JPH11260527A - Mold-in contact structure and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the turning-up of a contact part. SOLUTION: Contacts 1 are equipped with first hold parts 1a, contact parts 1b exposed to a fitting plate portion 11, second hold parts 1c continuing connected to the contact parts 1b. The first and the second hold parts are equipped with engage means blocking the contacts 1 from moving. The contacts 1 are blanked, engage means 2a, 2b and pilot holes 3 are formed, a carrier 4, connection portion of the second hold parts 1c and the carrier 4 are left, a board 10 is formed in a state where the contacts 1 are molded-in, and the connection part of the second hold parts 1c and the carrier 4 are cut off.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molded-in contact structure used for contacting a conductive contact provided on a substrate such as a printed circuit board with a mating contact of a mating connector, and its manufacture. About the method.

[0002]

2. Description of the Related Art A conventional mold-in-contact structure includes a plurality of conductive contacts 51 as shown in FIG.
And a substrate 52 such as a printed circuit board formed by molding these contacts 51 with a resin material.
The board 52 has a fitting plate 53 protruding from one end face thereof.
Is provided. Further, the contact 51 has a contact portion 51a on one surface 53a orthogonal to the plate thickness direction of the fitting plate portion 53 and extending in the fitting direction and exposed. That is, the contact 51 is fixed by the substrate 52 molded with a resin material.

[0003] Incidentally, the mold-in contact structure is configured such that after the mold 51 is molded in a state in which the contact 51 is embedded in the substrate 52 and the fitting plate portion 53 of the substrate 51, the tip of the contact portion 51a of the contact 51 is removed. The cut surface is exposed from the end surface of the fitting plate 53.

[0004]

However, since the contact 51 is embedded in the fitting plate portion 53 of the substrate 52 by molding, the cut surface at the tip of the contact portion 51a is exposed from the end surface of the fitting plate portion 53. Contact part 5
There is a problem that the fixing of the contact portion 51a is insufficient because the fixing of the contact portion 51a is insufficient and a strong force is applied when the contact of the mating connector with the mating contact is made.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a mold-in-contact structure capable of obtaining good contact without turning up the contact portion even in contact with a mating contact, and a method of manufacturing the same. It is in.

Another object of the present invention is to provide a mold-in-contact structure capable of preventing movement in the fitting direction, and a method of manufacturing the same.

Another object of the present invention is to provide a mold-in contact structure in which a mold can be formed while the contact is positioned, and the carrier is cut only after the mold-in molding. It is to provide a contact structure and a method of manufacturing the same.

[0008]

According to the present invention, there is provided a mold-in contact in which a conductive contact releasably contacting a conductive counterpart contact is held on a substrate formed by molding-in with a resin material. In the structure, the substrate has a fitting plate portion extending from one end surface thereof in a fitting direction, and the contact is orthogonal to a first holding portion embedded and held in the substrate and a plate thickness direction of the fitting plate portion. A contact portion that is exposed to the mating plate surface and is connected to the first holding portion and extends in the mating direction; and the contact portion is connected to the contact portion and bent in the plate thickness direction of the mating plate portion. A second holding portion embedded and held in the fitting plate portion;
At least one of the second holding portion and the second holding portion has an engagement means for preventing the movement of the contact in the fitting direction.

Further, according to the present invention, the first holding portion has a pilot hole through which a pilot pin provided in a mold used when molding the contact is molded. Thus, a mold-in-contact structure is obtained.

Further, according to the present invention, there is provided a method of manufacturing a mold-in contact structure for holding a conductive contact detachably contacting a conductive counterpart contact on a substrate formed by mold-in molding using a resin material. A plurality of contacts formed by connecting a first holding portion, a contact portion, and a second holding portion in a uniaxial direction by punching a conductive plate into a state where the plurality of contacts are aligned at a predetermined pitch, and The end of the holding portion is punched and formed into a shape connected to the strip-shaped carrier, and together with these punching, at least an engaging means in which a resin material bites into the first holding portion and a first mold are provided. A punching step of forming a pilot hole passing through a pilot pin, and bending a connecting portion between the contact portion and the second holding portion in a direction perpendicular to each other. Bending process, the positioning of installing the contact portion to the first mold surface of the first mold,
Positioning the contact at a predetermined position by inserting the pilot hole through the pilot pin, covering the second mold on the first mold at intervals so as to sandwich the contact, The first
And injecting into the space of the second mold, the carrier,
A mold-in step of forming the substrate in a state where the contact is molded in while leaving a connection portion between the second holding portion and the carrier, cutting a connection portion between the second holding portion and the carrier, A method for manufacturing a mold-in-contact structure, comprising a cutting step of removing a carrier, is obtained.

According to the present invention, the engagement means includes:
A mold-in-contact structure characterized by being a recess formed by cutting out at least one edge in the longitudinal direction is obtained.

[0012]

According to the mold-in-contact structure of the present invention, the contact portion is held in a state where one surface thereof is exposed to the fitting plate surface of the fitting plate portion and the first holding portion is buried in the substrate.
In addition, since the second holding portion is held as a part of the substrate in a state of being buried in the fitting plate portion molded together with the substrate, even when the second holding portion is in contact with the mating contact, the second holding portion is fitted with the mating contact. In some cases, the contact portion does not turn up.

[0013] The contact is held by embedding a first holding portion in the substrate, and holding the second holding portion by embedding in the fitting plate portion. Only the contact portion is provided on the fitting plate surface of the fitting plate portion. The contact portion is prevented from being deformed.

The first and second holding portions of the contact have engagement means, and the molded-in contact is fitted because the resin material is solidified in the recessed portion. Do not move in the direction.

Further, according to the method of manufacturing a mold-in contact structure of the present invention, since the contacts are positioned by the pilot pins and the mold-in molding is performed, it is possible to mold the plurality of contacts in an aligned state. . Further, a mold-in contact structure can be obtained only by cutting the carrier after the mold-in molding.

[0016]

FIG. 1, FIG. 5 and FIG. 6 show an embodiment of a mold-in-contact structure according to the present invention. FIGS. 1 to 5 illustrate steps of a method for manufacturing a mold-in-contact structure according to the present invention. FIG. 5 shows a finished product of the mold-in-contact structure.

Referring to FIGS. 1 and 5, the mold-in-contact structure includes a mating connector (shown in FIG. 5) 21.
And a substrate 10 such as a printed circuit board holding the contact 1 so as to be detachable from a conductive counterpart contact 22 incorporated therein. The substrate 10 is made by mold-in molding using a resin material for embedding the contact 1.

Usually, this type of mold-in-contact structure is also called a card-type plug, and a plurality of contacts 1 that are in one-to-one contact with mating contacts 22 are provided on one edge of the substrate 10. The substrate 10 has a fitting plate portion 11 extending from one end face 10a in the fitting direction.

The contact 1 is provided between the first holding portion 1a embedded and held in the substrate 10 and one fitting plate surface 11a orthogonal to the thickness direction of the fitting plate portion 11, and the first holding portion 1a Contact portion 1b extending in the fitting direction by being connected to
And the second portion connected to the contact portion 1b and bent in the thickness direction of the fitting plate portion 11 so as to be embedded and held in the fitting plate portion 11.
Holding portion 1c.

One surface of the contact portion 1b is connected to one fitting plate surface 11
a. The first holding portion 1a is formed with a recess (engaging means) 2a in which at least one edge in the longitudinal direction is cut out in the plate width direction. Second holding unit 1c
Is formed with a recessed portion (engaging means) 2b in which at least one edge in the longitudinal direction is cut out in the plate width direction. Further, the recesses 2a and 2b may be formed only in the first holding portion 1a. The resin material forming the substrate 10 bites into the recesses 2a and 2b, and the contact 1 is fixed.

Further, a pilot hole 3 for positioning the contact 1 at the time of molding is formed in the first holding portion 1a. The pilot hole 3 is used to penetrate a pilot pin provided in a first mold described later in the method for manufacturing a molded-in-contact structure. The pilot hole 3 is molded with a pilot pin penetrating therethrough.

Next, a method of manufacturing the mold-in-contact structure will be described with reference to FIGS. First, a thin band-shaped conductive plate (not shown) is punched out by a press in the width direction of the plate, so that the first holding portion 1a and the contact portion 1 are formed.
The contact 1 is formed in a state where the b and the second holding portion 1c are connected in a uniaxial direction. At this time, the plurality of contacts 1 are punched out intermittently in the longitudinal direction while leaving the carrier 4 on one side in the longitudinal direction of the conductive plate, and the plurality of contacts 1 are punched out at the same time in a comb-teeth-aligned state at a predetermined pitch. . The ends of the second holding portion 1c are mutually strip-shaped carriers 4.
Connected to each other to form a comb tooth shape. Simultaneously with this operation, dents 2a and 2b are formed in the first and second holding portions 1a and 1b as engagement means for engaging with the resin material by mold-in molding, and the first holding portion 1a is formed. To
A pilot hole 3 penetrating a pilot pin 32 provided in the first mold 31 shown in FIG. 2 is also formed.

A plurality of carrier holes 4a are formed in the carrier 4 at a predetermined pitch, and these carrier holes 4a are used for rotating pins of a feeder when moving the conductive plate in the longitudinal direction at a predetermined pitch interval. (Not shown) and used to move the conductive plate.

The first mold 31 is a lower mold. The first mold 31 has a first mold surface 31a on which pilot pins 32 are erected, and a second mold surface 31b having a step on the first mold surface 31a and on which the contact portion 1b is installed. doing. That is, as shown in FIG. 3, the contact portion 1b is provided on the second mold surface 31b, and the first holding portion 1a is connected to the first mold surface 31a in a state where the pilot hole 3 is penetrated by the pilot pin 32. It is set up with a small interval from.

The connection between the contact portion 1b and the second holding portion 1c is bent at right angles to each other. The carrier 4 is erected substantially parallel to the vertical wall portion 31c of the first mold 31 extending upward from the end of the second mold surface 31b. Pilot hole 3 of contact 1
Is a pilot pin 32 provided on the first mold 31.
And the contact 1 is positioned at a predetermined position, and one surface of the contact portion 1b, that is, the surface exposed on the fitting plate surface 11a side of the fitting plate portion 11, is
On the mold surface 31a.

Further, after the second mold (upper mold) 33 is put on the first mold 31 at intervals so as to sandwich the contact 1, the resin material is applied to the first and second molds 31, 32, and the carrier 4, the second
The shape of the substrate 10 is formed in a state where the contact 1 is molded in, leaving a connection portion between the holding portion 1 c and the carrier 4.

After the resin material is solidified, the first and second molds 31 and 32 are removed from the portion including the substrate 10, the contact 1, and the carrier 4. Then, the connecting portion between the second holding portion 1c and the carrier 4 is cut in the direction of arrow A in FIG. 4 to remove the carrier 4.

As shown in FIG. 5, the molded-in-contact structure manufactured as described above is embedded with one surface of the contact portion 1b being exposed on the fitting plate surface 11a of the fitting plate portion 11. Moreover, the first and second holding portions 1
1a and 1c, a first holding portion 1a is held by a substrate 10 formed by molding, and a second holding portion 1c is
0 is held by the fitting plate portion 11.

Such a molded-in contact structure is connected to a mating contact 22 of a mating connector 21 shown in FIG. That is, the contact portion 1b comes into contact with the mating contact 22. At this time, since the first and second holding portions 1a and 1c are held by the substrate 10 and the fitting plate 11, the contact portion 1b does not turn up at the time of contact.

The recesses 2a, 2b of the contact 1
Thereby, the contact 1 is firmly held on the substrate 10. Further, the contact 1 is fixed to the substrate 10 by the pilot pin 32. FIG. 6 shows a state in which the mold-in-contact structure of FIG. 5 is inverted. As shown in FIG. 6, the tip of the second holding portion 1c slightly projects from the other surface 11b of the fitting plate portion 11 that faces the fitting plate surface 11a in the thickness direction. However, the second holding portion 1c
Is a direction orthogonal to the fitting direction, and therefore has no influence on the contact between the contact portion 1b and the mating contact 22.

As the engagement means, the dents 2a,
In addition to 2b, a protrusion or a cut-out portion protruding beyond the plate width of the first and second holding portions 1a, 1c may be used. 1
Can be prevented from moving. Further, the pilot pin 32 may be detachably mounted on the first mold 31. In this case, the substrate 10
Molded with

[0032]

As described above, according to the mold-in-contact structure of the present invention, one surface of the contact portion is exposed to one surface of the fitting plate portion, and the first holding portion is formed on the substrate. Since it is held in a state of being buried and the second holding portion is held in a state of being buried in the fitting plate portion,
Even in the contact with the counterpart contact, the contact portion does not turn up.

Further, the contact is held by embedding a first holding portion in the substrate, holding the second holding portion by embedding in the fitting plate portion, and only the contact portion is provided on the fitting plate surface of the fitting plate portion. The contact portion is not deformed.

Further, since the first and second holding portions of the contact have engagement means for engaging with the resin material, the molded-in contact is fixed by the resin material biting into the recess. Therefore, it does not move in the fitting direction.

Further, according to the method of manufacturing a mold-in contact of the present invention, since the contact is positioned by the pilot pin and the mold-in molding is performed, it is possible to mold the plurality of contacts in an aligned state. Only by cutting the carrier after in-molding, a mold-in-contact structure can be easily obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a contact used in a mold-in-contact structure of the present invention.

FIG. 2 is a perspective view showing a first mold used in the method of manufacturing the mold-in-contact structure shown in FIG. 1;

FIG. 3 is a perspective view showing a state where the contact of FIG. 1 is set on the first mold of FIG. 2 and the second mold is placed thereon.

FIG. 4 is a perspective view showing a state where a resin material is molded from the state of FIG. 3 and then a mold is removed.

5 is a perspective view showing a state in which the carrier is cut off from the state of FIG. 4 to complete a mold-in-contact structure.

FIG. 6 is a perspective view of the mold-in-contact structure shown in FIG. 5 in an inverted state.

FIG. 7 is a perspective view showing a main part of a conventional mold-in-contact structure.

[Explanation of symbols]

 1, 51 Contact 1a First holding portion 1b, 51a Contact portion 1c Second holding portion 2a, 2b Depressed portion 3 Pilot hole 4 Carrier 4a Carrier hole 10, 52 Substrate 10a One end surface of substrate 11, 53 Fitting plate portion 11a One mating plate surface 21 Mating connector 22 Mating contact 31 First mold 32 Pilot pin 33 Second mold

Claims (4)

[Claims] 1. A mold-in contact structure in which a conductive contact that detachably contacts a conductive counterpart contact is held on a substrate made by mold-in molding using a resin material, wherein the substrate has one end surface thereof. A first holding portion embedded and held in the substrate, and the contact is exposed to a fitting plate surface orthogonal to a thickness direction of the fitting plate portion, and A contact portion connected to the first holding portion and extending in the fitting direction; and a second portion connected to the contact portion and bent in the plate thickness direction of the fitting plate portion and embedded and held in the fitting plate portion. And a holding portion, wherein at least one of the first and second holding portions has an engagement means for preventing movement of the contact in the fitting direction. 2. The mold-in-contact structure according to claim 1, wherein the first holding portion has a pilot hole through which a pilot pin provided in a mold used when molding the contact is molded. A mold-in-contact structure, characterized in that: 3. A method for manufacturing a mold-in contact structure in which a conductive contact that releasably comes into contact with a conductive counterpart contact is held on a substrate formed by mold-in molding with a resin material, wherein the first holding is performed. A plurality of contacts in which the portion, the contact portion, and the second holding portion are connected in a uniaxial direction, are punched out in a state where they are aligned with a predetermined pitch by punching a conductive plate, and the end of the second holding portion is formed. Punches are formed by punching into shapes that are connected to a band-shaped carrier, and together with these punches, an engaging means for causing a resin material to bite into at least the first holding portion, and a pilot penetrating a pilot pin provided in the first mold. A punching step of forming a hole, a bending step of bending a connecting portion between the contact portion and the second holding portion in a direction perpendicular to each other, Positioning on the first mold surface of the first mold, and positioning the contact at a predetermined position by inserting the pilot hole into the pilot pin; and positioning the contact at an interval so as to sandwich the contact. The second mold is placed on the first mold, and the resin material is injected into the spaces of the first and second molds, and the carrier, the connection portion between the second holding portion and the carrier are connected. A mold-in step of forming the substrate in a state where the contact is molded-in while leaving a contact, and a cutting step of cutting a connection portion between the second holding portion and the carrier and removing the carrier. A method for manufacturing an in-contact structure. 4. The method for manufacturing a mold-in-contact structure according to claim 1, or the method for manufacturing a mold-in-contact structure according to claim 3, wherein the engagement means is formed by cutting out at least one edge in a longitudinal direction. A mold-in-contact structure, characterized in that it is a recess.