JPH11308041A - Electromagnetic interference suppressor, method for fixing the same, part and device using the same - Google Patents
Electromagnetic interference suppressor, method for fixing the same, part and device using the sameInfo
- Publication number
- JPH11308041A JPH11308041A JP10944798A JP10944798A JPH11308041A JP H11308041 A JPH11308041 A JP H11308041A JP 10944798 A JP10944798 A JP 10944798A JP 10944798 A JP10944798 A JP 10944798A JP H11308041 A JPH11308041 A JP H11308041A
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- Japan
- Prior art keywords
- electromagnetic interference
- interference suppressor
- suppressor
- fixing
- conductivity
- Prior art date
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、一般電子機器にお
けるＥＭＩ対策に使用される電磁干渉抑制体に関し、特
に、半導体部品、回路基板パターンなどから発生する輻
射ノイズを抑止する電磁干渉抑制体、或いは静電気試験
によるノイズを抑止する電磁干渉抑制体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic interference suppressor used for EMI countermeasures in general electronic equipment, and more particularly, to an electromagnetic interference suppressor for suppressing radiation noise generated from semiconductor components, circuit board patterns, and the like. The present invention relates to an electromagnetic interference suppressor that suppresses noise due to an electrostatic test.
【０００２】[0002]
【従来の技術】近年、デジタル電子機器をはじめ高周波
を利用する電子機器類の小型化が著しい。特に、配線基
板への部品実装密度が高いディジタル電子機器において
は、中央演算処理装置（ＣＰＵ）や、ＬＳＩ、ＩＣが配
線基板上に実装されている。周知のように、ＬＳＩやＩ
Ｃは、多数の半導体素子で構成されている。これら半導
体素子或いは基板上の配線間で、いわゆる電磁波障害が
発生する。2. Description of the Related Art In recent years, electronic devices utilizing high frequencies such as digital electronic devices have been significantly reduced in size. In particular, in digital electronic devices having a high component mounting density on a wiring board, a central processing unit (CPU), an LSI, and an IC are mounted on the wiring board. As is well known, LSI and I
C is composed of a number of semiconductor elements. So-called electromagnetic interference occurs between these semiconductor elements or wiring on the substrate.
【０００３】従来、このような電磁波障害に対して、半
導体素子或いは配線基板の配線間に、電磁干渉抑制体を
設置することにより、電磁障害の原因となる電磁結合、
不要輻射や伝導ノイズを抑制することができる。Conventionally, by installing an electromagnetic interference suppressor between the semiconductor element or the wiring of the wiring board against such electromagnetic wave interference, electromagnetic coupling causing electromagnetic interference,
Unwanted radiation and conduction noise can be suppressed.
【０００４】[0004]
【発明が解決しようとする課題】従来においては、電磁
障害を抑制する電磁干渉抑制体の固定方法として、工業
用両面粘着テープ等で、ＬＳＩやＩＣ等、多数の半導体
素子の外部に形成されたシールドケースに固定されるこ
とが多い。Conventionally, as a method of fixing an electromagnetic interference suppressor for suppressing electromagnetic interference, a method has been used in which an industrial double-sided adhesive tape or the like is formed outside a large number of semiconductor elements such as LSIs and ICs. Often fixed to a shield case.
【０００５】従来、使用されている工業用両面粘着テー
プは、絶縁体が殆どであり、シールドケース等に、工業
用両面粘着テープを介して電磁干渉抑制体を貼り付けた
場合、電磁干渉抑制体とシールドケースの間に粘着テー
プが存在するため、粘着テープの絶縁部分で、電位差が
生じてしまい、イミュニティ試験（特にＥＳＤ放電試
験）において発生するノイズ電流が電磁干渉抑制体へ流
れにくくなってしまっている。Conventionally, most industrial double-sided pressure-sensitive adhesive tapes are made of an insulator. When an electromagnetic interference-suppressing material is attached to a shield case or the like via an industrial double-sided pressure-sensitive adhesive tape, the electromagnetic interference-suppressing material is hardly used. Since the adhesive tape exists between the shield tape and the shield case, a potential difference is generated in an insulating portion of the adhesive tape, so that a noise current generated in an immunity test (especially an ESD discharge test) does not easily flow to the electromagnetic interference suppressor. ing.
【０００６】そこで、本発明の第１技術的課題は、電気
機器等に特性の低下することなく固定できる電磁干渉抑
制体とその固定方法とを提供することにある。Accordingly, a first technical object of the present invention is to provide an electromagnetic interference suppressor which can be fixed to an electric device or the like without deteriorating its characteristics, and a method of fixing the same.
【０００７】また、本発明の第２技術的課題は、前記し
た電磁干渉抑制体、又はそれの固定方法を用いた機器及
び部品を提供することにある。A second technical object of the present invention is to provide an apparatus and a component using the above-described electromagnetic interference suppressor or a method for fixing the same.
【０００８】[0008]
【課題を解決するための手段】前記課題を解決するため
に、本発明では、電磁干渉抑制体の表面の電位とシール
ドケースの電位をほぽ同一にすることで、ＥＳＤノイズ
電流をより効率よく抑制できる電磁干渉抑制体を提供す
るものである。According to the present invention, in order to solve the above-mentioned problems, the potential of the surface of the electromagnetic interference suppressor and the potential of the shield case are made substantially the same, so that the ESD noise current can be reduced more efficiently. An object of the present invention is to provide an electromagnetic interference suppressor that can be suppressed.
【０００９】即ち、本発明では、電磁障害を抑制する電
磁干渉抑制体本体を備えた電磁干渉抑制体において、前
記電磁干渉抑制体本体の表面の片面若しくは両面に設け
られた導電膜を備え、前記導電膜は、当該電磁干渉抑制
体本体の面内方向には導電性を持たず、厚さ方向のみに
導電性を持ち、前記電磁干渉抑制体本体は前記導電膜を
介して、固定されていることを特徴としている。That is, according to the present invention, there is provided an electromagnetic interference suppressor provided with an electromagnetic interference suppressor body for suppressing electromagnetic interference, comprising a conductive film provided on one or both surfaces of the electromagnetic interference suppressor body. The conductive film does not have conductivity in the in-plane direction of the electromagnetic interference suppressor body, has conductivity only in the thickness direction, and the electromagnetic interference suppressor body is fixed via the conductive film. It is characterized by:
【００１０】また、本発明では、電磁障害を抑制する電
磁干渉抑制体本体を備えた電磁干渉抑制体において、前
記電磁干渉抑制体本体の表面の片面若しくは両面に張り
付けられた厚み方向のみに導電性を持つ粘着テープを備
え、前記粘着テープによって前記電磁干渉抑制体本体が
固定されることを特徴としている。Further, according to the present invention, there is provided an electromagnetic interference suppressor having an electromagnetic interference suppressor body for suppressing electromagnetic interference, wherein the conductive member is provided only in a thickness direction attached to one or both surfaces of the surface of the electromagnetic interference suppressor body. Wherein the electromagnetic interference suppressor main body is fixed by the adhesive tape.
【００１１】また、本発明の電磁干渉抑制体の固定方法
では、電磁障害を抑制する電磁干渉抑制体本体の表面の
片面若しくは両面に導電膜を設け、前記導電膜は前記電
磁干渉抑制体本体の厚み方向のみに導電性を持ち、面内
方向には導電性を持たないものを用いていることを特徴
としている。In the method for fixing an electromagnetic interference suppressor of the present invention, a conductive film is provided on one or both surfaces of the surface of the electromagnetic interference suppressor for suppressing electromagnetic interference, and the conductive film is provided on the electromagnetic interference suppressor main body. It is characterized by using a material having conductivity only in the thickness direction and not having conductivity in the in-plane direction.
【００１２】また、本発明の電磁干渉抑制体の固定方法
では、電磁障害を抑制する電磁干渉抑制体本体の表面の
片面若しくは両面に、厚み方向のみに導電性を持つ粘着
テープを貼り付けることを特徴としている。In the method for fixing an electromagnetic interference suppressor according to the present invention, an adhesive tape having conductivity only in the thickness direction is attached to one or both surfaces of the main body of the electromagnetic interference suppressor for suppressing electromagnetic interference. Features.
【００１３】また、本発明の部品では、前記いずれかの
電磁干渉抑制体を備えていることを特徴としている。Further, a component according to the present invention is characterized in that the component includes any one of the above-described electromagnetic interference suppressors.
【００１４】また、本発明の部品では、前記いずれかの
電磁干渉抑制体の固定方法を用いることを特徴としてい
る。Further, the component of the present invention is characterized in that any one of the above-described methods of fixing the electromagnetic interference suppressor is used.
【００１５】また、本発明の機器では、前記いずれかの
電磁干渉抑制体を備えていることを特徴としている。Further, the apparatus of the present invention is characterized by including any one of the above-mentioned electromagnetic interference suppressors.
【００１６】また、本発明の機器では、前記いずれかの
電磁干渉抑制体を備えていることを特徴としている。Further, the apparatus of the present invention is characterized by including any one of the above-mentioned electromagnetic interference suppressors.
【００１７】[0017]
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照しながら説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１８】（第１の実施の形態）図１（ａ）及び
（ｂ）は、本発明の第1 の実施の形態に係わる電磁干渉
抑制体を説明する平面図及び側面図を示したものであ
る。図１（ａ）及び（ｂ）は、電磁干渉抑制体１０は、
電磁干渉抑制体本体１の表面の片面に導電膜２を設けた
ものである。電磁干渉抑制体本体は、下記表１に示され
ているＦｅ−Ａｌ−Ｓｉ（センダスト系合金粉末）で平
均粒径３０μｍ、アスペクト比５以上の軟磁性体粉末８
０重量部と有機結合剤としての塩素化ポリエチレン２０
重量部を加熱混練・射出成形して得られる。また、この
センダスト合金粉末の場合には、酸素分圧２０％の窒素
−酸素混合ガス雰囲気中で酸化させ、表面に酸化皮膜が
形成されていることを確認してある。また、この電磁干
渉抑制体本体１の表面抵抗値を測定した所、８×１０6
Ωであった。(First Embodiment) FIGS. 1 (a) and 1 (b) are a plan view and a side view illustrating an electromagnetic interference suppressor according to a first embodiment of the present invention. is there. FIGS. 1A and 1B show that the electromagnetic interference suppressor 10
A conductive film 2 is provided on one surface of a surface of an electromagnetic interference suppressor main body 1. The electromagnetic interference suppressor body is a soft magnetic powder 8 of Fe-Al-Si (Sendust alloy powder) having an average particle diameter of 30 μm and an aspect ratio of 5 or more as shown in Table 1 below.
0 parts by weight and chlorinated polyethylene 20 as an organic binder
It is obtained by heating, kneading and injection molding parts by weight. In addition, it has been confirmed that the sendust alloy powder is oxidized in a nitrogen-oxygen mixed gas atmosphere having an oxygen partial pressure of 20% to form an oxide film on the surface. When the surface resistance value of the electromagnetic interference suppressor body 1 was measured, it was found to be 8 × 10 6
Ω.
【００１９】[0019]
【表１】 [Table 1]
【００２０】また、導電膜２は、電磁干渉抑制体本体１
に、直径１ｍｍφ程度の金の金属膜蒸着膜を２ｍｍ間隔
程度に、厚さ１０μ程度に蒸着させ形成する。Further, the conductive film 2 is composed of the electromagnetic interference suppressor main body 1.
Then, a gold metal film deposited film having a diameter of about 1 mmφ is formed by vapor deposition with a thickness of about 10 μ at intervals of about 2 mm.
【００２１】また、図２は、電磁干渉抑制体本体１の片
面に前記金属蒸着膜を形成し、金属蒸着膜の無い場所
に、固定用の絶縁接着剤４を塗布することにより、シー
ルドケース３に固定した状態を示した側面図である。図
２に示すように、導電膜２を介して、電磁干渉抑制体本
体１を、シールドケース３に固定することにより、金属
膜の厚み方向への電気伝導が支配的となり、接着面内方
向の電気伝導は、抑止される。本実施の形態では、導電
膜２を形成する金属蒸着膜として、金の蒸着膜を使用し
ているが、コスト低減、伝導性向上等の目的に合わせ、
銅或いは銀等を使用しても良い。FIG. 2 shows that the shield case 3 is formed by forming the metal deposition film on one side of the electromagnetic interference suppressor main body 1 and applying a fixing insulating adhesive 4 to a place where the metal deposition film does not exist. FIG. 4 is a side view showing a state where the display device is fixed to the position shown in FIG. As shown in FIG. 2, by fixing the electromagnetic interference suppressing body 1 to the shield case 3 via the conductive film 2, electric conduction in the thickness direction of the metal film becomes dominant, and Electrical conduction is suppressed. In the present embodiment, a gold vapor-deposited film is used as the metal vapor-deposited film for forming the conductive film 2. However, in order to reduce costs and improve conductivity,
Copper or silver may be used.
【００２２】（第２の実施の形態）図３は本発明の第２
の実施の形態による電磁干渉抑制体を示す断面図であ
り、電磁干渉抑制体本体１の表面の両面に導電膜２を設
けた状態を示した側面図である。図３に示すように、第
２の実施の形態による電磁干渉抑制体１１は、第１の実
施の形態と同様の形状の金属蒸着膜を電磁干渉抑制体本
体１の表面の両面に形成し、金属蒸着膜の無い場所に、
固定用絶縁接着剤４を塗布し、シールドケース３と接着
させている。(Second Embodiment) FIG. 3 shows a second embodiment of the present invention.
FIG. 4 is a cross-sectional view illustrating the electromagnetic interference suppressor according to the embodiment, and is a side view illustrating a state where conductive films 2 are provided on both surfaces on the surface of the electromagnetic interference suppressor main body 1. As shown in FIG. 3, the electromagnetic interference suppressor 11 according to the second embodiment forms a metal deposition film having the same shape as that of the first embodiment on both surfaces of the surface of the electromagnetic interference suppressor body 1. Where there is no metal deposition film,
The fixing insulating adhesive 4 is applied and adhered to the shield case 3.
【００２３】（第３の実施の形態）図４は、本発明の第
３の実施の形態による電磁干渉抑制体の側面図である。
図4 に示すように、第３の実施の形態による電磁干渉抑
制体１２は、電磁干渉抑制体本体１の表面の片面に、厚
み方向のみに導電性を持つ粘着テープ５（商品名：３Ｍ
社製 ＃９７０３）を貼り付け、シールドケース３に接
着させて形成されている。(Third Embodiment) FIG. 4 is a side view of an electromagnetic interference suppressor according to a third embodiment of the present invention.
As shown in FIG. 4, the electromagnetic interference suppressor 12 according to the third embodiment has an adhesive tape 5 (trade name: 3M) having conductivity only in the thickness direction on one surface of the surface of the electromagnetic interference suppressor main body 1.
# 9703) and attached to the shield case 3.
【００２４】（第４の実施の形態）図５は、本発明の第
４の実施の形態に電磁干渉抑制体の側面図である。図５
に示すように、第４の実施の形態に電磁干渉抑制体１４
は、電磁干渉抑制体本体１の表面の両面に、厚み方向の
みに導電性を持つ粘着テープ５（商品名：３Ｍ社製＃９
７０３）を貼付け、シールドケース３に接着させること
によって形成されている。(Fourth Embodiment) FIG. 5 is a side view of an electromagnetic interference suppressor according to a fourth embodiment of the present invention. FIG.
As shown in FIG.
Are adhesive tapes 5 having a conductivity only in the thickness direction (trade name: # 9 manufactured by 3M Company)
703), and is adhered to the shield case 3.
【００２５】図６（ａ）は本発明の実施の形態による電
磁干渉抑制体の特性を評価するための装置構成を示す図
である。図６（ｂ）は本発明の実施の形態による電磁干
渉抑制体の透過減衰レベルを示す図である。図６（ａ）
に示すように、電磁干渉抑制体の一面側にトラッキング
ジェネレータ２１に接続されたループ径２ｍｍ以下の送
信用ループアンテナ２３が配置され、一方他面側には、
スペクトラムアナライザー２２に接続されたループ径２
ｍｍ以下の受信用ループアンテナ２４が配置されてい
る。評価試料２０が存在しない状態での電磁界強度を基
準として測定するものである。その結果は、図６（ｂ）
に示されている。FIG. 6A is a diagram showing the configuration of an apparatus for evaluating the characteristics of the electromagnetic interference suppressor according to the embodiment of the present invention. FIG. 6B is a diagram illustrating a transmission attenuation level of the electromagnetic interference suppressor according to the embodiment of the present invention. FIG. 6 (a)
As shown in the figure, a transmission loop antenna 23 having a loop diameter of 2 mm or less connected to the tracking generator 21 is disposed on one side of the electromagnetic interference suppressor, while on the other side,
Loop diameter 2 connected to spectrum analyzer 22
A receiving loop antenna 24 of not more than mm is arranged. The measurement is performed based on the electromagnetic field strength in a state where the evaluation sample 20 does not exist. The result is shown in FIG.
Is shown in
【００２６】図６（ｂ）に示すように、本発明の実施の
形態による電磁干渉抑制体は、その表面に厚み方向のみ
に導電性をもたせているため、直線３１で示すように、
透過減衰特性は工業用両面テープを使用した場合（直線
３２）とほぼ同レベルであり、電磁干渉抑制体表面での
不要な反射を伴うことなくより効果的にＥＳＤノイズ電
流を抑制することができる。As shown in FIG. 6B, the electromagnetic interference suppressor according to the embodiment of the present invention has conductivity only in the thickness direction on its surface.
The transmission attenuation characteristic is almost the same level as when an industrial double-sided tape is used (straight line 32), and the ESD noise current can be more effectively suppressed without unnecessary reflection on the surface of the electromagnetic interference suppressor. .
【００２７】尚、本発明の実施の形態による電磁干渉抑
制体並びに電磁干渉抑制体の固定方法を用いて、実装さ
れた部品及び機器について、ＥＳＤ放電試験器（製造会
社：ＳＣＨＡＦＦＮＲ型番：ＮＳＧ４３５）を用いてＥ
ＳＤ試験を行った結果、携帯型ノートパソコンにおいて
は、耐電圧が２ＫＶ（工業用両面粘着テープによる電磁
干渉抑制体付設）から８ＫＶ（本発明の電磁干渉抑制体
付設）へ上昇した。The components and devices mounted using the electromagnetic interference suppressor and the method for fixing the electromagnetic interference suppressor according to the embodiment of the present invention are equipped with an ESD discharge tester (manufacturer: SCHAFFNR, model number: NSG435). Use E
As a result of the SD test, the withstand voltage of the portable notebook personal computer increased from 2 KV (with the electromagnetic interference suppressor provided with the industrial double-sided adhesive tape) to 8 KV (with the electromagnetic interference suppressor of the present invention).
【００２８】また、セキュリティＢＯＸ機器においては
耐電圧が６ＫＶ（工業用両面粘着テープによる電磁干渉
抑制体付設）から１４ＫＶ（本発明の電磁干渉抑制体付
設）へ上昇した。本結果から、工業用両面粘着テープで
貼った場合に比べて、良好な結果が得られていることが
分かる。In the security BOX device, the withstand voltage increased from 6 KV (with the electromagnetic interference suppressor provided with the industrial double-sided adhesive tape) to 14 KV (with the electromagnetic interference suppressor of the present invention). From these results, it can be seen that good results were obtained as compared with the case where the tape was applied with the industrial double-sided adhesive tape.
【００２９】[0029]
【発明の効果】以上説明したように、本発明によれば、
電気機器等に特性の低下することなく固定できる電磁干
渉抑制体とその固定方法とを提供することができる。As described above, according to the present invention,
It is possible to provide an electromagnetic interference suppressor that can be fixed to an electric device or the like without deteriorating characteristics and a method for fixing the same.
【００３０】また、本発明によれば、前記した電磁干渉
抑制体又はをそれの固定方法を用いた機器及び部品を提
供することができる。Further, according to the present invention, it is possible to provide equipment and components using the above-mentioned electromagnetic interference suppressor or a method for fixing the same.
【図１】（ａ）は本発明の第１の実施の形態に係わる電
磁干渉抑制体の平面図である。（ｂ）は（ａ）の電磁干
渉抑制体の断面図である。FIG. 1A is a plan view of an electromagnetic interference suppressor according to a first embodiment of the present invention. (B) is sectional drawing of the electromagnetic interference suppression body of (a).
【図２】本発明の第２の実施の形態に係わる電磁干渉抑
制体の断面図であって、電磁干渉抑制体の表面の片面に
導電膜を設け、導電膜のない場所、固定用絶縁接着剤を
塗布し、シールドケースに接着した状態を示している。FIG. 2 is a cross-sectional view of an electromagnetic interference suppressor according to a second embodiment of the present invention. This shows a state in which the agent has been applied and adhered to the shield case.
【図３】本発明の第３の実施の形態に係わる電磁干渉抑
制体を示す断面図であって、電磁干渉抑制体の表面の両
面に導電膜を設け、固定用絶縁接着剤を塗布し、シール
ドケースに接着した状態を示している。FIG. 3 is a cross-sectional view illustrating an electromagnetic interference suppressor according to a third embodiment of the present invention, in which conductive films are provided on both surfaces of the surface of the electromagnetic interference suppressor, and a fixing insulating adhesive is applied; This shows a state where it is adhered to the shield case.
【図４】本発明の第４の実施の形態に係わる電磁干渉抑
制体を示す断面図であって、電磁干渉抑制体の表面の片
面に、厚み方向のみに導電性を持つ粘着テープ（商品
名：３Ｍ社製 ＃９７０３）を貼り付け、シールドケー
スに接着した状態を示している。FIG. 4 is a cross-sectional view showing an electromagnetic interference suppressor according to a fourth embodiment of the present invention, wherein one side of the surface of the electromagnetic interference suppressor has an adhesive tape (trade name) having conductivity only in the thickness direction. : # 9703 manufactured by 3M Company and attached to the shield case.
【図５】本発明の第５の実施の形態に係わる電磁干渉抑
制体を示す断面図であって、電磁干渉抑制体の表面の両
面に、厚み方向のみに導電性を持つ粘着テープ（商品
名：３Ｍ社製 ＃９７０３）を貼り付け、シールドケー
スに接着した状態を示している。FIG. 5 is a cross-sectional view showing an electromagnetic interference suppressor according to a fifth embodiment of the present invention, in which an adhesive tape (trade name) having conductivity only in the thickness direction is provided on both surfaces of the surface of the electromagnetic interference suppressor. : # 9703 manufactured by 3M Company and attached to the shield case.
【図６】（ａ）及び（ｂ）は本発明による電磁干渉抑制
体と、工業用両面テープを用いた電磁干渉抑制体の透過
減衰量のグラフとその測定系をそれぞれ示している。FIGS. 6 (a) and (b) show a graph of transmission attenuation of an electromagnetic interference suppressor according to the present invention and an electromagnetic interference suppressor using an industrial double-sided tape, respectively, and a measurement system thereof.
１ 電磁干渉抑制体本体 ２ 導電膜 ３ シールドケース ４ 絶縁性接着剤 ５ 粘着テープ １０、１１、１２、１３、１４ 電磁干渉抑制体 ２１ トラッキングジェネレー夕 ２２ スペクトラムアナライザ ２３ 送信用ループアンテナ ２４ 受信用ループアンテナ ２０ 評価試料 DESCRIPTION OF SYMBOLS 1 Electromagnetic interference suppressor main body 2 Conductive film 3 Shield case 4 Insulating adhesive 5 Adhesive tape 10, 11, 12, 13, 14 Electromagnetic interference suppressor 21 Tracking generator 22 Spectrum analyzer 23 Transmission loop antenna 24 Receiving loop antenna 20 evaluation samples
Claims (8)
を備えた電磁干渉抑制体において、前記電磁干渉抑制体
本体の表面の片面若しくは両面に設けられた導電膜を備
え、前記導電膜は、当該電磁干渉抑制体本体の面内方向
には導電性を持たず、厚さ方向のみに導電性を持ち、前
記電磁干渉抑制体本体は前記導電膜を介して、固定され
ていることを特徴とする電磁干渉抑制体。1. An electromagnetic interference suppressor having an electromagnetic interference suppressor body that suppresses electromagnetic interference, comprising: a conductive film provided on one or both surfaces of the surface of the electromagnetic interference suppressor body; The electromagnetic interference suppressor body has no conductivity in the in-plane direction, has conductivity only in the thickness direction, and the electromagnetic interference suppressor body is fixed via the conductive film. Electromagnetic interference suppressor.
を備えた電磁干渉抑制体において、前記電磁干渉抑制体
本体の表面の片面若しくは両面に張り付けられた厚み方
向のみに導電性を持つ粘着テープを備え、前記粘着テー
プによって前記電磁干渉抑制体本体が固定されることを
特徴とする電磁干渉抑制体。2. An electromagnetic interference suppressor having an electromagnetic interference suppressor body for suppressing electromagnetic interference, wherein the adhesive tape has conductivity only in a thickness direction attached to one or both surfaces of the surface of the electromagnetic interference suppressor body. Wherein the electromagnetic interference suppressor body is fixed by the adhesive tape.
の表面の片面若しくは両面に導電膜を設けて、前記電磁
干渉抑制体本体を固定する方法であって、前記導電膜は
前記電磁干渉抑制体本体の厚み方向のみに導電性を持
ち、面内方向には導電性を持たないものを用いているこ
とを特徴とする電磁干渉抑制体を固定する方法。3. A method of fixing a main body of an electromagnetic interference suppressor by providing a conductive film on one or both surfaces of a main body of the main body of the electromagnetic interference suppressor for suppressing electromagnetic interference, wherein the conductive film is formed of a material for suppressing the electromagnetic interference. A method for fixing an electromagnetic interference suppressor, characterized in that a body having conductivity only in a thickness direction of a body body and not having conductivity in an in-plane direction is used.
の表面の片面若しくは両面に、厚み方向のみに導電性を
持つ粘着テープを貼り付けることを特徴とする電磁干渉
抑制体の固定方法。4. A method of fixing an electromagnetic interference suppressor, comprising: attaching an adhesive tape having conductivity only in a thickness direction to one or both surfaces of a surface of an electromagnetic interference suppressor body for suppressing electromagnetic interference.
備えていることを特徴とする部品。5. A component comprising the electromagnetic interference suppressor according to claim 1.
固定方法を用いることを特徴とする部品。6. A component using the method for fixing an electromagnetic interference suppressor according to claim 3 or 4.
備えていることを特徴とする機器。7. An apparatus comprising the electromagnetic interference suppressor according to claim 1.
備えていることを特徴とする機器。8. An apparatus comprising the electromagnetic interference suppressor according to claim 3 or 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10944798A JP3463189B2 (en) | 1998-04-20 | 1998-04-20 | Electromagnetic interference suppressor, method of fixing electromagnetic interference suppressor, and components and equipment using them |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10944798A JP3463189B2 (en) | 1998-04-20 | 1998-04-20 | Electromagnetic interference suppressor, method of fixing electromagnetic interference suppressor, and components and equipment using them |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11308041A true JPH11308041A (en) | 1999-11-05 |
| JP3463189B2 JP3463189B2 (en) | 2003-11-05 |
Family
ID=14510478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10944798A Expired - Lifetime JP3463189B2 (en) | 1998-04-20 | 1998-04-20 | Electromagnetic interference suppressor, method of fixing electromagnetic interference suppressor, and components and equipment using them |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3463189B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009054758A (en) * | 2007-08-27 | 2009-03-12 | Fuji Xerox Co Ltd | Optical communication apparatus and its shielding structure |
-
1998
- 1998-04-20 JP JP10944798A patent/JP3463189B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009054758A (en) * | 2007-08-27 | 2009-03-12 | Fuji Xerox Co Ltd | Optical communication apparatus and its shielding structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3463189B2 (en) | 2003-11-05 |
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