JPH11285924A - Metal die machining system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a metal die machining system, capable of not only machining such as cutting and grinding but also final finishing for minute groove, a sharp-edge interior angle part for molding a final product without shifting a metal die material installed in a single supporting member. SOLUTION: This system is provided with a first machining device 3, in which a metal die material 1 supported in a supporting member 2 can be machined by means of a cutting tool and a grinding tool, and a second machining device 4, in which the metal die material 1 supported in the supporting member 2 can be machined by means of laser beams. For moving and positioning the metal die material 1, which is supported in the supporting member 2, in respective machining areas for the machining devices 3, 4, both of the machining devices 3, 4 use a feeding mechanism 5 for the supporting member 2 in common.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing system for forming a mold having a shape that is difficult to form only by machining such as cutting, grinding, and polishing.

[0002]

2. Description of the Related Art When a die material is machined by a tool such as cutting, grinding, polishing, or the like, it is extremely difficult to machine a corner portion in a recess due to restrictions on the size of a blade. For this reason, a precise mold having a sharp edge-like inner corner portion in a fine groove or a recess cannot be formed only by machining.

[0003] Conventionally, after machining a mold material, finish machining has been performed by electric discharge machining or etching using wires or electrodes, or by manual work using a special tool.

However, since electric discharge machining is performed in a machining liquid tank, it is necessary to remove the machined mold material from the machining apparatus and attach it to a predetermined position in the machining liquid tank.
It takes a long time to remove and attach such a die material, and thus productivity is reduced, and dimensional accuracy may be reduced due to improper mounting. In addition, when polishing the work material to remove the deteriorated layer generated in the mold material by electric discharge machining, it is necessary to remove the work material from the electric discharge machine and attach it to the polishing machine, further reducing productivity and dimensional accuracy. I do. Further, in the case of wire electric discharge machining, fine machining is limited due to the restriction of the wire diameter, and machining of the bottomed recess cannot be performed. In the case of electric discharge machining using electrodes, there is a problem that the electrode production cost is large and the machining speed is low.

[0005] Since the etching requires completely different equipment from the machining, it is necessary to remove the machined mold material from the machining equipment and attach it to the etching equipment. Removal and attachment of such a mold material takes a long time, so that productivity is reduced, and dimensional accuracy may be reduced due to poor attachment.

[0006] After the finishing, the dimensional accuracy of the mold material is generally measured. When the finishing process is performed by electric discharge machining or etching, it is necessary to remove the mold material from the electric discharge machine or the etching machine and attach it to the measuring machine for the measurement. Furthermore, as a result of the measurement, when reworking is performed due to poor accuracy, it is necessary to attach the work to the processing machine again. Since it takes a long time to remove or attach such a mold material, productivity is reduced.

[0007] The present invention provides a mold processing system that overturns the conventional wisdom that it is necessary to attach and remove a mold material to and from a plurality of processing devices in order to form a precise mold. It is intended to solve the conventional problems as described above.

[0008]

SUMMARY OF THE INVENTION In accordance with the present invention, there is provided a mold machining system comprising: a first member capable of machining a mold material supporting member and a mold material supported by the supporting member by a cutting tool and a grinding tool; An apparatus and a second processing apparatus capable of processing a mold material supported by the supporting member by a laser beam. Both processing apparatuses share a feed mechanism of the support member so that the mold material supported by the support member can be moved and positioned in the processing area of each processing apparatus. The present invention has been made under the idea of using a laser beam, which has been conventionally used only for purposes such as cutting of materials, drilling, marking of characters and symbols, as an ideal cutting tool for machining a die material. It is. In other words, by using a laser beam, it is possible to machine a sharp edge-shaped inner corner portion in a fine groove or a recess in a mold material without performing a discharge machining or an etching process and without restricting a blade size. According to this configuration, it is possible to freely combine cutting and grinding with laser beam processing while the mold material remains mounted on one support member. As a result, it is possible to perform processing of a sharp edge-shaped inner corner portion or the like in a fine groove or a concave portion with high efficiency and high accuracy, and to finish it to a final product.

[0009] The first processing apparatus is preferably capable of processing a die material supported by the support member by a polishing tool. According to this configuration, it is possible to perform not only cutting, grinding and laser beam processing, but also polishing processing while the mold material is mounted on one support member, thereby enabling more accurate mold molding. Become. Further, even if a deteriorated layer is generated by laser beam processing, the deteriorated layer can be removed by polishing without removing the mold material from the support member.

[0010] A dimension measuring device for the die material supported by the support member is provided, and the die material supported by the support member can be positioned in a measurement area of the dimension measuring device by the support member feeding mechanism. Preferably it is. According to this configuration, it is possible not only to finish the final product while the mold material is mounted on one supporting member, but also to measure the dimensional accuracy, and to perform rework if the accuracy is poor.

The first processing apparatus has a spindle capable of holding a tool, and an automatic tool changer for exchanging a tool held by the spindle. The second processing apparatus includes a laser beam oscillator. And an optical system for guiding the laser beam to the mold material, and an actuator for driving the optical system so that the optical path of the laser beam can be changed. Thereby, productivity can be further improved.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. A mold processing system shown in FIGS. 1 and 2 includes a table-like support member 2 for supporting a mold material 1.
, A first processing device 3, a second processing device 4, a dimension measuring device 9, and a control device 10. In the present embodiment, the mold material 1 is supported by the support member 2 via the work plate 8.

The first processing device 3 has a support member feed mechanism 5 shared with the second processing device 4, a processing head 6, and a gate-shaped support 7 for supporting the processing head 6.

The support member feed mechanism 5 includes a bed 11 mounted on a floor, and a first moving member supported by the bed 11 via a guide rail 12 so as to be movable in one horizontal axis direction (hereinafter, X-axis direction). 13 and a second moving member 15 supported by the first moving member 13 via a guide rail 14 so as to be movable in one horizontal axis direction (hereinafter, Y axis direction) orthogonal to the X axis direction. Second moving member 15
Accordingly, the support member 2 is supported via a guide 16 so as to be movable in a vertical axis direction (hereinafter, Z-axis direction), and further, each of the moving members 13 and 15 and a driving mechanism of the support member 2 are provided.

The drive mechanism is screwed to a ball nut (not shown) attached to the first moving member 13 and drives a ball screw (not shown) attached to the bed 11 by a servomotor 21. An X-axis driving device for feeding the support member 2 in the X-axis direction;
By driving a ball screw (not shown) attached to the first moving member 13 side by a servo motor 22 and screwing into a ball nut (not shown) attached to the moving member 15 side, the support member 2 A Y-axis driving device for feeding in the axial direction and a ball screw (not shown) screwed to a ball nut (not shown) attached to the support member 2 and attached to the second moving member 15 are connected by a servo motor 23. A Z drive device that drives the support member 2 in the Z-axis direction by driving. Thus, the support member 2 can be moved and positioned in the X-axis, Y-axis, and Z-axis directions. The stroke of the support member 2 is such that the mold material 1 supported by the support member 2 can be moved and positioned in the processing regions of the processing devices 3 and 4 and the measurement region of the dimension measuring device 9. Stipulated.
The configuration of each driving device is not particularly limited, and may be configured by, for example, a rack and pinion type driving device. Also,
The driving direction of the support member 2 is not particularly limited. For example, the support member 2 may be driven in a rotation direction about the X, Y, and Z axes.

The processing head 6 includes a housing 31 attached to the portal support 7 and a housing 31.
Spindle 32 rotatably supported about the Z-axis by means of
And a motor 33 for driving the spindle 32 to rotate. The spindle 32 holds a tool 34 detachably. As a mechanism for holding the tool 34 by the spindle 32, a mechanism similar to the conventional mechanism can be used. As the tool 34, for example, a cutting tool such as a milling machine or an end mill, a grinding tool such as a grindstone, a polishing tool such as a buff for holding an abrasive material can be held by the spindle 32, and in addition, a drilling tool such as a drill, for example. It may be able to be held. An automatic tool changer (ATC) 35 for changing a tool 34 held by the spindle 32 is attached to a housing 31 of the processing head 6. The automatic tool changer 35 may have a known configuration. As a result, the first processing device 3 allows the support member 2
Can be processed by a cutting tool, a grinding tool, and a polishing tool. The working head 6 itself or the spindle 32 itself may be made movable with respect to the support member 2.
May be driven by the feed mechanism in the Y-axis direction, the Z-axis direction, the rotation direction around the X-axis, the rotation direction around the Y-axis, or the like, or the spindle 32 may be driven in the Z-axis direction by the feed mechanism. Further, the tool 34 may be held not only directly by the spindle 32 but also via an attachment mechanism attached to the processing head 6 so as to change the rotation axis direction of the spindle 32.

The second processing device 4 includes a laser beam oscillator 41, an optical system 42 for guiding a laser beam oscillated from the oscillator 41 to a mold material, and an optical system for changing the optical path of the laser beam. First and second servo motors 44 and 45 as actuators for driving the shutter 42, a shutter device 46 disposed between the oscillator 41 and the optical system 42, a controller 47, and the optical system 42;
It has a laser head 48 that covers the first and second actuators 44 and 45 and the shutter device 46.

In this embodiment, YAG (yttrium aluminum garnet crystal) is used as the laser medium of the oscillator 41. As the oscillator 41, a commercially available oscillator can be used. As the optical system 42,
In this embodiment, a galvanomirror beam scanning optical system is used. The first servo motor 44 displaces the laser beam irradiation position in the X-axis direction by displacing an optical element constituting the optical system 42, and the second servo motor 45 constitutes the optical system 42 By displacing the optical element, the irradiation position of the laser beam is displaced in the Y-axis direction. Thereby, the second processing device 4 can process the mold material 1 supported by the support member 2 by the laser beam. An ON / OFF signal of the oscillator 41 from the controller 47 and a shutter device 46
Is output, and the laser beam path between the oscillator 41 and the optical system 42 is opened and closed by the shutter device 46. In addition, since the processing region of the mold material 1 by the first processing device 3 and the processing region of the second processing device 4 partially overlap for effective use of space, the oscillator 41 of the controller 47 The housing is supported by the housing via a rail 49 so as to be displaceable in the X-axis direction, so that a portion such as the laser head 48 of the second processing device 4 that enters the interference area when the die material 1 is processed by the laser beam is subjected to the first processing. When the mold material 1 is machined by the device 3, it can be retracted from the machining area.

The servo motor 21 of the X-axis driving device, Y
Servo motor 22 of the axis driving device, servo motor 23 of the Z driving device, driving motor 33 of the spindle 32, automatic tool changer 35, first and second servo motors 44 and 45 for driving the optical system 42, second processing device Controller 47 of 4
Are connected to the control device 10. The control device 10 is connected to a computer 58 constituting a CAD / CAM system for creating a machining program for the die material 1.

Based on the machining program, the control device 10
The servo motors 21, 22, and 23 of the support member feed mechanism 5 are controlled by the control signal output from the control member to move and position the mold material 1 supported by the support member 2 in the processing area of the first processing device 3, By controlling the drive motor 32 of the spindle 32, cutting, grinding, or polishing of the mold material 1 by the tool 34 can be performed. By controlling the automatic tool changer 35 with the control signal, the tool 34 held by the spindle 32 can be changed. The control signals control the servo motors 21, 22 and 23 of the support member feed mechanism 5 to move and position the mold material 1 supported by the support member 2 in the processing area of the second processing device 4.
To control the on / off control of the oscillator 41 and the opening / closing control of the shutter device 46, and control the first and second driving servomotors 44 and 45 of the optical system 42 to control the irradiation position of the laser beam. Thus, laser beam processing of the mold material 1 can be performed.

Also, the displacement amount of the laser beam in the X-axis direction by the X-axis direction movement distance detection sensor 51, the Y-axis direction movement distance detection sensor 52, the Z-axis direction movement distance detection sensor 53, and the first servomotor 44 of the support member 2. Detection sensor 54, second
A sensor 55 for detecting the amount of displacement of the laser beam in the Y-axis direction by the servomotor 45 is provided for performing feedback control when controlling the position of the support member 2 and controlling the irradiation position of the laser beam, and is connected to the control device 10. Further, the control device 10 is connected with a display device 56 for displaying a control state and an operation panel 57 for manually controlling each of the processing devices 3 and 4 by an operator.

The dimension measuring device 9 is attached to the processing head 6. In the present embodiment, the dimension measuring device 9
Has a CCD camera 61 whose optical axis direction is the Z-axis direction, and is connected to the control device 10. The image of the mold material 1 captured by the camera 61 can be displayed on the display device 56. A cursor can be displayed together with the display image of the mold material 1 as a position instruction image, and the display position of the cursor can be changed by input from the operation panel 57. On the screen of the display device 56,
When the cursor is positioned at the measurement start point of the dimension in the display image of the mold material 1, a measurement start point signal is input to the control device 10 from the operation panel 57, and then the support member feeding mechanism 5 Moves the mold material 1
When the cursor is positioned at the measurement end point of the dimension in the display image of the mold material 1, a measurement end signal is input from the operation panel 57 to the control device 10 to the control device 10, and the measurement of the mold material 1 is started. When the detection signal of the movement distance between the end points of the points is input to the control device 10 from the X-axis movement distance detection sensor 51 or the Y-axis movement distance detection sensor 52, the measurement result can be displayed on the display device 56. It has been. That is, the dimensions of the mold material 1 supported by the support member 2 in the X-axis direction and the Y-axis direction are measured. In order to measure the dimension of the mold material 1 in the Z-axis direction,
The CCD camera 61 may be attached to the processing head 6 so that the optical axis direction can be changed in the X-axis and Y-axis directions. The dimension measuring device 9 may have a known configuration.

According to the above configuration, by using a laser beam, there is no need to perform electric discharge machining or etching, and there is no limitation on the size of the blade, and therefore, a sharp edge-shaped inner corner portion or the like of a fine groove or recess in the mold material 1 is used. Can be processed with high efficiency and high accuracy. As a result, while the mold material 1 is still mounted on one support member 2, machining that freely combines cutting, grinding, and laser beam machining is performed.
Can be finished to the final product. Further, while the mold material 1 is mounted on one support member 2, cutting,
Not only grinding and laser beam processing, but also polishing processing can be performed, so that a more accurate mold can be formed. Furthermore, even if an altered layer is generated by laser beam processing,
The deteriorated layer can be removed by polishing without removing the mold material 1 from the support member 2. In addition, it is possible not only to finish the final product while the mold material 1 is mounted on one support member 2, but also to measure the dimensional accuracy by the dimensional measuring device 9. .

The present invention is not limited to the above embodiment. For example, the arrangement of the first processing device 3 and the second processing device 4 is not limited to the above embodiment, and can be arbitrarily arranged. Also,
The form of the first processing apparatus 3 is not limited to the type in which the processing head 6 is supported by the gate-shaped support 7 as described above, and the processing head may be supported in a cantilever manner by, for example, a column-shaped support. Further, the spindle is not limited to the one that rotates about the vertical axis, and may be one that rotates about the horizontal axis.

[0025]

According to the present invention, not only the machining such as cutting, grinding and polishing, but also the final finishing of fine grooves and sharp edge-like inner corners while the mold material is mounted on one supporting member. It is possible to provide an ultimate ideal mold processing system capable of forming a final product by performing processing. As a result, productivity and dimensional accuracy can be improved, the total machine cost, the number of workers and the installation area of the apparatus can be reduced, and the delivery time of the mold can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a mold processing system according to an embodiment of the present invention.

FIG. 2 is a configuration explanatory view of a mold processing system according to an embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 mold material 2 support member 3 first processing device 4 second processing device 5 support member feed mechanism 9 dimension measuring device 32 spindle 34 tool 35 automatic tool changer 41 oscillator 42 optical system 44, 45 actuator

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[Procedure amendment]

[Submission date] April 15, 1999

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction contents]

[0008]

SUMMARY OF THE INVENTION In accordance with the present invention, there is provided a mold machining system comprising: a first member capable of machining a mold material supporting member and a mold material supported by the supporting member by a cutting tool and a grinding tool; An apparatus and a second processing apparatus capable of processing a mold material supported by the supporting member by a laser beam. Both processing apparatuses share a feed mechanism of the support member, so that the mold material supported by the support member can be moved and positioned in the processing area of each processing apparatus .
With the second processing device, the shear is
Ru can be processed der the Puejji-shaped corners. The present invention has been made under the idea of using a laser beam, which has been conventionally used only for purposes such as cutting of materials, drilling, marking of characters and symbols, as an ideal cutting tool for processing of a mold material. It is. In other words, by using a laser beam, it is possible to machine a sharp edge-shaped inner corner portion in a fine groove or a recess in a mold material without performing a discharge machining or an etching process and without restricting a blade size. According to this configuration, it is possible to freely combine cutting and grinding with laser beam processing while the mold material remains mounted on one support member. As a result, it is possible to perform processing of a sharp edge-shaped inner corner portion or the like in a fine groove or a concave portion with high efficiency and high accuracy, and to finish it to a final product.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Futa Moriyama, Inventor 1-19-3, Ibarada-Omiya, Tsurumi-ku, Osaka-shi, Osaka

Claims (4)

[Claims] 1. A support member for a mold material, a first processing device capable of processing the mold material supported by the support member with a cutting tool and a grinding tool, and a mold material supported by the support member. A second processing device capable of processing by a laser beam, wherein both processing devices are capable of moving and positioning a mold material supported by the support member in a processing region of each processing device. Sharing mold processing system. 2. The die processing system according to claim 1, wherein the first processing device is capable of processing the die material supported by the support member with a polishing tool. 3. A device for measuring the size of a mold material supported by the support member, wherein the support member feed mechanism positions the mold material supported by the support member in a measurement area of the size measurement device. Claim 1 or 2 which is possible
The machining system for a mold according to 1. 4. The first processing device has a spindle capable of holding a tool, and an automatic tool changer for exchanging a tool held by the spindle, and the second processing device has a laser beam The oscillator according to any one of claims 1 to 3, further comprising an optical system that guides the laser beam to the mold material, and an actuator that drives the optical system so that the optical path of the laser beam can be changed. Mold processing system.