JPH11266088A - Printed board housing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a printed board and a board housing device, wherein signals are transmitted from a printed board to a rack and vice versa in a non-contact manner, and the printed board is kept free of disturbances. SOLUTION: A light-emitting device 6 and a photodetector 7 are each arranged inside cylinders 8 and 9 provided to the printed board 2 in a direction in which the printed board 2 is inserted, and a photodetector 10 corresponding to the light-emitting device 6 and a light-emitting device 11 corresponding to the photodetector 7 are each arranged inside recesses 12 and 13 provided on the rack 1. Cylinders are fitted into recesses, when a printed board is mounted on a rack, and light signals are transmitted from a light-emitting device and a photodetector provided to the printed board to a corresponding photodetector and a light-emitting device which are provided to the rack or vice versa in a non-contacting state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board storage device in which signals are transmitted between a printed circuit board and a rack for storing the printed circuit board in a non-contact manner.

[0002]

2. Description of the Related Art FIG. 13 is a view showing a conventional printed circuit board and its storage device. In the figure, 1 is a rack for storing the printed circuit board, 2 is a printed circuit board stored in the rack 1, and 3 is the rack. A motherboard 4 which constitutes a part of 1; a connector 4 provided on the motherboard 3;
Reference numeral 5 denotes a metal terminal portion provided on the printed circuit board 2.

Next, the operation will be described. The connection between the printed circuit board 2 and the motherboard 3 is performed by bringing a metal terminal portion 5 provided on the printed circuit board 2 into contact with a connector 4 provided on the motherboard 3, and a signal input from the motherboard 3 to the printed circuit board 2 or Signal output from the printed circuit board 2 and power supply to the printed circuit board 2 are performed. Further, a metal terminal (not shown) provided inside the connector 4 holds the printed circuit board 2 by sandwiching the metal terminal portion 5 of the printed circuit board 2 with a strong spring force.

In the prior art, as a method for supplying power, for example, there is a method disclosed in Japanese Patent Application Laid-Open No. 9-182324. This principle is based on magnetically coupling a power transmitting side and a power receiving side to each other. Power is transmitted in a state of electrical insulation. More specifically, the transmission-side coil is driven by converting electric energy to be transmitted into high-frequency power, and a voltage induced in a reception-side coil placed near the transmission-side coil is used.

[0005]

As described above, the conventional printed circuit board and the storage device for accommodating the printed circuit board are connected to each other when the printed circuit board is connected to or disconnected from the connector when the printed circuit board is in an operating state, that is, in an energized state. There is a danger that a surge or the like may occur, and a noise or the like generated at that time may cause a malfunction. In addition, in a flammable gas atmosphere, there was a risk of ignition or explosion due to poor contact between metal terminals.

Further, in the conventional printed circuit board and its storage device, the printed circuit board is held by a connection portion made of a metal terminal of the connector. In order to hold the printed circuit board, a strong spring force is applied to the connection portion of the connector. Therefore, since the printed circuit board is sandwiched between the printed circuit board and the printed circuit board, extra force is generated when the printed circuit board is inserted and removed, and there is a risk that the printed circuit board or the connector is damaged when the printed circuit board is inserted or removed. In addition, when the connector and the printed board are not inserted at the correct positions when the printed board is mounted, a contact failure of the printed board may be caused.
Further, there is a disadvantage that the mechanization of the insertion and removal of the printed circuit board is prevented due to the difficulty of inserting and removing the printed circuit board.

Further, in the conventional printed circuit board and its storage device, there is a possibility that poor contact may occur due to oxidation and corrosion of the metal surface due to aging due to the contact of the metal terminals. There is also a drawback that it cannot be used in a metal corrosive gas atmosphere.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems. The connection for signal transmission between a printed circuit board and a motherboard is made non-contact, and the signal transmission between the printed circuit board and the motherboard is made in a non-contact manner. This prevents problems such as arc discharge at the time of attaching and detaching the printed circuit board and breakage due to mechanical force at the time of insertion and removal. Furthermore, signal transmission between the printed circuit board and the motherboard does not occur due to aging poor contact or in any environment where it is installed, for example, in a corrosive gas atmosphere, a flammable gas atmosphere, or a humid atmosphere. An object of the present invention is to provide a printed circuit board that can be favorably performed and a storage device for the printed circuit board.

[0009]

According to the present invention, there is provided an apparatus for storing a printed circuit board, comprising: a printed circuit board having a tubular portion for storing a light emitting element and a light receiving element for signal transmission and reception; A light-emitting element and a light-receiving element corresponding to the light-receiving element are provided with a rack having a concave portion in which the light-emitting element is disposed, and in a state where the printed circuit board is mounted on the rack, the cylindrical portion is fitted into the concave portion, and The light-emitting element and the light-receiving element and the light-receiving element and the light-emitting element of the rack corresponding to the light-emitting element and the light-receiving element transmit an optical signal in a non-contact state.

Also, a printed circuit board having a light emitting module composed of an aggregate of a plurality of light emitting elements surrounded by a barrier and a light receiving module composed of an aggregate of a plurality of light receiving elements surrounded by a barrier, and the printed board A light-receiving module comprising a plurality of light-receiving elements each of which is removably accommodated and whose periphery corresponding to the light-emitting module is surrounded by a barrier, and an aggregate of a plurality of light-emitting elements corresponding to the light-receiving modules surrounded by a barrier In the state where the printed circuit board is mounted on the rack, the modules of the printed circuit board and the rack corresponding to each other are combined in a non-contact state, and the barrier provided on each module is mutually separated. It is configured to fit.

A first light-emitting module comprising an aggregate of a plurality of light-emitting elements and a first light-receiving module comprising an aggregate of a plurality of light-receiving elements are arranged on one surface. A second light-receiving module and a printed circuit board on which the second light-emitting module composed of an aggregate of a plurality of light-emitting elements is disposed on the other surface, the printed circuit board is detachably housed, and the surface of the printed circuit board opposes the substrate plane. A third light receiving module facing the first light emitting module, or a rack in which the third light emitting module is disposed facing the first light receiving module, and the printed circuit board is mounted on the rack. In the above, each of the opposing modules transmits an optical signal in a non-contact state.

A printed board having a light transmitting hole and a light transmitting window, and an optical system comprising a prism in place of the half mirror, lens, light receiving element, or half mirror and lens near the light transmitting hole; This printed circuit board is removably housed, and a light-emitting element is provided on the inner surface facing the light-transmitting window, a rack provided with a light-receiving element on the other inner surface, and placed on the light-transmitting window of the printed circuit board. And an optical shutter module in which a plurality of optical shutter elements for switching transmission or blocking of incident light are arranged.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, Embodiment 1 of the present invention will be described with reference to FIG. In the following description, the same components or corresponding components described in the related art of FIG. 13 will be denoted by the same reference numerals, and description thereof will be omitted. A light emitting element 6 and a light receiving element 7 for transmitting and receiving signals are mounted inside the cylindrical portions 8 and 9 on the side of the printed board 2 in the direction of insertion into the rack 1. On the other hand, on the motherboard 3, a light receiving element 10 is provided corresponding to the light emitting element 6 of the printed board 2, and a light emitting element 11 is provided corresponding to the light receiving element 7 of the printed board 2. Hereinafter, the light emitting element and the light receiving element will be collectively referred to as an optical element for simplicity. The optical elements 6 and 7 of the printed circuit board 2 are mounted inside the cylindrical portions 8 and 9, respectively, whereas the optical elements 10 and 11 provided on the motherboard 3 are provided with concave portions provided on the connector 4. The motherboard 3 of the printed circuit board 2 is installed inside each of the printed circuit boards 12 and 13.
The optical elements 6 and 7 of the printed circuit board 2 and the corresponding optical elements 1 of the motherboard 3 are fitted by fitting the cylindrical parts 8 and 9 of the printed circuit board 2 into the concave parts 12 and 13 at the time of mounting.
0 and 11 are combined in a non-contact state.

As described above, according to the first embodiment,
In a state where the optical elements 6 and 7 of the printed circuit board 2 and the optical elements 10 and 11 of the corresponding motherboard 3 are not in contact with each other,
They face each other at the correct position and do not cause a signal transmission failure due to a positional shift between these optical elements. In the signal transmission between the optical elements, since optical signals are exchanged inside the cylindrical portions 8 and 9 fitted inside the concave portions 12 and 13, disturbance due to light incident from outside may occur. There is no. Further, since signals are exchanged by light, noise can be prevented from being transmitted between the printed circuit board 2 and the motherboard 3 to prevent malfunction.

Embodiment 2 Hereinafter, a second embodiment of the present invention will be described with reference to FIGS. 2, 3, and 4. FIG. FIG. 2 is a view of the printed circuit board 2 as viewed from a direction in which the printed circuit board 2 is inserted into the rack 1, and FIG.
In the figure, a light emitting module 15 in which a large number of light emitting elements 14 are assembled in the direction of inserting the printed circuit board 2 into the rack 1 and a light receiving module 17 in which a large number of light receiving elements 16 are assembled
Is installed. Barriers 18 and 19 are installed on the light emitting module 15 and the light receiving module 17 so as to surround a large number of optical elements 14 and 16, respectively.

FIG. 4 is a view of a rack 1 for accommodating a plurality of printed circuit boards 2 as viewed from the side where the printed circuit boards 2 are inserted, and shows a state in which one printed circuit board 2 is inserted into the right end inside the rack 1. In the figure, a light receiving module 22 in which a large number of light receiving elements 21 are assembled and a light emitting module 24 in which a large number of light emitting elements 23 are assembled are mounted on the surface of a mother board 3 attached to the rack 1.
24 are provided with barriers 25 and 26, respectively.

Next, the operation of the second embodiment will be described. The printed circuit board 2 is inserted into the rack 1, and the light emitting module 15 installed on the printed circuit board 2 is connected to the light receiving module 22 of the corresponding mother board 3 by the printed circuit board 2.
The light receiving module 17 installed in the first module is combined with the corresponding light emitting module 24 of the motherboard 3 in a state where the optical elements of the corresponding module are in a non-contact state.
At this time, the barrier 1 installed in the light emitting module 15
8 and a barrier 25 installed in the light receiving module 22;
And a barrier 19 installed in the light receiving module 17
And the barrier 26 installed in the light emitting module 24 are fitted with each other and adhere to each other without gaps.

As described above, in the second embodiment, since a large number of optical elements are arranged, a large number of signals can be transmitted at one time, and the signal transmission speed can be improved.

Embodiment 3 Hereinafter, a third embodiment of the present invention will be described with reference to FIGS. 5, 6, and 7. FIG. FIG. 5 is a perspective view of a printed circuit board 2 according to the third embodiment. The light emitting module 27 and the light receiving module 28 are installed on the printed circuit board 2. Next, the light receiving module 29 is installed at the same position on the back surface of the printed circuit board 2 where the light emitting module 27 is installed. Further, the light emitting module 30 is installed at the same position on the back surface of the light receiving module 28.

FIG. 6 is a view of the rack 1 for housing the printed circuit board 2 as viewed from the side where the printed circuit board 2 is inserted. In the figure, a light receiving module 31 and a light emitting module 32 that transmit signals to and from the printed circuit board 2 are provided on the inner side surface of the rack 1. FIG. 7 is a perspective view of the rack 1 seen from above. 6 and 7, reference numeral 2a denotes the printed circuit board 2.
The printed circuit boards 27a to 30a are the same modules corresponding to the modules 27 to 30 installed on the printed circuit board 2, respectively.

Next, the operation of the third embodiment will be described. A large number of printed circuit boards are stored in the rack 1. When a signal is to be transmitted from the rack 1 to each of the stored printed circuit boards, the printed circuit board closest to the inner side surface stored in the rack 1 from the light emitting module 32 inside the rack 1. This is achieved by transmitting an optical signal to the light receiving module 28 installed in the second optical module 2. Next, the printed circuit board 2 receiving this signal causes the light emitting module 30 to print the adjacent printed circuit board 2a.
The signal received from the light emitting module 32 inside the rack 1 can be transmitted as it is, or a signal processed or processed in the printed circuit board 2 can be transmitted.

As described above, according to the third embodiment, by transmitting a signal between adjacent printed circuit boards, all the printed circuit boards stored in the rack 1 can be transmitted from the rack 1 or the rack. 1 can be transmitted from outside. In addition, it goes without saying that the signal of the printed circuit board can be transmitted to another printed circuit board or the rack 1 or the outside of the rack 1 in the reverse manner.

Embodiment 4 Hereinafter, a fourth embodiment of the present invention will be described with reference to FIGS. 8, 9, and 10. FIG. FIG. 8 is a view of the printed circuit board 2 according to the fourth embodiment as viewed from the surface. First, a light transmitting hole 33 is provided on the surface of the printed circuit board 2, and an optical system including a half mirror 34, a lens 35, a lens holder 36, and a light receiving element 37 is installed near the light transmitting hole 33.

Next, a light transmission window 38 is provided on the printed board 2, and an optical shutter module 40 in which a plurality of optical shutter elements 39 are arranged in a line is installed. Here, the optical shutter element 39 switches whether to transmit or block incident light depending on the presence or absence of an electric signal to the optical shutter element. For example, a liquid crystal, a polarizing plate, and other electro-optical effects are used. Things.

FIG. 9 is a perspective view of the rack 1 accommodating a plurality of printed circuit boards according to the fourth embodiment seen from above.
FIG. 9 is a sectional view taken along line IX-IX of the printed circuit board 2 shown in FIG. 8. The light emitting elements 41 are vertically mounted on the inner side surface of the rack 1 in a line. The light emitting element 41 installed inside the rack 1 is provided at the same position as the light transmitting hole 33 formed in the printed circuit board 2 with the printed circuit board 2 mounted. The light emitting element 41 uses a light source that emits strong light, such as a semiconductor laser.
Thus, even when a large number of printed circuit boards are stored in the rack 1, the light emitted from the light emitting elements 41 passes through the light transmitting holes of each printed circuit board, and the light transmitting holes 33b of the printed circuit board 2b farthest from the light emitting elements 41. Can be reached with a small light spot diameter. In the vicinity of the light transmitting hole on each printed circuit board, a half mirror 34 is installed so as to form an angle of 45 ° with the plane of the board. Further, the light from the light emitting element 41 that has been partially reflected by the half mirror 34 is received by the light receiving element 3.
The lens 35 and the light receiving element 37 are installed so as to converge the light on the lens 7.

FIG. 10 is a perspective view of the rack 1 accommodating a plurality of printed circuit boards according to the fourth embodiment as viewed from above, and is a view of the printed circuit board 2 cut along the line XX shown in FIG. It is. The light-emitting elements 42 in rows equal to or more than the number of printed circuit boards to be stored in the rack 1 are installed on one inner side surface of the rack 1, and the light-receiving elements 43 are mounted on the inner side surface of the rack 1 facing the above. Are arranged in the same number of rows as the light emitting elements 42 of FIG. At this time, the light emitted from the light emitting element 42 attached to one inner side surface of the rack 1 goes straight, and the light emitting element 42 and the light receiving element 43 correspond one-to-one to the light receiving element 43 attached to the other inner side surface. And adjust its position to input. As described above, the light transmitting window 38 is provided on the printed circuit board 2, and the size of the light transmitting window 38 is
The size is such that all the light emitted from the light emitting elements 42 mounted in a row on the inner side surface of the light transmitting element is transmitted. In addition, this light transmission window 3
8, light emitting elements 4 mounted in a row on rack 1
The optical shutter element 39 is arranged so as to correspond to a certain one of the rows 2, for example, the first row. In the case of another printed circuit board housed in the rack 1, for example, the printed circuit board 2c, when the optical shutter element 39c is mounted, the rack 1
It is attached at a position opposite to the light emitting element 42c attached to the inner side surface of the.

In this manner, the optical shutters on the printed circuit board are arranged such that the optical shutter elements on all the printed circuit boards housed in the rack 1 have a one-to-one relationship with the light emitting elements mounted on the rack 1. The positions of the element 39 and the optical shutter module 40 are determined. The light emitting element 42 uses a light source that emits strong light, such as a semiconductor laser, like the light emitting element 41. This allows
Even when a large number of printed circuit boards are stored in the rack 1, the light emitted from the light emitting element can easily reach the printed circuit board 2b farthest from the light emitting element with a small spot diameter.

Next, the operation of the fourth embodiment will be described. When the printed circuit board 2 is housed in the rack 1, light emitted from a row of light emitting elements 41 attached to the inner side surface of the rack 1 passes through the half mirror 34 when passing through the light transmission holes 33 on the printed circuit board 2. The half mirror 34 semi-reflects and semi-transmits light. The semi-reflected light is collected by the lens 35 and input to the light receiving element 37. The semi-transmitted light passes through the light transmission hole 33 and enters the light transmission hole 33d of the adjacent printed circuit board 2d, but the light partially reflected by the half mirror 34d passes through the lens 35d. Then, the light enters the light receiving element 37d, and the semi-transmitted light further enters the adjacent printed circuit board. Similarly, light reaches the printed circuit board 2b farthest from the light emitting element 41 by the optical systems on all the printed circuit boards.

As described above, the optical signal sent from the light emitting element 41 mounted on the rack 1 to the printed circuit board is input to the light receiving elements on all the printed circuit boards. That is, signal transmission from the rack 1 to all printed circuit boards housed in the rack becomes possible.

Further, the light from the light emitting element array 42 attached inside the rack 1 to the light on the printed circuit board 2 (this is the first printed circuit board) disposed closest to the light emitting element array 42. The light input to the shutter element 39 operates the optical shutter element 39 in accordance with the calculation result in the printed circuit board and other signals of the printed circuit board to transmit or block the light. Then, the printed circuit board 2 of the light receiving elements 43 installed on the other side of the rack 1
By receiving the transmitted or blocked light by the light receiving elements in the one-to-one corresponding row, the signal of the printed circuit board 2 can be transmitted to the rack 1. Like the first printed circuit board 2, the second printed circuit board 2c arranged next to the first has a light shutter element at a position corresponding to the light emitting element row installed in the second row of the rack 1. With this arrangement, the signals of the printed circuit boards in the second row can be transmitted to the rack 1 by the light receiving elements 43c in the second row on the other side surface of the rack 1.

Therefore, the light-emitting element rows installed inside the respective racks 1 to 3 from the third row to the N-th row in the N light-transmitting windows of the printed circuit boards accommodated in the rack 1 as in the first and second rows. By arranging the optical shutter elements 39 in the row corresponding to 42, it is possible to transmit the signal of the printed circuit board to the rack 1.

Further, as shown in FIG. 11, the arrangement of the optical system elements provided on the printed circuit board housed in the rack 1 does not necessarily have to be arranged in order. That is, there is also an effect that the position where the printed circuit board is stored in the rack 1 can be changed as needed without fixing.

Further, in the fourth embodiment, a prism 44 can be used as shown in FIG. 12 instead of the half mirror 34 and the lens 35 on the printed circuit board. When light passes through the half mirror 34, the transmitted light is refracted according to the thickness of the half mirror, and the position of the transmitted light is shifted. Although the lens 35 is used to correct this positional deviation, in this usage example, since the transmitted light of the prism does not cause the positional deviation, there is an effect that the lens is not required.

Further, there is another effect that it is not necessary to dispose a self-luminous element on the printed circuit board side, and the power consumption in the printed circuit board can be suppressed low. It goes without saying that this is advantageous for the purpose of the present invention, which is to obtain power from the outside in a non-contact manner.

[0035]

Since the present invention is configured as described above, it has the following effects.

When the printed circuit board is inserted into the rack and mounted, the cylindrical portion of the printed circuit board fits into the concave portion of the rack, and the optical element of the printed circuit board and the corresponding optical element of the rack are in non-contact. Since the optical signal can be transmitted in the state, the signal transmission failure due to the displacement between the optical elements does not occur. Further, since signal transmission between the optical elements exchanges optical signals inside the cylindrical portion, there is an effect that disturbance due to light incident from the outside does not occur.

Also, modules in which a large number of light receiving / emitting elements of the printed circuit board and the rack are assembled are combined in a non-contact state, and the barriers provided on the combined printed circuit board and the rack module are fitted with each other. Since it is configured to be in close contact with no gap, transmission of a large number of signals can be performed at once, and there is an effect that the transmission speed of signals can be improved.

Further, a light receiving / light emitting module in which a large number of light receiving / light emitting elements are assembled is installed correspondingly to the front and back surfaces of the printed circuit board, and the light receiving / light emitting module is mounted on the rack facing the light receiving / light emitting module of the printed circuit board. Since the light receiving module is provided, there is an effect that optical signals can be transmitted between the adjacent printed circuit boards and the plurality of printed circuit boards mounted on the rack.

Further, as described above, a light transmitting hole and a light transmitting window are provided on the substrate plane of the printed circuit board, and an optical device including a half mirror, a lens, a lens holder, a light receiving element, or a prism is provided near the light transmitting hole. Install the system, above,
A light emitting element that emits strong light is provided at the position of the rack corresponding to the light transmitting hole, and the number of printed circuit boards housed in the rack is equal to or less than the number of printed circuit boards housed in the rack on one internal side surface of the rack facing the light transmitting window. A light emitting element array of the above rows is installed, and light receiving elements are installed on the other inner side surface of the rack opposed thereto at the same number of rows in a position facing each other one by one,
Optical shutter modules that switch the transmission of incident light or the blocking of incident light are provided at different positions in the light transmission windows provided on the individual printed circuit boards housed in the rack. The signal can be transmitted, and the signal of each printed circuit board can be transmitted to the rack.

[Brief description of the drawings]

FIG. 1 is a perspective view showing Embodiment 1 of the present invention.

FIG. 2 is a diagram illustrating a printed circuit board according to a second embodiment of the present invention as viewed from a direction in which the printed circuit board is inserted into a rack;

FIG. 3 is a view of a printed circuit board according to a second embodiment of the present invention as viewed from the surface;

FIG. 4 is a diagram of a rack according to a second embodiment of the present invention as viewed from a printed circuit board insertion side;

FIG. 5 is a perspective view of a printed circuit board according to Embodiment 3 of the present invention.

FIG. 6 is a view of a rack according to a third embodiment of the present invention as viewed from a printed circuit board insertion side.

FIG. 7 is a perspective view of a rack according to Embodiment 3 of the present invention seen from above.

FIG. 8 is a diagram of a printed circuit board according to Embodiment 4 of the present invention as viewed from the front surface.

FIG. 9 is a perspective view of a rack according to a fourth embodiment of the present invention as seen from above.

FIG. 10 is a perspective view of a rack according to a fourth embodiment of the present invention seen from above.

FIG. 11 shows another modification of the fourth embodiment of the present invention, and is a view in which a rack is seen through from above.

FIG. 12 shows another modification of the fourth embodiment of the present invention, and is a diagram seen through a rack from above.

FIG. 13 is a perspective view showing a conventional printed circuit board and its storage device.

[Explanation of symbols]

1 rack, 2 printed circuit boards, 3 motherboards, 4
Connector, 6, 11, 14, 23, 41 light emitting element,
7, 10, 16, 21, 37, 43 light receiving elements, 8, 9
Cylindrical part, 12, 13 concave part, 15, 24, 27, 3
0, 32 light emitting module, 17, 22, 28, 29,
31 light receiving module, 18, 19, 25, 26 barrier, 33 light transmitting hole, 34 half mirror, 35 lens, 38 light transmitting window, 39 light shutter element, 40
Optical shutter module, 42 light emitting element array, 44 prism.

Claims (4)

[Claims] 1. A printed circuit board having a tubular portion for accommodating a light emitting element and a light receiving element for transmitting and receiving signals, and a light receiving element and a light emitting element corresponding to the light emitting element and the light receiving element, the printed circuit board being removably accommodated. A rack having a concave portion arranged is provided, and in a state where the printed circuit board is mounted on the rack, the cylindrical portion fits into the concave portion,
And a light emitting element and a light receiving element of the printed circuit board and a light receiving element and a light emitting element of the rack corresponding to the light emitting element and the light emitting element transmit an optical signal in a non-contact state. 2. A printed circuit board comprising a light emitting module comprising an aggregate of a plurality of light emitting elements surrounded by a barrier and a light receiving module comprising an aggregate of a plurality of light receiving elements surrounded by a barrier. The light-receiving module comprising a set of a plurality of light-receiving elements surrounded by a barrier corresponding to the light-emitting module and a plurality of light-emitting elements surrounded by a barrier corresponding to the light-receiving module. A rack having a light emitting module composed of an aggregate is provided, and in a state where the printed circuit board is mounted on the rack, each module of the printed circuit board and the rack corresponding to each other are combined in a non-contact state, and provided in each module. The printed circuit board storage device, wherein the barriers are configured to be fitted to each other. Place. 3. A first light-emitting module comprising an aggregate of a plurality of light-emitting elements and a first light-receiving module comprising an aggregate of a plurality of light-receiving elements are arranged on one surface. A second light receiving module and a second light emitting module composed of an aggregate of a plurality of light emitting elements are provided on a printed circuit board arranged on the other surface, the printed circuit board is removably housed, and faces the substrate plane of the printed circuit board. A third light receiving module facing the first light emitting module, or a rack in which a third light emitting module is disposed facing the first light receiving module, wherein the printed circuit board is mounted on the rack. A printed circuit board storage device characterized in that, when mounted on a printed circuit board, the opposing modules transmit optical signals in a non-contact state. 4. A print having a light transmitting hole and a light transmitting window, and a half mirror, a lens, a light receiving element, or an optical system including a prism in place of the half mirror and the lens installed near the light transmitting hole. Board, a rack in which the printed circuit board is detachably housed, and a light emitting element is provided on an inner surface facing the light transmitting window, and a light receiving element is provided on another inner surface;
An apparatus for storing a printed circuit board, comprising: an optical shutter module arranged in a light transmitting window of the printed circuit board, and having a plurality of optical shutter elements arranged to switch transmission or blocking of incident light according to a signal from the printed circuit board. .