JPH11307699A - Heat dissipating spacer - Google Patents
Heat dissipating spacerInfo
- Publication number
- JPH11307699A JPH11307699A JP10728498A JP10728498A JPH11307699A JP H11307699 A JPH11307699 A JP H11307699A JP 10728498 A JP10728498 A JP 10728498A JP 10728498 A JP10728498 A JP 10728498A JP H11307699 A JPH11307699 A JP H11307699A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- thermal conductivity
- heat radiation
- powder
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、高柔軟性を有し、
電子機器に組み込んでも発熱性電子部品に対する負荷の
小さい放熱スペーサーに関する。TECHNICAL FIELD The present invention has high flexibility,
The present invention relates to a heat-dissipating spacer having a small load on a heat-generating electronic component even when incorporated in an electronic device.
【０００２】[0002]
【従来の技術】トランジスタ、サイリスタ等の発熱性電
子部品においては、使用時に発生する熱の除熱が重要な
課題となっている。従来、その除熱は、発熱性電子部品
を電気絶縁性の熱伝導性シートを介して放熱フィンや金
属板に取り付けることによって行われており、その熱伝
導性シートとしてはシリコーンゴムに窒化硼素、アルミ
ナ等の熱伝導性フィラーの充填された放熱シートが主に
使用されている。2. Description of the Related Art In heat-generating electronic components such as transistors and thyristors, removal of heat generated during use is an important issue. Conventionally, the heat removal is performed by attaching a heat-generating electronic component to a radiating fin or a metal plate via an electrically insulating heat conductive sheet, and the heat conductive sheet includes silicone rubber, boron nitride, A heat dissipation sheet filled with a heat conductive filler such as alumina is mainly used.
【０００３】一方、最近の電子機器の高密度化、小型軽
量化に伴い、放熱フィン等を取り付けるスペースがない
場合や、電子機器が密閉されていて放熱フィンから外部
への放熱が困難な場合においては、発熱性電子部品から
発生した熱を電子機器のケース等から直接伝熱する方式
がとられている。この方式においては、発熱性電子部品
とケースの間のスペースを埋めるだけの厚みを有する高
柔軟性放熱スペーサーが用いられている。また、ＩＣ化
やＬＳＩ化された発熱性電子部品がプリント基板に実装
されている場合の放熱においても、プリント基板と放熱
フィンとの間に高柔軟性放熱スペーサーが用いられてい
る。[0003] On the other hand, with the recent increase in density and miniaturization of electronic devices, there is no space for mounting radiating fins or the like, or when electronic devices are sealed and it is difficult to radiate heat from the radiating fins to the outside. Is a method in which heat generated from a heat-generating electronic component is directly transferred from a case or the like of an electronic device. In this method, a highly flexible heat radiation spacer having a thickness sufficient to fill a space between the heat-generating electronic component and the case is used. Also, in the case of heat dissipation when a heat-generating electronic component made into an IC or an LSI is mounted on a printed board, a highly flexible heat dissipation spacer is used between the printed board and the heat dissipation fins.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、従来、
一般に使用されている放熱シートは、ショアー硬度が９
０以上と硬いために形状追従性が悪く、発熱性電子部品
に密着させるために押圧すると応力に弱い発熱性電子部
品は破損する問題があった。このような問題は、熱伝導
性フィラーとして、窒化珪素粉末と酸化亜鉛粉末を併用
してなる放熱シート（特開平２−２０５５８号公報）に
おいても、同様にあった。However, conventionally,
A generally used heat radiation sheet has a Shore hardness of 9
Since the hardness is 0 or more, the shape following ability is poor, and there is a problem that the heat-generating electronic component, which is weak to the stress, is damaged when pressed to adhere to the heat-generating electronic component. Such a problem also occurred in a heat-radiating sheet (Japanese Patent Laid-Open No. 2-20558) in which silicon nitride powder and zinc oxide powder were used in combination as thermal conductive fillers.
【０００５】そこで、放熱シートよりも高柔軟な放熱ス
ペーサーが開発されている。この放熱スペーサーにおい
ては、その高柔軟性を発現させるためには熱伝導性フィ
ラーの充填量を少なくしなければならなかったので、熱
伝導性は小さいものであった。従って、最近の高密度化
された更なる高熱伝導性の要求される放熱スペーサーと
しては適用できない場合もでてきた。[0005] Therefore, heat radiation spacers that are more flexible than heat radiation sheets have been developed. In this heat radiation spacer, the amount of the thermally conductive filler had to be reduced in order to exhibit its high flexibility, so that the thermal conductivity was small. Therefore, in some cases, it cannot be applied as a heat-dissipating spacer that has been required to have higher thermal conductivity and that has recently been densified.
【０００６】本発明は上記に鑑みてなされたものであ
り、高柔軟性でかつ高熱伝導性を有する放熱スペーサー
の提供を目的とするものである。[0006] The present invention has been made in view of the above, and an object of the present invention is to provide a heat radiation spacer having high flexibility and high thermal conductivity.
【０００７】[0007]
【課題を解決するための手段】すなわち、本発明は、平
均粒子径０．３〜１μｍの酸化亜鉛粉末：平均粒子径１
０〜５０μｍの窒化珪素粉末の体積比が０．５：９．５
〜３：７である熱伝導性フィラー４０〜６０体積％と、
付加重合型液状シリコーン固化物６０〜４０体積％とを
含み、熱伝導率２Ｗ／ｍ・Ｋ以上、アスカーＣ硬度５０
以下であることを特徴とする放熱スペーサーである。That is, the present invention relates to a zinc oxide powder having an average particle diameter of 0.3 to 1 μm: an average particle diameter of 1 μm.
The volume ratio of the silicon nitride powder of 0 to 50 μm is 0.5: 9.5.
３3: 7, a thermally conductive filler of 40 to 60% by volume,
60 to 40% by volume of a solidified addition-polymerized liquid silicone, a thermal conductivity of 2 W / m · K or more and an Asker C hardness of 50
A heat radiation spacer characterized by the following.
【０００８】[0008]
【発明の実施の形態】以下、さらに詳しく本発明につい
て説明する。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail.
【０００９】本発明で使用されるシリコーン固化物は、
高柔軟性を有するものであり、付加重合型液状シリコー
ンの固化物である。この付加重合型液状シリコーンとし
ては、一分子中にビニル基とＨ−Ｓｉ基の両方を有する
一液性のシリコーン、または末端あるいは側鎖にビニル
基を有するオルガノポリシロキサンと末端あるいは側鎖
に２個以上のＨ−Ｓｉ基を有するオルガノポリシロキサ
ンとの二液性のシリコーンなどをあげることができる。
このような付加重合型液状シリコーンの市販品として
は、例えば東レダウコーニング社製、商品名「ＣＹ５２
−２８３Ａ／Ｂ」等を例示することができる。放熱スペ
ーサーの柔軟性は、付加反応によって形成される架橋密
度、熱伝導性フィラー量等によって調整することができ
る。The solidified silicone used in the present invention is:
It has high flexibility and is a solidified addition polymerization type liquid silicone. Examples of the addition polymerization type liquid silicone include a one-part silicone having both a vinyl group and an H-Si group in one molecule, or an organopolysiloxane having a vinyl group in a terminal or a side chain and two or more in the molecule. A two-part silicone with an organopolysiloxane having at least two H-Si groups can be used.
As a commercially available product of such an addition polymerization type liquid silicone, for example, "CY52" manufactured by Toray Dow Corning Co., Ltd.
-283A / B "and the like. The flexibility of the heat radiation spacer can be adjusted by the crosslink density formed by the addition reaction, the amount of the thermally conductive filler, and the like.
【００１０】本発明の放熱スペーサー中のシリコーン固
化物の含有量は４０〜６０体積％、好ましくは４５〜５
５体積％である。４０体積％未満では放熱スペーサーの
柔軟性が十分でなくなり、また６０体積％を越えると熱
伝導性が低下する。The content of the solidified silicone in the heat radiation spacer of the present invention is 40 to 60% by volume, preferably 45 to 5% by volume.
5% by volume. If it is less than 40% by volume, the flexibility of the heat radiation spacer is not sufficient, and if it exceeds 60% by volume, the thermal conductivity decreases.
【００１１】本発明で使用される熱伝導性フィラーは酸
化亜鉛と窒化珪素との混合粉末である。酸化亜鉛の平均
粒子径は０．３〜１μｍ、好ましくは０．５〜０．９μ
ｍである。０．３μｍ未満ではスラリー粘度が高くなっ
たり、硬化が阻害されたりするので好ましくない。ま
た、１μｍをこえると、目的とする熱伝導性が得られな
い。酸化亜鉛の製造法には、金属亜鉛から製造する方
法、亜鉛鉱石から直接製造する方法、更には湿式による
製造方法があるが、本発明においては、純度や表面活性
の点から金属亜鉛から製造したものが望ましい。The heat conductive filler used in the present invention is a mixed powder of zinc oxide and silicon nitride. The average particle size of zinc oxide is 0.3-1 μm, preferably 0.5-0.9 μm
m. When the thickness is less than 0.3 μm, the slurry viscosity is increased and the curing is inhibited, which is not preferable. If the thickness exceeds 1 μm, the desired thermal conductivity cannot be obtained. The method of producing zinc oxide includes a method of producing from metallic zinc, a method of producing directly from zinc ore, and a producing method by wet method.In the present invention, the method of producing from metallic zinc is used in terms of purity and surface activity. Things are desirable.
【００１２】窒化珪素粉末は、金属シリコンの直接窒化
法、シリカ還元窒化法、ハロゲン化ケイ素法等によって
製造されたものが使用され、その平均粒子径は１０〜５
０μｍ、好ましくは１５〜３０μｍである。１０μｍ未
満では、シリコーンの硬化が阻害され、また５０μｍを
こえると十分な熱伝導性が得られなくなる。As the silicon nitride powder, one produced by a direct nitridation method of metal silicon, a silica reduction nitridation method, a silicon halide method or the like is used.
0 μm, preferably 15 to 30 μm. If it is less than 10 μm, curing of the silicone is inhibited, and if it exceeds 50 μm, sufficient thermal conductivity cannot be obtained.
【００１３】酸化亜鉛粉末と窒化珪素粉末の割合は、体
積比で、前者：後者が０．５：９．５〜３：７、好まし
くは１：９〜２：８である。酸化亜鉛の割合がこれより
も少ないと熱伝導性が不十分となり、また多いとシリコ
ーン固化物の硬化が阻害される。The volume ratio of the zinc oxide powder to the silicon nitride powder is 0.5: 9.5 to 3: 7, preferably 1: 9 to 2: 8, for the former: the latter. If the proportion of zinc oxide is lower than this, thermal conductivity becomes insufficient, and if it is higher, curing of the solidified silicone is inhibited.
【００１４】本発明の放熱スペーサーの熱伝導率は２Ｗ
／ｍ・Ｋ以上であることが好ましい。熱伝導率が２Ｗ／
ｍ・Ｋ未満では、十分な放熱特性が得られない。また、
硬度は、アスカーＣ硬度で５０以下であることが好まし
い。アスカーＣ硬度が５０をこえると、放熱スペーサー
を発熱性電子部品に押しつけた際に、形状追従性が悪か
ったり、圧力がかかりすぎて発熱性電子部品を破損させ
たりする。The thermal conductivity of the heat radiation spacer of the present invention is 2 W
/ M · K or more. Thermal conductivity 2W /
If it is less than m · K, sufficient heat radiation characteristics cannot be obtained. Also,
The hardness is preferably 50 or less in Asker C hardness. If the Asker C hardness exceeds 50, when the heat radiation spacer is pressed against the heat-generating electronic component, the shape following property is poor, or the heat-generating electronic component is damaged due to excessive pressure.
【００１５】本発明の放熱スペーサーを製造する方法の
一例を示すと、一液性のシリコーン、または末端あるい
は側鎖にビニル基を有するオルガノポリシロキサンと末
端あるいは側鎖に２個以上のＨ−Ｓｉ基を有するオルガ
ノポリシロキサンとの二液性のシリコーンに、酸化亜鉛
と窒化珪素の混合粉末を混合してスラリーを調製した
後、それをフッ素樹脂やステンレスなどからなる型に流
し込み、真空脱泡装置等にて脱泡した後、加熱してシリ
コーンを固化させ、冷却後型より外し、更に必要に応じ
て加熱処理を行う方法である。An example of the method for producing the heat radiation spacer of the present invention is as follows. One-part silicone or organopolysiloxane having a vinyl group at the terminal or side chain and two or more H-Si compounds at the terminal or side chain are shown. After preparing a slurry by mixing a mixed powder of zinc oxide and silicon nitride with a two-part silicone with an organopolysiloxane having a group, the slurry is poured into a mold made of a fluororesin or stainless steel, etc. After defoaming, the silicone is heated to solidify the silicone, cooled, removed from the mold, and further subjected to a heat treatment if necessary.
【００１６】上記方法において、その成形方法は特に制
限されないが、スラリーの流し込みによって製造する場
合は、スラリー粘度は２万ｃｐｓ以下の低粘度であるこ
とが望ましく、また押出し法で製造する場合にはスラリ
ー粘度は５０万ｃｐｓ以上の粘度であることが望まし
い。増粘に際しては、シリカ超微粉（例えばアエロジ
ル）や十〜数百μｍのシリコーンパウダー等が使用され
る。In the above method, the molding method is not particularly limited, but when the slurry is produced by casting, the slurry viscosity is preferably as low as 20,000 cps or less. It is desirable that the slurry has a viscosity of 500,000 cps or more. For thickening, ultrafine silica powder (for example, Aerosil) or tens to hundreds of μm silicone powder is used.
【００１７】本発明の放熱スペーサーをシート状にした
場合の厚みは、一般的には０．３〜２０ｍｍ、好ましく
は０．５〜６ｍｍである。また、その平面ないし断面の
形状は、特に制限はなく、例えば三角形、四角形、五角
形等の多角形、円形、楕円形等である。また、その表面
は球面状であってもよい。The thickness of the heat radiation spacer of the present invention in the form of a sheet is generally 0.3 to 20 mm, preferably 0.5 to 6 mm. The shape of the plane or cross section is not particularly limited, and may be, for example, a polygon such as a triangle, a quadrangle, or a pentagon, a circle, an ellipse, or the like. Further, the surface may be spherical.
【００１８】このような放熱スペーサーは、熱伝導性が
大きく、また応力に対して非常に弱い発熱性電子部品に
押しつけても発熱性電子部品が損傷する危険性が極めて
小さい。また、発熱性電子部品が密集している場合にお
いても形状追従が十分に行われる。従って、放熱フィン
を取り付けるスペースがない場合や、電子機器が密閉さ
れていて放熱フィンから外部への放熱が困難な場合にお
いても、発熱性電子部品とケースの間に本発明の放熱ス
ペーサーを埋め込むことによって、高度な放熱を行うこ
とができる。Such a heat radiating spacer has high thermal conductivity, and the risk of damaging the heat-generating electronic component even when pressed against the heat-generating electronic component, which is very weak against stress, is extremely small. Further, even when the heat-generating electronic components are densely formed, the shape following is sufficiently performed. Therefore, even when there is no space for mounting the heat radiation fins, or when the electronic device is sealed and it is difficult to radiate heat from the heat radiation fins to the outside, the heat radiation spacer of the present invention should be embedded between the heat generating electronic component and the case. Thereby, high heat radiation can be performed.
【００１９】更に、本発明の放熱スペーサーには、平均
粒子径２５μｍ以下のアルミナ粉末及び／又はマグネシ
ア粉末を１５体積％以下を含ませることによって、十分
熱伝導性を保持した状態で、柔軟性を向上させることが
できる。Further, the heat radiation spacer of the present invention contains 15% by volume or less of alumina powder and / or magnesia powder having an average particle size of 25 μm or less, so that flexibility is maintained while maintaining sufficient thermal conductivity. Can be improved.
【００２０】[0020]
【実施例】以下、実施例、比較例を挙げてさらに具体的
に本発明を説明する。The present invention will be described more specifically below with reference to examples and comparative examples.
【００２１】実施例１〜５ 比較例１〜７ シリコーンＡ液（ビニル基を有するオルガノポリシロキ
サン）と、シリコーンＢ液（Ｈ−Ｓｉ基を有するオルガ
ノポリシロキサン）の二液性の付加重合型液状シリコー
ン（東レダウコーニング社製、商品名「ＣＹ５２−２８
３」）と、表１に示される酸化亜鉛粉末等の無機質粉末
を種々混合して得られた熱伝導性フイラーとを表２に示
す割合で配合し、粘度約１０万〜１５万ｃｐｓのスラリ
ーを調合した。これを、室温で真空脱泡した後、ステン
レス製型（１ｍｍ×１１０ｍｍ×１１０ｍｍ）に充填
し、プレス圧力１００Ｋｇ／ｃｍ2 でプレス成形した。Examples 1 to 5 Comparative Examples 1 to 7 Two-part addition polymerization type liquids of silicone A liquid (organopolysiloxane having a vinyl group) and silicone B liquid (organopolysiloxane having an H-Si group) Silicone (trade name “CY52-28, manufactured by Toray Dow Corning Co., Ltd.)
3 ") and a thermally conductive filler obtained by variously mixing inorganic powders such as zinc oxide powder shown in Table 1 in a ratio shown in Table 2, and a slurry having a viscosity of about 100,000 to 150,000 cps. Was prepared. After vacuum degassing at room temperature, this was filled in a stainless steel mold (1 mm × 110 mm × 110 mm) and press-molded at a press pressure of 100 kg / cm 2 .
【００２２】これを１５０℃で１時間加熱し、シリコー
ンを固化させてから型より取り外し、更に１５０℃で２
２時間加熱してシリコーン固化物（１ｍｍ×１１０ｍｍ
×１１０ｍｍ）からなる放熱スペーサーを製造した。This was heated at 150 ° C. for 1 hour to solidify the silicone and then removed from the mold.
Heat for 2 hours to solidify silicone (1mm x 110mm
× 110 mm).
【００２３】得られた放熱スペーサーについて、以下に
従うアスカーＣ硬度と熱伝導率を測定した。それらの結
果を表２に示す。With respect to the obtained heat radiation spacer, Asker C hardness and thermal conductivity were measured according to the following. Table 2 shows the results.
【００２４】（１）アスカーＣ硬度 放熱スペーサーを数枚重ねて厚みを１０ｍｍとし、アス
カーＣ硬度計にて測定した。(1) Asker C Hardness Several heat dissipation spacers were stacked to a thickness of 10 mm, and measured with an Asker C hardness meter.
【００２５】（２）熱伝導率 放熱スペーサーをＴＯ−３型銅製ヒーターケースと銅板
との間にはさみ、トルクレンチにより締め付けトルク２
００ｇ−ｃｍをかけてセットした後、銅製ヒーターケー
スに電力５Ｗをかけて４分間保持し、銅製ヒーターケー
スと銅板との温度差（℃）を測定し、式〔温度差（℃）
／電力 （Ｗ）〕により熱抵抗（℃／Ｗ）を求め、次い
で、式〔厚み（ｍ）／｛熱抵抗（℃／Ｗ）×測定面積
（ｍ2 ）｝〕により、熱伝導率（Ｗｍ・Ｋ）を算出し
た。(2) Thermal conductivity A heat radiation spacer is sandwiched between a TO-3 type copper heater case and a copper plate, and tightened with a torque wrench.
After setting by applying 00 g-cm, a power of 5 W was applied to the copper heater case and held for 4 minutes, the temperature difference (° C.) between the copper heater case and the copper plate was measured, and the equation [temperature difference (° C.)
/ Power (W)] to determine the thermal resistance (° C./W). Then, according to the formula [thickness (m) / {thermal resistance (° C./W)×measured area (m 2 )}], the thermal conductivity (Wm K) was calculated.
【００２６】[0026]
【表１】 [Table 1]
【００２７】[0027]
【表２】 [Table 2]
【００２８】表１〜２より、本発明の放熱スペーサー
は、アスカーＣ硬度で５０以下と柔軟性に優れており、
しかも熱伝導率が２Ｗ／ｍ・Ｋ以上と熱伝導性が良好な
ものである。From Tables 1 and 2, the heat radiation spacer of the present invention is excellent in flexibility with an Asker C hardness of 50 or less.
In addition, the thermal conductivity is 2 W / m · K or more and the thermal conductivity is good.
【００２９】[0029]
【発明の効果】本発明の放熱スペーサーは熱伝導性と柔
軟性に優れているため、発熱性電子部品の搭載された回
路基板に押しつけても応力が少なく、また高密度化され
発熱性電子部品の搭載された回路基板にも良好な密着性
を保った状態で放熱を行うことができる。The heat-dissipating spacer of the present invention has excellent thermal conductivity and flexibility, so that even if it is pressed against a circuit board on which heat-generating electronic components are mounted, the stress is small, and the heat-dissipating electronic components are increased in density. Can be dissipated while maintaining good adhesion to the circuit board on which is mounted.
Claims (2)
末：平均粒子径１０〜５０μｍの窒化珪素粉末の体積比
が０．５：９．５〜３：７である熱伝導性フィラー４０
〜６０体積％と、付加重合型液状シリコーン固化物６０
〜４０体積％とを含み、熱伝導率２Ｗ／ｍ・Ｋ以上、ア
スカーＣ硬度５０以下であることを特徴とする放熱スペ
ーサー。1. A thermally conductive filler 40 wherein the volume ratio of zinc oxide powder having an average particle diameter of 0.3 to 1 μm: silicon nitride powder having an average particle diameter of 10 to 50 μm is 0.5: 9.5 to 3: 7.
~ 60% by volume, and addition polymerization type liquid silicone solidified product 60
A heat radiation spacer characterized by having a thermal conductivity of 2 W / m · K or more and an Asker C hardness of 50 or less.
ナ粉末及び／又はマグネシア粉末を合計で１５体積％以
下を含有してなることを特徴とする請求項１記載の放熱
スペーサー。2. The heat radiation spacer according to claim 1, further comprising a total of 15% by volume or less of alumina powder and / or magnesia powder having an average particle size of 25 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10728498A JP3640525B2 (en) | 1998-04-17 | 1998-04-17 | Heat dissipation spacer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10728498A JP3640525B2 (en) | 1998-04-17 | 1998-04-17 | Heat dissipation spacer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11307699A true JPH11307699A (en) | 1999-11-05 |
| JP3640525B2 JP3640525B2 (en) | 2005-04-20 |
Family
ID=14455193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10728498A Expired - Fee Related JP3640525B2 (en) | 1998-04-17 | 1998-04-17 | Heat dissipation spacer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3640525B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11307700A (en) * | 1998-04-17 | 1999-11-05 | Denki Kagaku Kogyo Kk | Heat dissipating spacer |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101328230B1 (en) * | 2011-12-06 | 2013-11-14 | 전충규 | Heat radiation composition and heat sink product using the same |
-
1998
- 1998-04-17 JP JP10728498A patent/JP3640525B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11307700A (en) * | 1998-04-17 | 1999-11-05 | Denki Kagaku Kogyo Kk | Heat dissipating spacer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3640525B2 (en) | 2005-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW549011B (en) | Dissipation of heat from a circuit board having bare silicon chips mounted thereon | |
| JP6022061B2 (en) | Thermosetting resin composition, method for producing thermal conductive sheet, and power module | |
| JP3654743B2 (en) | Heat dissipation spacer | |
| JP3957596B2 (en) | Thermally conductive grease | |
| JP2007277406A (en) | Highly heat-conductive resin compound, highly heat-conductive resin molded article, compounding particle for heat-releasing sheet, highly heat-conductive resin compound, highly heat-conductive resin molded article, heat-releasing sheet, and method for producing the same | |
| JP3182257B2 (en) | Heat dissipation sheet | |
| EP0805618B1 (en) | Heat dissipating spacer for electronic equipments | |
| JP3891969B2 (en) | Thermally conductive grease | |
| JP2002138205A (en) | Thermal conductive molded article | |
| JP3178805B2 (en) | Heat radiation spacer | |
| JP3283454B2 (en) | Heat radiation spacer | |
| JP3640524B2 (en) | Heat dissipation spacer | |
| JP3563590B2 (en) | Heat radiation spacer | |
| JP4481019B2 (en) | Mixed powder and its use | |
| JP3183502B2 (en) | Heat radiation spacer | |
| JP4749631B2 (en) | Heat dissipation member | |
| JP4514344B2 (en) | Thermally conductive resin molding and its use | |
| JP3640525B2 (en) | Heat dissipation spacer | |
| JP3354087B2 (en) | Method of manufacturing heat-radiating spacer having high flexibility and high thermal conductivity | |
| JP2000095896A (en) | Powder for addition to resin, and resin composition and heat-releasing spacer using the powder | |
| JP2002299534A (en) | Heat radiation material and manufacturing method therefor | |
| JP2000286370A (en) | Heat radiation member of electronic component | |
| JP3092699B2 (en) | Heat radiation spacer, its use and silicone composition | |
| JP2000034107A (en) | Boron nitride to be added to resin, and resin composition and heat-radiation member by using the same | |
| JP4357064B2 (en) | Heat dissipation member |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20050118 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050118 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20050118 |
|
| R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080128 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080128 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090128 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100128 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100128 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110128 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110128 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120128 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120128 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130128 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140128 Year of fee payment: 9 |
|
| LAPS | Cancellation because of no payment of annual fees |