuration or an external force is applied, a stable connection is achieved without applying a force between the pad of the substrate and the terminal portion.

Further, a recess and a projection are formed on the insulator for positioning, and the same two connectors can be attached to both sides of the board.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the connector for mounting a board according to the present invention will be described below with reference to the drawings. FIG.
Shows a board mounting connector according to an embodiment. FIG. 2 shows a state in which the board mounting connector shown in FIG. 1 is viewed from the back side. FIG. 3 (A), FIG. 3 (B)
Each of FIG. 3 and FIG. 3C shows a plane of the board mounting connector. FIG. 4 shows a cross section of the board mounting connector. In the following description, the board mounting connector will be referred to as a connector.

Referring to FIGS. 1 to 4, the connector includes an insulator 1 having a fitting portion 1a for receiving a conductive mating contact of a mating connector described later, and a plurality of conductive members held by the insulator 1. Contact 2 (see FIG. 4), locator 3, and insulator 1
And an electrically conductive shell 4 attached to the main body.

The insulator 1 has the SMT shown in FIG.
Installation surface 1f for installation facing substrate 11 for use
And a pair of outer wall surfaces 1g facing each other in a direction perpendicular to the installation surface 1f.

As shown in FIG. 4, the contact 2 has a contact portion 2a housed in the fitting portion 1a so as to contact the mating contact, and extends from one end of the contact portion 2a and is held by the insulator 1 in the insulator 1. Holding portion 2b, and the substrate 11 extending from the holding portion 2b to the installation surface 1f.
Terminal part 2 connected to the conductive pattern provided on
c. The contact portion 2a and the holding portion 2b are incorporated in the insulator 1. The terminal portion 2c has a soldering portion 2d with the substrate 11.

The shell 4 has a pair of shell holding portions 4a attached along each of a pair of outer wall surfaces 1g of the insulator 1. The shell holding portion 4a has a pin 4b extending in a direction perpendicular to the installation surface 1f. The pins 4b extend beyond the installation surface 1f to extend the substrate 1
1 has a pin connection portion 4h inserted into the through hole 11a. The length dimension of the pin connection portion 4h extending outside the installation surface 1f is set to a dimension equal to or less than half the thickness of the board.

As shown in FIG. 5, the pin 4b is located below the shell holding portion 4a, and
The center line X of d is the same as the mounting width of the connector.

The pin 4b is connected to a pair of shell holding portions 4a.
And a pin 4b provided on one shell holding portion 4a and a pin 4b provided on the other shell holding portion 4a are displaced from each other in the direction in which the pair of shell holding portions 4a face each other. Are located. That is, pin 4
b alternately emerges at the respective shell holding portions 4a. The length of the pin 4b is half the thickness of the board to be mounted.

The diagonal pins 4b of the pair of shell holders 4a which are alternately protruded from the respective shell holders 4a.
Are inserted into a plurality of through holes 11a formed at predetermined intervals in the substrate 11, and the diagonal dimension of the pins 4b in the pair of shell holding portions 4a is set at a predetermined interval between the pair of shell holding portions 4a. Is slightly larger than the dimension between the inner diameters of the through holes 11a corresponding to the above.

The diagonal dimension of the pin 4b is the through hole 11a.
Since it is slightly larger than the inner diameter of the substrate 11, it does not come out even if the connector is mounted on the back surface of the substrate 11, and can be fixed at a predetermined position and soldered.

The fitting portion 1a is set to be parallel between the pair of outer wall portions 1g of the pair of shell holding portions 4a and larger than the distance between the pair of outer wall portions 1g. The dimension between the pins 4b facing each other while being displaced by the pair of shell holding sections 4a is the same as the width dimension of the fitting section 1a.

The fitting portion 1a has an installation side fitting surface 1j projecting from the installation surface 1f and parallel to the installation surface 1f, and a fitting surface 1k for inserting a mating contact. On the surface 1k, a plurality of through holes 1m are arranged in a matrix direction.

Further, the shell 4 has a shell fitting portion 4c whose end is engaged with the end surface of the installation-side fitting surface 1j and covers the outer peripheral surface. The shell fitting part 4c and the shell holding part 4a are connected by a shell crank part 4d formed by bending these connecting parts. The pair of shell holding portions 4a is bent by the shell crank portion 4d behind the insulator 1 and has a reduced width.

On the installation side fitting surface 1j, a projection 5 and a recess 6 are formed, and the connector shown in FIG.
When the connector shown in (1) is mounted with the substrate 11 interposed therebetween, the protrusion 5 and the recess 6 are engaged with each other. That is, as shown in FIG. 2 and FIG. 3C, the insulator 1 is provided with the dent 6 and the protrusion 5 on the bottom surface for positioning when the connectors are vertically stacked.

For example, assuming that the connector shown in FIG. 1 and the connector shown in FIG. 2 are the same two connectors, when these connectors are overlapped with the substrate 11 interposed therebetween, the protrusion 5 of one connector becomes The position where the other connector is fitted into the recess 6 is determined. That is,
The same connector can be mounted on both sides of the board 11. At this time, the fitting portion 1 a is located outside the end face of the substrate 11.

The pin 4b has a pin crank portion 4n which is bent between the pair of shell holding portions 4a and the pin connection portion 4h in a direction away from the pair of outer wall surfaces 1g. In addition, the pins 4b have the same mounting width as the connector by cranking, and are alternately protruded, so that the connector can be mounted tightly and firmly.

The pin 4b can be easily formed by punching the shell holding portion 4a into a pin shape and then performing bending.

The locator 3 is provided with a plurality of grooves 3a. The locator 3 is integral with the insulator 1 and serves to align the terminals 2c.
A groove 3a extends so that the locator 3 surrounds the holding portion 2b and the terminal portion 2c.

Hereinafter, an operation for mounting the connector on the substrate 11 will be described with reference to FIGS. The connector is mounted on the board 11 as shown in FIGS. 6 (A) to 10 (B).

First, as shown in FIGS. 11A and 11B, conductive pads 13 and through holes 11a, and conductive lands 14 are formed in the through holes 11a on both surfaces of the substrate 11 in advance. Have been. The pads 13 and the lands 14 are connected to the conductive patterns locked on the substrate 11. 6 (A) and FIG.
(B), FIG. 12 (A) and FIG. 12 (B),
Cream solder 17a on the pad 13 and the land 14,
17b is applied. At this time, the soldering portion 2 of the terminal portion 2c
At the connection portion of the substrate 11 facing d, the cream solder 17a is applied on the pad 13 similarly to the normal SMT connection. The portion where the shell holding portion 4a is mounted is applied with the cream solder 17b from above the through hole 11a. At this time, the cream solders 17a and 17b are
a is closed and applied on the land 14. Cream solder 17
After a and 17b are applied, the connector is mounted on the board 11 as shown in FIGS. 7 (A) to 9 (B). At this time, the pins 4b of the shell holding portion 4a are inserted into predetermined through holes 11a provided on the substrate 11. At this time, as shown in the pad 13, the cream solders 17a and 17b on the through hole 11a are pushed into the through hole 11a together with the pin connection portion 4h of the pin 4b. As a result, the cream solders 17a, 17a are formed between the side surface of the pin connection portion 4h of the pin 4b and the inner surface of the through hole 11a in the through hole 11a.
b is satisfied.

The cream solder 17b applied on the land 14 is attached to the side of the pin 4b which does not enter the substrate 11. At this time, the soldering portion 2d comes into close contact with the cream solder 17a applied to the pad 13 of the substrate 11. As described above, the diagonal dimension of the pin 4b is
Since it is slightly larger than the inner diameter of 1a, it is press-fitted, so that the connector is temporarily fixed to the substrate 11. FIG.
As shown in FIG. 8A and FIG. 8B, the arrangement of the pins 4b is alternated, so that the connector can be mounted immediately next to the connector mounted earlier. After a predetermined number of connectors are mounted, the board 11 is turned over as shown in FIGS. 9A, 9B, and 14, and the connectors are similarly mounted on the back surface of the board 11. At this time, the positions of the front and back connectors are accurately matched by combining the protrusion 5 and the recess 6 of the insulator 1.

At this time, even if the board 11 is turned over, the connector mounted previously remains at a predetermined position because the pin 4b of the fixed portion is press-fitted into the board 11 and temporarily fixed.

After mounting a predetermined number on the connector, FIG.
As shown in FIGS. 9A and 9B and FIG. 15, soldering is performed by applying heat in a solder bath.

As described above, since the connector is temporarily fixed on the substrate 11, the connector mounted on the back side does not shift when the connector is put into the solder bath. When heat is applied in the solder bath, the cream solders 17a and 17b melt. The soldering portion 2d is the same as the normal SMT connection, but the cream solder 17b in the through hole 11a is melted at the pin 4b of the shell holding portion 4a and the through hole 1
The inner surface 1a is connected to the side surface of the pin 4b. When the cream solder 17b on the land 14 melts, the pins 4b
And form a good fillet by connecting to the side of the part where the slab does not enter. Thus, the shell holding portion 4a is firmly connected to the substrate 11.

Therefore, the cream solders 17a and 17b are applied from above the through hole 11a, and the pin connection portion 4h of the above-mentioned pin 4b is pierced there, and heat is applied in a solder bath to melt the solder to form the inside of the through hole 11a. By soldering the pins 4b with the lands, the solid fixation on the substrate 11 can be performed in a normal SMT process.

Since the length of the pin 4b is less than half the thickness of the board 11, the connector can be mounted on the upper and lower sides of the board 11 and fixed by a strong fixing portion.

FIGS. 16A to 18 show mating connectors fitted to the connectors. FIG. 19 shows a fitting state between the connector and the mating connector.

The mating connector has a mating insulator 36 having a substantially U-shaped side surface, a conductive mating contact 37, and a shield contact 38.

The mating insulator 36 includes a base 36
a from the longitudinal ends of the base portion 36a.
6a and a pair of frame portions 36b which are parallel to each other. A plurality of frame grooves 36c are formed on the opposing surface of the frame portion 36b from the inner bottom surface side of the base portion 36a to the tip end side of the frame portion 36b.

The mating contact 37 is a plate-like base 3
6a, a mating contact portion 37a extending parallel from the mating holding portion 37b to the frame portion 36b, and a mating terminal portion 37c extending from the mating holding portion 37b to the outside of the base portion 36a. And

The base portion 36a, as shown in FIG.
It is mounted on the mating board 41. The mating terminal 41 c penetrates the mating substrate 41 and is connected to the mating conductive portion of the mating substrate 41. The shield contact 38 includes a shield holding portion 38b held by the mating insulator 36, a shield contact portion 38a extending from the shield holding portion 38b to the frame groove portion 36c, and a shield holding portion 38b extending from the shield holding portion 38b to the base portion 36.
a and a shield terminal portion 38c extending outside. The shell 4 is connected to the shield contact portion 38a, and EMI measures are taken by connecting the shield contact portion 38a and the shell 4.

[0048]

As described above in the embodiment, according to the board mounting connector of the present invention, the pins are alternately provided on the pair of shell holding portions at a thickness of less than half the thickness of the board. The pins provided on the pair of shell holders have the same mounting width as the connector by cranking the shell holders, and alternately protrude so that the pins can be tightly and firmly mounted on the board.

Also, since cream solder is applied from above the through hole, a pin is inserted into the through hole, heat is applied in a solder bath to melt the solder, and the pin can be soldered in the through hole and the land. It can be firmly fixed on a substrate in a normal SMT process.

Further, since the length dimension of the pin connection portion is equal to or less than half of the thickness of the substrate, the connector can be mounted on the upper and lower sides of the substrate and can be fixed by the strong fixing portion.

Further, since the diagonal dimension of the pin is slightly larger than the inner diameter of the through hole, even if the connector is mounted on the back surface of the board, it does not come out, and can be fixed at a predetermined position and soldered.

Further, the connector can be closely mounted on the surface of the substrate and mounted on both sides of the substrate with high density and strength.

Also, since the board and the connector are firmly fixed, even if the terminal portion is SMT, even if an external force is applied to the connector, a stable connection is achieved without applying a force between the pad of the board and the terminal of the connector. .

Further, the connectors can be mounted on both sides of the board at a high density without any gap, and the shortage of the number of cores between the boards can be solved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a connector for mounting a board of the present invention, in which a state where the connector for mounting a board is mounted on a board is viewed from above.

FIG. 2 is a perspective view of the board mounting connector of FIG. 1 as viewed from a bottom surface direction.

FIG. 3A is a plan view of the board mounting connector of FIG. 1;
FIG. 2B is a bottom view of the board mounting connector of FIG. 1, and FIG. 2C is a side view of the board mounting connector of FIG.

FIG. 4 is a sectional view of the board mounting connector of FIG. 1;

FIG. 5 is a sectional view taken along line AA of FIG. 3 (C).

6A is a plan view showing a main part of a board on which a board mounting connector is mounted, and FIG. 6B is a side view of FIG.

FIG. 7A is a plan view showing a board mounting connector and a main part of the board before mounting the board mounting connector, and FIG.
(A) is a side view of (A).

FIG. 8A is a plan view showing a board mounting connector and a main part of the board after mounting a plurality of board mounting connectors,
(B) is a side view of (A).

9A is a plan view showing a state where the plurality of board mounting connectors and the board of FIG. 8 are turned upside down, and FIG. 9B is a side view of FIG.

10A is a plan view showing a state where a plurality of board mounting connectors of FIG. 9 are mounted on both sides of a board, and FIG. 10B is a side view of FIG.

11A is a plan view showing pads and through holes of a board on which a board mounting connector is mounted, and FIG. 11B is a cross-sectional view of FIG.

12A is a plan view showing a state in which cream solder is applied to pads and through holes of a board on which a board mounting connector is mounted, and FIG. 12B is a cross-sectional view of FIG.

FIG. 13 is a cross-sectional view showing a state in which a board mounting connector is mounted on one side of a board to which cream solder has been applied, and pins have entered through holes.

FIG. 14 is a sectional view showing a state in which the pin of FIG. 13 has entered a through hole.

15 is a cross-sectional view showing a state when the pins in FIG. 14 are soldered through a solder bath.

FIG. 16 is a perspective view showing a mating connector to which the board mounting connector is fitted.

17A is a plan view of the mating connector of FIG. 16,
(B) is a front view, and (C) is a bottom view.

18 is a sectional view of the mating connector shown in FIG.

FIG. 19 is a cross-sectional view showing a fitted state of the board mounting connector and the mating connector.

20A is a plan view of a conventional through-hole type connector, FIG. 20B is a front view, and FIG. 20C is a side view.

21A is a plan view of a conventional SMT type connector, FIG. 21B is a front view, and FIG. 21C is a side view.

FIG. 22 is a side view of a conventional SMT type connector, which is a type of connector mounted on both sides of a board, and is partially sectioned.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulator 2 Contact 2a Contact 2b Holding part 2c Terminal 2d Solder part 3 Locator 3a Alignment groove 4 Shell 4a Shell holding part 4b Pin 4d Shell crank part 4h Pin connection part 4n Pink rank part 5 Protrusion part 6 Depression part 11 Substrate 11a Through hole 13 Pad 14 Land 36 Mating insulator 37 Mating contact 38 Shielding contact 17a, 17b Cream solder

Claims (8)

[Claims] 1. An insulator having a fitting portion fitted to a mating connector, a conductive contact held by the insulator, and a conductive shell attached to the insulator, wherein the insulator faces a substrate. Having an installation surface for installation and a pair of outer wall surfaces facing each other in a direction perpendicular to the installation surface,
A contact portion accommodated in the fitting portion so as to contact the mating contact; a holding portion extending from one end of the contact portion and held in the insulator by the insulator; and A terminal portion extending to a surface and connected to a conductive pattern provided on the substrate, wherein the shell is attached along each of the pair of outer wall surfaces. Wherein the shell holding portion has a pin extending in a direction perpendicular to the installation surface, and the pin extends outside the installation surface and is formed in the substrate. A length dimension of the pin connection portion extending outside the installation surface is set to a dimension not more than half the thickness of the substrate. A connector for mounting on a board, characterized in that: 2. The board mounting connector according to claim 1, wherein a plurality of pins are provided in each of the pair of shell holding portions, and the pins provided in one of the shell holding portions and the other of the shell holding portions. A board mounting connector, wherein the pins provided on the portion are displaced from each other in a direction facing the pair of shell holding portions. 3. The board mounting connector according to claim 2, wherein the pins located on a diagonal line of the pair of shell holding portions are inserted into a plurality of through holes formed at predetermined intervals in the board. Wherein the diagonal dimension of the pin in the pair of shell holding sections is larger than the dimension between the inner diameters of the through holes corresponding to the pair of shell holding sections at the predetermined interval. A connector for mounting on a board, comprising: 4. The board mounting connector according to claim 1, wherein a width dimension between the pair of shell holding portions is parallel between the pair of outer wall portions and larger than a width dimension between the pair of outer wall portions. The width dimension is set to be smaller than the dimension between the fitting outer wall surfaces of the fitting section, and the dimension between the pins that are displaced and opposed by the pair of shell holding sections is the fitting dimension. A connector for mounting on a board, wherein the connector has the same dimension as the width of the part. 5. The board mounting connector according to claim 1, wherein the fitting portion has a fitting installation surface protruding from the installation surface and parallel to the installation surface, and the shell is provided with the fitting installation surface. And a shell fitting part that covers the fitting outer wall surface, and the shell fitting part and the shell holding part are connected by a shell crank part formed by bending these connecting parts. A connector for mounting on a board, comprising: 6. The board mounting connector according to claim 5, further comprising a plurality of the board mounting connectors, wherein the connector is mounted on the board with the mounting surface opposed to the board with the board interposed therebetween, A board mounting connector, wherein a protrusion and a recess are formed on the fitting installation surface, and the protrusion and the recess are engaged with each other. 7. A pin crank portion according to claim 1, wherein said pin is bent between said pair of shell holding portions and said pin connection portion in a direction away from said pair of outer wall surfaces. A connector for mounting on a board, comprising: 8. The board mounting connector according to claim 1, further comprising a plurality of said board mounting connectors, wherein a plurality of said board mounting connectors are arranged adjacent to said board. Board mounting connector.