JPH11284025A - Circuit connection material, connection structure and connecting method of circuit terminal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric/electronic circuit connection material which is higher in low-temperature curing rate, has a longer serviceable life, and causes less corrosion damages to the circuit than the conventional epoxy resin. SOLUTION: This material is interposed between the opposite facing circuit electrodes, and the opposite facing circuit electrodes are pressed against each other to be electrically connected together with the material. Here, the material includes (1) a curing agent which generates free radicals through heating, (2) hydroxyl group containing resin whose molecular weight is higher than 10,000, (3) a radical polymerization material, and (4) arylphenylether as essential components.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit connecting material and a circuit terminal connecting structure which are interposed between opposing circuit electrodes, pressurize the opposing circuit electrodes, and electrically connect the electrodes in the pressing direction. And a method for connecting circuit terminals.

[0002]

2. Description of the Related Art Epoxy resin adhesives have high adhesive strength and are excellent in water resistance and heat resistance.
It is widely used for various purposes such as electronics, architecture, automobiles, aircraft, etc. Among them, one-pack type epoxy resin-based adhesives are used in the form of a film, paste, or powder because they do not require mixing of a main agent and a curing agent and are easy to use. In this case, it is general to obtain a specific performance by various combinations of an epoxy resin, a curing agent and a modifying agent (for example, JP-A-62-141083).

[0003]

However, the epoxy resin film adhesive disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 62-141083 is excellent in workability, but is required to have a contact time of about 140 seconds for a connection time of about 140 seconds. Heating at about 180 ° C. requires heating at about 180 to 210 ° C. for 10 seconds. The reason for this is that a catalyst-type curing agent that is inactive at room temperature is used for the purpose of obtaining good stability by achieving both short-time curing (rapid curing) and storage stability (preservability). This is because a sufficient reaction cannot be obtained during curing. In recent years, in the field of precision electronic equipment, the density of circuits has been increasing, and the electrode width and electrode interval have become extremely narrow. For this reason, under the conventional connection condition of the circuit connection material using the epoxy resin system, there has been a problem that the wiring is dropped, peeled off or displaced. In addition, it is required to shorten the connection time to 10 seconds or less in order to improve production efficiency, and low-temperature rapid curing is indispensable. The present invention is excellent in electric and
It is intended to provide a circuit connecting material for electronic use.

[0004]

The circuit connecting material of the present invention is interposed between opposing circuit electrodes, presses the opposing circuit electrodes, and electrically connects the electrodes in the pressing direction. It is a circuit connection material which essentially includes the following components (1) to (3). (1) Curing agent that generates free radicals upon heating (2) Hydroxyl group-containing resin having a molecular weight of 10,000 or more (3) Radical polymerizable substance (4) Allyl phenyl ether As a curing agent that generates free radicals upon heating, a half-life of 10 hours A curing agent having a temperature of 40 ° C. or more and a half-life of 1 minute of 180 ° C. or less is preferable, and a peroxyester can be used. The radical polymerizable substance may contain a radical polymerizable substance represented by Formula 1.
As the hydroxyl group-containing resin having a molecular weight of 10,000 or more, a phenoxy resin, particularly a phenoxy resin modified with a carboxyl group-containing elastomer and a phenoxy resin modified with an epoxy group-containing elastomer are preferable. The above-mentioned circuit connection material may contain conductive particles.

[0005] In the connection structure for circuit terminals of the present invention, the first circuit member having the first connection terminal and the second circuit member having the second connection terminal are formed by the first connection terminal and the second connection member. The connection terminals are arranged to face each other, and the circuit connection material is interposed between the first connection terminal and the second connection terminal arranged opposite to each other. And the second connection terminal are electrically connected.
The method for connecting circuit terminals of the present invention includes a first circuit member having a first connection terminal, a second circuit member having a second connection terminal, a first connection terminal and a second connection terminal. Are arranged facing each other, the circuit connection material is interposed between the first connection terminal and the second connection terminal that are opposed to each other, and the first connection terminal and the second connection that are opposed to each other by heating and pressing. Are electrically connected. At least one surface of the connection terminal can be made of a metal selected from gold, silver, tin and a platinum group.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The curing agent used in the present invention, which generates free radicals by heating, is one which decomposes upon heating a peroxide compound, an azo compound or the like to generate free radicals. The temperature, the connection time, the pot life and the like are appropriately selected. From the viewpoint of high reactivity and pot life, an organic organic compound having a half-life of 10 hours at a temperature of 40 ° C. or more and a half-life of 1 minute at a temperature of 180 ° C. or less is used. An oxide is preferable, and an organic peroxide having a temperature of 60 ° C. or more for a half-life of 10 hours and a temperature of 170 ° C. or less for 1 minute of a half-life is preferable. The compounding amount is 0.05 to 100 parts by weight of the sum of the hydroxyl group-containing resin having a molecular weight of 10,000 or more and the radical polymerizable substance.
It is preferably from 10 to 10 parts by weight, more preferably from 0.1 to 5 parts by weight.

The curing agent can be selected from diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide, silyl peroxide and the like. Also, in order to suppress the corrosion of the connection terminals of the circuit members,
Chlorine ions and organic acids contained in the curing agent are 5000p
pm or less, and more preferably those with little organic acid generated after thermal decomposition. Specifically, peroxyester, dialkyl peroxide,
It is more preferably selected from hydroperoxides and silyl peroxides, and more preferably selected from peroxyesters having high reactivity. The above-mentioned curing agents can be appropriately mixed and used.

[0008] Peroxyesters include cumyl peroxy neodecanoate, 1,1,3,3, -tetramethylbutyl peroxy neodecanoate, 1-cyclohexyl-1-methylethyl peroxynodecanoate. , T-hexyl peroxy neodecanoate, t-butyl peroxypivalate, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate,
2,5-dimethyl-2,5-di (2-ethylhexanoylperoxy) hexane, 1-cyclohexyl-1-
Methyl ethyl peroxy 2-ethyl hexanonate, t
-Hexylperoxy 2-ethylhexanonate, t-butylperoxy-2-ethylhexanonate, t-butylperoxyisobutyrate, 1,1-bis (t-butylperoxy) cyclohexane, t-hexylperoxy Isopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanonate, t-butylperoxylaurate, 2,5-dimethyl-2,2
5, di (m-toluoyl peroxy) hexane, t-butyl peroxyisopropyl monocarbonate, t-butyl peroxy 2-ethylhexyl monocarbonate, t-hexyl peroxy benzoate, t-butyl peroxy acetate, etc. are used. it can.

As dialkyl peroxides, α,
α'bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5, di (t-butylperoxy) hexane, t-butylcumyl peroxide and the like can be used.

As the hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide and the like can be used. As the diacyl peroxide, isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethyl Hexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, succinic peroxide, benzoylperoxytoluene, benzoyl peroxide and the like can be used.

Examples of peroxydicarbonate include di-n-propylperoxydicarbonate, diisopropylperoxydicarbonate, bis (4-t-butylcyclohexyl) peroxydicarbonate and di-2-ethoxymethoxyperoxydicarbonate. , Di (2-ethylhexylperoxy) dicarbonate, dimethoxybutylperoxydicarbonate, di (3-methyl-3-
(Methoxybutylperoxy) dicarbonate and the like can be used.

As peroxyketals, 1,1, -bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis (t -Butylperoxy) -3,3,5-trimethylcyclohexane,
1,1,1- (t-butylperoxy) cyclododecane,
2,2-bis (t-butylperoxy) decane and the like can be used.

As the silyl peroxide, t-butyltrimethylsilyl peroxide, bis (t-butyl)
Dimethylsilyl peroxide, t-butyltrivinylsilyl peroxide, bis (t-butyl) divinylsilyl peroxide, tris (t-butyl) vinylsilyl peroxide, t-butyltriallylsilyl peroxide, bis (t-butyl) ) Diallylsilyl peroxide, tris (t-butyl) allylsilyl peroxide and the like can be used. These hardeners that generate free radicals can be used alone or as a mixture, and may be used in combination with a decomposition accelerator, an inhibitor and the like. A microcapsule obtained by coating these curing agents with a polyurethane-based or polyester-based polymer substance or the like is preferable because the pot life is extended.

The radically polymerizable substance used in the present invention is a substance having a functional group that is polymerized by a radical, and includes acrylate, methacrylate, and maleimide compound. The radical polymerizable substance can be used in any state of a monomer and an oligomer, and the monomer and the oligomer can be used in combination. Specific examples of the acrylate (methacrylate) include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate,
Trimethylolpropane triacrylate, tetramethylolmethanetetraacrylate, 2-hydroxy1.
3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxypolyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, Tris (acryloyloxyethyl)
And isocyanurate. These can be used alone or in combination. If necessary, a polymerization inhibitor such as hydroquinone or methyl ether hydroquinone may be appropriately used. In addition, it is preferable to have a dicyclopentenyl group and / or a tricyclodecanyl group and / or a triazine ring, since heat resistance is improved.

The maleimide compound is a compound containing at least two maleimide groups in the molecule, for example, 1-methyl-2,4-bismaleimidebenzene,
N, N'-m-phenylenebismaleimide, N, N'-P-phenylenebismaleimide, N, N'-m-toluylenebismaleimide, N, N'-4,4-biphenylenebismaleimide, N, N '-4,4- (3,3'-dimethyl-biphenylene) bismaleimide, N, N'-4
4- (3,3′-dimethyldiphenylmethane) bismaleimide, N, N′-4,4- (3,3′-diethyldiphenylmethane) bismaleimide, N, N′-4,4diphenylmethanebismaleimide, N'-4,4 diphenylpropane bismaleimide, N, N'-4,4 diphenyl ether bismaleimide, N, N'-3
3'-diphenylsulfone bismaleimide, 2,2-bis (4- (4-maleimidophenoxy) phenyl) propane, 2,2-bis (3-s-butyl-4-8 (4-maleimidophenoxy) phenyl) propane, 1,1 -Bis (4- (4-maleimidophenoxy) phenyl) decane, 4,4'-cyclohexylidene-bis (1- (4maleimidophenoxy) -2-cyclohexylbenzene,
2,2-bis (4- (4-maleimidophenoxy) phenyl) hexafluoropropane and the like can be mentioned. These can be used alone or in combination.

When a radical polymerizable substance having a phosphate ester structure represented by the formula 1 is used in combination with the above-mentioned radical polymerizable substance, the adhesive strength on the surface of an inorganic substance such as a metal is improved. The compounding amount is 0.1% with respect to 100 parts by weight of the sum of the hydroxyl group-containing resin having a molecular weight of 10,000 or more and the radical polymerizable substance.
It is preferable to use 10 to 10 parts by weight, more preferably 0.5 to 5 parts by weight. The radical polymerizable substance having a phosphate ester structure is obtained as a reaction product of phosphoric anhydride and 2-hydroxyethyl (meth) acrylate. Specifically, mono (2-methacryloyloxyethyl) acid phosphate, di (2-methacryloyloxyethyl)
Acid phosphate and the like. These can be used alone or in combination.

[0017]

Formula 1

Allyl phenyl ether is added to the circuit connecting material of the present invention. The blending amount is 10,000 molecular weight.
Sum of the above hydroxyl group-containing resin and radical polymerizable substance 100
It is preferable to use 0.1 to 10 parts by weight with respect to parts by weight,
0.5 to 5 parts by weight is more preferred.

As the hydroxyl group-containing resin having a molecular weight of 10,000 or more used in the present invention, polymers such as polyvinyl butyral, polyvinyl formal, polyamide, polyester, phenol resin, epoxy resin, and phenoxy resin can be used, and are excellent in stress relaxation during curing. In addition, the adhesion by the hydroxyl group is improved. A polymer obtained by modifying each polymer with a radical polymerizable functional group is more preferable because heat resistance is improved. In such a case, the resin is a hydroxyl group-containing resin having a molecular weight of 10,000 or more and is also a radical polymerizable substance. The molecular weight of these polymers is preferably 10,000 or more,
If it exceeds 00000, the mixing property tends to be poor.

As the hydroxyl group-containing resin having a molecular weight of 10,000 or more, a hydroxyl group-containing resin having a Tg of 40 ° C. or more and a molecular weight of 10,000 or more is used, and a phenoxy resin can be used. The hydroxyl group-containing resin having a molecular weight of 10,000 or more may be modified with a carboxyl group-containing elastomer, an epoxy group-containing elastomer, or a radical polymerizable functional group. Further, those modified with a radical polymerizable functional group are preferable because heat resistance is improved. As the phenoxy resin, a phenoxy resin modified with a carboxyl group-containing elastomer and a phenoxy resin modified with an epoxy group-containing elastomer can be used.

The circuit connection material of the present invention is a polymer or copolymer containing at least one of acrylic acid, acrylate, methacrylate or acrylonitrile as a monomer component, and a glycidyl acrylate containing a glycidyl ether group. When a copolymer acrylic rubber containing glycidyl methacrylate or glycidyl methacrylate is used in combination, stress relaxation is excellent, so that it is preferable. The molecular weight (weight average) of these acrylic rubbers is preferably 200,000 or more from the viewpoint of increasing the cohesive strength of the adhesive.

Further, it may contain a filler, a softener, an accelerator, an antioxidant, a coloring agent, a flame retardant, a thixotropic agent, a coupling agent, a phenol resin, a melamine resin, an isocyanate and the like. It is preferable to include a filler, because an improvement in connection reliability and the like can be obtained. Can be used if the maximum diameter of the filler is less than the particle diameter of the conductive particles,
A range of 5 to 60 parts by volume (based on 100 parts by volume of the adhesive resin component) is preferable. If it exceeds 60 parts by volume, the effect of improving reliability may be saturated, and if it is less than 5 parts by volume, the effect of addition is small. As the coupling agent, a vinyl group, an acryl group, an amino group, an epoxy group, and an isocyanate group-containing material are preferable from the viewpoint of improving the adhesiveness.

The circuit connection material of the present invention can be connected by direct contact of opposing circuit electrodes at the time of connection even without conductive particles. When the conductive particles are contained, more stable connection can be obtained. As the conductive particles, Au, Ag,
There are metal particles such as Ni, Cu, solder and carbon, etc.
In order to obtain sufficient pot life, the surface layer should be Ni, Cu
Au, Ag, and noble metals of the platinum group are preferable, and Au is more preferable. Further, the surface of a transition metal such as Ni may be coated with a noble metal such as Au. In addition, when the above-mentioned conductive layer is formed on a non-conductive glass, ceramic, plastic, or the like by coating or the like, and the outermost layer is made of a noble metal plastic as a core or in the case of hot-melt metal particles, it has deformability by heating and pressing. This is preferable because the contact area with the electrode at the time of connection increases and the reliability improves. The thickness of the noble metals coating layer is preferably 100 Å or more in order to obtain good resistance. But,
When a layer of a noble metal is provided on a transition metal such as Ni, free radicals are generated due to oxidation-reduction action caused by a defect of the noble metal layer or a defect of the noble metal layer generated when the conductive particles are mixed and dispersed, thereby deteriorating storage stability. Therefore, the thickness is preferably 300 Å or more. The conductive particles are properly used in a range of 0.1 to 30 parts (volume) with respect to 100 parts (volume) of the adhesive resin component depending on the use. In order to prevent a short circuit of an adjacent circuit due to excessive conductive particles, 0.1 to 1
More preferably, it is 0 part (volume).

Further, the circuit connecting material is divided into two or more layers,
When the layer containing the hardener generating free radicals and the layer containing conductive particles are separated, the pot life can be improved.

The circuit connecting material of the present invention can also be used as a film adhesive for bonding an IC chip to a chip mounting substrate or bonding electric circuits to each other. The circuit connecting material of the present invention can be used, for example, when a semiconductor chip is bonded and fixed to a substrate and an adhesive film by a face-down method, and both electrodes are electrically connected to each other.
That is, a first circuit member having a first connection terminal,
A second circuit member having a second connection terminal, the first connection terminal and the second connection terminal are arranged facing each other, between the first connection terminal and the second connection terminal arranged facing each other. The connection material (film adhesive) of the present invention is interposed between the first connection terminal and the second connection terminal by heating and pressurizing the connection terminal. As such a circuit member, a chip component such as a semiconductor chip, a resistor chip, and a capacitor chip, a substrate such as a printed board, and the like are used. These circuit members are usually provided with a large number of connection terminals (in some cases, a single terminal may be provided), and at least one set of the circuit members is arranged so that at least a part of the connection terminals provided on the circuit members are opposed to each other. Then, an adhesive is interposed between the opposed connection terminals and heated and pressed to electrically connect the opposed connection terminals to form a circuit board. By heating and pressurizing at least one set of circuit members, the connection terminals arranged to face each other can be electrically connected by direct contact or via conductive particles of an anisotropic conductive adhesive.

In the circuit connecting material of the present invention, the adhesive melts and flows at the time of connection to obtain the connection between the circuit electrodes facing each other, and then hardens to maintain the connection. The fluidity of the adhesive is important. Factor. 0.7mm thick, 15mm x 15mm
A circuit connecting material having a thickness of 35 μm and a size of 5 mm × 5 mm is sandwiched between the glasses using a glass of
When the heating and pressurizing is performed for 10 seconds, the fluidity (B) expressed using the initial area (A) and the area after the heating and pressurizing (B)
The value of / (A) is preferably from 1.3 to 3.0,
More preferably, it is 1.5 to 2.5. If it is less than 1.3, the fluidity is poor and a good connection may not be obtained,
If the value exceeds 3.0, the reliability of bubbles is easily reduced. 40 after curing of the circuit connecting material of the present invention
The elastic modulus at 100 ° C. is preferably 100 to 2000 MPa.
000-1800 MPa is more preferable.

According to the method for connecting circuit electrodes of the present invention, a circuit connecting material having curability by radical polymerization has a surface of gold,
After forming one electrode circuit which is a metal selected from the group consisting of silver, tin, and platinum, the other circuit electrode can be positioned, heated and pressed, and connected.

[0028]

According to the present invention, it is possible to provide an electric / electronic circuit connecting material which has excellent low-temperature and quick-curing properties and has a usable life as compared with the conventional epoxy resin system.

[0029]

Example 1 50 g of a phenoxy resin (trade name: PKHC, manufactured by Union Carbide Co., Ltd., average molecular weight: 45,000) was mixed with toluene (boiling point: 110.6 ° C., SP value: 8.90) by weight ratio.
Ethyl acetate (boiling point 77.1 ° C., SP value 9.10) = 50
/ 50 to obtain a solution having a solid content of 40%. As a radical polymerizable substance, trihydroxyethyl glycol dimethacrylate (trade name: 80MFA, manufactured by Kyoeisha Yushi Co., Ltd.) was used. T-hexylperoxy 2-ethylhexanonate as a free radical generator
A 0 wt% DOP solution (trade name Percure HO, manufactured by NOF Corporation) was used. A nickel layer having a thickness of 0.2 μm was provided on the surface of the particles having polystyrene as a core, and a gold layer having a thickness of 0.04 μm was provided outside the nickel layer to produce conductive particles having an average particle diameter of 10 μm. Phenoxy resin 50 g, trihydroxyethyl glycol dimethacrylate resin 49 g, allyl phenyl ether 1 g, t-hexyl peroxy 2-ethylhexanonate 5 g in terms of solid weight ratio, and further 3% by volume of conductive particles Dispersed, 80 μm thick P
Apply to the ET film using a coating device,
By a minute of hot air drying, a circuit connection material having an adhesive layer thickness of 35 μm was obtained. (Circuit connection) Using the above-described circuit connection material, one flexible circuit board (FPC) having 500 copper circuits with a line width of 50 μm, a pitch of 100 μm, and a thickness of 18 μm is connected to each other.
It was heated and pressurized at 60 ° C. and 3 MPa for 10 seconds and connected over a width of 2 mm. At this time, beforehand on one FPC,
After attaching the adhesive surface of the circuit connection material,
Temporarily connect by heating and pressing at 5 MPa for 5 seconds, then PET
The film was peeled off and connected to the other FPC.

Examples 2 to 4 Phenoxy resin / trihydroxy resin / trihydroxyethyl glycol dimethacrylate, o-allylphenol, phosphate ester type acrylate (trade name: P2M, manufactured by Kyoeisha Yushi Co., Ltd.) were used as radical polymerizable substances. The solid weight ratio of ethyl glycol dimethacrylate / o-allylphenol / phosphate type acrylate is 5
0 g / 48 g / 1 g / 1 g (Example 2), 30 g / 68
g / 1g / 1g (Example 3), 70g / 28g / 1g /
A circuit connecting material was obtained in the same manner as in Example 1 except that 1 g (Example 4) was used.

Comparative Examples Phenoxy resin (PKHC), bisphenol A type epoxy resin (YL980, product name of Yuka Shell Co., Ltd.),
Imidazole microcapsule type curing agent (3941H
P) (trade name, manufactured by Asahi Kasei Corporation), the solid weight ratio of phenoxy resin / bisphenol A type epoxy resin / imidazole microcapsule type curing agent is 40/20 /
A circuit connecting material was obtained in the same manner as in Example 1 except that the material was set to 40.

(Measurement of connection resistance) After the connection of the circuit, the resistance value between the adjacent circuits of the FPC including the above-mentioned connection portion is set to an initial value of 8
After the sample was kept in a high-temperature and high-humidity bath at 5 ° C. and 85% RH for 500 hours, the measurement was performed with a multimeter. The resistance value was represented by an average (x + 3σ) of 150 points of resistance between adjacent circuits. The circuit connection material obtained in Example 1 showed good connection reliability. In addition, the initial connection resistance was low, and the resistance after the high-temperature and high-humidity test rose slightly, indicating high durability. In addition, the circuit connection materials of Examples 2 to 4 also obtained good connection reliability. On the other hand, in Comparative Example 1, the curing reaction was insufficient and the adhesion state was poor, and the initial connection resistance was high.

(Measurement of Adhesive Force) After connecting the circuit, the adhesive force was measured at a peeling rate of 90 ° and a peeling speed of 50 mm / min.
Comparative Example 1 had an insufficient curing reaction and Comparative Example 2 had a molecular weight of 10
Since no 000 or more hydroxyl group-containing resin was used, the adhesive strength was as low as about 200 gf / cm, but in Examples 1 to 4, a good adhesive strength of about 1000 gf / cm was obtained.

(Evaluation of Storage Property) The obtained circuit connection material was treated in a thermostat at 30 ° C. for 30 days, and the circuit connection was performed in the same manner as described above to evaluate the storage property. In each case, 3
A connection result equivalent to that in a state where no treatment was performed in a thermostat at 0 ° C. for 30 days (initial stage) was obtained.

(Evaluation of Insulation) Using the obtained circuit connection material, a line width of 50 μm, a pitch of 100 μm, and a thickness of 1
A printed circuit board having a comb-shaped circuit in which 250 pieces of 8 μm copper circuits are alternately arranged, a line width of 50 μm, and a pitch of 100 μm
A flexible circuit board (FPC) having 500 copper circuits having a thickness of 18 μm and a thickness of 18 μm was heated and pressed at 160 ° C. and 3 MPa for 10 seconds and connected over a width of 2 mm. A voltage of 100 V was applied to the comb-shaped circuit of this connection body, and the insulation resistance value after 500 hours of a high temperature and high humidity test at 85 ° C. and 85% RH was measured. In each case, good insulation of 10 ⁹ Ω or more was obtained, and no decrease in insulation was observed.

(Evaluation of fluidity) Thickness 35 μm, 5 mm ×
Using a circuit connection material of 5 mm and a thickness of 0.7 m
m, sandwiched between 15mm x 15mm glass, 150 ° C2
Heating and pressurization was performed at 10 MPa. Fluidity (B) / (A) using initial area (A) and area after heating and pressing (B)
Was found to be 1.9 in Example 1 and also in the range of 1.3 to 3.0 for Examples 2 to 4.

(Elastic Modulus After Curing) The elastic modulus at 40 ° C. of the circuit connecting material of Example 1 after curing was measured.
It was 00 MPa.

[0038]

According to the present invention, it is possible to provide an electric / electronic circuit connecting material which has excellent low-temperature and quick-curing properties, has a long pot life, and has low circuit corrosiveness as compared with the conventional epoxy resin system. Become.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tomoko Kanazawa 48 Wadai, Tsukuba, Ibaraki Prefecture Tsukuba Development Laboratory, Hitachi Chemical Co., Ltd.

Claims (12)

[Claims] 1. A circuit connecting material interposed between opposed circuit electrodes and pressurizing the opposing circuit electrodes to electrically connect the electrodes in the pressing direction. Circuit connection material that requires the following components: (1) Curing agent that generates free radicals upon heating (2) Hydroxyl group-containing resin having a molecular weight of 10,000 or more (3) Radical polymerizable substance (4) Allyl phenyl ether 2. The curing agent which generates free radicals by heating has a half-life of 10 hours at a temperature of 40 ° C. or more and a half-life of 1 hour.
The circuit connecting material according to claim 1, wherein the temperature of the minute is 180 ° C or less. 3. The circuit connecting material according to claim 1, wherein the curing agent that generates free radicals upon heating is a peroxyester. 4. The circuit connecting material according to claim 1, wherein the radically polymerizable substance contains a radically polymerizable substance represented by Formula 1. Formula 1 5. The circuit connecting material according to claim 1, wherein the hydroxyl group-containing resin having a molecular weight of 10,000 or more is a phenoxy resin. 6. The circuit connecting material according to claim 1, wherein the hydroxyl group-containing resin having a molecular weight of 10,000 or more is a phenoxy resin modified with a carboxyl group-containing elastomer. 7. The circuit connecting material according to claim 1, wherein the hydroxyl group-containing resin having a molecular weight of 10,000 or more is a phenoxy resin modified with an epoxy group-containing elastomer. 8. The circuit connecting material according to claim 1, further comprising an acrylic rubber. 9. The circuit connecting material according to claim 1, further comprising conductive particles. 10. A first circuit member having a first connection terminal and a second circuit member having a second connection terminal are arranged such that the first connection terminal and the second connection terminal face each other. Wherein the circuit connection material according to any one of claims 1 to 9 is interposed between the first connection terminal and the second connection terminal disposed opposite to each other, and the first connection terminal disposed opposite to the first connection terminal. A connection structure of a circuit terminal to which a second connection terminal is electrically connected. 11. A first circuit member having a first connection terminal and a second circuit member having a second connection terminal are arranged with the first connection terminal and the second connection terminal facing each other. The circuit connection material according to any one of claims 1 to 9 is interposed between the first connection terminal and the second connection terminal disposed opposite to each other, and the first connection terminal disposed opposite to the first connection terminal by heating and pressing. A method of connecting a circuit terminal for electrically connecting a second connection terminal. 12. The circuit terminal connection method according to claim 12, wherein the surface of at least one of the connection terminals is made of at least one selected from gold, silver, tin, and platinum group metals.