JPH11269341A - Phenolic resin molding composition - Google Patents

Phenolic resin molding composition

Info

Publication number
JPH11269341A
JPH11269341A JP9067398A JP9067398A JPH11269341A JP H11269341 A JPH11269341 A JP H11269341A JP 9067398 A JP9067398 A JP 9067398A JP 9067398 A JP9067398 A JP 9067398A JP H11269341 A JPH11269341 A JP H11269341A
Authority
JP
Japan
Prior art keywords
phenolic resin
melamine
heat resistance
pts
molding material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9067398A
Other languages
Japanese (ja)
Other versions
JP3555835B2 (en
Inventor
Hidehiro Korogi
英裕 興梠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Yukizai Corp
Original Assignee
Asahi Organic Chemicals Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Organic Chemicals Industry Co Ltd filed Critical Asahi Organic Chemicals Industry Co Ltd
Priority to JP09067398A priority Critical patent/JP3555835B2/en
Publication of JPH11269341A publication Critical patent/JPH11269341A/en
Application granted granted Critical
Publication of JP3555835B2 publication Critical patent/JP3555835B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To obtain the subject composition useful for e.g. automotive transmission parts by combined use of melamine with a resol-type phenolic resin so as to afford high (long-term) heat resistance while maintaining its moldability comparable to conventional materials. SOLUTION: This molding composition is obtained by compounding (A) 100 pts.wt. of a resol-type phenolic resin (e.g. a liquid or solid one including that of methylol type and dimethylene ether type) with (B) 30-100 pts.wt. of melamine and (C) 180-300 pts.wt. of an inorganic filler (e.g. calcium carbonate, clay, talc, aramid fiber, carbon fiber, glass fiber; in particular, glass fiber treated with a silane coupling agent such as an epoxysilane) through e.g. thoroughly kneading with a mixing hot roll.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、耐熱性、成形性に
優れたフェノール樹脂成形材料に関するものであり、更
に詳しくは、主として自動車部品をはじめとする各種金
属製部品の代替化に好適なフェノール樹脂成形材料に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenolic resin molding material having excellent heat resistance and moldability, and more particularly to a phenol resin suitable for substituting various metal parts such as automobile parts. The present invention relates to a resin molding material.

【0002】[0002]

【従来の技術】フェノール樹脂成形材料は、耐熱性、寸
法精度、機械的強度とコストとのバランスの優れた材料
として各分野で広く用いられている。しかしながら、市
場の要求特性は益々厳しくなる一方であり、特に、近年
の自動車産業における高温雰囲気で使用されるトランス
ミッション部品やエンジン付近の部品等のプラスチック
の代替化、あるいは、既にプラスチック化されているコ
ンミテーター等の次世代における高耐久化の要求には、
従来のフェノール樹脂の耐熱性は限界のところまできて
いる。
2. Description of the Related Art Phenolic resin molding materials are widely used in various fields as materials having excellent balance between heat resistance, dimensional accuracy, mechanical strength and cost. However, the required characteristics of the market are becoming increasingly severe. In particular, in recent years, the automotive industry has replaced plastics such as transmission parts and parts near engines used in high-temperature atmospheres, or commutators that are already plasticized. Demands for high durability in the next generation such as
The heat resistance of conventional phenolic resins has reached its limits.

【0003】この改良材料として、ザイロック樹脂(フ
ェノールアラルキル)や多環芳香族型フェノール樹脂等
を使用した材料が開発されている。これらの材料として
用いられる樹脂はフェノール性水酸基の少ない構造で、
耐酸化劣化性に優れていることから、高度な長期耐熱性
を有する。しかしながら、フェノール樹脂の硬化反応は
フェノール性水酸基によって促進されるため、ザイロッ
ク樹脂や多環芳香族型フェノール樹脂は従来のものと比
べて3〜4倍の硬化時間を有し、よってこれらの樹脂を
使用した材料は成形性に問題があった。また、熱間での
強度が従来のフェノール樹脂と比べて低いという問題も
あった。
As this improved material, a material using a Xyloc resin (phenol aralkyl) or a polycyclic aromatic phenol resin has been developed. The resin used as these materials has a structure with few phenolic hydroxyl groups,
It has high long-term heat resistance due to its excellent oxidation resistance. However, since the curing reaction of the phenolic resin is promoted by the phenolic hydroxyl group, the Xyloc resin and the polycyclic aromatic phenolic resin have a curing time three to four times as long as that of the conventional phenolic resin. The material used had a problem in moldability. In addition, there is also a problem that the strength during hot is lower than that of a conventional phenol resin.

【0004】[0004]

【発明が解決しようとする課題】本発明は、以上のよう
な従来技術の問題点に鑑みなされたもので、その目的
は、従来のフェノール樹脂成形材料と同等の成形性を有
し、且つ、耐熱性特に長期耐熱性に優れた成形材料を提
供することである。
DISCLOSURE OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and has an object to have moldability equivalent to that of a conventional phenolic resin molding material, and An object of the present invention is to provide a molding material having excellent heat resistance, especially long-term heat resistance.

【0005】[0005]

【課題を解決するための手段】本発明者等は、特に長期
耐熱性の向上を目的として種々検討した結果、レゾール
型フェノール樹脂にメラミンを併用することで目的が達
成できることを見い出し、本発明を成すに至った。すな
わち本発明は、レゾール型フェノール樹脂100重量部
に対し、メラミン30〜100重量部、及び無機充填材
180〜300重量部を配合させてなることを特徴とす
るフェノール樹脂成形材料である。
Means for Solving the Problems The present inventors have conducted various studies especially for the purpose of improving long-term heat resistance, and as a result, have found that the object can be achieved by using melamine in combination with a resole-type phenol resin. It came to be. That is, the present invention is a phenolic resin molding material characterized by mixing 30 to 100 parts by weight of melamine and 180 to 300 parts by weight of an inorganic filler with respect to 100 parts by weight of a resole type phenolic resin.

【0006】[0006]

【発明の実施の形態】本発明で使用されるレゾール型フ
ェノール樹脂はメチロール型、ジメチレンエーテル型を
含むものであり、液状でも固形状でもよい。
BEST MODE FOR CARRYING OUT THE INVENTION The resole type phenol resin used in the present invention includes a methylol type and a dimethylene ether type, and may be liquid or solid.

【0007】本発明で使用されるメラミンは、レゾール
型フェノール樹脂100重量部に対して30〜100重
量部の範囲で使用するのが良い。更に好ましくは30〜
70重量部である。30重量部より少ないと、耐熱性が
あまり向上せず、100重量部より多くなると機械的強
度が低下し、成形材料化する際の作業性も悪くなる。
The melamine used in the present invention is preferably used in an amount of 30 to 100 parts by weight based on 100 parts by weight of the resol type phenol resin. More preferably 30 to
70 parts by weight. If the amount is less than 30 parts by weight, the heat resistance is not so improved. If the amount is more than 100 parts by weight, the mechanical strength is reduced, and the workability in forming a molding material is also deteriorated.

【0008】本発明で使用される無機充填材は特に限定
されるものではなく、従来のフェノール樹脂に添加され
るものは何れも使用可能であり、例えば、炭酸カルシウ
ム、クレー、タルク、シリカ、アラミド繊維、カーボン
繊維、ガラス繊維等が挙げられる。特に、ガラス繊維を
主体とした無機充填材は強度、耐熱性に有効である。こ
の際、配合時にガラス繊維をシランカップリング剤で処
理することが望ましい。シランカップリング剤としては
従来のフェノール樹脂に添加されるものは使用可能であ
り、特に、機械的強度、耐熱性、成形材料化する際の作
業性の点から、エポキシシラン類が好適である。
The inorganic filler used in the present invention is not particularly limited, and any of those added to conventional phenolic resins can be used. Examples thereof include calcium carbonate, clay, talc, silica, and aramid. Fibers, carbon fibers, glass fibers and the like can be mentioned. In particular, an inorganic filler mainly composed of glass fiber is effective for strength and heat resistance. At this time, it is desirable to treat the glass fiber with a silane coupling agent during compounding. As the silane coupling agent, those added to a conventional phenol resin can be used, and in particular, epoxy silanes are preferable in terms of mechanical strength, heat resistance, and workability in forming a molding material.

【0009】成形材料化する際の作業上での離型性、ま
た成形材料の成形時における金型離型性は、従来のフェ
ノール樹脂成形材料と同等またはそれ以上であることか
ら、離型剤も従来のフェノール樹脂に添加されるもので
十分である。
[0009] The mold release property during the operation of forming a molding material and the mold release property during molding of the molding material are equal to or higher than those of the conventional phenolic resin molding material. What is added to the conventional phenol resin is sufficient.

【0010】本発明のフェノール樹脂成形材料の製造方
法には特に制限はないが、耐熱性をいっそう効果的に向
上させるためには、十分に混練した方が好ましく、特
に、ミキシング熱ロールによる製造が有効である。本発
明のフェノール樹脂成形材料の成形方法は、射出成形、
トランスファー成形、圧縮成形等のいずれにも適用でき
る。
The method for producing the phenolic resin molding material of the present invention is not particularly limited. However, in order to more effectively improve the heat resistance, it is preferable that the phenolic resin molding material is sufficiently kneaded. It is valid. The molding method of the phenolic resin molding material of the present invention, injection molding,
It can be applied to any of transfer molding, compression molding and the like.

【0011】本発明のフェノール樹脂成形材料を用いた
成形品が、特に長期耐熱性において優れている理由は未
だ明確ではないが、以下のように推察される。つまり、
メラミンの窒素原子はフェノール性水酸基と水素結合す
るため、保護された構造となり、水酸基の酸化劣化が抑
制される。この点は、水酸基の密度が低いザイロック樹
脂や多環芳香族型フェノール樹脂が酸化劣化しにくいの
と同様である。しかしながら、メラミンとの水素結合で
フェノール性水酸基の活性は損なわれることがないた
め、フェノール樹脂の硬化反応は抑制されることはな
く、良好な成形性を有することとなる。
The reason why a molded article using the phenolic resin molding material of the present invention is particularly excellent in long-term heat resistance is not yet clear, but is presumed as follows. That is,
Since the nitrogen atom of melamine forms a hydrogen bond with a phenolic hydroxyl group, the melamine has a protected structure, and the oxidative deterioration of the hydroxyl group is suppressed. This point is the same as that of a Xyloc resin or a polycyclic aromatic phenol resin having a low hydroxyl group density, which is hardly oxidized and deteriorated. However, since the activity of the phenolic hydroxyl group is not impaired by the hydrogen bond with melamine, the curing reaction of the phenolic resin is not suppressed, and good moldability is obtained.

【0012】またメラミンは、メラミン樹脂で良く知ら
れているように、メチロール基やジメチレンエーテル基
との反応性を有する。つまり、レゾール型フェノール樹
脂との反応性を有することから、単なる充填剤とは異な
る特性を示すものと推察される。
Melamine has reactivity with a methylol group or a dimethylene ether group, as is well known for melamine resins. That is, since it has reactivity with the resol-type phenol resin, it is presumed that it exhibits characteristics different from those of a simple filler.

【0013】[0013]

【実施例】以下、実施例と比較例によって本発明を詳細
に説明する。
The present invention will be described in detail below with reference to examples and comparative examples.

【0014】実施例1〜2 ジメチレンエーテル型レゾール樹脂(旭有機材工業
(株)製、数平均分子量700)、メラミン(三井東圧
化学(株)製)、ガラス繊維(日本電気ガラス(株)
製)、その他(硬化剤、離型剤等)添加剤を表1に示す
重量割合で配合し、ミキシング熱ロールにて混練後、パ
ワーミルで粉砕し、成形材料とした。
Examples 1-2 Dimethylene ether type resole resin (manufactured by Asahi Organic Materials Co., Ltd., number average molecular weight 700), melamine (manufactured by Mitsui Toatsu Chemicals, Inc.), glass fiber (NEC Glass Co., Ltd.) )
And other additives (hardening agent, release agent, etc.) were mixed in the weight ratios shown in Table 1, kneaded with a mixing hot roll, and pulverized with a power mill to obtain a molding material.

【0015】得られた成形材料を以下の条件で射出成形
し、JIS曲げ試験片(80×10×4mm)を得た。
The obtained molding material was injection-molded under the following conditions to obtain a JIS bending test piece (80 × 10 × 4 mm).

【0016】得られた試験片について180℃×3時間
+220℃×3時間のアフターキュアを行い、250℃
における長期耐熱試験、160℃雰囲気下での熱間強度
試験を行った。結果を表1に示した。
The obtained test piece was subjected to after-curing at 180 ° C. × 3 hours + 220 ° C. × 3 hours,
, And a hot strength test in a 160 ° C. atmosphere. The results are shown in Table 1.

【0017】比較例1〜2 表1のごとき割合で配合し試験片を得た以外は、実施例
1と同様にして耐熱試験を行った。結果を表1に示す。
Comparative Examples 1-2 A heat resistance test was conducted in the same manner as in Example 1 except that test pieces were obtained by mixing at the ratios shown in Table 1. Table 1 shows the results.

【0018】[0018]

【表1】 [Table 1]

【0019】表1より、本発明のフェノール樹脂成形材
料を使用した成形品は、比較例のごとき一般のフェノー
ル樹脂成形材料並みの熱間強度を保持し、長期耐熱性に
優れていることが分かる。
From Table 1, it can be seen that a molded article using the phenolic resin molding material of the present invention has the same hot strength as a general phenolic resin molding material as in the comparative example and is excellent in long-term heat resistance. .

【0020】[0020]

【発明の効果】本発明のフェノール樹脂成形材料は、高
温雰囲気での熱的特性(特に長期耐熱性)に優れてお
り、これまで不可能であった高温雰囲気中での使用が可
能であるため、トランスミッション、エンジン付近等の
自動車部品の金属の代替化が可能である。また、前記耐
熱改良材であるザイロック樹脂や多環芳香族型フェノー
ル樹脂を使用した成形材料と比較して、明らかに硬化速
度が速いことから成形性に優れており、更にコストも従
来の一般的フェノール樹脂成形材料と同等であることか
ら、工業的に非常に好適な材料である。
The phenolic resin molding material of the present invention has excellent thermal properties (especially long-term heat resistance) in a high-temperature atmosphere and can be used in a high-temperature atmosphere, which has been impossible so far. It is possible to substitute metal for automobile parts such as in the vicinity of transmissions and transmissions. In addition, compared to molding materials using the heat resistance improving material Xyloc resin or polycyclic aromatic phenolic resin, the curing speed is clearly higher, so that the moldability is excellent, and the cost is also higher than that of conventional general materials. Since it is equivalent to a phenolic resin molding material, it is a very industrially suitable material.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 レゾール型フェノール樹脂100重量部
に対し、メラミン30〜100重量部、及び無機充填材
180〜300重量部を配合させてなることを特徴とす
るフェノール樹脂成形材料。
1. A phenol resin molding material characterized by mixing 30 to 100 parts by weight of melamine and 180 to 300 parts by weight of an inorganic filler with respect to 100 parts by weight of a resole type phenol resin.
JP09067398A 1998-03-20 1998-03-20 Phenolic resin molding material Expired - Fee Related JP3555835B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP09067398A JP3555835B2 (en) 1998-03-20 1998-03-20 Phenolic resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09067398A JP3555835B2 (en) 1998-03-20 1998-03-20 Phenolic resin molding material

Publications (2)

Publication Number Publication Date
JPH11269341A true JPH11269341A (en) 1999-10-05
JP3555835B2 JP3555835B2 (en) 2004-08-18

Family

ID=14005071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP09067398A Expired - Fee Related JP3555835B2 (en) 1998-03-20 1998-03-20 Phenolic resin molding material

Country Status (1)

Country Link
JP (1) JP3555835B2 (en)

Also Published As

Publication number Publication date
JP3555835B2 (en) 2004-08-18

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