JPH11260887A - Apparatus for cleaning substrate holding chuck - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for which the used treating liq. quantity can substantially be reduced and even ant drying no water drop or the like scatters around to avoid production of particles. SOLUTION: Housing recesses 27a, 27b, 28a, 28b which are respectively conformed to the shapes of substrate holders 22a, 22b, 23a, 23b sandwich and house the substrate holders 22a, 22b, 23a, 23b respectively with gaps left in the housing recesses 27a, 27b, 28a, 28b to do the cleaning and drying with cleaning and drying treating fluids flowing therein. Thereby cleaning chambers 26a, 26b and 35a, 35b can be made small and the quantities of the cleaning treating liqs. (such as chemical liq. and pure water) and drying treatment fluid (such as nitrogen or IPA vapor) can be greatly reduced. Also the substrate holders 22a, 22b, 23a, 23b are respectively housed in the housing recesses 27a, 27b, 28a, 28b and hence the cleaning liq. or drying fluid will not leaks to the surroundings.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for immersing a plurality of thin substrates to be processed (hereinafter simply referred to as "substrates") in a processing liquid for processing electronic components such as semiconductor wafers and glass substrates for liquid crystal display panels. A substrate holding chuck, which is used in a substrate processing apparatus or the like that performs predetermined processing on a substrate by being brought into contact with a liquid vapor or a processing gas, holds a plurality of substrates at once, and transports the substrate between processing units. The present invention relates to a substrate holding chuck cleaning device for cleaning prior to processing by a unit.

[0002]

2. Description of the Related Art Conventionally, in a manufacturing process of a precision electronic substrate using a semiconductor wafer, a glass substrate for a liquid crystal display panel, or the like, a substrate processing apparatus for performing various surface treatments by immersing the substrate in a processing liquid has been used. I have. In such a surface treatment of the substrate, the substrate is sequentially immersed in a chemical bath storing a chemical such as an etching solution (such as a phosphoric acid solution), and further in a washing bath storing pure water as a rinsing liquid, and the substrate is immersed in a predetermined manner. After the chemical solution treatment described above, a rinsing process is further performed to wash contaminants such as a chemical solution attached to the substrate and particles generated by the chemical solution in a washing tank.

Prior to these processes, there is a step of cleaning a substrate holding chuck that collectively holds and transports a plurality of substrates in an aligned state. In the substrate holding chuck cleaning step, a substrate holding chuck cleaning device for cleaning and drying the substrate holding chuck is provided.

In such a substrate holding chuck cleaning apparatus, a pure water shower is sprayed toward the substrate holding chuck to wash away contaminants such as particles attached to the substrate holding chuck, and to clean the substrate holding chuck. Drying was performed by blowing off water droplets and the like attached to the substrate holding chuck by nitrogen blowing.

[0005] In addition to cleaning and drying the substrate holding chuck by a pure water shower and nitrogen blowing, the substrate holding chuck is immersed in pure water in a washing tank.
Contaminants such as particles attached to the substrate holding chuck are removed, and the surface of the substrate holding chuck is blown off with an air knife when the substrate holding chuck is lifted up from the washing tank. Some are configured to be dried.

Further, after cleaning the substrate holding chuck with a pure water shower or a washing dip, a sponge is applied to the substrate holding chuck with water droplets to wipe off the substrate holding chuck.
There is also a configuration in which moisture is absorbed by a sponge roller or the like.

[0007]

In the above-mentioned conventional pure water shower type or washing dip type washing, a large amount of processing liquid such as pure water is used, and after the pure water shower or washing dip for the substrate holding chuck, When the substrate holding chuck is dried with a nitrogen blow or air knife, water droplets and the like attached to the substrate holding chuck are blown off to dry the substrate holding chuck, and the scattered mist of water adheres to the surface of the wafer etc. Then, it caused spots, which also caused particles. When the substrate holding chuck is cleaned with a pure water shower or a washing dip, water droplets or the like adhering to the surface of the substrate holding chuck are wiped off with a sponge or the like to remove moisture from the surface of the substrate holding chuck. There was a problem that this might occur.

As described above, if contaminants such as particles remain attached to the substrate holding portion of the substrate holding chuck, the contaminants re-adhere to the surface of the wafer or the like from the substrate holding portion, and the re-adhesion occurs. Contaminants such as particles that have been produced have a great adverse effect on product quality.

The present invention solves the above-mentioned conventional problems. In addition, the amount of the processing solution used is greatly reduced, and a substrate capable of preventing generation of particles without splashing of water droplets to the surroundings even during drying. An object of the present invention is to provide a holding chuck cleaning device.

[0010]

According to a first aspect of the present invention, there is provided a substrate processing apparatus, wherein a plurality of holding grooves are provided in at least a pair of substrate holding portions arranged in parallel, and edges of the plurality of substrates are connected to the plurality of holding grooves. In a substrate holding chuck cleaning apparatus for cleaning a substrate holding chuck for holding a plurality of substrates collectively, the substrate holding chuck has a storage recess corresponding to the shape of the substrate holding section of the substrate holding chuck, The substrate holding chuck is housed in a state where there is a gap in both storage recesses sandwiched from both sides, a processing liquid for cleaning and a processing fluid for drying are supplied to the storage recess, and a processing liquid is supplied from the storage recess. And a flow path for discharging the processing fluid is provided.

With this configuration, in order to prevent splashes of water droplets and the like around the substrate during cleaning and drying, the entire substrate holding chuck is not simply covered and cleaned and dried.
The storage recess corresponding to at least the shape of the substrate holding portion is sandwiched so as to surround the substrate holding portion, and is housed in a state in which a flow path of a processing liquid for cleaning having a gap and a processing fluid for drying is formed in the storage recess. Cleaning and drying processing, the amount of processing liquid for cleaning and processing fluid for drying only requires a minimum volume in the flow path including the inside of the storage recess surrounding the substrate holder, and is used during cleaning. The amount of processing liquid to be used and the amount of processing fluid used during drying can be greatly reduced, and if the processing liquid is recycled and circulated through a filter or the like in the distribution channel, the amount of processing liquid used can be further reduced. The cleaning and drying effect and the cleaning and drying efficiency are also improved by allowing the processing liquid or the processing fluid to flow through the gap between the inside of the storage recess storing the substrate holding unit. Further, since the substrate holding portion is housed in the storage recess, particles are prevented from being scattered around the device even during washing and drying, and generation of particles is prevented. The drying effect and the drying efficiency are also improved by flowing the processing fluid through the gap.

Preferably, in the substrate processing apparatus according to the present invention, the flow path includes a plurality of fluid inlets opening at positions substantially opposed to the plurality of holding grooves of the substrate holding unit, respectively.
The processing liquid for cleaning and the processing liquid for drying supplied from the plurality of fluid introduction ports respectively are provided on substantially opposite sides of the plurality of fluid introduction ports, and are discharged through the gap between both the recessed portions and the substrate holding portion. It has a discharge port.

Conventionally, even when a pure water shower hits a plurality of holding grooves in a substrate holding portion of a substrate holding chuck and contaminants flow down from the holding grooves, the contaminants may flow in the adjacent holding grooves or between the holding grooves. In some cases, the contaminants may be difficult to remove due to the contaminants getting around and attaching again.

According to the present invention, the processing liquid or the processing fluid discharged from the plurality of fluid inlets toward the plurality of holding grooves respectively hit the plurality of holding grooves, pass through the plurality of holding grooves, and have the particle structure. After the contaminants are dropped, the contaminants flow out of the plurality of holding grooves into the gap between the substrate holding portion and the two storage recesses together with the contaminants, and are discharged from the outlet through the gap between the substrate holding portion and the two storage recesses. I do. That is, the flow of the processing liquid or the processing fluid discharged for each of the plurality of holding grooves is different from that of the related art.
It is difficult to flow in the direction of the other adjacent holding groove, and contaminants that have flowed down from inside the holding groove of the substrate holding part do not wrap around in the adjacent holding groove or between the holding grooves and adhere again, so that each The contaminants smoothly flow out of the discharge port from the holding groove through the gap between the substrate holding portion and both storage recesses. As described above, the contaminants are efficiently removed from the plurality of holding grooves in the substrate holding portion of the substrate holding chuck, and the transfer of the contaminants to the surface of a wafer or the like is also suppressed, thereby preventing adverse effects on product quality. It is also possible to do.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.

(Embodiment 1) FIG. 1 shows Embodiment 1 of the present invention.
1 is a plan view showing a schematic configuration of a wet station incorporating the substrate holding chuck cleaning device in FIG. 1, and a surface indicated by an arrow F is a front surface of the device.

In FIG. 1, a wet station 1
Is a transfer robot 9 for transferring a plurality of wafers 2 from a carrier 3 containing a plurality of wafers 2 to each processing tank.
And a transfer unit 5 on the loading side for transferring a plurality of wafers 2 collectively, and conversely, an unloading unit for transferring a plurality of wafers 2 from the transfer robot 9 to the carrier 3 collectively. The wafer 2 is successively immersed in a plurality of processing tanks adjacent to the wafer transfer unit 6 and the wafer transfer unit 5 and storing various processing liquids such as chemicals or pure water. A processing unit 7 for performing a series of various processes such as a cleaning process and a water washing process is disposed between the processing unit 7 and the wafer transfer unit 6 on the unloading side. And a drying unit 8 for drying.

The processing unit 7 includes a substrate holding chuck 10 which is a hand portion of a transfer robot 9 for collectively transferring a plurality of wafers 2 in an aligned manner to each of these processing tanks. A hand cleaning unit 12 for cleaning and drying with the substrate holding chuck cleaning device 11 of the first embodiment,
A first chemical processing section 13 which is adjacent to the hand cleaning section 12 and has a chemical tank storing a chemical such as an etching liquid as a processing liquid, and performs a chemical processing by immersing the wafer 2 in the chemical tank; A second chemical processing section 14, a functional cleaning processing section 15 adjacent to the chemical processing section 14 side, and for quickly cleaning the chemical liquid attached to the wafer 2 with water;
And a final rinsing unit 16 for rinsing the wafer 2 with water in the order of processing steps. The two first and second chemical processing units 13 and 14 are provided because the chemical processing by these chemical processing units 13 and 14 takes a longer time than the processing by other processing units. This is because a chemical solution treatment is performed in parallel to shorten the time.

FIG. 2 is a longitudinal sectional view schematically showing a schematic configuration of a main part of a hand portion of the transfer robot 9 shown in FIG.

In FIG. 2, the substrate holding chuck 10 comprises:
The two left and right arm members 21a which are respectively suspended
Further, a substrate holding portion 22a horizontally disposed so as to connect two arm members 21b on the front and rear sides of right and two distal end portions of the two arm members 21a on front and rear sides, A board holding portion 22b horizontally disposed so as to connect the tip portions of the arm members 21b; and a left and right front and rear 2 positioned above the board holding portion 22a.
A board holding portion 23a disposed horizontally so as to connect the arm members 21a and a horizontal position so as to connect the two front right and left arm members 21b positioned in parallel above the board holding portion 22b. Board holding part 23b arranged in the direction
As shown by an arrow A, these two arm members 21a and the substrate holding portions 22a and 23a and the two arm members 21b and the substrate holding portions 22b and 23b are
The plurality of wafers 2 can be freely transferred by being configured to be able to approach or separate from each other.

The two substrate holding portions 22a and 22b are disposed in parallel, and a plurality of holding grooves 24a and 24b are provided in a vertical direction in a state where they are opposed to each other at predetermined intervals. Each of the plurality of wafers 2 is sandwiched between the substrate holding portions 22a and 22b so as to receive the wafer 2 from obliquely below, and each of the plurality of wafers 2 is held in the holding groove portion 24 in the thickness direction.
a and 24b are fitted to each other to align and hold a plurality of wafers 2 collectively. Similarly,
The board holding portions 23a and 23b located above them are also arranged in parallel, and a plurality of holding groove portions 25a and 25b are provided.
Are provided in the longitudinal direction so as to face each other at predetermined intervals, and the substrate holding portions 23a, 2a are provided from both sides of the plurality of wafers 2.
3b, each of the plurality of wafers 2 is fitted in each of the holding grooves 25a and 25b in the thickness direction thereof,
The plurality of wafers 2 are aligned and held collectively.

FIG. 3 is a vertical cross-sectional view schematically showing a schematic configuration of a main part of a state in which the hand portion of the transfer robot 9 shown in FIG.

In FIG. 3, the cleaning chambers 26a, 26
b and the cleaning chambers 35a and 35b are each configured to be opened and closed by being driven by driving means such as air or a hydraulic cylinder (not shown), and the left side between the cleaning chambers 26a and 26b in the open state. The substrate holding chuck 10 is inserted and the substrate holding portions 22a, 23
a is positioned at a predetermined position, and the right substrate holding chuck 1 is positioned between the open cleaning chambers 35a and 35b.
0 to position the substrate holders 22b and 23b at predetermined positions, and then insert the left cleaning chambers 26a and 26b.
b in the closed state and the right cleaning chambers 35a, 35
5b in a closed state, the substrate holding portion 22a is accommodated in both accommodation recesses 27a, the substrate holding portion 23a is accommodated in both accommodation recesses 28a, and the substrate holding portion 22b is accommodated in both accommodation recesses 27b. The substrate holding portion 23b is accommodated in both accommodation concave portions 28b. These positionings can be accurately performed by sensing with a limit switch, an optical sensor, or the like.
a, 27b, 28a, 28b, for example, both storage recesses 2
7A as an example, when the cleaning chambers 26a and 26b are in the open state, the two storage recesses 27a are divided into two left and right storage recesses, and a round bar-shaped substrate holding portion is provided between these two separated storage recesses. After the positioning of the substrate holding portion 22a and the predetermined position, the left and right 2
The substrate holding portion 22a is housed in a hermetically sealed state with a small gap between the two holding recesses.

That is, in the cleaning chambers 26a and 26b, the left and right substrate holders 22a and 23
The two storage recesses 27a and 28a each having a shape corresponding to each of the columnar shapes of FIG.
Are respectively sandwiched between the two storage recesses 27a and 28a. Each of the storage recesses 27a, 28 is provided for each of the substrate holding portions 22a, 23a.
“a” is configured to be large to some extent so that gaps are provided around the periphery thereof such that a processing liquid for cleaning and a processing fluid for drying can flow. In addition, nozzles 29a and 30a as fluid introduction ports for supplying a processing liquid to the storage recesses 27a and 28a, respectively, and both storage recesses 26a are provided on opposite sides of the nozzles 29a and 30a. , 27a are respectively provided with discharge ports 31a, 32a for discharging a processing liquid for cleaning and a processing fluid for drying, respectively, to form circulation paths 33a, 34a.

Similarly, the right cleaning chamber 35a,
35b, each of the right and left substrate holders 2
Each storage recess 27 corresponding to each column shape of 2b and 23b
b and 28b are respectively configured to be able to be stored in the respective storage recesses 27b and 28b with the respective substrate holding portions 22b and 23b sandwiched therebetween. Each of the storage recesses 27b,
Each of 28b is configured to be large to some extent so that there is a space around the periphery thereof, through which a processing liquid for cleaning and a processing fluid for drying can flow. Further, nozzles 29b and 30b as fluid introduction ports for supplying a processing liquid to both of these storage recesses 27b and 28b, respectively,
These nozzles 29b and 30b are disposed on opposite sides of each other,
Outlets 31b, 32b for discharging the processing liquid for cleaning and the processing fluid for drying from the respective storage recesses 26b, 27b.
Are provided respectively to form distribution routes 33b and 34b.

FIG. 4 is a perspective view schematically showing a configuration of a main part of a state in which the hand portion of the transfer robot 9 shown in FIG.

In FIG. 4, the cleaning chambers 26a, 26
b, an introduction pipe 41a is detachably connected to a lower portion of one outer wall of the cleaning chamber 26a, and the cleaning chamber 26b
A discharge pipe 42a is detachably connected to a lower part of one outer wall. In the cleaning chambers 35a and 35b,
An introduction pipe 41b is detachably connected to a lower part of one outer wall of the cleaning chamber 35a, and a discharge pipe 42b is detachably connected to a lower part of one outer wall of the cleaning chamber 35b.

In the cleaning chambers 26a and 26b, the introduction pipe 41a is connected to the flow path 33a and the flow path 34.
a in parallel with the discharge pipe 42a via
In the cleaning chambers 35a and 35b, these introduction pipes 41b communicate with the discharge pipe 42b through the flow path 33b and the flow path 34b in parallel.

Further, the introduction pipe 41a and the discharge pipe 4
2a, and between the introduction pipe 41b and the discharge pipe 42b, processing fluid lines (not shown) for drying, such as high-temperature nitrogen and IPA vapor, and a decompression pump (not shown) are connected by piping. A reduced pressure line (not shown) and a processing liquid supply line (not shown) can be connected by a pipe, and a switching means constituted by a plurality of solenoid valves (not shown) and the like. Each line is configured to be switchable by a control signal from a control unit such as a sequencer (a signal that is inverted every predetermined time according to various times in the cleaning process and the drying process). In the first embodiment, the introduction pipe 4
1a and the discharge pipe 42a, and between the introduction pipe 41b and the discharge pipe 42b, pipes are respectively connected to the processing liquid supply lines to supply the processing liquid for cleaning. If a circulating pump (not shown) and a filter for filtering contaminants are connected between the pipe 42a and the inlet pipe 41b and the outlet pipe 42b, the processing liquid for cleaning can be recycled and circulated. As a result, the amount of the processing liquid used can be further reduced.

FIG. 5 is a partial cross-sectional view taken along the line BB 'in FIG. 3, FIG. 6 is a perspective view schematically showing a partial schematic configuration of the flow path 34b in FIG. 3, and FIG. It is an expanded sectional view of distribution channel 34b. The distribution routes 33a, 33b, 3
4a and 34b, the distribution channel 34b will be described as an example. Here, since the configuration is the same, other distribution channels 33 are used.
Descriptions of a, 33b, and 34a are omitted.

In FIG. 5 to FIG. 7, this distribution route 34b
Are nozzles 30b as a plurality of fluid introduction ports that are respectively opened at positions substantially facing the plurality of holding grooves 25b of the substrate holding portion 23b, and a plurality of nozzles 30b are provided on substantially opposite sides of the plurality of nozzles 30b. The processing liquid for cleaning and the processing fluid for drying supplied into the storage recesses 28b are applied to the outer periphery of the circular shape of the substrate holder 23b as shown by the arrow C through the gap between both the storage recesses 28b and the substrate holder 23b. And a discharge port 32b for discharging along. For this reason, the flow path 34b is configured such that the flow of the fluid discharged from the outlet 32b through the gap along the outer peripheral portion of the columnar substrate holding portion 23b after the contaminants such as particles are expelled from the plurality of holding grooves 25b. The contaminants expelled from the holding groove 25b as in the related art do not go around the other holding groove 25b.

A plurality of holding grooves 25b are formed at predetermined intervals in the longitudinal direction of the columnar substrate holding portion 23b.
5b, so that the processing liquid for cleaning and the processing fluid for drying, which have been ejected from the nozzle 30b and entered the holding groove 25b, can more smoothly flow into the gap between the two housing recesses 28b and the substrate holding part 23b. The both end portions 43 of the holding groove 25b are tapered. Although the nozzle 30b is not a narrowed inlet in the present embodiment, the nozzle 30b may be configured as a narrowed inlet so as to vigorously eject the cleaning processing liquid or the drying processing fluid into the holding groove 25b. it can.

The operation of the above configuration will be described below. First, wet station 1 in the clean room
The operator places each carrier 3 on the first table in the wafer transfer unit 5 on the wafer loading side from the front direction. Thereafter, driving is started by a switch operation by the operator, and the transfer robot 9 cleans the substrate holding chuck 10 which is a hand part of the transfer robot 9 with the substrate holding chuck cleaning device 11 before transferring the plurality of wafers 2. A hand washing and drying step of drying and drying is performed.

In the hand cleaning and drying step, as shown in FIG.
a, 26b and the cleaning chambers 35a, 35b are respectively opened, the substrate holding chuck 10 is lowered, and the substrate holding chuck 10 is positioned between the cleaning chambers 26a, 26b.
After the right side of the substrate holding chuck 10 is inserted between the cleaning chambers 35a and 35b.
6a and 26b and the cleaning chambers 35a and 35b are respectively closed. At this time, together with the tip portions of the arm members 21a and 21b of the substrate holding chuck 10, the substrate holding portion 22a is housed in the two housing recesses 27a, and the substrate holding portion 23a is housed in the two housing recesses 28a. The board holding portion 22b is housed in both housing recesses 27b, and the board holding portion 23b is housed in both housing recesses 28b.

Thereafter, the introduction pipes 41a and 41b are respectively connected to the processing liquid supply lines, and a processing liquid such as pure water for cleaning flows from the introduction pipe 41a of the cleaning chamber 26a through the distribution path 33a and the distribution path 34a in parallel. , And is discharged from the discharge pipe 42a of the cleaning chamber 26b, and the processing liquid such as pure water for cleaning also flows from the introduction pipe 41b of the cleaning chamber 35a through the flow path 33b and the flow path 34b in parallel. It is discharged from the discharge pipe 42b of the chamber 35b. At this time, the distribution path 34b among the distribution paths 33a and 34a and the distribution paths 33b and 34b will be described as an example. As shown in FIGS.
The processing liquid introduced from 1b is ejected from the nozzle 30b into the holding groove 25b, and the processing liquid that has hit the inside of the holding groove 25b is flushed along with the contaminant along the holding groove 25b to flow vertically. After coming out of the gap between the two storage recesses 28b and the substrate holding portion 23b, the holes are respectively passed through the gaps and discharged from the discharge port 32b, and further discharged from the discharge pipe 42b to the outside to hold the substrate holding portion 23b. The cleaning process is performed centering on the groove 25b.

Further, after a predetermined time required for cleaning, the introduction pipes 41a and 41b are respectively connected to a supply line of IPA (isopropyl alcohol) vapor, and the IPA vapor flows along with high-temperature nitrogen from the introduction pipe 41a of the cleaning chamber 26a. The gas flows through the path 33a and the flow path 34a in parallel, and is discharged from the discharge pipe 42a of the cleaning chamber 26b, and also from the introduction pipe 41b of the cleaning chamber 35a.
The IPA vapor flows in parallel with the high-temperature nitrogen through the flow path 33b and the flow path 34b, and is discharged from the discharge pipe 42b of the cleaning chamber 35b. At this time, the distribution channel 33
a, 34a and the flow path 33b, 34b, the flow of the drying IPA vapor in the flow path 34b will be described.
As shown in FIGS. 6 and 7, the drying IPA vapor introduced from the introduction pipe 41a is ejected from the nozzle 30b into the holding groove 25b, hits the holding groove 25b, and moves up and down along the holding groove 25b. After flowing out into the gap between the two housing recesses 28b and the substrate holding portion 23b, it passes through each of the gaps and is discharged from the discharge port 32b, and further discharged from the discharge pipe 42a to the outside to hold the substrate. The portion 23b is subjected to a drying process centering on the holding groove 25b.

Further, after a predetermined time required for vapor drying, the introduction pipes 41a and 41b are respectively connected to decompression lines of a decompression pump (not shown), and the introduction pipes 41a and 41b are connected.
Is closed, and the discharge pipe 42 of the cleaning chamber 26b is closed.
a, the pressure in the flow path 33a and the flow path 34a is reduced in parallel, and the flow path 33b and the flow path 34b are also reduced in pressure in parallel from the discharge pipe 42b of the cleaning chamber 35b.

Further, after a predetermined decompression time, the introduction pipe 41
a and 41b are respectively connected to a high-temperature nitrogen line, the discharge pipes 42a and 42b are closed, and high-temperature nitrogen flows from the introduction pipe 41a of the cleaning chamber 26a to the circulation path 33a
And the flow path 34a flow in parallel, and nitrogen also flows from the introduction pipe 41b of the cleaning chamber 35a.
b and the distribution channel 34b flow in parallel, and the distribution channel 3
The insides of 3a, 33b and the flow paths 34a, 34b are returned to atmospheric pressure (normal pressure).

Thereafter, the cleaning chambers 26a and 26b and the cleaning chambers 35a and 35b are respectively opened, and the substrate holding chuck 10 is raised to a predetermined position.

Next, the plurality of wafers 2 are collectively transferred from the carrier 3 containing the plurality of wafers 2 to the substrate holding chuck 10 of the transfer robot 9 via the wafer transfer unit 5. Further, the plurality of wafers 2 are transferred to a lifter device (not shown) by the substrate holding chuck 10 of the transfer robot 9, and the plurality of wafers 2 are collectively collected by the lifter device in the first and second processing units 7. Second chemical processing section 1
The substrates are sequentially immersed in the chemicals in the chemical baths 3 and 14 and subjected to chemical treatments such as etching.

Further, the first and second chemical processing units 1
After finishing the chemical liquid treatment by 3 and 14, and further functionally washing the wafer 2 in the functional washing section 15 and finally washing the wafer 2 in the final washing section 16, the plurality of wafers 2 are dried. And spin dry. As described above,
The plurality of wafers 2 having been subjected to the predetermined surface treatment and spin-dried are transported and collected by the substrate holding chuck 10 of the transport robot 9 into the carrier 4 of the wafer transfer unit 6 on the unloading side, and transferred to the unloading side. In the transfer section 6, contrary to the case of the wafer transfer section 5, the wafers are divided into two wafer groups into two transfer carriers 3 and transferred into the front and rear carriers 3 respectively. The operator may unload the two carriers 3 containing the processed wafers 2.

(Second Embodiment) In the first embodiment, the chuck cleaning / drying position is separately provided as the hand cleaning unit 12. However, in the second embodiment, the chuck cleaning / drying position is not separately provided as the hand cleaning unit 12. 9
As shown in (1), the cleaning chambers 26a and 26b and the cleaning chambers 35a and 35b may be moved to a position below the substrate holding chuck 10 by a driving means such as a cylinder when cleaning and drying the hand. In this case, there is no need for a dedicated chuck cleaning / drying position for arranging the cleaning chambers 26a and 26b and the cleaning chambers 35a and 35b, and the space can be saved and the substrate processing apparatus itself can be reduced in size.

Therefore, according to the first and second embodiments, the two storage recesses 27a, 27b, 28a, which match the shapes of the substrate holders 22a, 22b, 23a, 23b, respectively.
28b are substrate holders 22a, 22b, 23a, respectively.
23b, and the two storage recesses 27a, 27
b, 28a, and 28b are stored in a state having a gap, and the cleaning and drying processing fluids are respectively passed through the cleaning and drying processing.
b, 23a, 23b respectively
a, 27b, 28a, 28b,
Only a minimum volume within 34a, 33b, 34b,
Cleaning chambers 26a, 26b and cleaning chamber 35
a and 35b can be miniaturized, and the amount of processing liquid (chemical solution, pure water, etc.) and the amount of processing fluid (high-temperature nitrogen gas and IPA vapor, etc.) can be greatly reduced during cleaning. If the liquid is recycled and circulated, the amount of the processing liquid to be used can be further reduced, and the cleaning effect and the cleaning efficiency can be improved by the flow of the processing liquid. Further, the substrate holders 22a, 22b, 23
a and 23b are respectively stored in both storage recesses 27a, 27b and 28.
Since the cleaning liquid and the drying fluid are not leaked to the surroundings by being housed in the a and 28b respectively, it is possible to prevent the generation of particles, especially in the case of drying, without splashing of water droplets and the like to the surroundings. The substrate holders 22a, 22b,
Both storage recesses 27a, 27b that house 23a, 23b,
The drying effect and the drying efficiency can be improved by flowing the processing fluid through the gaps between the insides 28a and 28b.

The plurality of nozzles 29a, 29b, 30
a, 30b from the plurality of holding grooves 24a, 24, respectively.
b, 25a, and 25b, the processing liquid and the processing fluid respectively discharged to the plurality of holding grooves 24a, 24b, and 2
5a and 25b, respectively, and pass through to remove contaminants such as particles, and a plurality of holding grooves 24a and 24b.
After flowing out together with the contaminants into the respective gaps from the insides b, 25a, and 25b, the contaminants are discharged from the outlets 31a, 31b, 32a, and 32b through the respective gaps. For this reason, the processing liquid or the flow of the processing fluid discharged from each of the plurality of holding grooves does not flow in the direction of another adjacent holding groove as in the related art. 22b, 23
The contaminants that have flowed down from the holding grooves 24a, 24b, 25a, and 25b of the a and 23b do not go around the adjacent holding grooves or between the holding grooves and adhere again, and the substrate holding from the respective holding grooves. Flows out together with the contaminant through the gap between the portion and the two storage recesses through the discharge port, so that the substrate holding portions 22a, 22b, and 23 of the substrate holding chuck 10 are removed.
Contaminants can be efficiently removed from the inside of the plurality of holding grooves at a and 23b, and transfer of the contaminants to the surface of the substrate such as the wafer 2 can be suppressed, thereby preventing adverse effects on product quality. be able to.

Since the distance (gap) between the nozzle of the chamber and the chuck holding groove is relatively small, the holding groove can be finely cleaned one-to-one.

Further, since the substrate holding chuck cleaning device 11 can be made compact, the installation space can be saved, and the substrate processing apparatus can be downsized.

The wet station 1 of the first and second embodiments is an example of a multi-tank type substrate processing apparatus, and the specific configuration can be changed as appropriate without departing from the gist of the present invention. . For example, it goes without saying that the present invention is applicable not only to a multi-tank type substrate processing apparatus but also to a single-tank type substrate processing apparatus. In the processing unit 7 of the above embodiment, as a series of various chemical liquid treatments, in addition to the etching treatment for removing the nitride film with the phosphoric acid solution, the resist film peeling treatment, the oxide film etching treatment, the light etching treatment, the cleaning treatment before diffusion, and the like. There are various chemical treatments.

[0048]

As described above, according to the first aspect of the present invention, the accommodating concave portion corresponding to the shape of the substrate holding portion sandwiches the substrate holding portion and is accommodated in the accommodating concave portion with a gap provided therein for cleaning. In addition, since the drying process is performed, only a minimum volume in the flow path including the inside of the storage recess surrounding the substrate holding unit is required, and the amount of the processing solution used for cleaning can be significantly reduced, and the processing solution can be reduced. By recycling and circulating, it is possible to further reduce the amount of the processing liquid used, and to improve the cleaning effect and the cleaning efficiency by the flow of the processing liquid. Also, in order to house the substrate holding portion in the housing recess,
Even during drying, it is possible to prevent generation of particles without scattering of water droplets to the surroundings, and also to improve the drying effect and the drying efficiency by allowing the processing fluid to flow through the gap between the inside of the storage recess accommodating the substrate holding portion. be able to.

Further, according to the second aspect of the present invention, the flow of the processing liquid or the processing fluid discharged for each of the plurality of holding grooves flows in the direction of another adjacent holding groove as in the related art. As a result, contaminants that have flowed down from the holding grooves of the substrate holding portion do not sneak into the adjacent holding grooves or between the holding grooves and adhere again, and the substrate holding portion and the storage recess from each of the holding grooves. The contaminant flows out through the discharge port together with the contaminant through the gap, so that the contaminant can be efficiently removed from the plurality of holding grooves in the substrate holding portion of the substrate holding chuck, and the contaminant is applied to the surface of the substrate such as a wafer. Transfer can also be suppressed, thereby preventing adverse effects on product quality.

[Brief description of the drawings]

FIG. 1 is a plan view showing a schematic configuration of a wet station incorporating a substrate holding chuck cleaning device according to a first embodiment of the present invention.

FIG. 2 is a longitudinal sectional view schematically showing a schematic configuration of a main part of a hand portion of the transfer robot of FIG. 1;

3 is a longitudinal sectional view schematically showing a schematic configuration of a main part in a state where a hand portion of the transfer robot of FIG. 2 is accommodated in a substrate holding chuck cleaning device.

4 is a perspective view schematically showing a schematic configuration of a main part in a state where a hand portion of the transfer robot of FIG. 3 is accommodated in a substrate holding chuck cleaning device.

FIG. 5 is a partial cross-sectional view taken along the line BB ′ of FIG. 3;

FIG. 6 is a perspective view schematically illustrating a partial schematic configuration of an upper flow path in FIG. 3;

FIG. 7 is an enlarged cross-sectional view of the upper circulation path in FIG. 3;

FIG. 8 is a perspective view schematically showing the hand cleaning unit of FIG. 1;

FIG. 9 is a perspective view schematically illustrating a hand cleaning unit according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wet station 2 Wafer 7 Processing unit 9 Transfer robot 10 Substrate holding chuck 11 Substrate holding chuck cleaning device 12 Hand cleaning part 21a, 21b Arm member 22a, 22b, 23a, 23b Substrate holding part 24a, 24b, 25a, 25b Holding groove part 26a, 26b, 35a, 35b Cleaning chambers 27a, 27b, 28a, 28b Both storage recesses 29a, 29b, 30a, 30b Nozzles 31a, 31b, 32a, 32b Outlets 33a, 34a, 33b, 34b Flow paths 41a, 41b Introductory pipe 42a, 42b discharge pipe

Claims (2)

[Claims] A plurality of holding grooves are provided in at least one pair of substrate holding portions arranged in parallel, and edges of the plurality of substrates are supported by the plurality of holding grooves to collectively hold the plurality of substrates. A substrate holding chuck cleaning apparatus for cleaning a substrate holding chuck to hold the substrate holding chuck, comprising a storage recess corresponding to a shape of a substrate holding portion of the substrate holding chuck, wherein the substrate holding portion is sandwiched from both sides so that the inside of the both storage recesses is provided. The substrate holding chuck is housed in a state having a gap, and a processing liquid for cleaning and a processing fluid for drying are supplied to the inside of the housing recess, and the processing liquid and the processing fluid are respectively supplied from inside the housing recess. A substrate holding chuck cleaning device, wherein a circulation path for discharging is provided. 2. The method according to claim 1, wherein the flow path is provided on a plurality of fluid introduction ports which are respectively opened at positions substantially opposed to the plurality of holding grooves of the substrate holding section, and provided on substantially opposite sides of the plurality of fluid introduction ports. 2. A discharge port for discharging a processing liquid for cleaning and a processing liquid for drying supplied from a plurality of fluid inlets, respectively, through a gap between the both storage recesses and the substrate holding part. 4. The substrate holding chuck cleaning apparatus according to claim 1.