JPH1126240A - Laminated composite lc parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the reliability of laminated composite LC parts by reducing the occurrence of disconnection by reducing the strain of a conductor pattern caused by a molding density difference in the components. SOLUTION: Dummy patterns J1-J3 are formed with a same diameter immediately below a via hole D3, which is positioned between the conductors E1, E2, E3, and E4 for inductor and conductors F1, F2, Fe, and F4 for inductor of an inductor section 30, namely, at nearly the center of laminated composite LC components. Because of the dummy patterns J1-J3, the bottom side thickness of the hole D3 and, accordingly, the molding density are increased and the indentation of the via hole D3 is reduced against the connecting pressure of the hole D3. Therefore, the disconnection of the conductors E1, F1,..., E3, and F3 can be prevented, because the strains of the conductors to the center sides are reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated LC composite component including an inductor (coil) and a capacitor (capacitor), and more particularly, to an improvement in the molding density of the laminated structure.

[0002]

2. Description of the Related Art A laminated LC composite component used for a high-frequency filter circuit or the like has a configuration as shown in FIGS. 4 and 5, for example. FIG. 4A is a cross-sectional view of an ideal state, FIG. 5A is an exploded perspective view showing a laminated state, and FIG.
Is an external perspective view, and FIG. 5C is an equivalent circuit. This background art is an example of an LC composite component constituting a so-called T-type filter as shown in FIG. As shown in FIG. 5A, a capacitor (capacitor) unit 10 is configured by an upper layer, and an inductor (coil) unit 12 is configured by a lower layer. The sheets A1 to A6 forming the capacitor section 10 are formed of, for example, a dielectric material, and the sheets A2 to A5 are formed with capacitor conductors.

On the other hand, the sheets B1 to B8 constituting the inductor section 12 are formed of, for example, a magnetic material, and the sheets B2 to B7 are formed with inductor conductors. Each of the above sheets is laminated, molded, pressed and fired, and a terminal electrode for external drawing is formed on the laminated body, whereby a laminated LC composite component is obtained.

Next, each part will be described in order. First,
Explaining from the capacitor section 10, the sheet A1 is a protective layer. One of the capacitor conductors D1 is formed on each of the sheets A2 and A4. These capacitor conductors D1 are exposed on the front and rear sides of the laminated sheet, and are connected to the GND electrodes (side terminals) 14 shown in FIG. The other capacitor conductor D2 is formed on each of the sheets A3 and A5. These capacitor conductors D2 are connected by via holes D3 (indicated by connection lines) near the center. That is, a window is formed at the center of the above-described capacitor conductor D1, and the upper and lower portions of the capacitor conductor D2 are connected by a via hole D3 passing through this portion. These capacitor conductors D1 and D2 are further laminated if necessary. Sheet A6 is a protective layer. The components described above constitute the capacitor C shown in FIG.

Next, the inductor section 12 will be described. The sheet B1 is a protective layer. Conductors for inductors are formed on the sheets B2 to B7. A substantially U-shaped inductor conductor E1, F1 is formed on the sheet B2.
These inductor conductors E1 and F1 are continuous in a substantially inverted S-shape, and the connection portions are connected to the capacitor side by via holes D3 penetrating the sheet B1.

A substantially U-shaped inductor conductors E2 and F2 are formed on the sheet B3 so that the openings face the opposite sides. And one end of them is via hole G1,
H1 connects to the inductor conductors E1 and F1, respectively. Similarly, a substantially U-shaped inductor conductor E3, F3 is formed on the next sheet B4 so that the opening faces. One ends of the conductors are respectively connected to inductor conductors E2 and F2 by via holes G2 and H2.
2 are connected. Sheet B5 below includes sheet B
Inductor conductors E2 and F2 similar to 3 are formed respectively. The sheet conductors E3 and F3 similar to the sheet B4 are formed on the sheet B6. These inductor conductors E2, F2 and E3, F3 are further multilayered if necessary. On the sheet B7, inductor conductors E4 and F4, each of which has a substantially U-shaped pattern extended and exposed to the left and right sides, respectively, are formed. The lowermost sheet B8 is a protective layer.

[0007] Of the above components, the inductors L1, E2, E3, and E4 and the via holes G1 and G2, which are continuous in a spiral, form the inductor L in FIG.
A is configured. The inductor LB shown in FIG. 5C is constituted by the inductor conductors F1, F2, F3, F4 and the via holes H1, H2 which are continuous in a spiral shape. Then, the inductor conductors E4 and F4 of the sheet B7 are exposed to the left and right from the laminated sheet, and are connected to the terminal electrodes 16 and 18 of FIG. 5B, respectively. FIG. 3E shows a perspective view of the conductor pattern of the inductor section 12.

The sheets on which the conductors for capacitors, conductors for inductors, and via holes are formed as described above are stacked in the order shown in FIG. And
Then, it is formed, pressed and fired to form a laminate. And
Electrodes are formed before, after, and on the left and right of the laminate, and the
Obtain composite parts. FIG. 5B shows the appearance,
The parts have a rectangular parallelepiped shape. Input / output electrodes 16 and 18 are formed at both ends in the longitudinal direction, and the GND electrodes 14 are formed on the side surfaces in a direction perpendicular to the longitudinal direction, that is, on the near side and the far side in the drawing. FIG. 4 (A) shows a cross section of the component as viewed in the direction of the arrow along line # 3 in FIG. 5 (B). As shown in the cross-sectional view, the pillar of the via hole D3 traverses substantially the center of the component, thereby connecting the inductor element and the capacitor element inside the component.

[0009]

As described above, according to the background art, in the capacitor section 10, there is a connection portion by the via hole D3 at the center of the chip. On the other hand, the inductor section 12 has no via hole connection section at the center of the chip. For this reason, at the time of lamination, the high-density via-hole connection part where the pressure increases may be pushed into the center of the low-density inductor part where the pressure is low, and distortion as shown in FIG. . Then, a tensile stress is applied to the conductor pattern of the inductor portion 12, and in some cases, disconnection also occurs, and reliability is reduced.

More specifically, the above-mentioned sheets A1, A2,
.., B1, B2,..., For example, a ceramic green sheet formed with via holes,
One that does not form a via hole is prepared. A sheet without via holes is used as a cover sheet (protective sheet). The above-mentioned conductor pattern for a capacitor or an inductor is screen-printed on a sheet having a via hole, for example, using a conductive paste. At this time, the via holes are filled with a conductive paste. These sheets are alternately stacked, and the cover sheet is stacked on one of the sheets to form the capacitor section 10 or the inductor section 12.
And The conductor patterns are connected by via holes when the sheets are stacked.

Next, the capacitor unit 1 thus obtained
0 and the inductor portion 12 are overlapped and pressed with a flat plate. In this case, there are portions where the printed portions of the conductive paste overlap, and portions where the non-printed portions overlap. The printed portion has the thickness of the conductive paste. For this reason, the printing portion is strongly applied with pressure, and the molding density is increased. However, pressure is not easily applied to the non-printed portion, and the molding density does not increase.

Therefore, as apparent from FIG. 4A, the connection portion of the via hole D3 has the highest density because it penetrates through the capacitor portion 10. On the other hand, in the portion of the inductor portion 12 where the conductor pattern is not printed, the density is low. For this reason, FIG.
, The connection portion of the via hole D3 of the capacitor portion 10 is pushed toward the middle portion of the inductor portion 12, and the inductor conductors E1, F1,... Are distorted toward the center.

The present invention focuses on the above points,
It is an object of the present invention to reduce distortion of a conductor pattern caused by a difference in density inside a component, prevent disconnection, and improve reliability of the component.

[0014]

In order to achieve the above object, the present invention relates to a laminated LC composite component including a capacitor portion and an inductor portion, wherein a corresponding one of the conductors included therein is connected by a hole. A dummy layer is formed corresponding to the hole connection. According to one of the main modes, the dummy layer includes at least one of a dummy pattern and a dummy hole. According to another embodiment, the dummy layer is formed at a position facing the hole connection or in the vicinity thereof. According to still another aspect, the hole connection is a via hole for connecting the capacitor section and the inductor section, and the dummy layer is formed in the inductor section.

According to the present invention, the dummy layer is formed at the position facing the hole connection or in the vicinity thereof. The formation density is improved by the dummy layer, the density difference from the formation density due to the hole connection is reduced, and the distortion is dispersed or reduced.
The above and other objects, features, and advantages of the present invention will be apparent from the following detailed description and the accompanying drawings.

[0016]

Embodiments of the present invention will be described below in detail. (1) First Embodiment First, a first embodiment will be described with reference to FIGS. 1 and 3A.
Will be described. Note that the same reference numerals are used for components corresponding to the above-described background art. FIG.
1A is a cross-sectional view, and FIG. 1B is an exploded perspective view showing a stacked state. This form is also an example of an LC composite component constituting a so-called T-type filter as shown in FIG.
As shown in FIG. 1B, the basic laminated structure is the same as in the above embodiment. That is, the capacitor (capacitor) unit 10 is configured by the upper layer, and the inductor (coil) unit 30 is configured by the lower layer. The sheets A1 to A6 constituting the capacitor section 10 are formed of, for example, a dielectric material. The sheets B1 to B8 constituting the inductor section 30 are formed of, for example, a magnetic material.

The capacitor section 10 has the same configuration as that of the background art, and includes a sheet conductor A1, a capacitor conductor D2, and a via hole D3 on sheets A1 to A6.
Are formed as described above. Inductor section 30
Are also provided on the sheets B1 to B8 with conductors E1 and E for inductors.
2, E3, E4, F1, F2, F3, F4, and via holes G1, G2, H1, H2 are formed as described above.

In the present embodiment, the inductor 30
Between the inductor conductors E1, E2, E3, and E4 and the inductor conductors F1, F2, F3, and F4, that is, in the center of each sheet, as dummy layers J1 and J2.
2,..., J3 are provided. The dummy patterns J1 and J2 are provided repeatedly corresponding to the repetition of the conductor pattern. FIG. 3 (A) shows the inductor section 3
The conductor pattern of 0 is shown in perspective. As shown in this figure, inductor LA (FIG. 5) is formed by inductor conductors E1, E2, E3, E4 and via holes G1, G2.
(C)) and the conductor F for the inductor.
1, F2, F3, F4 and via holes H1, H2 constitute an inductor LB (see FIG. 5C). Dummy patterns J1 to J3 are formed between the inductor patterns. These dummy patterns J1 to J3 have substantially the same diameter as the via holes D3.

The sheets on which the conductors for capacitors, conductors for inductors, via holes and dummy patterns are formed as described above are stacked in the order shown in FIG. Then, it is molded, pressed and fired to form a laminate. The electrodes 1 are placed before and after and left and right of the laminate.
4, 16 and 18 (see FIG. 5B), and
Obtain C composite parts.

FIG. 1A shows a cross section of the composite part according to the present embodiment. As shown in this figure, the pillar of the via hole D3 is located substantially at the center of the component. Furthermore,
In the present embodiment, the dummy patterns J1 to J3 are formed with the same diameter in the center of the inductor section 30, that is, immediately below the via hole D3. For this reason, the thickness below the via hole D3 increases, and the molding density increases. Accordingly, the pressure at the time of molding opposes the pressure at the connection portion of the via hole D3, and the pushing of the via hole portion toward the intermediate portion of the inductor portion 30 is reduced. Therefore, the inductor conductor E as shown in FIG.
The distortion toward the center of 1, F1,... Is also reduced and the disconnection is prevented.

(2) Second Embodiment Next, a second embodiment will be described with reference to FIG. In this embodiment, as shown in the cross section in FIG. 2A and the laminated structure in FIG.
Instead of 1 to J3, dummy holes K connected between layers are formed penetrating through the sheets B3 to B7. The dummy hole K is formed at the center of the inductor portion 40, that is, directly below the via hole D3, with the same diameter. For this reason, the thickness below the via hole D3 increases, and the molding density increases. Therefore, the pressure at the time of molding is reduced to the via hole D3.
And the pressure of the via hole toward the intermediate portion of the inductor portion 40 is reduced. Also in this embodiment, the distortion of the inductor conductor is favorably reduced. The perspective view of the conductor pattern of the inductor section 40 of the present embodiment is the same as that of the first embodiment, and is shown in FIG.

(3) Third Embodiment Next, a third embodiment will be described with reference to FIG. In the embodiment shown in FIG. 3B, a rectangular dummy layer L is formed at a position corresponding to the via hole D3. The perspective position of the via hole D3 is indicated by a dotted line. For this reason, the dummy layer L also acts to increase the molding density around the via hole D3.

(4) Fourth Embodiment In a fourth embodiment shown in FIG. 3C, a dummy layer M is formed by three circular dummies M1 to M3, and a central circular dummy M is formed.
No. 1 is arranged at a position opposing the via hole D3. In the illustrated example, the diameter of the circular dummy M1 is set smaller than the diameter of the via hole D3. In this embodiment, three circular dummy M1 of the dummy layer M
Of M3, the shortage of molding density due to M1 at the center is
M2 and M3 compensate for this by increasing the molding density near via hole D3. Thereby, the via hole D3 is supported as a whole.

(5) Fifth Embodiment In a fifth embodiment shown in FIG. 3D, the dummy layer N is formed in a donut shape. The via hole D3 is a dummy layer N
It is located in the central hole. That is, in this embodiment, no dummy layer is provided immediately below the via hole D3, and the dummy layer N exists near the dummy layer. According to this embodiment, the molding density is increased by the dummy layer N around the portion directly receiving the stress generated by the bonding of the via hole D3.

In any of the above embodiments 3 to 5, the pushing of the via hole D3 into the inductor portion is favorably suppressed by the dummy layers L, M and N. The dummy layers L, M, and N may be dummy patterns provided on each sheet of the inductor portion, or may be dummy holes penetrating each sheet. The size and shape of the dummy layers L, M, N,
The number may be appropriately adjusted according to the degree of distortion generated in the inductor conductor.

(6) Examples Next, examples of the above-described embodiments will be described. The manufacturing steps and conditions of the example are as follows. An organic binder is added to the TiO ₂ -based dielectric material to obtain a green sheet having a thickness of 50 μm. Further, the same binder addition treatment is performed on the NiZn-based magnetic material to obtain a 30 μm thick material.
Obtain a green sheet of m. Holes for connecting via holes are formed in the green sheet by a hole processing machine. On the green sheet, a conductor pattern for a capacitor, a conductor pattern for an inductor, and a dummy pattern for improving a molding density for a via hole are formed. As a paste used for forming these patterns, a magnetic material paste and a conductor material paste are appropriately used.

Each of the sheets on which the pattern formation has been completed is laminated in the above-mentioned predetermined order, and the temperature is 90 ° C., 500 kg / c.
Pressure bonding at a temperature and pressure of m ² . The laminate obtained by the pressure bonding is separated into individual chips by a dicing machine, and after the binder is removed at 500 ° C. for 1 hour, firing is performed at 900 ° C. for 1 hour. An external terminal paste is applied to the fired chip, and 6
Baking is performed at 00 ° C. for 15 minutes.

As described above, samples of 300 laminated chips were obtained for each of the embodiments shown in FIGS. 3 (A) to 3 (E). And about these samples, the disconnection defect rate in the inductor part was measured using the milliohm meter. The results are shown in Table 1 below.

[0029]

[Table 1]

As shown in this table, in the background art of FIG. 3E, seven disconnection failures out of a total of 300 samples occurred, but in the present invention, no disconnection failure occurred in any of the embodiments. Was. ＄ There are many embodiments of the present invention, and various modifications can be made based on the above disclosure. For example, the following is also included. (1) In each of the above embodiments, the present invention is applied to a T-type filter, but the present invention is also applicable to various circuits such as π-type and double π-type circuits.

(2) The number of laminated sheets, conductor patterns, via holes, etc. shown in the above embodiment may be appropriately set as required.

(3) As a material used for the dummy pattern and the dummy hole, an appropriate material may be used if necessary, as long as the molding density can be increased. But,
It is more efficient to use the same material as other patterns in the same sheet.

(4) Dummy patterns and dummy holes may be combined. For example, in the form of FIG. 3C, the central circular dummy M1 is a dummy hole, and the peripheral circular dummies M2 and M3 are dummy patterns. Also, some sheets of the inductor portion may be formed as dummy holes, and other sheets may be formed as dummy patterns. You may make it laminate | stack the sheet which formed only the dummy layer.

(5) In each of the above embodiments, a via hole having a high molding density is present at the center of the component chip. However, the position of the via hole connection portion is also arbitrary, and is not limited to the above embodiment. Absent. Further, when the via hole connection is provided at a plurality of locations, a dummy layer may be provided for each location.

[0035]

As described above, according to the present invention,
Since the dummy layer is formed opposite to the via hole connection, the distortion of the conductor pattern caused by the difference in molding density inside the component is reduced, the disconnection is prevented well, and the reliability of the component is improved. There is.

[Brief description of the drawings]

FIG. 1 is a diagram showing a cross section and a laminated structure of a first embodiment.

FIG. 2 is a diagram showing a cross section and a laminated structure of a second embodiment.

FIG. 3 is a perspective view of an inductor unit according to the first to fourth embodiments and the background art.

FIG. 4 is a diagram showing a cross section of the background art.

FIG. 5 is a diagram showing a laminated structure, an appearance, and an equivalent circuit of the background art.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Capacitor part 12,30,40 ... Inductor part 14 ... GND electrode 16,18 I / O electrode A1-A6, B1-B8 ... Sheet D1, D2 ... Capacitor conductor D3, G1, G2, H1, H2 ... Via hole E1 to E4, F1 to F4 ... conductors for inductors J1 to J3, K, L, M, N ... dummy layers (dummy patterns, dummy holes)

Claims (4)

[Claims] A capacitor unit and an inductor unit;
A laminated LC composite component in which a corresponding one of the conductors included therein is connected by a hole, wherein a dummy layer is formed corresponding to the hole connection. 2. The multilayer LC composite component according to claim 1, wherein the dummy layer includes at least one of a dummy pattern and a dummy hole. 3. The laminated LC composite component according to claim 1, wherein the dummy layer is formed at a position facing the hole connection or in the vicinity thereof. 4. The hole connection is a via hole for connecting the capacitor section and the inductor section,
4. The laminated LC according to claim 1, wherein the dummy layer is formed on the inductor portion.
Composite parts.