JPH11273557A - Manufacture of plasma display panel and ink jet printer apparatus employed the manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a plasma display panel capable of lessening the amount of a film forming material to be used and forming a pattern with high precision and to provide an ink jet printer apparatus to be employed for the manufacture. SOLUTION: This plasma display panel manufacturing method includes a process of roughening the surface of a substrate, a process of printing electrodes, a color filter, and a black matrix or phosphors on the surface 18 roughened substrate 16 by an ink jet printer, and a process of removing an organic component contained in the printed ink by firing. Instead of the surface roughening of the substrate 16, an ink absorptive layer of an organic material is formed. This ink jet printer apparatus tube used for the method comprises a means for heating the substrate 16 and a means for cooling a nozzle head 11. The head of the ink jet printer apparatus is provided with a plurality of nozzles 12 arranged in a line at fixed intervals and a means for rotating the head around the rotary axis vertical to the printing face.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method of manufacturing a plasma display panel, and more particularly to an ink jet printer used for manufacturing the same.

[0002]

2. Description of the Related Art FIG. 10 shows, for example, a document ("display").
1997, Vol. 3, No. 10 pp. 39-41)
1 shows a conventional method for forming a mother electrode of a front panel of a plasma display panel using a photosensitive Ag paste. In the figure, 16 is a glass substrate, 101 is a thick film of a photosensitive electrode material, 51 is a photomask, 52 is ultraviolet light, 53
Denotes a light-shielding emulsion pattern formed on the photomask 51,
Reference numeral 17 denotes an exposed electrode pattern, and 43 denotes a transparent electrode pattern. The electrode pattern 17 of the plasma display usually has a line width of 50 to 150 μm and a length of 400 to 1000 m.
This is a line formed at an equal pitch of m.

Next, a method of forming a mother electrode will be described. First, as shown in FIG. 10A, a 10 to 15 μm photosensitive thick film electrode paste material 101 having a thickness of 10 to 15 μm is applied on the glass substrate 16 on which the transparent electrode 43 is formed by screen printing, roll coating or die coating. Let it. next,
As shown in FIG. 10B, a photomask 51 is superimposed on the glass substrate 16 and aligned with the pattern 43 of the transparent electrode.
Is exposed. Normally, the photosensitive electrode thick film 101 is of a negative type, and the photosensitive resin is polymerized only in the irradiated portion 17 of the ultraviolet light 52. Thereafter, as shown in FIG. 10C, the unexposed portions of the photosensitive electrode thick film material are developed and removed with a weak alkaline developer. The mother electrode pattern 17 formed in this manner is
Baking at a temperature of 00 ° C. to form a photosensitive thick film electrode paste 10
In addition to oxidizing and removing the resin component contained in 1, Ag particles contained in the photosensitive thick film electrode paste 101 are fused to the substrate 16 to form an electrode. The pattern forming method using the photosensitive thick film paste 101 is also applied to other components of the plasma display, for example, address electrodes on the rear panel, black stripes on the front panel, color filters, and the like. However, regarding the pattern formation of the black stripe and the color filter on the front panel, a black pigment or a red, blue or green pigment is mixed in the paste material instead of the Ag fine particles.

Next, a conventional example of a method for forming a mother electrode by screen printing, which is different from the above, will be described. FIG. 11 shows, for example, a document (“Electronic Materials”, December 1996, pp. 45-4).
9) or publication ("Latest technology of plasma display")
Shigeo Mikoshiba, ED Research, pp. 84 to 86) show a method of forming electrodes on the front panel of the conventional AC plasma display panel described in the above. In the figure, 111
Is a screen plate made of a mesh having an opening in an electrode portion to be printed. Reference numeral 112 applies pressure to the screen plate 111 to make the screen plate 111 come into contact with the substrate 16 and at the same time, extrudes the printing paste attached to the screen mesh, and
This is a rubber squeegee for transferring to a squeegee.

Next, a method of forming a mother electrode will be described. First, as shown in FIG. 11A, the screen plate 111 coated with the electrode printing paste is brought close to the glass substrate 16 on which the transparent electrode 43 is formed. At this time, the transparent electrode 43
And the opening of the mother electrode on the screen plate 111 are aligned. Then, screen version 11 with squeegee 112
1 is pushed laterally while being pushed into the substrate side, the printing paste adhered to the electrode portion of the screen plate is transferred to the substrate 16, and the mother electrode pattern 17 as shown in FIG.
Print. After printing, the paste transferred to the substrate is dried at 50 to 200 ° C and baked at 350 to 600 ° C to form electrodes. Such a pattern forming method by screen printing is also applied to other components of a plasma display such as an address electrode on a rear panel, a phosphor pattern, a black stripe on a front panel, and a color filter.

[0006]

In the conventional method for forming an electrode using a photosensitive Ag paste, the unexposed portion of the thick film electrode material is removed by a developing solution during development. More material is needed. Since the area where no electrode is formed is generally larger, several times as many materials are required. This results in high material costs and consequently high product prices. In particular, expensive Ag is often used as a low resistance and chemically stable material as a thick film electrode material, and the material price is expensive.

On the other hand, in the conventional electrode forming method by screen printing, since the printing paste is transferred only to the electrode portion, there is no waste and the material cost is reduced. However, since pressure is applied to the screen plate 111 during printing, if it is used repeatedly, the tension will be loosened and the pattern will be deformed. For this reason, the number of times of printing is 1000 to 2000 times and replacement is necessary, and the cost of the screen plate 111 per sheet is added to the manufacturing cost, which also increases the manufacturing cost. In addition, when the screen plate 111 is replaced, it is necessary to inspect the finished plate making state, which complicates the production process, and as a result, increases the production cost.

[0008] Further, the plasma display is required to have high image quality, and thus tends to have high definition. However, in the electrode forming method by screen printing, the screen plate 111 is used.
The minimum pattern size that can be printed is determined from the pitch of the mesh, and it is difficult to form a pattern of 100 μm or less.

In order to reduce the material cost of the thick-film electrode material and to use no screen plate, a so-called ink jet system can be considered. It is only necessary to print the electrode pattern of the plasma display on the glass substrate by using a dispersion of Ag as the electrode material or glass powder as the binder, and the ink is consumed only in the necessary parts and no screen plate is required Therefore, it is expected that the production cost may be significantly reduced.

However, the ink jet system has the following problems. First, in the case of a glass substrate, when a droplet collides with the substrate, the substrate does not have a function of absorbing the ink, so that the ink easily recoils and scatters. Further, since the viscosity of the ink is as small as 20 mPas or less, there is a problem that the ink on the substrate flows and the print shape changes.

A photosensitive thick film paste or a printing paste for screen printing has a viscosity as large as 50 Pas or more and can form a film having a thickness of 10 to 20 μm by one printing. The resulting ink has a viscosity of 20 mPas or less, and it is difficult to form a film having a thickness of 10 to 20 μm by only one printing and drying. The electrode thickness needs to be about 10 μm after printing and drying,
If the film thickness is increased by repeatedly printing in order to obtain this film thickness, there is a problem that the throughput is significantly reduced.

In the ink jet system, the diameter is several tens to
Since the pattern is formed by flying droplets of 100 μm, the pattern edge of the print finish has microscopic irregularities of several tens to 100 μm, and there is a problem that the accuracy of the pattern shape is not good.

[0013] The above-mentioned problems arise not only in the formation of electrodes, but also in
The same applies to the pattern formation of the phosphor, the black stripe, and the color filter.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and is a manufacturing method capable of saving film materials such as electrodes and manufacturing a pattern with high accuracy in manufacturing a plasma display panel. And an ink jet printer used for the production thereof.

[0015]

According to a first aspect of the present invention, there is provided a method of manufacturing a plasma display panel, comprising the steps of roughening a substrate surface, and forming an electrode, a color filter, and a black color on the roughened substrate by an ink jet printer. The method includes a step of printing a matrix or a phosphor, and a step of removing an organic component contained in the printed electrode, color filter, black matrix, or ink of the phosphor by baking.

A method of manufacturing a plasma display panel according to a second method of the present invention comprises the steps of: forming an ink absorbing layer made of an organic material on a substrate; A step of printing a color filter, a black matrix or a phosphor, and a step of removing the printed electrode, the color filter, the organic components contained in the ink of the black matrix or the phosphor and the ink absorbing layer by firing. is there.

A method of manufacturing a plasma display panel according to a third method of the present invention includes the steps of printing electrodes, color filters, black matrices, or phosphors by an ink jet printer while heating the substrate to 50 to 200 ° C. Removing the organic components contained in the printed electrode, color filter, black matrix or phosphor ink by baking.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a plasma display panel, comprising the steps of: forming a pattern using a photoresist on a substrate; and forming an electrode, a color filter, and a black matrix on an area where the photoresist is removed by an inkjet printer. Or a step of printing a phosphor, a step of removing a pattern of a photoresist, and a step of removing an organic component contained in the printed electrode, color filter, black matrix or phosphor ink by baking. is there.

According to a fifth aspect of the present invention, there is provided a method for manufacturing a plasma display panel, comprising printing an electrode, a color filter, a black matrix, or a fluorescent substance on a substrate with an ink containing a photosensitive resin in a size larger than a desired pattern. Exposing and developing the printed electrodes, color filters, black matrices or phosphors to remove necessary portions, and removing the printed electrodes, color filters, black matrices or phosphor inks Removing the organic components contained in the above by firing.

According to a sixth aspect of the present invention, there is provided a method for manufacturing a plasma display panel, comprising: forming a resist for determining an etching pattern on a substrate; and forming a concave portion by etching on the substrate on which the resist has been formed. And a step of printing an electrode, a color filter, a black matrix or a fluorescent substance on the recess by an inkjet printer, and the printed electrode, a color filter,
Removing the organic components contained in the black matrix or the phosphor ink by baking.

A method for manufacturing a plasma display panel according to a seventh method of the present invention comprises the steps of forming a black antireflection layer made of an inorganic material on a glass substrate, and etching the glass substrate having the antireflection layer formed thereon. Forming a resist for determining the pattern, cutting the glass substrate on which the resist is formed by etching to form a recess, printing an address electrode by an inkjet printer in the recess, and printing the resist. Removing the organic components contained in the ink of the electrode by firing.

A first aspect of the present invention relates to an ink jet printer for printing on a substrate by ejecting ink from nozzles provided on a head, wherein the substrate is heated to 50 to 200 ° C. And means for cooling the nozzle head.

An ink jet printer apparatus according to a second configuration of the present invention includes a head having a plurality of nozzles arranged in a straight line at fixed intervals, and the head having a plurality of nozzles arranged around a rotation axis perpendicular to a printing surface. Means for rotating.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a method and an apparatus for manufacturing a plasma display panel using an inkjet printer according to Embodiment 1 of the present invention.
FIG. 3 is a cross-sectional configuration diagram illustrating formation of an address electrode pattern on a back substrate of a plasma display by inkjet. In the figure, 11 is a nozzle head of an ink jet printer, 12 is a nozzle, 13 is an ink reservoir, 14 is a piezoelectric element, 15 is a droplet discharged from the nozzle 12, 16 is a glass substrate, 17 is an address electrode, and 18 is ground glass. Of the glass substrate 16 of FIG.

Next, the manufacturing method will be described. The nozzle 12 provided in the nozzle head 11 is placed at a distance of about 1 mm from the substrate 16. The nozzle head 11 includes an ink reservoir 13 and a piezoelectric element 14.
The vibration of 4 causes the volume of the ink reservoir 13 to fluctuate, and the ink is discharged from the nozzle head 12. By controlling the vibration frequency of the piezoelectric element 14 and the shape of the nozzle 12, a droplet 15 of ink having a diameter of 100 μm or less is emitted from the nozzle head 11. The discharged droplet 15 is the glass substrate 1
6 to form an electrode pattern 17. The electrode pattern 17 is formed by moving the nozzle head 11 to an appropriate position on the glass substrate 16 on which an electrode is to be formed, and ejecting ink. In a plasma display, usually, most of the electrodes are parallel straight lines, so that the nozzle head 11 moves in one direction while discharging ink. Conversely, the positioning may be performed by moving the glass substrate 16 side.

The glass substrate surface 18 is roughened into a frosted glass shape to hold ink. In order to roughen the surface, the glass substrate 16 is treated with sandblast or dilute hydrofluoric acid to have a surface roughness of about 0.1 to 5 μm.

Ag fine particles are dispersed in the ink. The fine particles are adsorbed on the irregularities of the glass substrate surface 18 to form the electrode 17. Therefore, even if ink having a low viscosity is used, the flow of the ink can be avoided, and a highly accurate pattern shape can be obtained. The solvent contained in the ink is removed by a drying process after printing. The substrate 16 is further fired in the air at a temperature of 350 to 550 ° C., and the Ag fine particles are fixed to the glass surface and fused together to form an electrode. During firing, the organic components contained in the ink are also oxidized and removed. With this manufacturing method, a line width of 50 to 150 μm can be obtained.

In this embodiment, the formation of the electrode 17 has been described. However, if an inorganic pigment is dispersed in the ink instead of the Ag fine particles, a black matrix, a color filter, etc. formed on the front plate of the plasma display can be obtained. Can be printed in the same manner. Further, if the phosphor is dispersed in the ink, it can be applied to the printing of the phosphor.

As described above, according to the present embodiment, the ink is jetted only to the pattern portion by the ink jet printer to form the pattern, so that the pattern can be formed with much less material than the conventional photosensitive paste. Can be formed. Further, as compared with the conventional screen printing method, a screen plate is unnecessary and the only necessary consumable is the inkjet head 11. Further, before printing, the glass substrate 1
Since the surface 6 is roughened, the ink printed on the unevenness of the surface 18 is retained, and a highly accurate pattern shape can be obtained without flowing the ink on the substrate 16.

Embodiment 2 FIG. FIG. 2 is a sectional view illustrating a method of manufacturing a plasma display panel according to Embodiment 2 of the present invention. In the first embodiment, the glass substrate 1
The surface of the glass substrate 16 is roughened to absorb the ink, but in the present embodiment, the ink is absorbed by coating the surface of the glass substrate 16 with the ink absorbing layer 21 mainly composed of an organic substance. The ink absorbing layer 21 is formed by applying a paste made of a fibrous resin such as ethyl cellulose or a particulate polymer material onto the substrate 16.
It is applied to a thickness of about 30 μm and dried to form. The coating may be performed by a method such as screen printing, roll coating, blade coating, and die coating.

The ink ejected from the nozzle head 11 is adsorbed on the ink absorbing layer 21. As described above, since the ink is absorbed by the ink absorbing layer 21, it is possible to form a thicker film than in the case of the first embodiment. After printing, the solvent contained in the ink is removed by a drying step.
Substrate 16 is further fired in air at a temperature of 350-550 ° C. At the time of baking, the organic components of the ink absorbing layer 21 are removed by oxidation. Further, organic components contained in the ink are also oxidized and removed. And Ag contained in the ink
And only inorganic components remain. Ag fine particles are deposited on the glass substrate 16.
The electrodes 17 are fixed to the surface and fused together.

In this embodiment, as in the first embodiment, if an inorganic pigment is dispersed in ink instead of Ag fine particles, a black matrix or a color filter formed on the front plate of the plasma display can be formed. Is also possible. Further, if the fluorescent substance is dispersed in the ink, it can be applied to the printing of the fluorescent substance.

As described above, in the present embodiment, the ink droplets 15 reach the substrate 16 after the ink droplets 15 reach the substrate 16 by providing the ink absorbing layer 21 in advance on the substrate 16 on which a pattern is formed by ink jet. Since it is absorbed by the layer 21, recoil of the droplet 15 and flow of ink can be prevented, and a highly accurate pattern shape can be obtained. In addition, if the thickness of the absorbing layer 21 is increased, a large amount of ink can be held, and a pattern of a thick electrode or the like can be formed. Further, since printing is performed only where necessary, the amount of ink material can be reduced. The absorbing layer 21 can be burned and removed in a firing step after printing.

Embodiment 3 FIG. 3 shows a method of printing a pattern on a plasma display panel using an inkjet printer according to a third embodiment of the present invention, and the configuration of the apparatus. In the present embodiment, printing is performed while heating the substrate 16 in the same printing step as in the first embodiment. In the drawing, reference numeral 31 denotes a means for adjusting the temperature of the substrate 16, which is a heat retaining plate. A means 32 for cooling the nozzle head 11 is a water-cooled metal plate. next,
The manufacturing method will be described. Before printing, substrate 16
Heat to 200 ° C. The substrate 16 is printed in the same manner as in the first embodiment while maintaining the temperature on the heat retaining plate 31. Since the temperature of the substrate 16 is high, the droplets
Upon reaching 6, the solvent of the ink dries instantly. Therefore, the spread of the ink on the substrate 16 is reduced, so that a highly accurate pattern shape can be obtained and the printed film thickness of the electrode pattern 17 can be increased.

In order to prevent the temperature of the nozzle head 11 from rising due to radiant heat during printing, the nozzle head 1 used in this embodiment is used.
1 is surrounded by a water-cooled metal plate 32.

After the solvent is dried, the substrate 16 is further fired in the air at a temperature of 350 to 550 ° C. as in the first embodiment, and the Ag fine particles are fixed to the glass surface and fused together to form the electrode 17. To form During firing, the organic components contained in the ink are oxidized and removed, leaving only the Ag and inorganic components contained in the ink.

In this embodiment, the surface of the substrate 16 is roughened as in the first embodiment. However, the ink absorbing layer 21 may be provided on the surface of the substrate 16 as in the second embodiment. Further, in the present embodiment, since the ink dries instantaneously, the above-described treatment of the surface of the substrate 16 is not necessarily required.

In this embodiment, as in the first embodiment, if an inorganic pigment is dispersed in ink instead of Ag fine particles, a black matrix or a color filter formed on the front plate of the plasma display can be formed. Printing is also possible. Further, if the phosphor is dispersed in the ink, it can be applied to the printing of the phosphor.

As described above, according to the present embodiment, by maintaining the temperature of the substrate 16 during printing at 50 to 200 ° C., the ink adhered to the substrate 16 is instantaneously dried,
Since the flow of ink on the surface of the substrate 16 can be prevented, a highly accurate pattern shape can be obtained. Further, since printing is performed only where necessary, the amount of ink material can be reduced. Further, by cooling the nozzle head 11, the substrate 16
This can prevent the temperature of the nozzle head 11 from rising due to radiant heat from the ink and drying of the ink inside.

Embodiment 4 FIG. FIG. 4 is a view illustrating a method of manufacturing a plasma display panel according to a fourth embodiment of the present invention, illustrating a process of forming a mother electrode pattern on a front substrate of a plasma display by inkjet.
In the figure, 41 is a negative pattern, 42 is a resist removal portion, and 43 is a transparent electrode. Next, a manufacturing method will be described. First, a negative pattern 41 is formed on a glass substrate 16 using a dry film resist. That is, the glass substrate 1
6 is laminated with a dry film resist, and a pattern is formed by exposure and development so that the electrode pattern becomes the resist removal portion 42. Thereafter, as shown in FIG. 4A, the ink is filled by ejecting the ink droplets 15 from the nozzle head 11 to the resist removing section 42. Next, at 50 ° C
Heat to a temperature of ~ 200C to evaporate the solvent of the ink. Thereafter, the dry film 41 is swelled and peeled off with a weak alkaline solution, leaving only the electrode pattern 17 as shown in FIG. Further, 350 to 550 as in the first embodiment.
Firing in air at a temperature of ° C. In addition, dry film 4
The first peeling step may be omitted, and the dry film 41 may be removed by firing.

The printing pattern shape is determined by photolithography to follow the pattern shape of the dry film 41. For this reason, the shape precision of the pattern can be excellent compared to the case where the pattern is formed only by the ink jet. Further, since the dry film 41 can be printed with a thickness of 30 to 100 μm, there is an advantage that the film thickness of the electrode pattern 17 can be increased. Further, since printing is performed only where necessary, the amount of ink material can be reduced.

In the present embodiment, not only the formation of the mother electrode but also the formation of a thick print pattern such as a phosphor or the front plate black matrix or the color where linearity of barrier ribs and pattern edges are required. It is also applicable to filter pattern formation.

Embodiment 5 FIG. FIG. 5 is a view illustrating a method of manufacturing a plasma display panel according to Embodiment 5 of the present invention, and illustrating a method of forming a mother electrode using negative photosensitive ink. In the figure, 51 is a photomask,
52 is an ultraviolet light, and 53 is a light-shielding emulsion pattern. Next, a manufacturing method will be described. First, a glass substrate 16 having a transparent electrode 43 as shown in FIG. 5A is prepared. Next, as shown in FIG. 5B, the ink absorbing layer 21 described in the second embodiment is applied. Next, as shown in FIG. 5C, an electrode pattern 17 that is thicker than the desired electrode pattern is printed using a negative photosensitive resin and an ink containing Ag particles. Thereafter, as shown in FIG. 5D, the photomask 51 in which the desired electrode pattern shape is a transparent portion.
Is exposed to ultraviolet light 52 and developed. As shown in FIG. 5E, the unexposed portion of the ink absorbing layer 21 is removed together with the unexposed electrode pattern 17 during development. This determines the electrode width. The electrode after development is baked to remove the organic components contained in the ink, and the Ag particles are fused and fixed to the surface of the substrate 16 to form a final electrode. As described above, in the present embodiment, since the pattern shape is determined by the photolithography process, a highly accurate pattern shape can be obtained. Further, since the photosensitive ink is not printed on the entire surface, material saving can be achieved as compared with the conventional method using a photosensitive thick film material.

The present embodiment can be applied not only to the formation of the mother electrode but also to the formation of the pattern of the address electrodes of the front plate black matrix, the color filter and the back plate which require the linearity of the pattern edge. . Also, the present invention can be applied to pattern formation of a phosphor.

Embodiment 6 FIG. FIG. 6 is a diagram illustrating a method for manufacturing a plasma display panel according to Embodiment 6 of the present invention. In the figure, 61 is a concave portion formed on the substrate 16, 62 is a mask pattern, and 63 is a sandblast abrasive. In the present embodiment, the recesses 61 are formed in the substrate 16 by etching, and the recesses 61 are filled with ink by inkjet to form the pattern 17.

Next, the manufacturing method will be described in detail.
First, a concave portion 61 is formed by etching a portion of the glass substrate 16 where a pattern is to be formed. The etching is performed, for example, as follows. First, a dry film resist is laminated on the glass substrate 16, exposed and developed to form a dry film pattern 62 on the glass substrate 16. Thereafter, as shown in FIG. 6A, the glass substrate 16 is ground to a desired depth by sandblasting using the dry film pattern 62 as a mask. The abrasive 63 is harder than glass, for example, 50 μm of Al ₂ O ₃ or SiC.
The following particles are used: Thereafter, the substrate 16 is immersed in a weak alkaline solution or exposed to a shower of a weak alkaline aqueous solution to swell and peel off the dry film 62 in the same manner as in the first embodiment. (B)
The substrate 16 having the concave portion 61 as shown in FIG. Instead of using a dry film, a liquid resist may be applied to form a pattern, and the pattern may be formed by etching with dilute hydrofluoric acid or buffered hydrofluoric acid. The recess 61 is formed as described above. Next, as shown in FIG.
In the same manner as in the fourth embodiment, the ink containing fine particles of Ag is discharged from the nozzle head 12 into the concave portion 61 to fill the concave portion 61 pattern. Further, the temperature of the substrate 16 is set to 100 to 200.
6C, the solvent of the ink is evaporated, the ink is dried, and the entire substrate 16 is fired in the air at a temperature of 350 to 550 ° C. to form the electrode pattern 17 in the same manner as in the first embodiment. The substrate 16 in which the electrode pattern 17 is formed in the concave portion 61 as shown in FIG.

In the present embodiment, since the recess 61 is filled with ink in the same manner as in the fourth embodiment, the flow of ink is prevented, a highly accurate pattern shape is obtained, and the electrode 1
7 can be formed thicker. Further, since the substrate 16 is printed in the recessed portion 16 in which the substrate 16 is dug, the finished substrate surface can be smoothed. Further, since printing is performed only where necessary, the amount of ink material can be reduced.

The present embodiment can be applied not only to the mother electrode but also to the pattern formation of the front panel black matrix or the color filter which requires the linearity of the pattern edge. Also, the present invention can be applied to pattern formation of a phosphor.

Embodiment 7 FIG. FIG. 7 shows a method for manufacturing a plasma display panel according to Embodiment 7 of the present invention, and is a view for explaining a method for forming barrier ribs and address electrodes by inkjet. In the figure, 71 is a glass containing a black pigment, 72 is a resist pattern, 73 is a sandblasting abrasive, 74 is an address electrode pattern,
75 is a barrier rib, and 76 is a white dielectric material. Next, a manufacturing method will be described. First, as shown in FIG. 7A, a glass layer 7 containing a black pigment is formed on a glass substrate 16.
1 and a stripe pattern 72 of barrier ribs is formed thereon by photoresist. In the method of forming the glass layer 71 containing a black pigment, a paste made of a black pigment and glass is applied to the surface of the glass substrate 16 and baked. Application method is screen printing, roll coating, blade coating,
Any of die coating and the like may be used. The photoresist may be coated with a liquid resist or may be laminated with a sheet-like resist, a so-called dry film resist.
Next, a stripe pattern 72 serving as a barrier rib pattern is baked on the photoresist, and is formed by exposing and developing. Thereafter, the abrasive 73 is sprayed, and the glass substrate 16 is carved by so-called sand blasting. At this time, the resist pattern 72 serves as a mask to leave that portion.
The shape of the barrier rib 75 as shown in FIG. 7B is formed. The height of the barrier rib 75 is determined by the engraving depth of the sandblast, and is 100 to 150 μm. The abrasive 73 is harder than glass, for example, Al ₂
Particles of 50 μm or less such as O ₃ and SiC are used. Next, the resist 72 on the top of the barrier rib 75 is peeled and removed with an aqueous solution of an alkali such as sodium hydroxide. At this time, the abrasive 73 is also washed at the same time. Thereafter, as shown in FIG. 7C, the address electrodes 74 are printed by ink jet as in the fourth and sixth embodiments, and are dried and fired to form the electrodes 74 as in the fourth and sixth embodiments. Next, as shown in FIG. 7D, the white dielectric film 76 is printed again by inkjet. The ink used here consists of glass, white pigment, resin, and organic solvent. Then, after drying at 100-200 ° C, 500-
By firing at 600 ° C., a dense white dielectric film 76 is formed.

As described above, according to the present embodiment, since the ink is filled in the concave portion surrounded by the barrier rib 75 as in the fourth embodiment, it is possible to prevent the flow of the ink and to form a highly accurate pattern shape. Since the ink is obtained and printed only where necessary, not only the ink material can be saved, but also the glass substrate 16 can be directly cut to form the barrier ribs 75. For example, a publication ("Latest Technology of Plasma Display", Mikoshiba) By Shigeo, ED Research, pp.86-
As compared with the screen printing method and the sand blast method described in 89), there is an advantage that a material for the barrier rib is not required and a panel can be formed at low cost. Since the electrode 74 is always formed between the barrier ribs, the barrier rib 75 and the electrode 74 generated by the screen printing method or the photosensitive paste method are used.
Can be eliminated.

Embodiment 8 FIG. 8 and 9 show a configuration of a main part of an ink jet printer according to an eighth embodiment of the present invention. FIG. 8 is a front view, and FIG. 9 is a top view. 8, reference numeral 81 denotes a nozzle head in which four nozzles 11 are integrated. Each nozzle 12 is formed on the same substrate at equal intervals. Each nozzle 12
Independently, the ink reservoir 13 and the piezoelectric element 14 are mounted. Each ink reservoir 13 is connected to an ink supply tube 82. Four piezoelectric elements 14
Can be driven independently. The nozzle head 81 is attached to a support rod 83 that is perpendicular to the printing surface.
Is attached so as to pass through the center of the nozzle 12 at the end. By using the nozzle head 81 configured as described above, four points can be printed simultaneously as shown in FIG.

As shown by the arrow 91 in FIG. 9A, the direction of movement of the nozzle head is
If the head 81 is moved vertically in the direction in which the four lines 17 are arranged, four lines 17 can be simultaneously printed at an interval equal to the interval d between the nozzles 12. Therefore, the present nozzle head 81
Is used, four times the throughput can be obtained as compared with the case of a head having one nozzle 12. Further, the present nozzle head is supported by a cylindrical support rod 83, and by rotating the support rod 83 about its rotation shaft 83a, as shown in FIG.
Pitch can be changed. At this time, the nozzle 12
Can fix the printing reference point if any one position of the plurality of nozzles coincides with the support rod rotation shaft 83a.

As described above, according to the present embodiment, a plurality of nozzles 12 of an ink-jet printer are arranged in a straight line at regular intervals so that a plurality of lines can be printed at the same time. Throughput can be improved. Further, if the line pitch is equal to or less than the nozzle interval d, it is possible to cope with electrode patterns having different line pitches by rotating the nozzle head 81.
Therefore, for example, the same type of address electrodes and mother electrodes can be printed by the same ink jet printer. In addition, it is possible to cope with printing of another model having a different pitch.

In the present embodiment, the number of nozzles has been described as four, but any number of nozzles may be arranged in a straight line as long as the number is two or more.

[0055]

As described above, according to the first method of the present invention, the step of roughening the surface of the substrate and the steps of forming electrodes, color filters, black matrices or phosphors on the roughened substrate by an ink jet printer. Since the method includes a printing step and a step of removing an organic component contained in the printed electrode, color filter, black matrix, or phosphor ink by baking, the ink printed by the inkjet printer is held on the unevenness of the substrate surface. In addition, it is possible to prevent the flow of ink and obtain a highly accurate pattern shape, and at the same time, to use the ink only in the necessary parts, thereby reducing the material required in the process and reducing the production cost. .

According to the second method of the present invention, a step of forming an ink absorbing layer made of an organic material on a substrate,
The step of printing an electrode, a color filter, a black matrix or a phosphor by an ink jet printer on the substrate on which the ink absorption layer is formed, and the printed electrode, the color filter, an organic component contained in the black matrix or the phosphor ink and Removing the ink absorbing layer by baking, so that the ink printed by the ink is held in the ink absorbing layer, thereby preventing the flow of the ink and obtaining a highly accurate pattern shape, and at the same time, the ink is necessary. Since it is used only for the essential parts, the materials required in the process can be saved and the production cost can be reduced. If the thickness of the absorbing layer is further increased, a printed pattern having a large thickness can be obtained.

According to the third method of the present invention, a step of printing an electrode, a color filter, a black matrix or a phosphor by an ink jet printer while heating the substrate to 50 to 200 ° C .; Removing the organic components contained in the color filter, black matrix or phosphor ink by baking, by instantaneously drying the solvent contained in the ink attached to the substrate, At the same time, the flow is prevented and a highly accurate pattern shape can be obtained, and at the same time, the ink is used only in the necessary parts.

According to the fourth method of the present invention, a step of forming a pattern by a photoresist on a substrate;
An electrode, a color filter, a step of printing a black matrix or a phosphor by an ink jet printer on a portion where the photoresist is removed, a step of removing a pattern of the photoresist, and a step of removing the printed electrode, the color filter, the black matrix or the phosphor. Removing the organic components contained in the ink by baking,
Since the pattern shape printed by the ink jet printer is determined by the pattern shape of the photoresist, it is possible to obtain a highly accurate pattern shape, and also to prevent the flow of ink by the photoresist and obtain a thick print film. There is. Further, since the ink is used only for the necessary parts, there is an effect that the material required in the process can be reduced and the production cost can be reduced.

Further, according to the fifth method of the present invention, a step of printing an electrode, a color filter, a black matrix or a phosphor larger than a desired pattern on a substrate with an ink containing a photosensitive resin by an ink jet printer; A step of exposing and developing the printed electrodes, color filters, black matrices or phosphors to remove necessary portions, and an organic substance contained in the printed electrodes, color filters, black matrices or phosphor inks And removing the components by baking, so that the pattern shape printed by the inkjet printer is determined by subsequent photoengraving, so that a highly accurate pattern shape equivalent to the pattern forming method using a photosensitive paste can be obtained. . Further, since the ink containing the photosensitive resin is not printed on the entire surface, the material can be saved as compared with the conventional method using a photosensitive thick film material.

According to the sixth method of the present invention, a step of forming a resist for determining an etching pattern on the substrate, a step of forming a concave portion by etching on the substrate on which the resist is formed, Since the method includes a step of printing an electrode, a color filter, a black matrix or a phosphor by an ink jet printer, and a step of firing and removing organic components contained in the printed electrode, color filter, black matrix or phosphor ink. Since the recesses are filled with ink, it is possible to prevent the flow of ink, obtain a highly accurate pattern shape, and form a pattern having a large thickness. Further, since the print pattern is formed in the recess formed by engraving the substrate, the surface of the substrate after printing can be smoothed. Further, since printing is performed only where necessary, the amount of ink material can be reduced.

Further, according to the seventh method of the present invention, a step of forming a black anti-reflection layer made of an inorganic material on a glass substrate, and determining an etching pattern on the glass substrate on which the anti-reflection layer is formed Forming a resist, etching the glass substrate on which the resist is formed to form a concave portion, printing an address electrode in the concave portion with an inkjet printer, and applying ink to the printed electrode ink. The process of removing contained organic components by baking, so that the flow of ink is prevented by the barrier ribs, a highly accurate pattern shape is obtained, and printing is performed only where necessary, so that only ink material can be saved. In addition, the material cost of the material forming the barrier ribs can be reduced, and the address electrodes and the barrier ribs can be reduced. There is an effect that it is possible to eliminate the positional deviation.

According to the first configuration of the present invention, there is provided an ink jet printer for printing ink on a substrate by ejecting ink from nozzles provided on a head, comprising: a heating device for heating the substrate to 50 to 200 ° C. Means for cooling the nozzle head is provided, so that by keeping the substrate at a high temperature and instantaneously drying the solvent contained in the ink attached to the substrate, it is possible to prevent the flow of ink on the surface of the substrate and to improve the accuracy. A high print pattern shape can be obtained. Further, there is an effect that the temperature rise of the nozzle head due to the radiant heat from the substrate is prevented, and the ink inside the nozzle head is prevented from drying.

According to the second configuration of the present invention, a head having a plurality of nozzles arranged in a straight line at fixed intervals, and rotating the head around a rotation axis perpendicular to the printing surface. Since the printing speed is increased, patterns having different pitches can be manufactured with the same nozzle head.

[Brief description of the drawings]

FIG. 1 is a cross-sectional configuration diagram illustrating a method and an apparatus for manufacturing a plasma display panel using an inkjet printer according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional configuration diagram illustrating a method and an apparatus for manufacturing a plasma display panel using an inkjet printer according to a second embodiment of the present invention.

FIG. 3 is a cross-sectional configuration diagram illustrating a method and an apparatus for manufacturing a plasma display panel using an inkjet printer according to a third embodiment of the present invention.

FIG. 4 is a diagram illustrating a method for manufacturing a plasma display panel using an inkjet printer according to a fourth embodiment of the present invention.

FIG. 5 is a diagram illustrating a method for manufacturing a plasma display panel using an inkjet printer according to a fifth embodiment of the present invention.

FIG. 6 is a diagram illustrating a method for manufacturing a plasma display panel using an inkjet printer according to a sixth embodiment of the present invention.

FIG. 7 is a diagram illustrating a method for manufacturing a plasma display panel using an inkjet printer according to a seventh embodiment of the present invention.

FIG. 8 is a front view showing a configuration of a nozzle head of an ink jet printer according to an eighth embodiment of the present invention.

FIG. 9 is a diagram illustrating an operation of an ink jet printer according to an eighth embodiment of the present invention.

FIG. 10 is a diagram illustrating a conventional method for manufacturing a plasma display panel using a photosensitive paste.

FIG. 11 is a view for explaining a method of manufacturing a plasma display panel by screen printing, which is different from the conventional method shown in FIG.

[Explanation of symbols]

11 Nozzle head of inkjet printer, 12
Nozzles of inkjet printer, 13 ink reservoir of nozzle head of inkjet printer, 14 piezoelectric elements of nozzle head of inkjet printer, 15 droplets of ink, 16 glass substrate, 17 electrode pattern, 18
Surface of glass substrate, 21 ink absorbing layer, 31 hot plate, 32 metal plate for cooling, 41 resist pattern, 42 resist removed portion, 43 transparent electrode, 51 photomask substrate, 52 ultraviolet light, 53 light shielding emulsion pattern, 61 substrate , A mask pattern, 63 a sandblast abrasive, 71 a glass containing a black pigment, 72 a resist pattern, 73
Sandblasting abrasive, 74 address electrode pattern,
75 barrier rib, 76 white dielectric, 81 ink jet nozzle head, 82 ink supply tube, 8
3 support rod, 83a rotation axis, 91 nozzle head moving direction, 101 photosensitive electrode thick film, 111 screen plate, 112 squeegee.

 ────────────────────────────────────────────────── ─── Continued on front page (72) Inventor Kazuya Kawabe 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation

Claims (9)

[Claims] A step of roughening the surface of the substrate; a step of printing an electrode, a color filter, a black matrix or a fluorescent substance on the roughened substrate by an inkjet printer; Removing the organic component contained in the phosphor ink by baking. 2. A step of forming an ink absorbing layer made of an organic material on a substrate, and a step of printing an electrode, a color filter, a black matrix or a phosphor by an ink jet printer on the substrate on which the ink absorbing layer is formed,
Removing the organic components contained in the printed electrode, color filter, black matrix or phosphor ink and the ink absorbing layer by firing. 3. While heating the substrate to 50 to 200 ° C.,
Electrodes, color filters,
A method of manufacturing a plasma display panel, comprising: printing a black matrix or a phosphor; and removing an organic component contained in the printed electrode, color filter, black matrix or phosphor ink by baking. Method. 4. A step of forming a pattern with a photoresist on a substrate, a step of printing an electrode, a color filter, a black matrix or a phosphor on an area where the photoresist is removed by an ink jet printer, and removing the pattern of the photoresist. And a step of removing organic components contained in the printed electrode, color filter, black matrix or phosphor ink by baking. 5. A step of printing an electrode, a color filter, a black matrix or a phosphor larger than a desired pattern on a substrate with an ink containing a photosensitive resin by an ink jet printer, and printing the printed electrode, the color filter, the black matrix or Exposing and developing the phosphor to remove necessary portions, and removing an organic component contained in the printed electrode, color filter, black matrix or phosphor ink by firing. A method for manufacturing a plasma display panel, comprising: 6. A step of forming a resist for determining an etching pattern on a substrate, a step of forming a concave portion by etching on the substrate on which the resist is formed, and an electrode, a color filter, and a black matrix in the concave portion by an inkjet printer. Alternatively, a method of manufacturing a plasma display panel, comprising: printing a phosphor; and removing an organic component contained in the printed electrode, color filter, black matrix, or phosphor ink by baking. 7. A step of forming a black antireflection layer made of an inorganic material on a glass substrate, a step of forming a resist for determining an etching pattern on the glass substrate on which the antireflection layer is formed, Forming a recess by etching the glass substrate on which is formed, forming an address electrode by an inkjet printer in the recess, and removing an organic component contained in the ink of the printed electrode by firing. A method for manufacturing a plasma display panel, comprising: 8. An ink jet printer apparatus for printing on a substrate by ejecting ink from nozzles provided on a head, comprising: a heating device for heating the substrate to 50 to 200 ° C .; and means for cooling the nozzle head. An ink jet printer device, characterized in that: 9. A head comprising a plurality of nozzles arranged in a straight line at fixed intervals, and means for rotating the head about an axis of rotation perpendicular to a printing surface. Ink jet printer device.