WO2017019083A1

WO2017019083A1 - Removable module

Info

Publication number: WO2017019083A1
Application number: PCT/US2015/042882
Authority: WO
Inventors: Kevin LEIGH; John Norton; George Megason
Original assignee: Hewlett Packard Enterprise Development Lp
Priority date: 2015-07-30
Filing date: 2015-07-30
Publication date: 2017-02-02

Abstract

One example of a removable module includes a module board and a module faceplate. The module board is to electrically couple the removable module to a system. The module board includes an alignment mechanism to align the module board with a system board of the system. The system board is electrically coupled to a system chip. The module faceplate is perpendicular to the module board. The module faceplate is to fill a void in a system faceplate of the system.

Description

REMOVABLE MODULE

Background

[0001] Transceiver modules, such as 1 -lane Small Form-Factor Pluggable (SFP), 4-lane Quad Small Form-Factor Pluggable (QSFP), and 12-lane CXP, are used for network data communications. The transceiver modules are hot- pluggable to a system board, such as a printed circuit board of a switch module A system board is typically behind a faceplate where connectors for coupling communication cables (e.g., fiber optic cables) to the transceiver modules are arranged.

Brief Description of the Drawings

[0002] Figure 1 illustrates an exploded view of one example of a system including a removable line pod (RLP).

[0003] Figure 2A illustrates one example of a first type of RLP.

[0004] Figure 2B illustrates one example of a second type of RLP.

[0005] Figure 2C illustrates one example of a third type of RLP.

[0006] Figure 2D illustrates one example of a fourth type of RLP.

[0007] Figure 3 illustrates one example of a system including a plurality of installed RLPs.

[0008] Figure 4 is a side view illustrating another example of the first type of RLP and a system. [0009] Figure 5 is a side view illustrating another example of the second type of RLP and a system.

[0010] Figure 6 is a side view illustrating another example of the third type of RLP and a system.

[0011] Figure 7 is a side view illustrating another example of the third type of RLP and a system.

[0012] Figures 8A and 8B illustrate an isometric view and a bottom view, respectively, of another example of the first type of RLP.

[0013] Figures 9A and 9B illustrate an isometric view and a bottom view, respectively, of another example of the second type of RLP.

[0014] Figures 10A and 10B illustrate an isometric view and a bottom view, respectively, of another example of the third type of RLP.

[0015] Figures 1 1 A and 1 1 B illustrate an isometric view and a bottom view, respectively, of another example of the third type of RLP.

[0016] Figures 12A and 12B illustrate an isometric view and a bottom view, respectively, of another example of the fourth type of RLP.

[0017] Figures 13A and 13B illustrate an isometric view and a bottom view, respectively, of another example of the third type of RLP.

[0018] Figures 14A and 14B illustrate another example of RLPs installed in a system.

[0019] Figures 15A and 15B illustrate an isometric view and an exploded view, respectively, of another example of the fourth type of RLP.

[0020] Figures 16A to 16E illustrate further examples of the fourth type of RLP.

Detailed Description

[0021] In the following detailed description, reference is made to the

accompanying drawings which form a part hereof, and in which is shown by way of illustration specific examples in which the disclosure may be practiced. It is to be understood that other examples may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims. It is to be understood that features of the various examples described herein may be combined, in part or whole, with each other, unless specifically noted otherwise.

[0022] Pluggable cages for receiving transceiver modules may use large electrical connectors to support high lane-count optical transceivers and multiple printed circuit boards (PCBs) may be used (e.g., one PCB for transmitter components and another PCB for receiver components). The pluggable cages may also take up a significant amount of space, may not efficiently support highspeed signals, may not efficiently support cooling, and may not be cost efficient due to large electro-mechanical overheads. Line cards may be used to support high lane-count transceivers but they may use even larger PCBs than pluggable cages, may be even more difficult to cool, and may be more expensive than pluggable cages. Because pluggable transceiver modules typically operate in hot thermal environments, the modules may wear-out, which in turn

necessitates that the modules be replaceable. The reliability of optical transceivers has been improving such that modules may not be replaced due to component failures, but rather replaced due to modular connection failures. In addition, many applications may not require the replacement of transceivers once they are installed in a system.

[0023] Accordingly, this disclosure describes removable modules, referred to herein as removable line pods (RLPs), which do not use hot-blindmate mechanics, and thus are cost and space efficient. A RLP may include a RLP board to support transceiver devices on the top side and contacts on the bottom side to electrically couple to a system board. A RLP may include a RLP faceplate that fills a void in a system faceplate when the RLP is installed in a system. The RLP faceplate may have one or multiple faceplate connectors to electrically and/or optically couple to transceiver devices. The RLP may include alignment and retention mechanisms to secure the RLP in a system.

[0024] Figure 1 illustrates an exploded view of one example of a system 100 including a RLP 120. System 100 includes a system 102 such as a switch module. System 102 includes a system chassis 104, a system faceplate 106, and a system board 108. System board 108 is attached to system chassis 104. System faceplate 106 is attached to system chassis 104 and is perpendicular to system board 108.

[0025] System board 108 includes RLP alignment mechanisms 1 10 (e.g., alignment pins) extending vertically from system board 108 and RLP retention mechanisms 1 12 (e.g., bases for receiving screws). In one example, RLP alignment mechanisms 1 10 provide power and/or ground connections to RLP 120. System board 108 includes a RLP contact footprint 1 14 (shown with an outlined area) between the RLP alignment mechanisms 1 12 and the RLP retention mechanisms 1 12. In one example, RLP alignment mechanisms 1 10 are arranged near two opposite corners of RLP contact footprint 1 14, and RLP retention mechanisms 1 12 are arranged near another two opposite corners of RLP contact footprint 1 14.

[0026] RLP 120 includes a RLP board support structure 122, a RLP faceplate 124 (i.e., a module faceplate), brackets 126, and a RLP board 128 (i.e., a module board). Brackets 126 provide structural support for RLP board support structure 122 and RLP faceplate 124. RLP board 128 is attached to RLP board support structure 122 and is perpendicular to RLP faceplate 124. In the example illustrated in Figure 1 , an optical transceiver 130 (e.g., an optical transceiver chip) is electrically coupled to RLP board 128. An optical connector 132 is coupled to RLP faceplate 124. An optical cable 134 optically couples optical transceiver 130 to optical connector 132. In other examples, as will be described below, RLP 120 may include other configurations, such as pluggable transceiver cages. In addition, a signal retime chip (not shown) and/or a management controller chip (not shown) may be electrically coupled to RLP board 128. The signal retime chip is to condition electrical signals of RLP 120. The management controller chip is electrically coupled to optical transceivers or pluggable transceiver cages through RLP board 128 to aggregate management signals for multiple transceivers of RLP 120.

[0027] With RLP 120 installed in system 102, RLP board 128 contacts RLP contact footprint 1 14. RLP board 128 is aligned with RLP contact footprint 1 14 via RLP alignment mechanisms 1 10 and secured to system board 108 via RLP retention mechanisms 1 12. In one example, RLP 120 is electrically coupled to RLP contact footprint 1 14 on system board 108 via an array of parallel-plane- mating contacts on the bottom surface of RLP board 128. With RLP 120 installed in system 102, RLP faceplate 124 fills a void in system faceplate 106.

[0028] Figure 2A illustrates one example of a first type (i.e., type-1 ) of RLP 200. RLP 200 includes a RLP board 202, a first pluggable transceiver cage 204a (e.g., a first multi-source agreement (MSA) pluggable transceiver cage) and a second pluggable transceiver cage 204b (e.g., a second MSA pluggable transceiver cage). Each pluggable transceiver cage 204a and 204b is electrically coupled to RLP board 202. In one example, each pluggable transceiver cage 204a and 204b may be for receiving a 1 -lane Small Form- Factor Pluggable (SFP) transceiver module, a 4-lane Quad Small Form-Factor Pluggable (QSFP) transceiver module, and/or a 12-lane CXP transceiver module. Each pluggable transceiver cage 204a and 204b is electrically coupled to a cable 206a and 206b, respectively, via RLP board 202. In one example, cables 206a and 206b may be combined into a single cable.

[0029] While RLP 200 includes two pluggable transceiver cages 204a and 204b arranged laterally with respect to each other, in other examples pluggable transceiver cages 204a and 204b may be arranged vertically with respect to each other. In another example, RLP 200 may include one pluggable transceiver cage. RLP 200 may also include more than two pluggable transceiver cages arranged laterally with respect to each other, vertically with respect to each other, or a combination of both laterally and vertically with respect to each other.

[0030] RLP board 202 includes alignment and retention mechanisms (not shown) as described for RLP board 128 in Figure 1 . RLP 200 includes a support structure and a faceplate (not shown) as described for RLP 120 in Figure 1 . RLP board 202 may not have signal contacts on the bottom side of the RLP board since cables 206a and 206b may include signal wires to electrically couple to a system. In one example, RLP board 202 may not have power contacts on the bottom side of the RLP board since cables 206a and 206b may include power wires to electrically couple to a system. In another example, RLP board 202 may have power contacts on the bottom side of the RLP board.

[0031] Figure 2B illustrates one example of a second type (i.e., type-2) of RLP 220. RLP 220 includes a RLP board 222, a first pluggable transceiver cage 224a (e.g., a first MSA pluggable transceiver cage), a second pluggable transceiver cage 224b (e.g., a second MSA pluggable transceiver cage), a third pluggable transceiver cage 224c (e.g., a third MSA pluggable transceiver cage), and a fourth pluggable transceiver cage 224d (e.g., a fourth MSA pluggable transceiver cage). Each pluggable transceiver cage 224a to 224d is electrically coupled to RLP board 222. In one example, each pluggable transceiver cage 224a to 224d may be for receiving a 1 -lane SFP transceiver module, a 4-lane QSFP transceiver module, and/or a 12-lane CXP transceiver module. RLP board 222 includes an array of parallel-plane-mating contacts (not shown) on the bottom surface of the RLP board to electrically couple each pluggable transceiver cage 224a to 224d to a system board of a system.

[0032] While RLP 220 includes four pluggable transceiver cages 224a to 224d arranged in a combination of both laterally and vertically with respect to each other, in other examples pluggable transceiver cages 224a to 224d may be arranged laterally with respect to each other or vertically with respect to each other. In another example, RLP 220 may include less than four pluggable transceiver cages. RLP 200 may also include more than four pluggable transceiver cages arranged laterally with respect to each other, vertically with respect to each other, or a combination of both laterally and vertically with respect to each other.

[0033] RLP board 222 has alignment and retention mechanisms (not shown) as described for RLP board 128 in Figure 1 . RLP 220 has a support structure and a faceplate (not shown) as described for RLP 120 in Figure 1 . Similar to RLP 220 and RLP board 222, subsequent RLPs and RLP boards will not show details as shown for RLP 120 and RLP board 128 in Figure 1 .

[0034] Figure 2C illustrates one example of a third type (i.e., type-3) of RLP 240. RLP 240 includes a RLP board 242, mid-board optics 244, and optical connectors 246. Mid-board optics 244 includes optical transceivers (e.g., optical transceiver chips and associated optical connectors) electrically coupled to RLP board 242. Each optical transceiver is optically coupled to an optical connector 246 via a respective optical cable 248. In one example, each optical connector 246 is a Lucent Connector (LC) or a multi-fiber push on (MPO) connector.

[0035] Mid-board optics 244 may include any suitable number of optical transceivers optically coupled to respective optical connectors 246. Optical connectors 246 may be arranged laterally with respect to each other, vertically with respect to each other, or a combination of both laterally and vertically with respect to each other as shown in the example of Figure 2C. RLP board 242 includes an array of parallel-plane-mating contacts (not shown) on the bottom surface of the RLP board to electrically couple mid-board optics 244 to a system board of a system.

[0036] Figure 2D illustrates one example of a fourth type (i.e., type-4) of RLP 260. RLP 260 includes a flex-rigid board assembly including a RLP board 262, flexible portions 264a and 264b, and further boards 266a and 266b arranged perpendicular to RLP board 262. RLP board 262 is electrically coupled to further board 266a via flexible portion 264a and to further board 266b via flexible portion 264b. RLP 260 also includes signal retime chips 268a and 268b, and pluggable transceiver cages 270a and 270b.

[0037] Signal retime chip 268a and pluggable transceiver cages 270a are electrically coupled to further board 266a. Pluggable transceiver cages 270a are electrically coupled to signal retime chip 268a through further board 266a. Signal retime chip 268a conditions electrical signals of RLP 260 including electrical signals of pluggable transceiver cages 270a. Signal retime chip 268b and pluggable transceiver cages 270b are electrically coupled to further board 266b. Pluggable transceiver cages 270b are electrically coupled to signal retime chip 268b through further board 266b. Signal retime chip 268b conditions electrical signals of RLP 260 including electrical signals of pluggable transceiver cages 270b. In other examples, signal retime chip 268a and 268b are excluded. RLP board 262 includes an array of parallel-plane-mating contacts (not shown) on the bottom surface of the RLP board to electrically couple signal retime chips 268a and 268b and pluggable transceiver cages 270a and 270b to a system board of a system.

[0038] Figure 3 illustrates one example of a system 280 including a plurality of installed RLPs 286. In one example, system 280 is a switch module or another suitable computing or switching system. System 280 includes a system board 282 (e.g., a printed circuit board), a system chip 284 (e.g., an application specific integrated circuit (ASIC) chip, a switch chip, a processor chip, or a network interface chip), and a plurality of RLP contact footprints indicated for example at 288. Each RLP contact footprint 288 may include an array of parallel-plane-mating contacts corresponding to the array of parallel-plane- mating contacts on the bottom surface of the RLP board of each RLP 286. As such, each RLP 286 may be electrically coupled to system chip 284 via system board 282. Each RLP 286 may be any one of the four types of RLPs previously described and illustrated with reference to Figures 2A-2D.

[0039] Figure 4 is a side view illustrating another example of the first type of RLP 300 and a system 302. System 302 includes a system board 304, a system faceplate 308 perpendicular to system board 304, and RLP retention mechanisms 310. System board 304 may include parallel-plane-mating contacts 306 to provide power and ground connections and/or management signal connections to RLP 300. In other examples contacts 306 are excluded.

[0040] RLP 300 includes a RLP board 320, a communications cable 324 electrically coupled to RLP board 320, pluggable transceiver cages 322a and 322b electrically coupled to RLP board 320, and a support structure 326 to secure RLP 300 to system 302. Each pluggable transceiver cage 322a and 322b may be electrically coupled to a system via RLP board 320 and

communications cable 324. In one example, RLP board 320 may include parallel-plane-mating contacts on the bottom surface of the RLP board to electrically couple to contacts 306 to provide power and ground connections and/or management signal connections to RLP 300. In other examples, the power and ground connections and/or management signal connections to RLP 300 may be provided through communications cable 324. RLP 300 may be secured within system 302 by fasteners 312 (e.g., screws), which secure support structure 326 to retention mechanisms 310 when RLP 300 is installed in system 302.

[0041] Figure 5 is a side view illustrating another example of the second type of RLP 350 and a system 352. System 352 includes a system board 354, a system faceplate 362 perpendicular to system board 354, and RLP retention mechanisms 364. System board 354 includes an array of parallel-plane-mating contacts 356 to electrically coupled system board 354 to RLP 350. Contacts 356 are electrically coupled to a system chip 360 via system board 354 as indicated at 358.

[0042] RLP 350 includes a RLP board 370, pluggable transceiver cages 372a and 372b electrically coupled to RLP board 370, and a support structure 376 to secure RLP 350 to system 352. RLP board 370 includes an array of parallel- plane-mating contacts on the bottom surface of the RLP board to electrically couple to corresponding contacts 356 to electrically couple RLP 350 to system 352. RLP 350 may be secured within system 352 by fasteners 366 (e.g., screws), which secure support structure 376 to retention mechanisms 364 when RLP 350 is installed in system 352.

[0043] Figure 6 is a side view illustrating another example of the third type of RLP 400 and a system 402. System 402 includes a system board 404, a system faceplate 412 perpendicular to system board 404, and RLP retention mechanisms 414. System board 404 includes an array of parallel-plane-mating contacts 406 to electrically couple system board 404 to RLP 400. Contacts 406 are electrically coupled to a system chip 410 via system board 404 as indicated at 408.

[0044] RLP 400 includes a RLP board 420, optical transceivers 422a and 422b (e.g., optical transceiver chips) electrically coupled to RLP board 420, optical connectors 426 optically coupled to optical transceivers 422a and 422b via optical cables 424a and 424b, respectively, and a support structure 428 to secure RLP 400 to system 402. RLP board 420 includes an array of parallel- plane-mating contacts on the bottom surface of the RLP board 420 to

electrically couple to corresponding contacts 406. Contacts 406 electrically couple RLP 400 to system 402. RLP 400 may be secured within system 402 by fasteners 416 (e.g., screws), which secure support structure 428 to retention mechanisms 414 when RLP 400 is installed in system 402.

[0045] Figure 7 is a side view illustrating another example of the third type of RLP 450 and a system 452. System 452 includes a system board 454, a system faceplate 462 perpendicular to system board 454, and RLP retention mechanisms 464. System board 454 includes an array of parallel-plane-mating contacts 456 to electrically coupled system board 454 to RLP 450. Contacts 456 are electrically coupled to a system chip 460 via system board 454 as indicated at 458. System board 454 also includes an alignment mechanism 466 (e.g., an alignment pin) for aligning RLP 450 to contacts 456 and to provide power to RLP 450 through the alignment mechanism.

[0046] RLP 450 includes a RLP board 470, optical transceivers 472a and 472b electrically coupled to RLP board 470, optical connectors 476 optically coupled to optical transceivers 472a and 472b via optical cables 474a and 474b, respectively, and a support structure 478 to secure RLP 450 to system 452. RLP board 470 includes an array of parallel-plane-mating contacts on the bottom surface of the RLP board to electrically couple to corresponding contacts 456 to electrically couple RLP 450 to system 452. RLP board 470 also includes a power connector socket 480 for receiving alignment mechanism 466 of system board 454. Power connector socket 480 aligns RLP 450 to contacts 456 and provides power to RLP board 470 via alignment mechanism 466. RLP 450 may be secured within system 452 by fasteners 466 (e.g., screws), which secure support structure 478 to retention mechanisms 464 when RLP 450 is installed in system 452.

[0047] While power connector socket 480 and alignment mechanism 466 are illustrated with reference to a type-3 RLP in Figure 7, power connector socket 480 and alignment mechanism 466 may also be used for a type-1 , type-2, or type-4 RLP.

[0048] Figures 8A and 8B illustrate an isometric view and a bottom view, respectively, of another example of the first type of RLP 500. RLP 500 includes a RLP board 502, a communications cable 504, dual QSFP transceiver cages 506, a RLP faceplate 510, and a support structure 512. In one example, dual QSFP transceiver cages 506 include a heat sink 508. RLP board 502 is perpendicular to RLP faceplate 510 and coupled to RLP faceplate 510 via support structure 512. RLP faceplate 510 includes openings to each

transceiver cage of dual QSFP transceiver cages 506. Dual QSFP transceiver cages 506 are electrically coupled to RLP board 502. RLP board 502 includes alignnnent sockets 514 to receive alignnnent pins of a system board to align RLP 500 with a RLP contact footprint of a system board when RLP 500 is installed in a system. Alternatively, alignment sockets 514 in conjunction with faceplate 510 may be used as a retention mechanism to secure RLP 500 to a system board. RLP board 502 is electrically coupled to communications cable 504.

Communications cable 504 may be used to electrically couple RLP 500 to a system. Communications cable 504 may be a cable assembly with a connector to be removably attached to RLP 500.

[0049] Figures 9A and 9B illustrate an isometric view and a bottom view, respectively, of another example of the second type of RLP 550. RLP 550 includes a RLP board 552, dual QSFP transceiver cages 556, a RLP faceplate 560, a support structure 562, and light pipes 566 (partially illustrated). In other examples, light pipes 566 may be excluded. In one example, dual QSFP transceiver cages 556 include a heat sink 558. RLP board 552 is perpendicular to RLP faceplate 560 and coupled to RLP faceplate 560 via support structure 562. Faceplate 560 includes openings to each transceiver cage of dual QSFP transceiver cages 556 and to light pipes 566. Dual QSFP transceiver cages 556 are electrically coupled to RLP board 552. RLP board 552 includes alignment sockets 564 to receive alignment pins of a system board to align RLP 550 with a RLP contact footprint of a system board when RLP 550 is installed in a system. Alternatively, alignment sockets 564 in conjunction with faceplate 560 may be used as a retention mechanism to secure RLP 550 to a system board. RLP board 552 also includes an array of parallel-plane-mating contacts 554 to electrically couple RLP 550 to corresponding contacts of a system board.

[0050] Figures 10A and 10B illustrate an isometric view and a bottom view, respectively, of another example of the third type of RLP 600. RLP 600 includes a RLP board 602, mid-board optics 606, optical cables 607, a MPO connector 608, a RLP faceplate 610, and a support structure 612. RLP board 602 is perpendicular to RLP faceplate 610 and coupled to RLP faceplate 610 via support structure 612. Faceplate 610 includes an opening through which MPO connector 608 is attached. Mid-board optics 606 are electrically coupled to RLP board 602. Mid-board optics 606 are optically coupled to MPO connector 608 through optical cables 607. RLP board 602 includes alignment sockets 614 to receive alignment pins of a system board to align RLP 600 with a RLP contact footprint of a system board when RLP 600 is installed in a system. Alternatively, alignment sockets 614 in conjunction with faceplate 610 may be used as a retention mechanism to secure RLP 600 to a system board. RLP board 602 also includes an array of parallel-plane-mating contacts 604 to electrically couple RLP 600 to corresponding contacts of a system board.

[0051] Figures 1 1 A and 1 1 B illustrate an isometric view and a bottom view, respectively, of another example of the third type of RLP 650. RLP 650 includes a RLP board 652, mid-board optics 656, optical cables 657, a plurality of LC connectors 658, a RLP faceplate 660, and a support structure 662. RLP board 652 is perpendicular to RLP faceplate 660 and coupled to RLP faceplate 660 via support structure 662. Faceplate 660 includes an opening through which each of the LC connectors 658 are attached. Mid-board optics 656 are electrically coupled to RLP board 652. Mid-board optics 656 are optically coupled to LC connectors 658 through optical cables 657. RLP board 652 includes alignment sockets 664 to receive alignment pins of a system board to align RLP 650 with a RLP contact footprint of a system board when RLP 650 is installed in a system. Alternatively, alignment sockets 664 in conjunction with faceplate 660 may be used as a retention mechanism to secure RLP 650 to a system board. RLP board 652 also includes an array of parallel-plane-mating contacts 654 to electrically couple RLP 650 to corresponding contacts of a system board.

[0052] Figures 12A and 12B illustrate an isometric view and a bottom view, respectively, of another example of the fourth type of RLP 700. RLP 700 includes a flex-rigid assembly including a RLP board 702, a flexible portion 703, and a further board 705 perpendicular to RLP board 702 and electrically coupled to RLP board 702 via flexible portion 703. RLP 700 also includes mid- board optics 706, optical cables 707, a MPO connector 708, a RLP faceplate 710, and a support structure 712.

[0053] RLP board 702 is perpendicular to RLP faceplate 710 and coupled to RLP faceplate 710 via support structure 712. Faceplate 710 includes an opening through which MPO connector 708 is attached. Mid-board optics 706 are electrically coupled to further board 705. Mid-board optics 706 are optically coupled to MPO connector 708 through optical cables 707. (Note only a portion of each optical cable 707 is shown in Figures 12A and 12B to simplify the drawings.) RLP board 702 includes alignment sockets 714 to receive alignment pins of a system board to align RLP 700 with a RLP contact footprint of a system board when RLP 700 is installed in a system. Alignment sockets 714 may be used as a retention mechanism to secure RLP 700 to a system board. RLP board 702 also includes an array of parallel-plane-mating contacts 704 to electrically couple RLP 700 to corresponding contacts of a system board.

[0054] Figures 13A and 13B illustrate an isometric view and a bottom view, respectively, of another example of the third type of RLP 750. RLP 750 includes a RLP board 752, mid-board optics 756, optical cables 757, a MPO connector 758, a faceplate power connector 768, a RLP faceplate 760, and a support structure 762. RLP board 752 is perpendicular to RLP faceplate 760 and coupled to RLP faceplate 760 via support structure 762. Faceplate 760 includes an opening through which MPO connector 758 and faceplate power connector 768 are attached. Mid-board optics 756 are electrically coupled to RLP board 752. Mid-board optics 756 are optically coupled to MPO connector 758 through optical cables 757. Faceplate power connector 768 is electrically coupled to RLP board 752 via an electrical power cable 770 and RLP board power connector 769. RLP board 752 may include power conditioning components (not shown).

[0055] RLP board 752 may include alignment sockets 764 and 766 to receive alignment pins of a system board to align RLP 750 with a RLP contact footprint of a system board when RLP 750 is installed in a system. Alignment sockets 766 may also receive power from a system board through an alignment pin of the system board. Alignment sockets 766 may be electrically coupled to faceplate power connector 768 through electrical power cable 770 and RLP board power connector 769. Alignment sockets 766 in conjunction with faceplate 760 may be used as a retention mechanism to secure RLP 750 to a system board. RLP board 752 also includes an array of parallel-plane-mating contacts 754 to electrically couple RLP 750 to corresponding contacts of a system board. While alignment sockets 766, electrical power cable 770, RLP board power connector 769, and faceplate power connector 768 are illustrated with reference to a type-3 RLP in Figures 13A and 13B, alignment sockets 766, electrical power cable 770, RLP board power connector 769, and faceplate power connector 768 may also be included in a type-1 , type-2, or type-4 RLP.

[0056] Figures 14A and 14B illustrate another example of RLPs installed in a system 800. System 800 includes a system board 802, a system chip 804, a heat sink 806, a system faceplate 808, and built-in 2x4 stacked QSFP transceiver cages 810. System board 802 is perpendicular to system faceplate 808. System chip 804 is electrically coupled to system board 802 and thermally coupled to heat sink 806. System 800 also includes an installed type-1 RLP 812, type-2 RLP 814, type-3 RLP 816, type-3 RLP 818, and type-4 RLP 820. Each QSFP transceiver cage 810 and each RLP 812, 814, 816, 818, and 820 is electrically coupled to system chip 804 through system board 802. The faceplate of each RLP 812, 814, 816, 818, and 820 fills a void in system faceplate 808.

[0057] Type-1 RLP 812 is similar to RLP 500 previously described and illustrated with reference to Figures 8A and 8B, except that RLP 812 includes light pipes. Type-2 RLP 814 is similar to RLP 550 previously described and illustrated with reference to Figures 9A and 9B. Type-3 RLP 816 is similar to RLP 650 previously described and illustrated with reference to Figures 1 1 A and 1 1 B. Type-3 RLP 818 is similar to RLP 600 previously described and illustrated with reference to Figures 10A and 10B. Type-4 RLP 820 is similar to RLP 700 previously described and illustrated with reference to Figures 12A and 12B.

[0058] Figures 15A and 15B illustrate an isometric view and an exploded view, respectively, of another example of the fourth type of RLP 900. RLP 900 includes a carrier 902, a flex-rigid assembly 904, and pluggable transceiver cages 906. Pluggable transceiver cages 906 are electrically coupled to flex- rigid assembly 904. Flex-rigid assembly 904 is mechanically coupled to carrier 902. As illustrated in Figure 15B, Carrier 902 includes a faceplate 908 including a plurality of openings 910 through which pluggable transceiver cages 906 protrude. Faceplate 908 is coupled to a RLP extension bracket 912 and a RLP base bracket 914 perpendicular to RLP extension bracket 912. A brace 916 extends from faceplate 908 to RLP base bracket 914.

[0059] Flex-rigid assembly 904 includes a RLP board 924, a flexible portion 922, and a further board 920 perpendicular to RLP board 924 and electrically coupled to RLP board 924 via flexible portion 922. The bottom surface of RLP board 924 includes an array of parallel-plane-mating contacts (not shown) to electrically couple RLP 900 to corresponding contacts of a system board. RLP board 924 is mechanically coupled to RLP base bracket 914, and further board 920 is mechanically coupled to RLP extension bracket 912. Pluggable transceiver cages 906 include a plurality of cages 930 arranged in rows and/or columns. Each cage 930 partially extends through an opening 910 of faceplate 908.

[0060] Figure 16A illustrates a further example of a fourth type of RLP 950a. RLP 950a includes a carrier 952a supporting a flex-rigid assembly including a 1 x-wide RLP board 958a, a flexible portion 956a, and a 1 x-tall further board 954a perpendicular to RLP board 958a and electrically coupled to RLP board 958a via flexible portion 956a. A suitable number of optical transceivers or pluggable transceiver cages may be electrically coupled to RLP board 958a and/or further board 954a. RLP board 958a includes an array of parallel-plane- mating contacts on the bottom surface of the RLP board 958a to electrically couple to corresponding contacts on a system board.

[0061] Figure 16B illustrates a further example of a fourth type of RLP 950b. RLP 950b includes a carrier 952b supporting a flex-rigid assembly including a 2x-wide RLP board 958b, a first flexible portion 956b, a first 1 x-tall further board 954b perpendicular to RLP board 958b and electrically coupled to RLP board 958b via flexible portion 956b, a second flexible portion 960b, and a second 1 x- tall further board 962b perpendicular to RLP board 958b and electrically coupled to RLP board 958b via flexible portion 960b. A suitable number of optical transceivers or pluggable transceiver cages may be electrically coupled to RLP board 958b and/or first further board 954b and second further board 962b. In comparison to RLP 950a previously described and illustrated with reference to Figure 16A, RLP 950b may include twice as many optical transceivers and/or pluggable transceiver cages. RLP board 958b includes an array of parallel- plane-mating contacts on the bottom surface of the RLP board 958b to electrically couple to corresponding contacts on a system board. RLP board 958b may have twice the number of parallel-plane-mating contacts compared to RLP board 958a illustrated in Figure 16A.

[0062] Figure 16C illustrates a further example of a fourth type of RLP 950c. RLP 950c includes a carrier 952c supporting a flex-rigid assembly including a 1 x-wide RLP board 958c, a flexible portion 956c, and a 2x-tall further board 954c perpendicular to RLP board 958c and electrically coupled to RLP board 958c via flexible portion 956c. A suitable number of optical transceivers or pluggable transceiver cages may be electrically coupled to RLP board 958c and/or further board 954c. In comparison to RLP 950a previously described and illustrated with reference to Figure 16A, RLP 950c may include twice as many optical transceivers and/or pluggable transceiver cages. RLP board 958c includes an array of parallel-plane-mating contacts on the bottom surface of the RLP board 958c to electrically couple to corresponding contacts on a system board.

[0063] Figure 16D illustrates a further example of a fourth type of RLP 950d. RLP 950d includes a carrier 952d supporting two flex-rigid assemblies. A first flex-rigid assembly includes a first 1 x-wide RLP board 958d, a first flexible portion 956d, and a first 2x-tall further board 954d perpendicular to first RLP board 958d and electrically coupled to first RLP board 958d via flexible portion 956d. A second flex-rigid assembly includes a second 1 x-wide RLP board 964d, a second flexible portion 960b, and a second 2x-tall further board 962b perpendicular to second RLP board 964d and electrically coupled to second RLP board 964d via second flexible portion 960b. Second RLP board 964d is coplanar with first RLP board 958d. A suitable number of optical transceivers or pluggable transceiver cages may be electrically coupled to first RLP board 958d and second RLP board 964d and/or first further board 954d and second further board 962d. In comparison to RLP 950a previously described and illustrated with reference to Figure 16A, RLP 950d may include four times as many optical transceivers and/or pluggable transceiver cages. RLP boards 958d and 964d each include an array of parallel-plane-mating contacts on the bottom surface of the respective RLP board to electrically couple to corresponding contacts on a system board.

[0064] Figure 16E illustrates a further example of a fourth type of RLP 950e. RLP 950e includes a carrier 952e supporting a flex-rigid assembly including a 2x-wide RLP board 958e, a flexible portion 956e, and a 2x-tall further board 954e perpendicular to RLP board 958e and electrically coupled to RLP board 958e via flexible portion 956e. A suitable number of optical transceivers or pluggable transceiver cages may be electrically coupled to RLP board 958e and/or further board 954e. In comparison to RLP 950a previously described and illustrated with reference to Figure 16A, RLP 950e may include more optical transceivers and/or more pluggable transceiver cages and/or larger pluggable transceiver cages for receiving higher lane-count transceivers. RLP board 958e includes an array of parallel-plane-mating contacts on the bottom surface of the RLP board 958e to electrically couple to corresponding contacts on a system board. RLP board 958e may have twice the number of parallel-plane-mating contacts compared to RLP board 958c illustrated in Figure 16C.

[0065] RLPs as described herein may enable reliable, modular, flexible, and lower cost high lane-count transceiver devices with a lower electrical- mechanical overhead. The RLP board parallel-plane-mating with a system board may provide electrical high-speed signal connectively (e.g., 25 Gbps/lane or 50 Gbps/lane) with minimum losses. The RLP faceplate, which may be as tall as the system faceplate, enables multiple connectors to be supported on the faceplate. The size of the RLP faceplate may also be changed without changing the RLP board. The RLPs allow easy cooling of transceivers on the RLP board. In addition, a switch module supporting RLPs may be configured to support various types of faceplate connectors for downlink and uplink ports, saving development cost as well as product module proliferation costs.

[0066] Although specific examples have been illustrated and described herein, a variety of alternate and/or equivalent implementations may be substituted for the specific examples shown and described without departing from the scope of the present disclosure. This application is intended to cover any adaptations or variations of the specific examples discussed herein. Therefore, it is intended that this disclosure be limited only by the claims and the equivalents thereof.

Claims

1 . A removable module comprising:

a module board to electrically couple the removable module to a system, the module board comprising an alignment mechanism to align the module board with a system board of the system, the system board electrically coupled to a system chip; and

a module faceplate perpendicular to the module board, the module faceplate to fill a void in a system faceplate of the system.

2. The removable module of claim 1 , further comprising:

a pluggable transceiver cage electrically coupled to the module board; and

a cable electrically coupled to the module board to electrically couple the removable module to the system.

3. The removable module of claim 1 , further comprising:

a pluggable transceiver cage electrically coupled to the module board, wherein the module board comprises an array of parallel-plane-mating contacts to electrically couple the removable module to the system board.

4. The removable module of claim 1 , further comprising:

an optical transceiver electrically coupled to the module board;

an optical connector on the module faceplate; and

an optical cable optically coupling the optical connector to the optical transceiver,

wherein the module board comprises an array of parallel-plane-mating contacts to electrically couple the removable module to the system board.

5. The removable module of claim 1 , further comprising: a flex-rigid board assembly comprising the module board electrically coupled to a further board via a flexible portion of the flex-rigid board assembly, the further board perpendicular to the module board; and

a transceiver cage electrically coupled to the further board,

6. The removable module of claim 1 , further comprising:

a flex-rigid board assembly comprising the module board electrically coupled to a first further board via a first flexible portion of the flex-rigid board assembly and a second further board via a second flexible portion of the flex- rigid board assembly, the first further board and the second further board perpendicular to the module board;

a first transceiver cage electrically coupled to the first further board; and a second transceiver cage electrically coupled to the second further board,

7. The removable module of claim 1 , further comprising:

a flex-rigid board assembly comprising the module board electrically coupled to a further board via a flexible portion of the flex-rigid board assembly, the further board perpendicular to the module board;

an optical transceiver electrically coupled to the further board;

an optical connector on the module faceplate; and

8. The removable module of claim 1 , further comprising: a further module board to electrically couple the removable module to a system, the further module board coplanar with the module board.

9. The removable module of claim 1 , further comprising:

an electrical power connector on the module faceplate, the electrical power connector electrically coupled to the module board.

10. The removable module of claim 1 , wherein the alignment mechanism is to electrically couple to the system board to provide power to the removable module.

1 1 . A system comprising:

a system board comprising an array of parallel-plane-mating contacts to electrically couple to a removable module;

a system faceplate perpendicular to the system board, the faceplate having a void to receive a faceplate of the removable module;

an alignment pin extending from the system board to be received by an alignment socket of the removable module; and

a retention mechanism to secure the removable module to the system board.

12. The system of claim 1 1 , wherein the alignment pin is to provide power to the removable module.

13. A system comprising:

a system board;

a system chip electrically coupled to the system board;

a system faceplate perpendicular to the system board, the system faceplate having a void; and

a removable module comprising a module board and a module faceplate perpendicular to the module board, the module faceplate to fill the void in the system faceplate, wherein the removable module is installable on the system board with the module board parallel to the system board.

14. The system of claim 13, wherein the module board comprises an array of parallel-plane-mating contacts to electrically couple the removable module to the system board.

15. The system of claim 13, wherein the removable module comprises:

an optical connector on the module faceplate; and

an optical transceiver optically coupled to the optical connector and electrically coupled to the module board.