JPH11307456A - Exhauster in semiconductor substrate surface treatment equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely reduce entering in the state of a block, by installing an ascending part of an exhaust duct in the upward direction from below and a descending part in the downward direction from above, and detachably installing a receiving box of powdered product in the lower end of the ascending part or the descending part. SOLUTION: Exhaust gas from a heating furnace 1 flows in a cylindrical body 4e through an exhaust gas inlet 4b and a notched hole 4e', passes small holes of two perforated plates 4f, 4g in the cylindrical body 4e, and flows out toward a dry pump 2 from an exhaust gas outlet 4c through a pipe 4d. In the course of gas flow, powdered product contained in the exhaust gas is captured. In an exhaust duct pipe 3 from the heating furnace 1 to the dry pump 2, a descending part 3 in the downward direction from above is installed in the upper stream side of a trap 4. A receiving box 5 made of transparent material is detachably installed to the lower end of the descending part 3a by screwing or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor chip by placing a semiconductor substrate such as a silicon wafer in a heating furnace and diffusing impurities on the surface of the substrate, or various films such as an oxide film. The present invention relates to an apparatus for performing a surface treatment such as formation of a gas and for exhausting the inside of the heating furnace.

[0002]

2. Description of the Related Art In general, in the above-mentioned semiconductor substrate surface treatment apparatus, a semiconductor substrate surface treatment is performed while exhausting a part of gas in a heating furnace by a dry pump. Contains a powdery product generated during the surface treatment. Therefore, if the exhaust gas is directly sucked into the dry pump, the durability in the dry pump is reduced due to the powdery product. It will drop sharply.

Therefore, conventionally, a trap containing a perforated plate is provided in the middle of an exhaust duct pipe from the heating furnace to the dry pump, and in this trap, the trap is contained in the exhaust gas from the heating furnace. It is configured to collect a powdery product.

[0004]

However, in order to reliably collect the powdery product in the exhaust gas from the heating furnace in the trap, it is necessary to reduce the size of the hole in the perforated plate in the trap. However, the powdery product in the exhaust gas is liable to grow into a lump, and when the lump of the powdery product comes into the trap, the holes in the perforated plate in the trap are filled immediately. Therefore, in the conventional apparatus, the surface treatment on the semiconductor substrate must be frequently stopped at short time intervals because of the clogging of the trap. Another problem is that the work efficiency of the surface treatment is reduced.

An object of the present invention is to provide an exhaust device that solves this problem.

[0006]

In order to achieve this technical object, the present invention provides a method for manufacturing a semiconductor substrate surface treatment apparatus, comprising a trap having a built-in perforated plate in the middle of an exhaust duct pipe from a heating furnace to a dry pump. In the exhaust device, the exhaust duct pipe is provided with a rising portion from the bottom to the top or a falling portion from the top to the bottom in the portion of the exhaust duct tube on the upstream side of the trap, and the rising portion or A receiving box for the powdery product is detachably attached to the lower end of the falling portion. "

[0007]

As described above, a portion of the exhaust duct pipe upstream of the trap is provided with a rising portion from the bottom to the top or a falling portion from the top to the bottom. At the lower end of the rising portion or the falling portion, the receiving box for the powdery product is detachably mounted, so that when the powdery product contained in the exhaust gas from the heating furnace grows into a lump, When the powdery product mass reaches the rising portion or the falling portion in the exhaust duct pipe, it falls downward while separating from the exhaust gas by its weight and enters the receiving box. Become.

As a result, it is possible to reliably reduce the amount of the powdery product in the exhaust gas entering the trap containing the perforated plate in a lump state. Therefore, the occurrence of clogging of the trap with the powdery product can be significantly reduced, and the time interval for stopping the surface treatment on the semiconductor substrate due to the clogging in the trap can be increased, thereby reducing the work efficiency of the surface treatment. In addition, according to the present invention, it is only necessary to provide a rising portion or a falling portion provided with a receiving box at the lower end in the middle of the exhaust duct pipe, and the structure is extremely simple. This has the effect of not increasing the price and increasing the size.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In this figure,
Reference numeral 1 denotes a heating furnace in the semiconductor substrate surface treatment apparatus,
Reference numeral 2 denotes an exhaust dry pump, and the exhaust gas from the heating furnace 1 is connected to the heating furnace 1 and the dry pump 2 through an exhaust duct pipe 3 so that the exhaust gas is discharged from the heating furnace 1 and the dry pump 2. The air is sucked into the dry pump 2 and then exhausted to the atmosphere.

Reference numeral 4 denotes a trap provided in the middle of the exhaust duct pipe 3, and the trap 4 is configured as described below. That is, an exhaust gas inlet 4b is provided on an upper side surface of a case 4a having an open upper surface, an exhaust gas outlet 4c is provided on a bottom surface of the case 4a, and a pipe 4d communicating with the exhaust gas outlet 4c is provided in the case 4a. Into the case 4a, a cylindrical body 4e having a cutout hole 4e 'at the lower end is detachably inserted so as to fit into the pipe 4d.
e, two perforated plates 4f and 4g having a number of small holes formed therein
Is inserted, and a lid plate 4h is detachably attached to the upper surface of the case 4a with bolts or the like (not shown),
Exhaust gas from the heating furnace 1 flows into the cylinder 4e through the exhaust gas inlet 4b and the notch hole 4e '.
e, passes through the small holes in the two perforated plates 4f, 4g and then flows out from the exhaust gas outlet 4c through the pipe 4d toward the dry pump 2, while the powder contained in the exhaust gas It is configured to collect the product.

Then, the dry pump 2 is
In the exhaust duct pipe 3 reaching the upstream side of the trap 4, a falling part 3a is provided, which is downward from above, and a receiving box 5 made of a transparent body is screwed at the lower end of the falling part 3a. Attach it detachably in case etc. In this configuration, the exhaust gas from the heating furnace 1 in the semiconductor substrate surface treatment apparatus is sucked by the dry pump 2 through the exhaust duct pipe 3 and is exhausted.

The powdery product contained in the exhaust gas grows into a lump when the exhaust gas flows through the exhaust duct pipe 3. The lump of the powdery product grows in the exhaust duct pipe 3. When falling to the falling portion 3a provided in the middle of the exhaust gas, it falls downward while being separated from the exhaust gas by its weight and is collected so as to enter the receiving box 5, so that the The powdery product is a perforated plate 4f, 4
It is possible to surely reduce the amount of lumps entering the trap 4 containing g therein, and thus to greatly reduce the occurrence of clogging of the trap with the powdery product.

The powdery product collected in the receiving box 5 is removed by removing the receiving box 5 when the appropriate amount of the powdery product has accumulated. Is made of a transparent material, it is possible to constantly monitor the amount of the powdery product that accumulates inside. And, as described above, the present invention relates to a portion of the exhaust duct pipe 3 upstream of the trap 4,
The present invention is not limited to the case where the falling portion 3a is provided downward from the top and the receiving box 5 is detachably attached to the lower end of the falling portion 3a. An upwardly rising portion 3b is provided in the portion of the pipe 3 upstream of the trap 4, and the receiving box 5 is detachably attached to the lower end of the rising portion 3b. As in the third embodiment, the exhaust duct pipe 3 is provided with a downwardly falling portion 3a 'and a downwardly rising portion 3b' at a portion upstream of the trap 4 on the upstream side of the trap 4. It goes without saying that the receiving box 5 may be detachably attached to the lower end of the bent portion of the rising portion 3b 'from the falling portion 3a'.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional front view showing a first embodiment of the present invention.

FIG. 2 is an exploded sectional view of a trap according to the embodiment of the present invention.

FIG. 3 is a longitudinal sectional front view showing a second embodiment of the present invention.

FIG. 4 is a longitudinal sectional front view showing a third embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heating furnace 2 Dry pump 3 Exhaust duct pipe 4 Trap 4f, 4g Perforated plate 3a, 3a 'Falling part 3b, 3b' Rising part 5 Receiving box

Claims (1)

[Claims] 1. An exhaust system comprising a trap having a built-in perforated plate in the middle of an exhaust duct pipe from a heating furnace to a dry pump in a semiconductor substrate surface treatment apparatus, wherein the exhaust duct pipe is located upstream of the trap. Is provided with a rising portion from the bottom upward, or a falling portion from the top downward, and a receiving box for the powdery product is detachably attached to the lower end of the rising portion or the falling portion. An exhaust device in a semiconductor substrate surface treatment apparatus, wherein the exhaust device is mounted on a surface.