JPH11291151A - Automatic flaw removing method of long size material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To quickly, accurately and automatically remove a flaw by storing flaw lengthwise directional position information obtained by a whole cross-sectional surface flaw inspection device in a storage device, and specifying a flaw circumferential directional position by a circumferential directional flaw detector. SOLUTION: Flaw position information on a flaw existent material 8 is processed by a signal processor 15 of a rotary leakage flux flaw detector 4 to be stored. A flaw detector 10 moves to a central position of a lengthwise directional flaw by this stored flaw map information, the flaw existent material 8 is chucked in the end part by a chucking device 12, and the material is rotated by a material rotating device 13 to detect and specify a circumferential position of a flaw. A grinding tool of an automatic grinder 11 directly connected to the flaw detector 10 descends on the flaw existent material 8 to remove the flaw while moving in the lengthwise direction. When there is a flaw in the chucking part, the material 8 is clamped by a clamp device 16 by turning the flaw just above, and chucking is released to grind the flaw by the automatic grinder 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting the surface flaws of a long material such as a round bar steel, a steel pipe or the like by a full-section flaw inspection apparatus, and automatically grinding the flawed material based on the flaw position information. The present invention relates to a method for automatically removing a flaw material. In particular, the present invention
The present invention relates to a method for automatically removing a flaw in a long material, which enables quick and accurate automatic flaw removal regardless of the position of the flaw in the long material.

[0002]

2. Description of the Related Art As a prior art of this kind, there is, for example, Japanese Patent Publication No. 52-15054 entitled "Method of defining a flaw position in a separation type automatic flaw removing apparatus".

In this method, a flaw inspection device and a grinder are separately arranged, a reference point such as a label which can be detected by an optical means is provided on a workpiece at the time of inspection, and a flaw is detected by an optical detector during grinding. The position of the grinding machine is controlled based on the position information.

[0004]

The method of attaching a label to a test material such as a round steel bar or spraying quick-drying ink or paint on the test material such as the example shown in the above-mentioned "prior art" is not practical. However, in terms of the accuracy of the position, the accuracy with respect to various flaws and the like, it was never sufficient. In particular, it has been difficult to apply the method to a line having a high flaw detection speed (for example, 100 m / min or more) or a material having a small diameter bend.

[0005] Further, there is a case where there is an ultrasonic flaw detector using water immediately after the surface inspection apparatus, and in such a line configuration, label separation, marking bleeding, and the like occur.
It is difficult to apply it to an automatic flaw removal device that requires accuracy and certainty of the origin position.

Further, during flaw detection, the material may be twisted due to abrasion of a transport roll, etc., and when there is only one reference mark, the position information map of the flaw becomes inaccurate, causing a positional shift in automatic grinding.

[0007]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and provides an automatic flaw removing line for long materials capable of quick and accurate automatic flaw removal. It is as described. That is, 1. Inspection of surface flaws of long materials such as round bars and steel pipes by a total cross-section flaw inspection device, and sorting of flawed and flawless materials,
Next, for the flawed material, the flaw longitudinal position information obtained by the all-section flaw inspection device is stored in a storage device,
The tracking process is performed in the order of the materials, and then, when the flawed material reaches the flaw grinding position, the circumferential flaw detector directly connected to the grinder is used to generate the flaw longitudinal position information stored in the storage device for the flawed material. Based on, move to the longitudinal flaw coordinate position of the flawed material, further chuck and rotate one end of the flawed material, specify the flaw circumferential position by the circumferential flaw detector, and then The material having a flaw in the chucking portion is separated from the material having no flaw, and in the case of a material having no flaw in the chucking portion, the flaw is automatically ground based on the above-specified flaw position information while being chucked. In the case of a material having flaws, when grinding the flaws in the chucking portion, the material is supported by a clamp device, the chucking device is released, and the flaws are automatically ground. Auto flaws up method.

[0008] 2. Surface flaws of long materials such as round bar steel and steel pipes are inspected by a total cross-sectional flaw inspection device, materials having flaws and materials having no flaws are selected, and then, for flawed materials, flaws obtained by the total cross-sectional flaw inspection device. The longitudinal position information and the first flaw circumferential position information are stored in the storage device, and the tracking processing is performed in the order of the materials. Then, when the flawed material reaches the flaw grinding position, the circumferential flaw directly connected to the grinding machine. The probe is moved to the longitudinal flaw coordinate position of the flawed material based on the flaw longitudinal position information stored in the storage device for the flawed material, and one end of the flawed material is chucked. And rotate it to obtain second flaw circumferential position information by the circumferential flaw detector, and collate the second flaw circumferential position information with the first flaw circumferential position information stored in the storage device. And the position of the flaw is determined based on the matching result. Identify and then separate the material with and without the flaw in the chucking part.If the material has no flaw in the chucking part, the flaw is automatically ground based on the specified flaw position information while chucking. In the case of a material having a flaw in the chucking portion, when grinding the flaw in the chucking portion, the material is supported by a clamp device, the chucking device is released, and the flaw is automatically ground. Automatic scratch removal method.

[0009]

As the whole cross-sectional flaw inspection apparatus used in the present invention, a leakage magnetic flux flaw detection apparatus or an eddy current flaw detection apparatus is used. There is a type in which is rotated, and both can be applied.

The tracking processing is performed by synchronizing the flaw position information in the longitudinal direction of the flaw or the flaw position information in the circumferential direction of the flaw with the whole cross-section flaw inspection apparatus with the conveyance of the flawed material to the grinding table. . Even if the flaw position information by this whole cross-section flaw inspection apparatus is only the flaw position information in the longitudinal direction of the flaw as in the invention described in claim 1 of the present application, a circumferential flaw detector directly connected to a grinding machine later is used. Since the flaw circumferential position can be specified, flaw grinding is possible. However, as in the invention described in claim 2 of the present application, flaw circumferential position information is also stored (first flaw circumferential position information). It is also practical to match the flaw circumferential position information (second flaw circumferential position information) obtained by a circumferential flaw detector directly connected to a subsequent grinding machine to specify the flaw position. That is, according to the latter method, for example, when there are a plurality of flaws, the flaw position information (a so-called flaw map) by the first whole cross-sectional flaw inspection apparatus is mainly used to collate one flaw position information. There is an advantage that the position of all the flaws can be specified and the automatic grinding can be performed only by performing the operation.

If the flaw position information finely divided in the circumferential direction is also taken in, the number distribution of flaws can be known in advance, and the information can be used as an information source for efficient grinding machine control based on the information.

As the circumferential flaw detector directly connected to the grinding machine, it is preferable to use a flaw detector having a flaw detection capability equivalent to that of a full-section flaw detector. In addition, the automatic grinding machine and the circumferential flaw detector are directly connected to each other, so that there is almost no mechanical displacement between the probe and the grinder, and the detected flaw can be surely ground.

When a flaw is detected by a circumferential flaw detector directly connected to the grinding machine, one end of the flawed material is chucked and rotated. Thereby, the circumferential position of the flaw can be specified. However, the flaw position may overlap the chucking portion of the material, and automatic grinding becomes difficult as it is.

Therefore, in the present invention, a material having a flaw in the chucking portion and a material having no flaw are then separated, and in the case of a material having no flaw in the chucking portion, the material is left chucked and based on the specified flaw position information. To automatically grind the flaws,
In the case of a material having a flaw in the chucking portion, when the flaw in the chucking portion is ground, the material is supported by a clamp device, the chucking device is released, and the flaw is automatically ground.

The present invention according to claim 2 of the present application provides the first flaw circumferential position information obtained by the entire cross-sectional flaw inspection apparatus and the second flaw circumferential position detector obtained by the circumferential flaw detector directly connected to the grinding machine. Is characterized by collating the flaw circumferential position information and performing automatic grinding based on the collation result. Thereby, more accurate automatic grinding can be performed.

For example, if there are two or more flaws on the same circumference in the first flaw circumferential position information (flaw map) obtained by the all-section flaw inspection apparatus, the circumferential direction directly connected to the grinding machine A method is required to determine which of the flaws in the second flaw circumferential position information obtained by the flaw detector corresponds to the first flaw circumferential position information (flaw map). Since the reference point in the circumferential direction is not clear in the position information (flaw map), it is necessary to collate based on the relative position information of each flaw. If the discrimination is not appropriate, wrong grinding will be performed.

Further, for example, when the position of G is searched in the case where there are three flaws as shown in FIG. 1, as shown in FIG. Is higher, it is determined to be the third flaw, and the wrong grinding is also performed. Further, as shown in FIG. 2, the same applies to the case where the third flaw cannot be found even if the judgment level is gradually lowered from the normal judgment level I to the judgment level lower limit II by a computer.

Then, the first flaw circumferential position information obtained by the total cross-sectional flaw inspection apparatus is compared with the second flaw circumferential position information obtained by the circumferential flaw detector directly connected to the grinding machine. The method was developed.

With this configuration, effective automatic flaw removal can be achieved.

[0021]

FIG. 3 is a layout diagram showing an embodiment of the automatic flaw removal method of the present invention.

In this embodiment, the present invention is applied to round steel bars Φ20 to Φ80. The material 1 is kicked in from the deburring table 2 to the inspection table 3 and inspected by a rotary type leakage magnetic flux detector 4 over the entire length of the entire cross-section. The wafer is tracked and transferred to a flaw grinding station 6 provided at the station. At this time,
Flaw position information of each flawed material 8 (longitudinal direction and circumferential direction)
The tracking process is also performed in synchronization with the tracking (forward feeding) of each flawed material 8.

The inspection speed of the inspection table 3 is 80 to 12
Since the rotary ultrasonic flaw detector 6 uses water as a couplant at a speed as fast as 0 m / min and has a rear surface, accurate origin mark or labeling cannot be applied. The mark by the marking device 5 is for confirmation.

The material passed by the rotary type magnetic flux leakage detector 4 goes straight without being bounced out as a flawless material (passing material, maintenance-free material) 7. That is, only the flawed material (rejected material, required maintenance material) 8 is arranged in a line on the spring-out table 14. The flaw-free material (passing material, maintenance-free material) 7 may be passed through the grinding table 9, and it is not necessary to sort out good or defective products.

[0025] This flawed material (rejected material, required maintenance material)
The flaw position information 8 is processed and stored by the signal processing device 15 of the rotary type magnetic flux leakage detector 4, and when the flawed material (rejected material, required maintenance material) 8 comes to the grinding table 9 by tracking. Then, a control signal is transmitted to the control device of the grinding machine 11.

That is, based on the flaw map information stored in the signal processing device 15, the flaw detector 10 moves to the center position of the flaw in the longitudinal direction, and the end of the flawed material 8 is chucked by the chucking device 12. The material is rotated by the material rotating device 13 and the circumferential position of the flaw is searched and specified. Thereafter, the flawed material 8 is fixed with the flaw position facing up. Thereafter, the automatic grinding machine 1 directly connected to the flaw detector 10
The grinding tool 1 descends on the flawed material 8 and removes flaws while moving in the longitudinal direction. If there are a plurality of flaws, the position in the circumferential direction is specified for each flaw, and the grinding operation is repeated with the flaw position facing up.

If there is a flaw in the chucking portion, as shown in FIG.
Is clamped and supported from the side by the clamping device 17, the chucking is released, the chuck is released, and the flaw is ground by the automatic grinding machine 11.

FIG. 5 shows an example of a work flow based on the presence or absence of a flaw in the chucking portion of the flawed material 8.

By performing the grinding while specifying the circumferential position of each flaw for each flaw as described above, a reliable flaw removal operation can be performed without the influence of bending of the material or the displacement of the material due to chucking. became.

In addition, the conventional origin mark method cannot cope with the positional deviation in the circumferential direction due to the torsional running of the material 1 when the flaw data is collected by the rotary leakage magnetic flux detector 4, but the position can be specified for each flaw in the present method. Grinding is now possible.

The main functions of the signal processing device 15 in this embodiment include creation and storage of a flaw map, tracking of a flaw map, position control of the flaw detector 10, and a grinder 11.
And the control of the grinding conditions and the grinding conditions are performed collectively.

Next, a description will be given of a method of specifying the circumferential position of a flaw when there are a plurality of flaws in this embodiment.

FIG. 6 is an explanatory diagram of the flaw collation method of the present invention.

FIG. 6 (a) shows the distribution of flaws in the circumferential direction in the first flaw inspection device (that is, the rotary type magnetic flux detector 4) on a map obtained by dividing the circumference into 16 parts using the grinding width of the flaw grinder 11 as a guide. Indicates the presence or absence of flaws. In this case, A, B, C and 3
Flaws at several places have been detected. FIG. 4 (b) shows the result of flaw detection using the second flaw inspection device (that is, flaw detector 10).
It is assumed that distributions D, E, and F as shown in FIG.
The flaw map shown in FIG. 6A and the flaw map shown in FIG.
It is rotated clockwise at a pitch of 6 divided sections (12.5 degrees), and the flaw positions are collated. For example, in this case θ
Since 1 = θ3, θ2 ≠ θ4, the matching verification status of each flaw is as follows.

(1) When flaw A and flaw D match B = E C F (2) When flaw A and flaw E match B ≠ FC C ≠ A (3) Flaw A and flaw F match Time B ≠ D ≠ C ≠ E If two or more of these coincide, grinding is possible,
In this case, it is determined that grinding is performed with A = D and B = E.

As described above, as the flaw detection data flaw position information by the first flaw inspection device, the flaw position information divided into the circumferential grinding width or less is transferred in the circumferential direction. The information on the positional relationship between the flaws (angle difference between flaws) is compared, and the matched portion is used for grinding, thereby enabling highly reliable automatic flaw removal work.

[0037]

According to the present invention, it is possible to automate the operation of removing surface flaws by linking a high-speed automatic surface flaw inspection apparatus and an automatic grinding machine, which was impossible in the past. This eliminates the need for the operator to inspect and remove flaws using magnetic powder flaw detection, which requires the skill of the conventional operator.The sensory inspection and manual flaw removal work that depended on the skills of these people are mechanized, and work errors such as oversight are reduced. And contributed to the improvement of product quality.

Further, even when a plurality of flaws exist and the flaw signal distribution in the first flaw inspection device does not match the flaw signal distribution in the second flaw inspection device, the positional deviation of the automatic grinding is not changed. It has become possible to provide a more reliable automatic flaw removal system without causing any trouble.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of flaw position information (flaw map) in flaw detection.

FIG. 2 is a diagram showing a relationship between a signal level of a flaw, a noise signal level, and a determination level in flaw detection.

FIG. 3 is a layout diagram showing one embodiment of the present invention.

FIG. 4 is a diagram showing a relationship between a flawed material, a chucking device, and a clamp device.

FIG. 5 is a flowchart showing an example of a work flow based on the presence / absence of a flaw in a chucking portion of flawed material.

FIG. 6 is an explanatory diagram showing an example of a method of collating second flaw circumferential direction position information and first flaw circumferential direction position information according to one embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Material (round bar) [Work] 2 ... Deburring table 3 ... Inspection table 4 ... Rotating type magnetic flux leakage detector 5 ... Marking device 6 ... Rotating ultrasonic flaw detector 7 ... Flaw-free material (passing material, maintenance-free material) 8) Flawed material (rejected material, required maintenance material) 9 ... Grinding table 10 ... Flaw detector 11 ... Automatic grinder 12 ... Chucking device 13 ... Material rotating device 14 ... Bounce table 15 ... Signal processing device 16 … Clamping device

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Junichi Ishibashi 3007 one-letter Nakajima character in Shima, Himeji City, Hyogo Prefecture Inside Sanyo Special Steel Co., Ltd. Sanyo Special Steel Co., Ltd. (72) Inventor Koji Kawamura 5-10-1 Fuchinobe, Sagamihara City, Kanagawa Prefecture Nippon Steel Elex Co., Ltd. (72) Inventor Minoru Nakakusu 773-2 Kayubashicho, Yao City, Osaka Prefecture No. Japan Felster Co., Ltd. Osaka branch office

Claims (2)

[Claims] 1. A surface flaw of a long material such as a round bar steel or a steel pipe is inspected by a total cross-section flaw inspection apparatus, and a flawed material and a flawless material are selected. The flaw longitudinal position information obtained by is stored in the storage device, tracking processing in the order of the material, then, when the flawed material reaches the flaw grinding position, the circumferential flaw detector directly connected to the grinder, The flawed material is moved to the longitudinal flaw coordinate position of the flawed material based on the flaw longitudinal position information stored in the storage device, and one end of the flawed material is chucked and rotated. The position of the circumferential direction of the flaw is specified by the circumferential flaw detector, and then the material having the flaw in the chucking portion is separated from the material having no flaw. Is In the case of a material having a flaw in the chucking portion, the material is supported by a clamp device and the chucking device is released when the material has a flaw in the chucking portion. Automatic grinding method for a long material, characterized by automatically grinding the surface. 2. A surface defect of a long material such as a round bar steel or a steel pipe is inspected by a total cross-sectional defect inspection device, and a flawed material and a non-flawed material are selected. The flaw longitudinal position information and the first flaw circumferential direction position information obtained by the above are stored in a storage device, and tracking processing is performed in the order of the materials. Then, when the flawed material reaches the flaw grinding position, it is directly connected to the grinding machine. Moved the circumferential flaw detector to the longitudinal flaw coordinate position of the flawed material based on the flaw longitudinal position information stored in the storage device for the flawed material, and further moves the flawed material. One end is chucked and rotated, and the second flaw circumferential direction position information is obtained by the circumferential flaw detector, and the second flaw circumferential direction position information is stored in the storage device. Collate with the direction position information, and Based on the specified flaw position information, the flaw position is specified based on the specified flaw position, and then the material having the flaw in the chucking portion is separated from the material having no flaw. Automatically grinds flaws, and in the case of a material having a flaw in the chucking part, when grinding the flaw in the chucking part, the material is supported by a clamp device, the chucking device is released, and the flaw is automatically ground. Method for automatically removing long materials.