JPH11307983A - Electronic component and manufacture thereof - Google Patents
Electronic component and manufacture thereofInfo
- Publication number
- JPH11307983A JPH11307983A JP12814098A JP12814098A JPH11307983A JP H11307983 A JPH11307983 A JP H11307983A JP 12814098 A JP12814098 A JP 12814098A JP 12814098 A JP12814098 A JP 12814098A JP H11307983 A JPH11307983 A JP H11307983A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic interference
- interference suppressor
- wiring board
- thermosetting resin
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電磁干渉抑制体を
用いた電子部品及びその製造方法に関し、特に、一般の
電子機器におけるＥＭＩ対策に用いられる電磁干渉抑制
体の固定方法に関し、さらに、詳しくは、部品、基板パ
ターン等から発生する輻射ノイズを抑制する電磁干渉抑
制体、あるいは静電気試験によるノイズを抑制する電磁
干渉抑制体の固定方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component using an electromagnetic interference suppressor and a method of manufacturing the same, and more particularly, to a method of fixing an electromagnetic interference suppressor used for EMI measures in general electronic equipment. The present invention relates to a method for fixing an electromagnetic interference suppressor that suppresses radiation noise generated from components, board patterns, and the like, or a method of fixing an electromagnetic interference suppressor that suppresses noise by an electrostatic test.
【０００２】[0002]
【従来の技術】近年、ディジタル電子機器をはじめ、高
周波を利用する電子機器類の小型化が著しい。特に、配
線基板への部品実装密度が高い、中央演算処理装置（Ｃ
ＰＵ）等を備えたディジタル電子機器においては、ＬＳ
Ｉ、ＩＣが配線基板上に実装されている。このＬＳＩや
ＩＣは、周知のように、多数の半導体素子で構成されて
いる。しかし、これらの半導体素子あるいは配線基板上
の配線間で、いわゆる電磁波障害が発生する。2. Description of the Related Art In recent years, electronic devices utilizing high frequencies, such as digital electronic devices, have been significantly reduced in size. In particular, the central processing unit (C
PU) and other digital electronic devices, LS
I and IC are mounted on a wiring board. As is well known, these LSIs and ICs are composed of a large number of semiconductor elements. However, so-called electromagnetic interference occurs between these semiconductor elements or wiring on the wiring board.
【０００３】従来、このような電磁波障害に対して、半
導体素子あるいは配線基板の配線間に、電磁干渉抑制体
を設置することにより、電磁波障害の原因となる電磁結
合、不要輻射や伝導ノイズを抑制していた。Conventionally, an electromagnetic interference suppressor is installed between the wiring of a semiconductor element or a wiring board against such electromagnetic interference to suppress electromagnetic coupling, unnecessary radiation and conduction noise which cause the electromagnetic interference. Was.
【０００４】[0004]
【発明が解決しようとする課題】ところで、従来使用さ
れている電磁干渉抑制体は、バインダとなる樹脂に磁性
粉末が混練されたものであるが、その磁性粉末の充填量
によって、ノイズ吸収の度合いが異なる。ノイズ吸収量
をより大きくするためには、充填量を多くする必要があ
るが、現在実用化されている耐熱性の高い樹脂では、磁
性粉末の充填量を多くできず、一方、耐熱性の低い樹脂
を使用して、磁性粉末の充填量を多くし、ノイズ吸収量
を大きくしようとすると、電磁干渉抑制体の耐熱性が低
下するという問題があった。The electromagnetic interference suppressors conventionally used are made by kneading magnetic powder into a resin serving as a binder. The degree of noise absorption depends on the filling amount of the magnetic powder. Are different. In order to increase the noise absorption amount, it is necessary to increase the filling amount.However, with a resin having high heat resistance currently in practical use, the filling amount of the magnetic powder cannot be increased, while the heat resistance is low. If the resin is used to increase the filling amount of the magnetic powder and increase the noise absorption amount, there is a problem that the heat resistance of the electromagnetic interference suppressor is reduced.
【０００５】また、現在の電子機器の製造は、リフロー
による基板、部品の半田付けが主流であり、耐熱性の低
い電磁干渉抑制体を装着するには、リフロー後に行わな
ければならなかった。[0005] At present, the manufacture of electronic equipment mainly involves soldering of substrates and components by reflow. To mount an electromagnetic interference suppressor having low heat resistance, it must be performed after reflow.
【０００６】上記課題を解決するために、本発明は、リ
フローによる部品の半田付けのように、耐熱性が必要な
作業工程に対応可能な電子部品及びその製造方法を提供
することにある。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, an object of the present invention is to provide an electronic component capable of coping with an operation process requiring heat resistance, such as soldering of components by reflow, and a method of manufacturing the same.
【０００７】[0007]
【課題を解決するための手段】本発明は、電磁波障害を
抑制する電磁干渉抑制体を用いた電子部品において、前
記電磁干渉抑制体は半導体部品または配線基板へ熱硬化
性樹脂で覆われ、固定された電子部品である。According to the present invention, there is provided an electronic component using an electromagnetic interference suppressor for suppressing electromagnetic interference, wherein the electromagnetic interference suppressor is covered with a thermosetting resin on a semiconductor component or a wiring board and fixed. Electronic components.
【０００８】本発明は、電磁波障害を抑制する電磁干渉
抑制体を用いた電子部品の製造方法において、前記電磁
干渉抑制体を半導体部品または配線基板へ熱硬化性樹脂
で覆い、固定する電子部品の製造方法である。According to the present invention, there is provided a method for manufacturing an electronic component using an electromagnetic interference suppressor for suppressing electromagnetic interference, wherein the electromagnetic interference suppressor is covered and fixed on a semiconductor component or a wiring board with a thermosetting resin. It is a manufacturing method.
【０００９】[0009]
【発明の実施の形態】以下、本発明に係わる電磁干渉抑
制体の固定方法の実施の形態を図面を用いて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for fixing an electromagnetic interference suppressor according to the present invention will be described below with reference to the drawings.
【００１０】まず、本実施の形態に使用される電磁干渉
抑制体として次の組成のものを準備した。 ＜電磁干渉抑制体の組成＞ 偏平状軟磁性体粉末 ９０重量部 組成：Ｆｅ−Ａｌ−Ｓｉ合金 平均粒径：１０μｍ アスペクト比：＞５ 有機バインダ ポリウレタン樹脂 ８重量部 硬化剤（イソシアネート化合物） ２重量部 溶剤（シクロヘキサノンとトルエンの混合物） ４０重量部First, the following composition was prepared as an electromagnetic interference suppressor used in the present embodiment. <Composition of Electromagnetic Interference Suppressor> Flat soft magnetic powder 90 parts by weight Composition: Fe-Al-Si alloy Average particle size: 10 μm Aspect ratio:> 5 Organic binder 8 parts by weight Polyurethane resin 8 parts by weight Hardener (isocyanate compound) 2 parts by weight Parts solvent (mixture of cyclohexanone and toluene) 40 parts by weight
【００１１】次に、この電磁干渉抑制体を配線基板へ次
のように固定した。図１は、本発明の実施の形態におけ
る電磁干渉抑制体を配線基板へ固定する作業工程を示す
側面図である。図１に示すとおり、小型化、軽量化が要
求されているノートパソコン等に使用されているＣＰＵ
等を搭載している配線基板１の上部に配置された、ノイ
ズ発生源である半導体部品２の上面を覆うようにして、
電磁干渉抑制体３を搭載する。Next, this electromagnetic interference suppressor was fixed to a wiring board as follows. FIG. 1 is a side view showing an operation process for fixing an electromagnetic interference suppressor to a wiring board according to an embodiment of the present invention. As shown in FIG. 1, a CPU used in a notebook personal computer or the like that is required to be reduced in size and weight.
So as to cover the upper surface of the semiconductor component 2 which is a noise source and is disposed above the wiring board 1 on which
The electromagnetic interference suppressor 3 is mounted.
【００１２】さらに、電磁干渉抑制体３を全面覆うよう
に、フェノール樹脂、エポキシ樹脂または不飽和ポリエ
ステル樹脂等の熱硬化性樹脂４を塗布し、固定した後
で、例えば、２４０℃程度の半田付けリフロー工程を通
過させて、熱硬化性樹脂を硬化させ、電磁干渉抑制体を
完全に封じ込めて固定する。Further, a thermosetting resin 4 such as a phenol resin, an epoxy resin or an unsaturated polyester resin is applied so as to cover the entire surface of the electromagnetic interference suppressor 3 and fixed, and then, for example, soldered at about 240 ° C. The thermosetting resin is cured by passing through a reflow process, and the electromagnetic interference suppressor is completely enclosed and fixed.
【００１３】これにより、その特性を劣化させることな
く、見かけ上の耐熱性を向上させることができる。ま
た、熱硬化性樹脂が外周を覆っていることで、外部から
の環境から保護され、その耐久性も向上する。Thus, the apparent heat resistance can be improved without deteriorating the characteristics. Further, since the thermosetting resin covers the outer periphery, the thermosetting resin is protected from an external environment and its durability is improved.
【００１４】本発明による熱硬化性樹脂で固定した電磁
干渉抑制体を使用した場合は、リフロー工程通過後で
も、電磁干渉抑制体に変質は発生せず、不具合は発生し
ていなかった。なお、熱硬化性樹脂を使用せず、リフロ
ー工程を通過させた場合には、電磁干渉抑制体の変質が
激しく、長期の使用に耐えられない結果になり、リフロ
ー工程には対応できなかった。When the electromagnetic interference suppressor fixed with the thermosetting resin according to the present invention was used, no deterioration occurred in the electromagnetic interference suppressor even after passing through the reflow step, and no trouble occurred. In addition, when the reflow process was performed without using the thermosetting resin, the electromagnetic interference suppressor was severely deteriorated and could not withstand long-term use, and could not cope with the reflow process.
【００１５】本実施の形態では、ノイズ発生源である半
導体部品の上面を覆うように、電磁干渉抑制体を搭載
し、熱硬化性樹脂を塗布し、固定しているが、例えば、
部品の存在しないようなノイズ発生源、例えば、配線基
板パターン上についても、電磁干渉抑制体を搭載し、熱
硬化性樹脂で固定してもよい。In this embodiment, the electromagnetic interference suppressor is mounted so as to cover the upper surface of the semiconductor component which is a noise source, and a thermosetting resin is applied and fixed.
An electromagnetic interference suppressor may also be mounted on a noise generation source where no component is present, for example, on a wiring board pattern, and fixed with a thermosetting resin.
【００１６】[0016]
【発明の効果】以上、説明したごとく、本発明によれ
ば、熱硬化性樹脂で電磁干渉抑制体を固定した半導体部
品あるいは配線基板は、リフロー工程を通過させること
が可能となった。さらに、本発明である熱硬化性樹脂で
固定した電磁干渉抑制体を使用した電子部品について、
リフロー工程を通過させた後でも、電磁干渉抑制体の変
質は発生せず、電子部品あるいは機器の信頼性が向上す
る効果がある。As described above, according to the present invention, a semiconductor component or a wiring board having an electromagnetic interference suppressor fixed with a thermosetting resin can be passed through a reflow process. Furthermore, regarding electronic components using the electromagnetic interference suppressor fixed with the thermosetting resin of the present invention,
Even after passing through the reflow process, no deterioration of the electromagnetic interference suppressor occurs, and the effect of improving the reliability of the electronic component or the device is obtained.
【図１】本発明の実施の形態における電磁干渉抑制体を
配線基板へ固定する作業工程を示す側面図。FIG. 1 is a side view showing an operation process for fixing an electromagnetic interference suppressor to a wiring board according to an embodiment of the present invention.
１ 配線基板 ２ 半導体部品 ３ 電磁干渉抑制体 ４ 熱硬化性樹脂 DESCRIPTION OF SYMBOLS 1 Wiring board 2 Semiconductor component 3 Electromagnetic interference suppressor 4 Thermosetting resin
Claims (2)
用いた電子部品において、前記電磁干渉抑制体は半導体
部品または配線基板へ熱硬化性樹脂で覆われ、固定され
たことを特徴とする電子部品。1. An electronic component using an electromagnetic interference suppressor that suppresses electromagnetic wave interference, wherein the electromagnetic interference suppressor is covered and fixed to a semiconductor component or a wiring board with a thermosetting resin. parts.
用いた電子部品の製造方法において、前記電磁干渉抑制
体を半導体部品または配線基板へ熱硬化性樹脂で覆い、
固定することを特徴とする電子部品の製造方法。2. A method of manufacturing an electronic component using an electromagnetic interference suppressor that suppresses electromagnetic interference, wherein the electromagnetic interference suppressor is covered with a thermosetting resin on a semiconductor component or a wiring board.
A method for manufacturing an electronic component, comprising fixing the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12814098A JPH11307983A (en) | 1998-04-21 | 1998-04-21 | Electronic component and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12814098A JPH11307983A (en) | 1998-04-21 | 1998-04-21 | Electronic component and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11307983A true JPH11307983A (en) | 1999-11-05 |
Family
ID=14977399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12814098A Withdrawn JPH11307983A (en) | 1998-04-21 | 1998-04-21 | Electronic component and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11307983A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1143516A2 (en) | 2000-04-04 | 2001-10-10 | Tokin Corporation | Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same |
| CN101877345A (en) * | 2009-04-28 | 2010-11-03 | 大日本印刷株式会社 | The manufacture method of semiconductor device and metal shielding board |
| JP2013062318A (en) * | 2011-09-12 | 2013-04-04 | Tomoegawa Paper Co Ltd | Composite magnetic material |
-
1998
- 1998-04-21 JP JP12814098A patent/JPH11307983A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1143516A2 (en) | 2000-04-04 | 2001-10-10 | Tokin Corporation | Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same |
| EP1143516A3 (en) * | 2000-04-04 | 2003-02-19 | NEC TOKIN Corporation | Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same |
| EP2028690A3 (en) * | 2000-04-04 | 2011-02-09 | Nec Tokin Corporation | Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same |
| CN101877345A (en) * | 2009-04-28 | 2010-11-03 | 大日本印刷株式会社 | The manufacture method of semiconductor device and metal shielding board |
| JP2013062318A (en) * | 2011-09-12 | 2013-04-04 | Tomoegawa Paper Co Ltd | Composite magnetic material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040910 |
|
| A761 | Written withdrawal of application |
Effective date: 20060425 Free format text: JAPANESE INTERMEDIATE CODE: A761 |