JPH11270978A - Temperature-adjusting material utilizing latent heat - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve an energy efficiency and disperse energy consumption by providing an accommodation body for accommodating a microcapsule including a heat-storing material with a specific range of melt point. SOLUTION: A microcapsule 2 including a heat-storing material is filled into a casing 1 without any gap. Then, a Peltier element 3 is provided at the central upper side of the casing 1 while the cooling side is at a lower surface. A heat-storing material being included in the microcapsule 2 should have a melt point ranging from -5 to 72 deg.C. A temperature-adjusting material utilizing latent heat fully achieves a temperature adjustment function due to melting caused by temperature increase while it is coagulated and left due to cooling by the Peltier element 3 of the heat-storing material in the microcapsule 2. Then, by controlling the Peltier element 3 so that it can be activated every time the heat-storing material absorbs heat energy and reaches a specific temperature, the temperature adjustment function is continuously and fully achieved and at the same time the continuous usage of energy is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a latent heat utilizing temperature control material which exhibits a temperature control function by absorbing heat energy or releasing stored heat energy.

[0002]

2. Description of the Related Art Various types of air conditioners have been used for business use, general home use such as concrete buildings and wooden buildings such as buildings and condominiums, and the like. For example, in the case of a cooling device, air cooling and dehumidification are performed, and low-temperature air is discharged to lower the room temperature to a predetermined temperature. For this reason, the electric power consumption becomes maximum from 2:00 pm to 3:00 pm when the temperature is highest. Therefore, the power company must set the power generation capacity on the assumption of this, and the power generation capacity is wasted. For this reason, it is required to improve the efficiency of the cooling and heating equipment and to save power.

[0003] In order to improve the efficiency in such cooling and heating, a heat insulating material such as a fibrous material, a porous material, and a powdery material is used. These heat insulating materials utilize the thermal resistance of an air layer of the heat insulating material, and are typically made of glass wool as a fibrous material, polystyrene foam as a porous material, and calcium silicate as a powdery material. It is.

[0004] However, although the heat insulating material suppresses the diffusion of thermal energy to the outside, it does not emit or absorb heat by itself, so that a sufficient temperature control effect cannot be obtained.

Therefore, it is conceivable that a heat storage microcapsule utilizing latent heat is mixed or carried in each heat insulating material to obtain a heat insulating effect and a temperature change suppressing effect. It is difficult to mix them, and they can be loaded, but they cannot be loaded in large amounts, so that a sufficient effect cannot be expected. In addition, microcapsules can be mixed and supported on the porous material, but cannot be supported in a large amount, so that a sufficient effect cannot be expected. In this respect, a large amount of microcapsules can be mixed into the powdery material, and a great effect can be expected.Moreover, it is mixed with calcium silicate, gypsum, etc., water-mixed, and formed into a complex shape as a heat storage heat insulating material. It also has the advantage that it can be molded. However, there arises a problem that the heat insulating property is greatly reduced.

[0006] By the way, conventional heating and cooling appliances are:
Basically, since air is discharged at a temperature higher or lower than the temperature of the outside air, an air flow is generated. In particular, there is a problem that the body is too cold during cooling, and some people are harmed to their health. There is also a problem that a large amount of energy is required to cool or heat the entire air in the room. In recent years, power consumption has been reduced by warming the indoor components, such as floor heating systems, more than in the case of heating air. There is a problem that it is not satisfactory and is not suitable for cooling. Further, the above-mentioned problem of the time concentration of the cooling cannot be solved.

The present invention has been made based on the above-mentioned problem, and has as its object to provide a latent heat utilizing temperature control material having good energy efficiency and capable of dispersing energy consumption.

[0008]

According to a first aspect of the present invention, there is provided a temperature control material utilizing latent heat, comprising: a microcapsule containing a heat storage material having a melting point of -5 to 72 ° C; and a housing for housing the microcapsule. , A heating element or a cooling element of the microcapsule. For this reason, the heat storage material in the microcapsules is melted or solidified by absorbing or releasing the heat energy by causing the heating element to generate heat or cooling by the cooling element, and by leaving the heat storage material as it is, the heat storage material is Conversely, it can exhibit a temperature control function by releasing or absorbing thermal energy by solidifying or melting. At this time, the heating element or the cooling element is activated or heated and cooled each time when the heat storage material emits or absorbs the heat energy and becomes equal to or lower than a predetermined temperature, thereby continuously using the energy. Can be prevented, and the power consumption can be prevented from increasing at one time. Further, since the heat storage material exhibiting such a function is directly filled in the storage body as microcapsules, the filling rate can be increased, and the effect of the above-described temperature control function is enhanced.

A latent heat utilizing temperature control material according to a second aspect of the present invention is a foam body impregnated with a heat storage material having a melting point of -5 to 72 ° C, a housing body for housing the foam body, and a heating element for the foam body. Or a cooling body. For this reason, the heat storage material in the foam is melted or solidified by absorbing or releasing the heat energy by causing the heating element to generate heat or cooling by the cooling body, and by leaving the heat storage material as it is, the heat storage material is Conversely, it can exhibit a temperature control function by releasing or absorbing thermal energy by solidifying or melting.

The latent heat utilizing temperature control material according to a third aspect of the present invention is such that one side of the housing is used as a temperature control surface and a heat insulating material is provided on the other side. Therefore, the temperature of the heat storage material is efficiently transmitted to one side, so that the temperature control function is further improved.

Further, in the latent heat utilization temperature control material according to claim 4, the latent heat utilization temperature control material is a building material,
The heat storage material of the microcapsule has a melting point in the range of 20 to 25C and has a cooling body. Therefore, the microcapsules are cooled by the cooling body to solidify the heat storage material. Thereafter, the cooling is stopped and the temperature is lowered to 20 to 25 ° C.
, The heat of fusion is absorbed as the heat storage material melts, so that a rise in temperature can be suppressed. Then, when the temperature of the heat storage material becomes equal to or higher than the predetermined temperature, the heat storage material may be cooled again by the cooling body. This continuation enables efficient cooling.

Further, the latent heat utilizing temperature control material according to the fifth aspect is obtained by mixing a plurality of types of microcapsules containing heat storage materials having different melting points in the housing.
Therefore, if the storage body is cooled below the melting point of the heat storage material having the lowest melting point, all the heat storage material to be filled in the storage body solidifies,
Until the heat storage material having the lowest melting point is completely melted, the rise in room temperature can be continuously suppressed, and the cooling capacity can be further increased. In addition, if the temperature of the housing is controlled in accordance with the melting point of each heat storage material, it is possible to adjust the temperature of the room temperature stepwise according to the melting point of each heat storage material.

In the temperature control material utilizing latent heat according to the sixth aspect of the present invention, since the cooling body is constituted by a Peltier element, the cooling body can be reduced in size and weight, and heat can be stored by switching current to the Peltier element. The material can be cooled and heated, and its temperature can be easily controlled.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a first temperature control material of the present invention is described.
An embodiment of a building panel for ceiling will be described with reference to FIGS. 1 and 2. In FIG. 1, reference numeral 1 denotes, for example, a length of 60 cm made of an aluminum alloy or the like serving as a housing,
The casing 1 is a thin box-shaped casing having a width of 45 cm and a thickness of about 8 mm. The casing 1 is filled with microcapsules 2 containing a heat storage material without gaps. Also,
A Peltier element 3 is provided at the upper center of the casing 1 with the cooling side as the lower surface.
It is configured to act as a cooling body for
The Peltier element 3 is connected to a DC power supply (not shown), and the DC power supply is controlled by a control mechanism connected to a temperature detecting means (not shown) embedded in the microcapsule 2, and supplies a current at a predetermined temperature. It is controlled to turn on and off. A heat insulating material 4 such as polystyrene foam is disposed above the casing 1. Reference numeral 5 denotes a heat radiating hole for releasing heat from the Peltier element 3.

In the above-mentioned temperature control material, as the heat storage material used for the microcapsule 2, for example,
n-pentadecane (melting point about 9-10 ° C.), n-heptadecane (melting point about 21-24 ° C.), stearic acid (melting point about 7 ° C.)
Organic heat storage materials such as 2 ° C.) and paraffin wax (the melting point varies depending on the number of carbon atoms) can be used. Such an organic heat storage material can have a desired melting point by appropriately changing the number of carbon atoms, substituents, and the like, so that the melting point can be appropriately set according to the intended use, location, and the like. it can. In particular, in this embodiment, n-heptadecane (melting point: about 21 to 24 ° C.) is used.

A microcapsule 2 can be obtained by forming a skin layer on such an organic heat storage material.
The resin or wax for forming the skin layer is not particularly limited, and polystyrene, methyl methacrylate polymer, urea, gelatin, or the like can be used. As shown in FIG. 2, the microcapsule 2 has a structure in which a skin layer 12 made of resin is formed on the surface of n-heptadecane 11, which is an organic heat storage material.

The microcapsules 2 as described above can be manufactured by a conventional method. For example, in the case of the microcapsules 2 as shown in FIG. 2, n-heptadecane 11 is contained in a solution containing a resin for forming the skin layer 12. If necessary, a filler such as silicon carbide is charged and mixed and stirred, whereby a skin layer 12 made of resin is formed in a thin film on the particle surfaces of the n-heptadecane 11, and can be microencapsulated. At this time, by forming a crosslinked structure in the skin layer 12, the strength of the skin layer 12 can be improved.

As such a microcapsule 2, 5
It is preferable to use those having an average particle size of from 500 to 500 μm.
When the average particle size of the microcapsules 2 is less than 5 μm,
Not only is production difficult, but also the proportion of the skin layer 12 to the amount of n-heptadecane 11 in the microcapsules 2 increases, and the amount of n-heptadecane 11 per unit volume of the microcapsules 2 decreases. The amount of heat stored is reduced.

The operation of the above configuration will be described. Such a temperature control material can be suitably used for cooling by forming an interior material of a building, particularly a ceiling surface. That is, for example, the microcapsule 2
When the temperature is 25 ° C. or lower, no current flows through the Peltier element 3, but when the temperature exceeds 25 ° C., the DC power supply is controlled so as to energize. By cooling, the microcapsules 2 are cooled, and when the temperature becomes lower than the melting point of n-heptadecane 11, which is an organic heat storage material, the n-heptadecane 11 solidifies. At this time, heat of solidification is released from the n-heptadecane 11. Then, when the temperature of the microcapsule 2 becomes equal to or lower than a predetermined temperature, for example, 20 ° C. or lower, the current supply to the Peltier element 3 is stopped to stop cooling. Then, the room temperature, which is the melting point of n-heptadecane 11, is 21 to 24.
When the temperature reaches ° C., the heat of fusion is taken away from nearby air or the like as it melts, so that the rise in room temperature can be suppressed until the n-heptadecane 11 is completely melted. Then, when the n-heptadecane 11 is completely dissolved and the temperature further rises and the temperature of the microcapsule 2 exceeds 25 ° C., a current is again applied to the Peltier element 3 and the above-described operation is repeated to cool the indoor air conditioner. Can function as As described above, according to the building panel for ceiling according to the first embodiment of the present invention, it is only necessary to apply a current periodically or systematically, so that power consumption can be reduced.
Also, even if the temperature drops naturally, such as at night,
Similarly, since the microcapsules 2 are cooled, it is not necessary to cool the microcapsules 2 in the initial stage after such natural cooling, so that the energy efficiency is also improved in this respect. Moreover, unlike a normal cooling device, the cooling is not performed by discharging low-temperature air, but by cooling the ceiling surface, the entire room is cooled by cooling body radiation from the ceiling surface. It becomes about 22 ° C near the surface, and the temperature gradually rises toward the floor and rises to about 26 ° C about 1.5m above the floor, so the lower body does not cool down or excessively deprive of body temperature, It is also excellent in terms of health. In addition, an organic heat storage material such as n-heptadecane solidifies or melts and changes its volume greatly, or absorbs moisture to show deliquescence. Since n-heptadecane 11, which is a heat storage material, is used as the microcapsules 2, such a state change does not occur, and the handleability is good. The microcapsules 2 make it possible to obtain n-heptadecane 11
It is considered that the loss is large in terms of calorific value because the absolute amount of is reduced, but this loss can be compensated for by improving the filling rate by using the microcapsules 2.

If the temperature of the microcapsule 2 is too low as compared with the room temperature, dew condensation occurs on the microcapsule 2 and the casing 1 and the heat insulating property is significantly reduced. It is desirable to use together. That is, although the comfortable summer room temperature is about 26 to 28 ° C. and the relative humidity is about 50 to 60%, in order for the room to meet this condition, the temperature is lowered while dehumidifying the air conditioner at the start, and then the Peltier device 3 is turned on. It is desirable to operate. This is because in summer, for example, the dew point is about 31 ° C. at a room temperature of 35 ° C. and a relative humidity of 80%, and when the microcapsules 2 are rapidly cooled by the Peltier element 3 under these conditions, dew condensation occurs on the indoor side of the casing 1. Therefore,
At first, the indoor humidity is adjusted with an air conditioner or a dehumidifier or a dehumidifier until the relative humidity becomes 50 to 60%. When adjusting the indoor humidity with an air conditioner, the relative humidity should be 50-60%.
After that, only the air needs to be blown. Then, when the humidity is high, when the number of persons in the room increases, or when the amount of generated steam increases, the air conditioner may be operated auxiliary to perform an excessive rise in room temperature and dehumidification.

The ceiling building of the first embodiment as described above.
The following are the theoretical effects of applying
Is obtained. In other words, high air
Daytime during continuous operation, assuming a dense and highly insulated room between 8 tatami mats
Average cooling load of 60 kcal / m^TwoThen 8
The floor area between the tatami mats is 13.0m^Two(3.6m × 3.6m)
Yes, the cooling capacity required for this cooling is 60 kca
l / m^Two× 13.0m ^Two= 780 kcal. here
And the core substance of the microcapsule 2 is n-heptadecane
Then, the latent heat is 49.3 kcal / kg,
Ratio of n-heptadecane in black capsule 2
Is assumed to be 0.455, the microcapsule 2 itself
The latent heat was 49.3 kcal / kg × 0.455 = 22.
It becomes 4 kcal / kg. Therefore, it cools between 8 tatami mats
780 kcal ÷ 22.4 kcal / kg = 3
4.8 kg of microcapsules are required. I mentioned earlier
As described above, the building panel of this embodiment has a length of 60 cm and a width of 4 cm.
It is 5cm, so if this panel is installed all over the ceiling
In this case, 48 sheets are required, so
The amount of the capsule 2 is 34.8 kg / h ÷ 48 = 0.72
5 kg, and the specific gravity of the microcapsule 2 itself is 360
kg / m^ThreeThen, 0.725kg ÷ 360kg / m
^Three= 2.01 × 10^-3m^ThreeBecomes The area of the panel is
0.45m × 0.6m = 0.27m^TwoTherefore, 2.
01 × 10^-3m^Three÷ 0.27m2 = 7.44 × 10^-3m
Becomes Therefore, if the melting time is one hour,
In this example, the internal dimensions of the head need only be 7.5 mm.
Here, the thickness of the casing 1 was 8 mm. In addition,
The amount of heat (latent heat) of one panel of the present embodiment is 22.
4 kcal / kg × 0.725 kg / h = 16.2 kc
al / h, 583 for 36 panels between 6 tatami mats
kcal / h, 780 kca with 48 panels between 8 tatami mats
1 / h, 972kcal / with 10 panels between 10 tatami mats
It is 1166 kcal / h between h and 12 tatami mats.

As described in detail above, the temperature control material utilizing latent heat of the first embodiment is a building panel for ceiling functioning as a cooling system, and includes a microcapsule 2 containing n-heptadecane 11 and a microcapsule 2. And a Peltier element 3 for cooling the microcapsule 2. By cooling with the Peltier element 3, the n-heptadecane 11 in the microcapsule 2 is solidified and heat energy is reduced. When the temperature is higher than the melting point of n-heptadecane 11, the heat energy is absorbed as the n-heptadecane 11 in the microcapsule 2 is melted, so that the temperature control function is exhibited. . At this time, the n-heptadecane 11 absorbs the heat energy of the Peltier element 3,
When the temperature of the microcapsule 2 becomes equal to or higher than a predetermined temperature, the microcapsule 2 is controlled to be activated each time, so that the temperature control function can be continuously exhibited, but the energy is not continuously used. It is possible to prevent the consumption from rising at one time. In addition, since the microcapsules 2 exhibiting such a function are directly filled in the casing 1, the filling rate with respect to the volume of the casing 1 can be increased, so that the above-described effect of the temperature control function is enhanced. .

Particularly, in the present embodiment, the lower surface side of the casing 1 is a temperature control surface because the temperature control material using latent heat constitutes the ceiling, and the heat insulating material 4 is disposed on the upper side surface. Since the cooling to the upper side surface by the capsule 2 is small, the cooling efficiency is further improved. Moreover, since the surface area of the ceiling increases in proportion to the size of the room, the radiant heat from the ceiling also increases,
Cooling efficiency also improves.

Furthermore, n-heptadecane is about 21 to 2
Since it has a melting point in the temperature range of 4 ° C, it is suitable for cooling. Moreover, since it has a melting point of 21 to 24 ° C, the ceiling surface temperature in winter or the like is about 22 ° C, so it must be heated to a higher temperature. For example, not only does the heating efficiency not decrease, but also at lower temperatures, it can function as a heat insulating material.

Further, by using the Peltier element 3 as a cooling body of the microcapsule 2, the cooling body can be reduced in size and weight, and cooling and heating of the microcapsule 2 can be performed by switching the current to the Peltier element 3. Also, the temperature of the microcapsules 2 can be easily controlled. Further, since no refrigerant is used, the structure can be simplified, and piping for the refrigerant is not required, so that maintenance and management are easy.

Next, a packaging material will be described as a second embodiment of the present invention. This wrapping material has basically the same configuration as that of the first embodiment except that the casing 1 is made of plastic, thin foil, fiber, paper or the like having flexibility. The thing itself works. This packaged object, such as a food, dislikes high temperature and is cooled to low temperature in advance. The casing is further covered with a polystyrene sheet as a heat insulating material.

The operation of the above configuration will be described. The article to be packaged is covered with a casing made of vinyl chloride as the packaging material, and then covered with a polystyrene sheet.
Then, since this package is pre-cooled,
When the microcapsules 2 are cooled by the object to be packaged and the temperature thereof becomes lower than the melting point of n-heptadecane, the n-heptadecane solidifies. If this state is maintained for a long period of time, such as during transportation, the temperature is firstly suppressed because the sheet is covered with a polystyrene sheet. When the temperature further rises to 21 to 24 ° C., which is the melting point of n-heptadecane, the temperature of the packaged product does not increase any more until these are completely dissolved because heat of fusion is taken away with the melting. I have.

As in the present embodiment, the casing 1 may have flexibility, and it is not necessary to provide a special heating and cooling element as in the first embodiment. When used as a package as in the embodiment, the object to be packaged may be a heating element or a cooling element.

FIG. 3 shows a third embodiment of the present invention.
This will be described with reference to FIG. In FIG. 3, reference numeral 21 denotes a bag as a storage body made of polyethylene or the like and having a length of, for example, about 24 cm and a width of about 24 cm. The bag 21 has heat seal portions 22 formed at intervals of 5 mm. A microcapsule 23 containing n-heptadecane as an organic heat storage material is filled between the seal portions 22. The bag body 21 functions as clothing, and in such a bag body 21, a human body functions as a heating element.

The operation of the above configuration will be described. Clothing is made with this bag body 21 and worn by a person.
Then, since this bag body 21 is warmed by the human body,
When the microcapsules 23 are heated and the temperature becomes higher than the melting point of n-heptadecane, the n-heptadecane melts. Then, in this state, the temperature decreases due to the outside air and the like, and when the melting point of n-heptadecane reaches 21 to 24 ° C., as the n-heptadecane starts to solidify, the solidification of the human body is completed until the solidification heat is generated. The temperature does not drop. In this case, it is more effective to further wear clothing as a heat insulating material outside the clothing by the bag body 21.

Although the latent heat utilizing temperature control material of the present invention has been described above, the present invention is not limited to this, and various modifications can be made without departing from the spirit of the present invention. For example, in each of the above embodiments, n
Although the case of heptadecane has been described as an example, other organic heat storage materials can be used depending on the application, and not only the organic heat storage material but also an inorganic heat storage material may be used. Further, in the case of heating, the operation may be performed in a manner opposite to that described above. For example, when the casing is made of a hard material as in the first embodiment, the casing may be used for heating a floor surface or an interior material other than being disposed on a ceiling for cooling, and furthermore, may be used for a roof. In addition to being applicable to flooring materials, etc., if its scale is reduced, it can be applied to heat storage, cold storage, heat insulation car, cold storage car, car lining and ceiling, cups, glasses and their holders, etc. It is possible. In the case where the casing has flexibility as in the second and third embodiments, in addition to clothing such as a packaging material, heat-resistant clothing, and winter clothing, bedding, a hot compress, a cold compress, and an antifreeze material. And the like, and a heating element or a cooling element that uses electricity or the like as an energy source may be provided as necessary. In the first embodiment, the microcapsules are cooled by using the Peltier element 3. However, the cooling means is not limited to this, and other means such as cooling water may be used. In the first embodiment, the heat storage material n-heptadecane 11 is microencapsulated. However, when not used as a heat insulating material, as shown in FIG. 4, the heat storage material n-heptadecane 11 is used. May be directly impregnated into a foam 30 such as a sponge, and the foam 30 may be stored in the casing 1. If the foam 30 is impregnated with the n-heptadecane 11 without microencapsulation, the manufacturing process can be simplified. Also, n-heptadecane 11 as a heat storage material
When solidifies or melts, the volume changes,
By impregnating the foam 30 such as a sponge with n-heptadecane 11, the state change of the n-heptadecane 11
30 can be absorbed and handling is easy.

In the first embodiment, the casing 1 is filled with microcapsules containing n-heptadecane 11 having a melting point of about 21 to 24 ° C. as a heat storage material. In areas where dew condensation does not need to be considered, the melting point is low, for example, about 9-1.
It is also possible to use n-pentadecane at 0 ° C. as a heat storage material. By using such a heat storage material having a low melting point, the cooling capacity can be further increased. Further, as in the fourth embodiment of the present invention shown in FIG. 5, a plurality of types of microcapsules containing heat storage materials having different melting points can be mixed in the casing 1. For example, the melting point is about 9 to 10 ° C. A microcapsule 2A containing n-hexadecane having a melting point of about 16 to 19 ° C, and a microcapsule 2C containing n-heptadecane having a melting point of about 21 to 24 ° C. If the casing 1 is cooled so as to have a temperature equal to or lower than the melting point of n-pentadecane having the lowest melting point, all the microcapsules 2A to 2C to be filled in the casing 1 are filled.
The heat storage material inside solidifies. Therefore, the room temperature is 24 ° C. or higher,
That is, the microcapsule 2C having the highest melting point
When the temperature is higher than the melting point of n-heptadecane (21 to 24 ° C.), all the heat storage materials in each of the microcapsules 2A to 2C are melted, and n-heptadecane having the highest melting point (melting point: about 21 to 24 ° C.) Can be continuously suppressed until completely melted, so that the cooling capacity can be further increased. Furthermore, each microcapsule 2
If the casing 1 is cooled substantially corresponding to the melting point of the heat storage material in A to 2C, the temperature can be adjusted according to the melting point of the heat storage material in each of the microcapsules 2A to 2C. That is,
When it is desired to perform strong cooling, if the casing 1 is cooled below the melting point of n-pentadecane having the lowest melting point, all the heat storage materials in the microcapsules 2A to 2C in the casing 1 are solidified as described above, and n-pentadecane having the lowest melting point is used. Until pentadecane (melting point about 9 to 10 ° C.) is completely melted, the rise in room temperature can be suppressed continuously, which is convenient for rapidly cooling a room. If it is desired to perform medium cooling, if the casing 1 is cooled in correspondence with n-hexadecane having an intermediate melting point, the heat storage material in each of the microcapsules 2B and 2C solidifies and n-hexadecane having a melting point of about 16 to 19 ° C. Can be continuously suppressed from rising until room temperature is completely melted. Furthermore, if the casing 1 is cooled in the range of 19 ° C. to 21 ° C. corresponding to the melting point of n-heptadecane having the highest melting point, only n-heptadecane will solidify,
It is convenient to make it cold. As described above, the plurality of microcapsules 2A to 2C containing the heat storage materials having different melting points are mixed and filled in the case 1, so that the room temperature of the room is changed according to the melting point of the heat storage materials contained in the microcapsules 2A to 2C. Can be controlled step by step. If a plurality of microcapsules 2A to 2C containing heat storage materials having different melting points are mixed and filled in the case 1 as described above, when used for heating, the room temperature decreases even when the heat source is stopped, The heat storage material having the higher melting point is sequentially solidified and the heat of solidification is released. The temperature of the room can be suppressed from decreasing until the n-pentadecane having the lowest melting point solidifies, and the heating efficiency is good.

[0033]

The present invention will be described in more detail with reference to the following specific examples. Example 1 As shown in FIG. 6, a styrene foam box 31 of 30 cm × 30 cm × 30 cm (inner dimensions 24 cm × 24 cm ×
23 cm × 23 filled with 214 g of microcapsules containing n-heptadecane on the inner ceiling surface of 24 cm)
A vinyl chloride casing 32 having a thickness of 12 cm and a thickness of 12 mm was attached, and this was used as a ceiling panel. After the ceiling panel is cooled to 10 ° C., the air in the box 31 is circulated while the center O of the box when left in an environment with an outside air temperature of 40 ° C.
And the temperature at the ceiling panel P was measured every 10 minutes.
Table 1 shows the results.

[0034]

[Table 1]

Table 2 also shows the results of the measurement of the temperature change when left at an outside air temperature of 30 ° C. in the same manner.

[0036]

[Table 2]

As is clear from Tables 1 and 2, the provision of the ceiling panel, which is the latent heat utilizing temperature control material of the present invention, makes it possible to obtain a temperature of 5 ° C. for about 30 minutes or more even under severe conditions at an outside air temperature of 40 ° C. It can be seen that the inside of the box 31 can be maintained at a lower temperature, and that the temperature inside the box can be maintained at 28 ° C. or lower for one hour at an outside air temperature of 30 ° C. Accordingly, it was confirmed that the cooling effect in the room can be obtained by cooling the ceiling panel 32 at intervals of 30 minutes or 60 minutes without continuously cooling the ceiling panel 32. Example 2 As shown in FIG. 7, 12 g of 23 cm × 23 cm filled with 214 g of microcapsules containing n-heptadecane.
An electric heater 42 is arranged on the lower surface of a vinyl chloride casing 41 having a thickness of 1 mm, covered with a polystyrene sheet 43 as a heat insulating material, cooled to 15 ° C., and then the lower surface of the pouch 51 is heated by the electric heater 42. Table 3 shows the results of measuring the temperature of the lower surface and the upper surface when heated to about 45 ° C. at intervals of 10 minutes.

[0038]

[Table 3]

As is clear from Table 3, the temperature on the lower surface side of the casing 41 quickly rose to near 45 ° C., but the temperature on the upper surface side was maintained at 20 ° C. or less for one hour or more. This indicates that the temperature control material using latent heat of the present invention has an excellent temperature control function, and that the indoor side can be cooled for a long time by using a heat insulating material in combination.

[0040]

According to the first aspect of the present invention, there is provided a temperature control material utilizing latent heat, comprising: a microcapsule containing a heat storage material having a melting point of -5 to 72 ° C; a housing for housing the microcapsule; Since it has a heating element or a cooling element, the heat storage material solidifies or melts and releases or absorbs thermal energy, thereby exhibiting a temperature control function. At this time, it is possible to prevent continuous use of energy and prevent an increase in power consumption at one time. Further, since the heat storage material exhibiting such a function is directly filled in the storage body as microcapsules, the filling rate can be increased, and the effect of the above-described temperature control function is enhanced.

The latent heat utilizing temperature control material according to claim 2 of the present invention comprises: a foam impregnated with a heat storage material having a melting point of -5 to 72 ° C;
Since it has a storage body for storing the foam and a heating or cooling body of the foam, the heat storage material solidifies or melts and releases or absorbs heat energy, thereby exhibiting a temperature control function. can do. Also,
By simply impregnating the foam with the heat storage material, the heat utilization temperature control material can be easily manufactured.

In the third aspect of the present invention, the temperature control material for latent heat uses one side of the storage body as a temperature control surface and a heat insulating material on the other side, so that the temperature of the heat storage material is reduced to one side. Because it is transmitted well, the temperature control function is further improved.

Further, the latent heat utilization temperature control material according to claim 4 is characterized in that the latent heat utilization temperature control material is a building material, the heat storage material of the microcapsules has a melting point in the range of 20 to 25 ° C. Since the heat storage material is melted, the heat of fusion is absorbed as the heat storage material melts, so that a rise in temperature can be suppressed. Then, when the temperature of the heat storage material becomes equal to or higher than the predetermined temperature, the heat storage material may be cooled again by the cooling body.

The latent heat utilizing temperature control material according to claim 5 is
A plurality of types of microcapsules containing heat storage materials having different melting points are mixed in the storage body, and the temperature can be adjusted stepwise in a temperature band corresponding to the melting point of each heat storage material.

Further, in the latent heat utilizing temperature control material according to claim 6, since the cooling body is a Peltier element,
The cooling body can be reduced in size and weight, and by switching the current to the Peltier element, the heat storage material can be cooled and heated, and its temperature can be easily controlled. Furthermore, since no refrigerant is used, the structure can be simplified, and piping for the refrigerant is not required, so that maintenance and management are easy.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view showing a building panel for ceiling which is a first embodiment of a heat storage material using latent heat according to the present invention.

FIG. 2 is a sectional view showing microcapsules constituting the building panel.

FIG. 3 is a schematic view showing a clothing material which is a third embodiment of the heat storage material utilizing latent heat according to the present invention.

FIG. 4 is a partially broken perspective view showing a modified example of the heat storage material utilizing latent heat of the present invention.

FIG. 5 is a partially cutaway perspective view showing a building panel for ceiling which is a fourth embodiment of the heat storage material using latent heat according to the present invention.

FIG. 6 is a schematic diagram illustrating a configuration of the first embodiment.

FIG. 7 is a schematic diagram illustrating a configuration of a second embodiment.

[Explanation of symbols]

 1, 32, 41 Casing (storage body) 2, 2A, 2B, 2C, 23 Microcapsule 3 Peltier element (cooling body) 4 Heat insulation material 11 n-Heptadecane (organic heat storage material) 43 Polystyrene sheet (heat insulation material) 21 Bag (housing) 22 Heat seal 30 Foam 31 Styrofoam box

Claims (6)

[Claims] 1. Latent heat comprising: a microcapsule containing a heat storage material having a melting point of -5 to 72 ° C .; a housing for housing the microcapsule; and a heating element or a cooling body for the microcapsule. Use temperature control material. 2. A latent heat comprising a foam impregnated with a heat storage material having a melting point of -5 to 72 ° C., a housing for housing the foam, and a heating or cooling body of the foam. Use temperature control material. 3. A temperature control material utilizing latent heat according to claim 1, wherein one side of said housing is a temperature control surface and a heat insulating material is provided on the other side. 4. The temperature control material utilizing latent heat is a building material, the heat storage material of the microcapsule has a melting point in the range of 20 to 25 ° C., and has a cooling body. The latent heat utilization temperature control material according to any one of the above. 5. The latent heat utilizing temperature control material according to claim 1, wherein a plurality of types of microcapsules containing heat storage materials having different melting points are mixed in said housing. . 6. The latent heat utilizing temperature control material according to claim 1, wherein the cooling body is a Peltier element.