JPH11266087A - Mounting structure of printed board - Google Patents
Mounting structure of printed boardInfo
- Publication number
- JPH11266087A JPH11266087A JP10087994A JP8799498A JPH11266087A JP H11266087 A JPH11266087 A JP H11266087A JP 10087994 A JP10087994 A JP 10087994A JP 8799498 A JP8799498 A JP 8799498A JP H11266087 A JPH11266087 A JP H11266087A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- support member
- groove
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、プリント基板実装
構造に関し、特に、プリント基板に外部から荷重や衝撃
が加わりやすい携帯型端末装置等に使用されるプリント
基板の実装構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board mounting structure, and more particularly to a printed circuit board mounting structure used in a portable terminal device or the like in which a load or impact is easily applied to a printed circuit board from the outside.
【0002】[0002]
【従来の技術及びその課題】従来、携帯型端末装置に実
装されるプリント基板には、外部から荷重や衝撃が加わ
りやすく、プリント基板とその上面に配置された電子部
品の破壊を防止するため、種々の方法が採られている。2. Description of the Related Art Conventionally, a printed circuit board mounted on a portable terminal device is easily subjected to a load or impact from the outside. In order to prevent the printed circuit board and electronic components disposed on the upper surface thereof from being destroyed, Various methods have been adopted.
【0003】例えば、図8に示す特開平3−00609
7号公報に記載の発明では、プリント基板の実装構造1
0が、プリント基板11と、このプリント基板11を支
える保持部材12と、プリント基板11を固定する固定
部材13と、これら両部材12、13を結合するための
固定ねじ14によって構成され、装置に加わる荷重や衝
撃は、固定部材13から固定ねじ14を介してプリント
基板11に伝達される。[0003] For example, FIG.
According to the invention described in Japanese Patent Application Publication No. 7-107, the printed circuit board mounting structure 1
Reference numeral 0 denotes a printed circuit board, a holding member 12 for supporting the printed circuit board 11, a fixing member 13 for fixing the printed circuit board 11, and a fixing screw 14 for connecting the two members 12, 13. The applied load or impact is transmitted from the fixing member 13 to the printed circuit board 11 via the fixing screw 14.
【0004】ここで、プリント基板11の取付部の切り
欠きの形状と保持部材12を適切な形状とすることによ
り、所望の取付強度を得ることができるとともに、保持
部材12を変形させることにより、装置に加わる荷重と
衝撃を緩和することができる。Here, by setting the shape of the notch in the mounting portion of the printed circuit board 11 and the holding member 12 to an appropriate shape, a desired mounting strength can be obtained, and by deforming the holding member 12, The load and impact applied to the device can be reduced.
【0005】しかし、上記従来のプリント基板の実装構
造においては、携帯型端末装置に使用されるプリント基
板のように、小型、軽量化を目的とした薄い基板材料を
採用した場合には、プリント基板11の保持部材12と
の係合部近傍に応力が集中しやすくなり、プリント基板
そのものが脆性破壊を起こしやすくなるという問題があ
る。However, in the above-described conventional printed circuit board mounting structure, when a thin substrate material for the purpose of reducing the size and weight is used, such as a printed circuit board used for a portable terminal device, the printed circuit board is not used. There is a problem that stress is likely to concentrate near the engaging portion of the printed circuit board 11 with the holding member 12, and the printed circuit board itself is liable to cause brittle fracture.
【0006】また、保持部材12を固定部材13に固定
するために固定ねじ14を使用しているため、プリント
基板の実装構造10の生産性の向上及び装置の軽量化を
図る上で障害になる。Further, since the fixing screw 14 is used to fix the holding member 12 to the fixing member 13, it becomes an obstacle in improving the productivity of the printed circuit board mounting structure 10 and reducing the weight of the device. .
【0007】一方、第2の従来例として、図9に示され
る実開昭63−121489号公報に記載のプリント基
板の実装構造20は、プリント基板21と、弾性材料か
らなる支持部材22と、支持部材22の位置決めを行う
筐体23のガイドピン23aと、支持部材22を固定す
る筐体23のボス23bで構成され、プリント基板21
の取付孔に予め支持部材22を被着し、これらをガイド
ピン23aに押し込んで位置決めを行う。さらに、筐体
23のボス23bで支持部材22を上方から押さえるこ
とにより支持部材22を介してプリント基板21を固定
している。On the other hand, as a second conventional example, a printed circuit board mounting structure 20 described in Japanese Utility Model Laid-Open Publication No. 63-121489 shown in FIG. 9 includes a printed circuit board 21, a support member 22 made of an elastic material, and The printed circuit board 21 includes a guide pin 23 a of a housing 23 for positioning the support member 22 and a boss 23 b of the housing 23 for fixing the support member 22.
The support member 22 is previously attached to the mounting hole of the above, and these are pushed into the guide pins 23a to perform positioning. Further, the printed circuit board 21 is fixed via the support member 22 by pressing the support member 22 from above with the boss 23b of the housing 23.
【0008】しかし、このプリント基板の実装構造20
においては、支持部材22をプリント基板21に穿設さ
れた取付孔に被着する必要があるため、プリント基板2
1を加工する必要があるとともに、支持部材22の外径
をプリント基板21の取付孔より大きくする必要があ
り、支持部材22をその外径より小さい孔にはめ込み被
着するのは作業性が悪く、生産性の向上を妨げるという
問題がある。However, this printed circuit board mounting structure 20
In this case, since the support member 22 needs to be attached to the mounting hole formed in the printed circuit board 21,
In addition, it is necessary to machine the support member 22, and it is necessary to make the outer diameter of the support member 22 larger than the mounting hole of the printed circuit board 21, and it is difficult to work by fitting the support member 22 into a hole smaller than the outer diameter. However, there is a problem in that productivity is hindered.
【0009】さらに、支持部材22をボス23bで押さ
えることによって固定するため、プリント基板21の取
付部近傍が拘束され易く、プリント基板21の取付部の
自由度が小さい。そのため、プリント基板21を弾性体
によって形成して、衝撃を吸収したとしても、静的な曲
げ、ねじり変形が大きいと、プリント基板21に反りや
曲がりが生じ易く、プリント基板21の配線の断線や半
田付け部品の半田部に亀裂を生じさせるという問題があ
る。Further, since the support member 22 is fixed by pressing it with the boss 23b, the vicinity of the mounting portion of the printed circuit board 21 is easily restrained, and the degree of freedom of the mounting portion of the printed circuit board 21 is small. Therefore, even if the printed circuit board 21 is formed of an elastic body and the impact is absorbed, if the static bending and torsion deformation are large, the printed circuit board 21 is likely to be warped or bent, and the wiring of the printed circuit board 21 may be disconnected or broken. There is a problem that a crack is generated in the solder part of the soldered component.
【0010】そこで、本発明は、上記従来のプリント基
板の実装構造における問題点に鑑みてなされたものであ
って、小型、軽量化を目的とした薄い基板材料を採用し
た場合でも、プリント基板の脆性破壊、プリント基板の
反りや曲がりが生じ難いためプリント基板とその上面に
配置された電子部品の破壊を防止することができるとと
もに、プリント基板の加工が容易かつ組立時の作業性が
良いため生産性を向上させることができ、装置の軽量化
を図ることも可能なプリント基板の実装構造を提供する
ことを目的とする。In view of the above, the present invention has been made in view of the above-mentioned problems in the conventional mounting structure of a printed circuit board. Since brittle fracture and warpage or bending of the printed circuit board are unlikely to occur, it is possible to prevent damage to the printed circuit board and the electronic components disposed on the upper surface thereof, and it is easy to process the printed circuit board and has good workability during assembly, so production It is an object of the present invention to provide a printed circuit board mounting structure capable of improving the performance and reducing the weight of the device.
【0011】[0011]
【課題を解決するための手段】請求項1記載の発明は、
プリント基板の実装構造であって、プリント基板の周辺
部に設けられ、該プリント基板の縁部に向かって開いた
切り欠き部と、該プリント基板が実装される筐体に立設
されたガイドピンと、前記切り欠き部に挿入可能な溝部
と、前記ガイドピンと係合可能な穴部と、前記溝部と該
穴部との間に形成され、該溝部及び該穴部の周辺の厚さ
よりも薄く形成された緩衝部からなる弾性支持部材で構
成されることを特徴とする。According to the first aspect of the present invention,
A printed circuit board mounting structure, wherein a notch provided on the periphery of the printed circuit board and opened toward an edge of the printed circuit board, and a guide pin provided upright on a housing on which the printed circuit board is mounted. A groove that can be inserted into the notch, a hole that can be engaged with the guide pin, and is formed between the groove and the hole, and is formed thinner than the thickness of the groove and the periphery of the hole. It is characterized by being constituted by an elastic support member formed of a buffer portion.
【0012】請求項2記載の発明は、前記弾性支持部材
は、略々円板状に形成され、外周面に形成された溝部
と、該外周面と略々同じ厚さに形成された中央部に穿設
された穴部と、前記溝部と該穴部との間に形成され、前
記外周面及び前記中央部の厚さよりも薄く形成された緩
衝部で構成されることを特徴とする。According to a second aspect of the present invention, the elastic supporting member is formed in a substantially disk shape, and has a groove formed on an outer peripheral surface thereof and a central portion formed to have substantially the same thickness as the outer peripheral surface. And a buffer portion formed between the groove portion and the hole portion, and formed to be thinner than the thickness of the outer peripheral surface and the central portion.
【0013】請求項3記載の発明は、前記弾性支持部材
は、略々コマ状に形成され、外周面に形成された溝部
と、該外周面と略々同じ厚さに形成され、前記外周面が
存在する面から離間した面内に存在し、前記外周面より
小径の中央部に穿設された穴部と、前記溝部と該穴部と
の間に形成され、前記外周面及び前記中央部の厚さより
も薄く形成された円錐面状緩衝部で構成されることを特
徴とするAccording to a third aspect of the present invention, the elastic supporting member is formed in a substantially coma shape, a groove formed on the outer peripheral surface, and formed to have substantially the same thickness as the outer peripheral surface. A hole that is located in a plane separated from the plane where the hole exists, and is formed in a central portion having a smaller diameter than the outer peripheral surface, and is formed between the groove portion and the hole portion, and the outer peripheral surface and the central portion are formed. It is characterized by comprising a conical surface buffer part formed thinner than the thickness of
【0014】そして、請求項1記載の発明によれば、切
り欠き部に弾性支持部材が均等に接触するため、プリン
ト基板の脆性破壊が生じ難く、プリント基板には、周辺
部に縁部に向かって開いた切り欠き部を形成するだけで
あるので、加工が容易であり、かつ弾性支持部材をプリ
ント基板の縁部から差し込むだけで容易に取り付けるこ
とができるため組立時の作業性が良く、筐体に立設され
たガイドピンと弾性支持部材の穴部を係合させるだけで
良いので、ねじ等を使用する必要がない。そして、弾性
支持部材の弾性特性、形状及び組み合わされるガイドピ
ンの径等を適切に選択することにより、筐体のねじれや
曲げなどの変形による静的な外力と、衝撃や落下による
衝撃に対して、支持部材の弾性変形により緩衝し、プリ
ント基板の変形を抑制してプリント基板の配線の断線や
半田付け部品の半田に亀裂等が生ずるのを防止すること
ができる。According to the first aspect of the present invention, since the elastic support member uniformly contacts the notch, the brittle fracture of the printed circuit board hardly occurs, and the printed circuit board has a peripheral portion toward the edge. It is easy to work because it only forms a notched part that is open and the elastic support member can be easily attached by simply inserting the elastic support member from the edge of the printed circuit board. It is only necessary to engage the guide pin provided on the body with the hole of the elastic support member, so that it is not necessary to use screws or the like. By appropriately selecting the elastic characteristics and shape of the elastic support member and the diameter of the guide pin to be combined, etc., static external force due to deformation such as torsion or bending of the housing, and impact due to impact or drop In addition, the elastic deformation of the support member dampens and suppresses the deformation of the printed circuit board, thereby preventing disconnection of the wiring of the printed circuit board and the occurrence of cracks in the solder of the soldered components.
【0015】また、 請求項2記載の発明によれば、弾
性支持部材の弾性変形の程度を比較的小さくすることが
できる。According to the second aspect of the invention, the degree of elastic deformation of the elastic support member can be made relatively small.
【0016】請求項3記載の発明によれば、弾性支持部
材の弾性変形の程度を比較的大きくすることができる。According to the third aspect of the invention, the degree of elastic deformation of the elastic support member can be made relatively large.
【0017】[0017]
【発明の実施の形態】次に、本発明にかかるプリント基
板の実装構造の実施の形態の具体例を図面を参照しなが
ら説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a specific example of an embodiment of a printed circuit board mounting structure according to the present invention will be described with reference to the drawings.
【0018】図1は、本発明にかかるプリント基板の実
装構造の第1実施例を示す図であって、このプリント基
板の実装構造5は、プリント基板1と、支持部材2と、
筐体3とによって構成される。FIG. 1 is a view showing a first embodiment of a printed circuit board mounting structure according to the present invention. The printed circuit board mounting structure 5 includes a printed circuit board 1, a support member 2,
It is constituted by the housing 3.
【0019】プリント基板1は、その周辺部の適当な位
置に複数の取付用U字形切り欠き部1aを有する。The printed circuit board 1 has a plurality of U-shaped notches 1a for attachment at appropriate positions around the periphery.
【0020】支持部材2は、切り欠き部1aに押し込ま
れる弾性材料からなる部材である。この材料には、ゴ
ム、ウレンタン、エラストマー、ナイロンのような変形
に対する許容度、復元力が大きい高分子材料が好適であ
る。The support member 2 is a member made of an elastic material which is pushed into the notch 1a. For this material, a polymer material such as rubber, urethane, elastomer, and nylon, which has a large tolerance to deformation and a large restoring force, is preferable.
【0021】支持部材2の外周面には、切り欠き部1a
に嵌合する溝部2aが形成される。この溝部2aの幅
は、プリント基板1の厚さと略々同じか、わずかに小さ
く形成される。支持部材2の中心には筐体3のガイドピ
ン3aが挿入される穴部2bが穿設される。尚、穴部2
bとガイドピン3aは、所望の取付強度及び自由度を得
るため、穴部2bの径は、ガイドピン3aの径よりもわ
ずかに小さく形成される。支持部材2の周辺の溝部2a
と中心の穴部2bとの間には、肉厚を薄くして筐体3か
ら伝わる荷重及び衝撃に対して変形して緩衝する緩衝部
2cが備えられる。そして、緩衝部2cの形状を適宜変
更することにより、種々の環境下において適切な緩衝効
果を発揮させることが可能となる。A notch 1a is formed on the outer peripheral surface of the support member 2.
Is formed. The width of the groove 2a is formed to be substantially the same as or slightly smaller than the thickness of the printed circuit board 1. A hole 2b into which the guide pin 3a of the housing 3 is inserted is formed in the center of the support member 2. The hole 2
The diameter of the hole 2b is slightly smaller than the diameter of the guide pin 3a in order to obtain the desired mounting strength and the degree of freedom of the guide pin 3a. Groove 2a around support member 2
A buffer 2c is provided between the hole 3b and the central hole 2b to reduce the thickness and deform and buffer the load and impact transmitted from the housing 3. By appropriately changing the shape of the buffer 2c, an appropriate buffer effect can be exhibited in various environments.
【0022】ガイドピン3aは筐体3の一部とするか、
または図2に示すように、筐体3とは別体のガイドピン
3a’としても良く、その場合には、筐体3に圧入等に
て一体化される。Whether the guide pin 3a is a part of the housing 3,
Alternatively, as shown in FIG. 2, a guide pin 3 a ′ may be provided separately from the housing 3. In that case, the guide pins 3 a ′ are integrated with the housing 3 by press fitting or the like.
【0023】次に、上記構成を有するプリント基板の実
装構造5の動作を図3を参照して説明する。Next, the operation of the printed circuit board mounting structure 5 having the above configuration will be described with reference to FIG.
【0024】図3(a)に示すように、支持部材2の溝
部2aをプリント基板1の切り欠き部1aに対して矢印
B方向に押し込む。ここで、溝部2aの幅は、プリント
基板1の厚さと略々同じか、わずかに小さいため、支持
部材2はプリント基板1から容易に脱落せず、支持部材
2をプリント基板1に取り付けたままの状態で以後取り
扱うことができる。As shown in FIG. 3A, the groove 2a of the support member 2 is pushed in the direction of arrow B into the notch 1a of the printed circuit board 1. Here, since the width of the groove 2a is substantially the same as or slightly smaller than the thickness of the printed circuit board 1, the support member 2 does not easily fall off the printed circuit board 1, and the support member 2 is still attached to the printed circuit board 1. Can be handled hereafter.
【0025】次に、図3(b)に示すように、プリント
基板1に支持部材2を取り付けた状態でこれらを矢印C
方向に移動し、ガイドピン3a及び穴部2b(図1)を
介して、筐体3に支持部材2を差し込む、ここでも、穴
部2bの径は、ガイドピン3aの径よりもわずかに小さ
いため、支持部材2と筐体3との間の摩擦によりプリン
ト基板1を保持することが可能となり、ねじや工具を使
用しないでプリント基板の実装構造5の組立て及び保守
が可能となる。Next, as shown in FIG. 3B, with the support member 2 attached to the printed circuit board 1,
The support member 2 is inserted into the housing 3 via the guide pin 3a and the hole 2b (FIG. 1). Here, the diameter of the hole 2b is slightly smaller than the diameter of the guide pin 3a. Therefore, the printed circuit board 1 can be held by the friction between the support member 2 and the housing 3, and the assembly and maintenance of the printed circuit board mounting structure 5 can be performed without using screws or tools.
【0026】図4は、プリント基板の実装構造5を使用
してプリント基板1を筐体3に実装した状態を示し、図
4(a)は、筐体3が外力により静的に矢印D方向にね
じれた状態を示す。筐体3のねじれによる変位は、支持
部材2の緩衝部2cの変形によって吸収され、プリント
基板1には筐体3の変形が直接伝わることはなく、プリ
ント基板1の反りや曲がりを最小限に押さえることがで
きる。FIG. 4 shows a state in which the printed circuit board 1 is mounted on the housing 3 using the mounting structure 5 of the printed circuit board. FIG. Shows a twisted state. The displacement of the housing 3 due to the torsion is absorbed by the deformation of the buffer portion 2c of the support member 2, and the deformation of the housing 3 is not directly transmitted to the printed board 1, so that the warpage or bending of the printed board 1 is minimized. Can be held down.
【0027】図4(b)は、支持部材2を使用してプリ
ント基板1を筐体3に実装した状態において、筐体3に
矢印E方向の衝撃が加えられた状態を示す。この衝撃に
より、瞬間的にガイドピン3aがE方向に移動するが、
この変位は支持部材2の緩衝部2cの変形によって緩衝
され、プリント基板1には筐体3の衝撃が直接加わるこ
とはなく、プリント基板1とその上面に半田付けされた
電子部品に与える影響を最小限に押さえることができ
る。FIG. 4B shows a state in which a shock in the direction of arrow E is applied to the housing 3 in a state where the printed circuit board 1 is mounted on the housing 3 using the support member 2. Due to this impact, the guide pin 3a momentarily moves in the E direction,
This displacement is buffered by the deformation of the buffer portion 2c of the support member 2, so that the impact of the housing 3 is not directly applied to the printed board 1, and the influence on the printed board 1 and the electronic components soldered to the upper surface thereof is affected. It can be kept to a minimum.
【0028】次に、図5を参照しながら、支持部材2を
使用してプリント基板1を筐体3に実装する要領につい
て具体的に説明する。Next, the procedure for mounting the printed circuit board 1 on the housing 3 using the support member 2 will be described in detail with reference to FIG.
【0029】ここで、プリント基板1の厚さは0.8m
mとし、ゴム成形により外径が8mm、穴部2bの径が
1.8mm、溝部2aの溝幅が0.7mmの支持部材2
を使用し、直径2mmのガイドピン3aが筐体3と一体
に射出成形されているものとする。Here, the thickness of the printed circuit board 1 is 0.8 m.
m, the outer diameter is 8 mm by rubber molding, the diameter of the hole 2b is 1.8 mm, and the groove width of the groove 2a is 0.7 mm.
And a guide pin 3a having a diameter of 2 mm is integrally formed with the housing 3 by injection molding.
【0030】プリント基板1の周辺部の4箇所に切り欠
き部1aが形成され、この切り欠きの形状に対応して形
成された支持部材2をF方向に移動し、切り欠き部1a
に押し込む。ここで、溝部2aの溝幅が0.7mm、プ
リント基板1の厚さが0.8mmであり、ゴム成形材の
弾性を利用して支持部材2を押し込むので、不用意に支
持部材2がプリント基板1から脱落することはなく、支
持部材2をプリント基板1に取り付けたままの状態で以
後取り扱うことができる。Notches 1a are formed at four places around the periphery of the printed circuit board 1. The support member 2 formed corresponding to the shape of the notches is moved in the direction F to form the notches 1a.
Press Here, the groove width of the groove 2a is 0.7 mm, the thickness of the printed circuit board 1 is 0.8 mm, and the support member 2 is pushed in by utilizing the elasticity of the rubber molding material. The support member 2 does not fall off from the substrate 1 and can be handled thereafter with the support member 2 still attached to the printed circuit board 1.
【0031】支持部材2を押し込んだプリント基板1
は、筐体3のガイドピン3aに対して上方からG方向に
下降させ、支持部材2の穴部2bをガイドピン3aに圧
入するだけでプリント基板1の実装が完了する。ここ
で、穴部2bの径が1.8mm、ガイドピン3aの径が
2mmであるため、支持部材2の弾性力による摩擦によ
ってプリント基板1を保持することができる。Printed circuit board 1 into which support member 2 has been pushed
The mounting of the printed circuit board 1 is completed only by lowering the guide pins 3a of the housing 3 from above in the G direction and press-fitting the holes 2b of the support members 2 into the guide pins 3a. Here, since the diameter of the hole 2b is 1.8 mm and the diameter of the guide pin 3a is 2 mm, the printed circuit board 1 can be held by friction caused by the elastic force of the support member 2.
【0032】次に、本発明にかかるプリント基板の実装
構造の第2実施例を図6を参照しながら説明する。Next, a second embodiment of the printed circuit board mounting structure according to the present invention will be described with reference to FIG.
【0033】本実施例では、支持部材2’の溝部2a’
の高さを、図1の第1実施例の外周面に形成された溝部
2aとは異なる高さに設定し、緩衝部2c’を円錐面状
に大きく形成し、より大きな筐体3の変形や衝撃に対し
て自由度を大きくし、プリント基板1に対する影響を最
小限に押さえたものである。尚、支持部材2’の材質、
溝部2a’の溝幅とプリント基板1の厚さとの関係、穴
部2b’の径とガイドピン3aの径との関係、緩衝部2
c’の厚さ等は、支持部材2の場合と同様である。In this embodiment, the groove 2a 'of the support member 2'
Is set to a height different from that of the groove 2a formed on the outer peripheral surface of the first embodiment of FIG. 1, the buffer 2c 'is formed to have a large conical surface, and the larger housing 3 is deformed. In this case, the degree of freedom with respect to shock and impact is increased, and the influence on the printed circuit board 1 is minimized. In addition, the material of the support member 2 ',
The relationship between the groove width of the groove 2a 'and the thickness of the printed circuit board 1, the relationship between the diameter of the hole 2b' and the diameter of the guide pin 3a, the buffer 2
The thickness of c ′ and the like are the same as those of the support member 2.
【0034】図7に示すように、プリント基板1の切り
欠き部1aの位置に応じて使用する支持部材を変化させ
ている。As shown in FIG. 7, the support member to be used is changed according to the position of the cutout portion 1a of the printed circuit board 1.
【0035】すなわち、プリント基板1の縦横の中央の
切り欠き部1aに対しては比較的変形の小さい支持部材
2を使用し、プリント基板1の四隅の切り欠き部1aに
対しては、より変形に関して自由度の大きい支持部材
2’を使用する。この支持部材2’も支持部材2と同様
にH方向に移動させて切り欠き部1aに挿入する。この
ように支持部材2、2’を適宜選択することにより、筐
体3のねじれに対してプリント基板1の変形を最小限に
押さえながら筐体3へ確実に実装することができる。That is, the support member 2 having relatively small deformation is used for the center notch 1a in the vertical and horizontal directions of the printed board 1, and the notch 1a at the four corners of the printed board 1 is more deformed. The supporting member 2 'having a large degree of freedom is used. This support member 2 'is also moved in the H direction similarly to the support member 2, and is inserted into the notch 1a. By appropriately selecting the support members 2 and 2 'in this manner, the printed circuit board 1 can be reliably mounted on the housing 3 while minimizing deformation of the printed circuit board 1 due to twisting of the housing 3.
【0036】[0036]
【発明の効果】請求項1記載の発明によれば、プリント
基板の脆性破壊が生じ難く、加工が容易であり、組立時
の作業性が良く、ねじ等を使用する必要がないので軽量
化が可能で、筐体のねじれや曲げなどの変形による静的
な外力と、衝撃や落下による衝撃に対して、支持部材の
弾性変形により緩衝し、プリント基板の変形を抑制して
プリント基板の配線の断線や半田付け部品の半田に亀裂
等が生ずるのを防止することが可能なプリント基板の実
装構造を提供することができる。According to the first aspect of the present invention, the printed circuit board is less likely to be brittlely broken, the processing is easy, the workability at the time of assembling is good, and there is no need to use screws or the like, so that the weight is reduced. It is possible to buffer the static external force due to deformation such as twisting or bending of the housing and the shock due to shock or drop by the elastic deformation of the support member, suppress the deformation of the printed circuit board and reduce the wiring of the printed circuit board. It is possible to provide a printed circuit board mounting structure capable of preventing the occurrence of cracks or the like in the disconnection or in the solder of the soldered component.
【0037】請求項2記載の発明によれば、弾性支持部
材の弾性変形の程度を比較的小さくすることができるた
め、筐体の変形や衝撃に対する自由度が比較的小さくて
済む箇所に使用することが可能なプリント基板の実装構
造を提供することができる。According to the second aspect of the present invention, since the degree of elastic deformation of the elastic support member can be made relatively small, the elastic support member is used in a place where the degree of freedom for deformation and impact of the housing is relatively small. It is possible to provide a printed circuit board mounting structure capable of performing the above.
【0038】請求項3記載の発明によれば、弾性支持部
材の弾性変形の程度を比較的大きくすることができるた
め、筐体の変形や衝撃に対して比較的に大きな自由度が
必要な箇所に使用することが可能なプリント基板の実装
構造を提供することができる。According to the third aspect of the present invention, since the degree of elastic deformation of the elastic support member can be made relatively large, a portion requiring a relatively large degree of freedom with respect to deformation or impact of the housing is required. It is possible to provide a mounting structure of a printed circuit board that can be used for a printed circuit board.
【図1】本発明にかかるプリント基板の実装構造の第1
実施例を示す図であって、(a)は平面図、(b)は図
(a)のA−A線断面図である。FIG. 1 is a first view of a printed circuit board mounting structure according to the present invention.
It is a figure which shows an Example, (a) is a top view and (b) is a sectional view on the AA line of (a) of FIG.
【図2】図1のプリント基板の実装構造において、ガイ
ドピンを筐体と別部材とした場合を示す断面図である。FIG. 2 is a cross-sectional view showing a case where guide pins are formed as separate members from a housing in the printed circuit board mounting structure of FIG. 1;
【図3】図1のプリント基板の実装構造のプリント基板
と支持部材の取付要領を説明するための斜視図であっ
て、(a)はプリント基板への支持部材の取付前の状態
を示す図、(b)はプリント基板へ支持部材が取り付け
られた後であって、ガイドピンへの挿入前の状態を示す
図である。3A and 3B are perspective views for explaining a procedure for mounting a printed circuit board and a support member of the printed circuit board mounting structure of FIG. 1, and FIG. 3A illustrates a state before the support member is mounted on the printed circuit board; (B) is a diagram showing a state after the support member is attached to the printed circuit board and before insertion into the guide pin.
【図4】図1のプリント基板の実装構造において筐体に
外力が加えられた場合の支持部材2の変形状態を示す図
であって、(a)は、D方向のねじれが加えられた状態
を、(b)はE方向の衝撃が加えられた状態を示す図で
ある。4A and 4B are diagrams illustrating a deformation state of the support member 2 when an external force is applied to the housing in the printed circuit board mounting structure of FIG. 1, wherein FIG. 4A illustrates a state where a twist in a D direction is applied; (B) is a diagram showing a state in which an impact in the E direction is applied.
【図5】図1のプリント基板の実装構造の組立要領を説
明するための斜視図である。FIG. 5 is a perspective view for explaining how to assemble the printed circuit board mounting structure of FIG. 1;
【図6】本発明にかかるプリント基板の実装構造の第2
実施例を示す断面図である。FIG. 6 shows a second embodiment of the printed circuit board mounting structure according to the present invention.
It is sectional drawing which shows an Example.
【図7】図6のプリント基板の実装構造の組立要領を説
明するための斜視図である。FIG. 7 is a perspective view for explaining an assembly procedure of the printed circuit board mounting structure of FIG. 6;
【図8】従来のプリント基板の実装構造の第1の例を示
す斜視図である。FIG. 8 is a perspective view showing a first example of a conventional printed circuit board mounting structure.
【図9】従来のプリント基板の実装構造の第2の例を示
す斜視図である。FIG. 9 is a perspective view showing a second example of a conventional printed circuit board mounting structure.
【符号の説明】 1 プリント基板 1a 切り欠き部 2、2’支持部材 2a、2a’ 溝部 2b 穴部 2c、2c’ 緩衝部 3 筐体 3a、3a’ ガイドピン 5 プリント基板の実装構造DESCRIPTION OF REFERENCE NUMERALS 1 printed board 1a cutout 2, 2 'support member 2a, 2a' groove 2b hole 2c, 2c 'buffer 3 housing 3a, 3a' guide pin 5 printed board mounting structure
Claims (3)
リント基板の縁部に向かって開いた切り欠き部と、 該プリント基板が実装される筐体に立設されたガイドピ
ンと、 前記切り欠き部に挿入可能な溝部と、前記ガイドピンと
係合可能な穴部と、前記溝部と該穴部との間に形成さ
れ、該溝部及び該穴部の周辺の厚さよりも薄く形成され
た緩衝部からなる弾性支持部材で構成されることを特徴
とするプリント基板の実装構造。1. A notch provided in a peripheral portion of a printed circuit board and opened toward an edge of the printed circuit board; a guide pin erected on a housing on which the printed circuit board is mounted; A groove that can be inserted into the groove, a hole that can be engaged with the guide pin, and a buffer formed between the groove and the hole, and formed to be thinner than the thickness of the groove and the periphery of the hole. A printed circuit board mounting structure comprising an elastic support member made of:
され、 外周面に形成された溝部と、 該外周面と略々同じ厚さに形成された中央部に穿設され
た穴部と、 前記溝部と該穴部との間に形成され、前記外周面及び前
記中央部の厚さよりも薄く形成された緩衝部で構成され
ることを特徴とする請求項1記載のプリント基板の実装
構造。2. The elastic support member is formed in a substantially disk shape, and has a groove formed in an outer peripheral surface thereof, and a hole formed in a central portion having substantially the same thickness as the outer peripheral surface. The printed circuit board according to claim 1, further comprising a buffer portion formed between the groove portion and the hole portion, the buffer portion being formed thinner than the thickness of the outer peripheral surface and the central portion. Mounting structure.
され、 外周面に形成された溝部と、 該外周面と略々同じ厚さに形成され、前記外周面が存在
する面から離間した面内に存在し、前記外周面より小径
の中央部に穿設された穴部と、 前記溝部と該穴部との間に形成され、前記外周面及び前
記中央部の厚さよりも薄く形成された円錐面状緩衝部で
構成されることを特徴とする請求項1記載のプリント基
板の実装構造。3. The elastic support member is formed in a substantially coma shape, a groove formed on an outer peripheral surface, and formed to have substantially the same thickness as the outer peripheral surface, and is separated from a surface on which the outer peripheral surface exists. A hole that is present in the center and has a smaller diameter than the outer peripheral surface, and is formed between the groove and the hole, and is formed thinner than the thickness of the outer peripheral surface and the central portion. The printed circuit board mounting structure according to claim 1, wherein the mounting structure is constituted by a conical buffer portion formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10087994A JPH11266087A (en) | 1998-03-17 | 1998-03-17 | Mounting structure of printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10087994A JPH11266087A (en) | 1998-03-17 | 1998-03-17 | Mounting structure of printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11266087A true JPH11266087A (en) | 1999-09-28 |
Family
ID=13930367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10087994A Withdrawn JPH11266087A (en) | 1998-03-17 | 1998-03-17 | Mounting structure of printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH11266087A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006216689A (en) * | 2005-02-02 | 2006-08-17 | Fujikura Ltd | Fixing structure of flexible wiring board |
JP2008166389A (en) * | 2006-12-27 | 2008-07-17 | Funai Electric Co Ltd | Substrate mounting tool |
-
1998
- 1998-03-17 JP JP10087994A patent/JPH11266087A/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006216689A (en) * | 2005-02-02 | 2006-08-17 | Fujikura Ltd | Fixing structure of flexible wiring board |
JP2008166389A (en) * | 2006-12-27 | 2008-07-17 | Funai Electric Co Ltd | Substrate mounting tool |
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A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20050607 |