JPH11254410A - Manufacture of particle board - Google Patents
Manufacture of particle boardInfo
- Publication number
- JPH11254410A JPH11254410A JP10685698A JP10685698A JPH11254410A JP H11254410 A JPH11254410 A JP H11254410A JP 10685698 A JP10685698 A JP 10685698A JP 10685698 A JP10685698 A JP 10685698A JP H11254410 A JPH11254410 A JP H11254410A
- Authority
- JP
- Japan
- Prior art keywords
- particle board
- mdi
- adhesive
- synthetic resin
- surfactant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明が属する技術分野】本発明は、木材のリサイクル
チップや建築廃材等の木片に、接着剤を塗布して板状に
フォーミングし熱圧締成形してパーティクルボードを得
るパーティクルボードの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a particle board by applying an adhesive to wood chips, such as recycled wood chips and building waste, forming into a plate shape, and hot pressing to obtain a particle board. .
【０００２】[0002]
【従来の技術】木片に、ユリア樹脂やメラミン樹脂等の
熱硬化性樹脂からなる接着剤を塗布して板状にフォーミ
ングし、熱圧締成形してパーティクルボードを得るプロ
セスが知られている。2. Description of the Related Art There is known a process in which an adhesive made of a thermosetting resin such as a urea resin or a melamine resin is applied to a piece of wood, formed into a plate shape, and hot pressed to obtain a particle board.
【０００３】従来、既知の接着剤を用いるパーティクル
ボードの製造プロセスにおいては、製品品質の面では問
題はないが、生産性をさらに向上せしめるには限界があ
った。Conventionally, in the production process of a particle board using a known adhesive, there is no problem in terms of product quality, but there is a limit in further improving the productivity.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、従来技術よ
りもさらに生産性を向上せしめ得るパーティクルボード
の製造方法を提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a particle board which can further improve the productivity as compared with the prior art.
【０００５】[0005]
【課題を解決するための手段】本発明の特徴とする処
は、木片に、熱硬化性合成樹脂接着剤を塗布して板状に
フォーミングした後、熱圧締成形するパーティクルボー
ドの製造方法において、木片に先ず熱硬化性合成樹脂接
着剤を塗布し、次いで非乳化ＭＤＩ及び界面活性剤から
なる接着剤を塗布して板状にフォーミングした後、熱圧
締成形することを特徴とするパーティクルボードの製造
方法にある。以下、本発明を詳細に説明する。A feature of the present invention resides in a method of manufacturing a particle board in which a thermosetting synthetic resin adhesive is applied to a piece of wood, formed into a plate, and then subjected to hot pressing. A particle board characterized in that a thermosetting synthetic resin adhesive is first applied to a piece of wood, and then an adhesive comprising non-emulsified MDI and a surfactant is applied, formed into a plate shape, and then subjected to hot pressing. Manufacturing method. Hereinafter, the present invention will be described in detail.
【０００６】[0006]
【発明の実施の態様】本発明は叙上のように構成したか
ら、パーティクルボードの製造プロセスにあって、熱圧
締成形時間を短縮せしめ生産性を向上させ得る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Since the present invention is configured as described above, it is possible to shorten the time of hot press molding and improve productivity in the particle board manufacturing process.
【０００７】発明者は、パーティクルボードの製造プロ
セスにおいて、生産性を向上せしめる技術的手段につい
て種々検討を重ねた結果、接着剤にＭＤＩ（ジ・フェニ
ルメタン、ジ・イソシアネート）を添加することが有効
であることを知見した。ＭＤＩを添加するに際しては、
接着剤にＭＤＩを添加したものを同時に木片（チップ）
に吹き付け塗布するのではなくて、先ず、たとえば尿素
メラミン共縮合樹脂接着剤を木片に吹き付け、然る後に
ＭＤＩ（乳化タイプ）を吹き付け塗布し、板状にフォー
ミングし熱圧締成形してパーティクルボードを得る。As a result of various studies on technical means for improving productivity in the particle board manufacturing process, it has been found that adding MDI (diphenylmethane, diisocyanate) to the adhesive is effective. It was found that. When adding MDI,
Adhesive with MDI added simultaneously with wood chips (chips)
Instead of spray coating, a urea melamine co-condensation resin adhesive is first sprayed onto a piece of wood, followed by MDI (emulsion type) spray coating, forming into a plate shape, and hot pressing to form a particle board. Get.
【０００８】しかしながら、乳化タイプのＭＤＩを用い
ると、熱圧締成形時間は短縮されるけれども、乳化タイ
プのＭＤＩは高価である。そこで発明者は、安価な非乳
化タイプのＭＤＩを用いることを試みたが、接着剤の粘
度が低いことに起因して分離が生じることがある。そこ
で発明者はさらに検討を加えた結果、非乳化タイプのＭ
ＤＩに石鹸等の界面活性剤をＭＤＩと等量、接着剤塗布
に次いで木片に塗布することによって、乳化タイプのＭ
ＤＩを用いる場合に比し、遜色のない結果を得ることが
できることを知見した。However, when the emulsification type MDI is used, the hot press molding time is shortened, but the emulsification type MDI is expensive. Then, the inventor tried to use inexpensive non-emulsifying type MDI, but separation may occur due to the low viscosity of the adhesive. Therefore, the inventor further studied and found that the non-emulsifying type
An emulsifying type M is prepared by applying a surfactant such as soap to DI in an amount equivalent to that of MDI and then applying the adhesive to a piece of wood.
It has been found that results comparable to those using DI can be obtained.
【０００９】前述のプロセスにあって、尿素樹脂接着剤
は硬化剤が配合してあると酸性であるからＭＤＩは硬化
せず、熱圧締成形を経て硬化する。In the above-described process, the urea resin adhesive is acidic when a curing agent is mixed therein, so that the MDI does not cure but is cured through hot press molding.
【００１０】接着剤に、非乳化タイプのＭＤＩおよび石
鹸等の界面活性剤を添加するときの量は、接着剤固形分
に対して非乳化ＭＤＩおよび石鹸等の界面活性剤の量が
３％−８％の範囲内である。ＭＤＩおよび石鹸等の界面
活性剤の量が３％未満であると、熱圧締成形時間短縮効
果が発現しない。一方、８％を超えて添加すると、パー
ティクルボードの製造コストを上昇せしめて好ましくな
い。而して、非乳化ＭＤＩおよび界面活性剤の量に占め
る界面活性剤の量は、重量で、５％−３０％の範囲であ
る。界面活性剤としては、たとえばＬｉ石鹸やＮａ石鹸
などの金属石鹸が実際的なものとして利用され得る。[0010] When adding a surfactant such as non-emulsifying type MDI and soap to the adhesive, the amount of the surfactant such as non-emulsifying MDI and soap is 3% based on the solid content of the adhesive. It is within the range of 8%. If the amount of the surfactant such as MDI and soap is less than 3%, the effect of shortening the time for hot press molding is not exhibited. On the other hand, adding more than 8% is not preferable because it increases the production cost of the particle board. Thus, the amount of surfactant in the amount of non-emulsified MDI and surfactant ranges from 5% to 30% by weight. As the surfactant, a metal soap such as Li soap or Na soap can be used as a practical one.
【００１１】本発明の実施態様においては、上記接着剤
成分の他にそれら自体周知の、耐水性を付与するための
ワックスエマルジョンをまた、硬化剤としての塩安をさ
らに、ホルマリン吸収剤としての尿素等を適当量添加す
ることは勿論できる。In an embodiment of the present invention, in addition to the above-mentioned adhesive component, a wax emulsion for imparting water resistance, which is well known per se, is used. Can of course be added in appropriate amounts.
【００１２】[0012]
【実施例１】パーティクルボードの芯層を形成する木片
（チップ）に尿素メラミン共縮合樹脂接着剤を重量で、
木片１００部当り１１部スプレイ塗布した後、非乳化タ
イプのＭＤＩに界面活性剤としての石鹸を配合したもの
を、接着剤固形分に対し５％となる量、スプレイ塗布し
て板状にフォーミングした後、ホットプレスによって温
度：１６０℃−１８０℃、圧力：２９ｋｇｆ／ｃｍ２−
３１ｋｇｆ／ｃｍ２、時間：３分間で熱圧締成形し、１
５ｍｍ厚さのパーティクルボードを得た。強度性能（曲
げ強さ、湿潤曲げ強さ等）に関して全く問題のないパー
ティクルボードであった。Example 1 A urea-melamine co-condensation resin adhesive was added to wood chips (chips) forming a core layer of a particle board by weight.
After spray-coating 11 parts per 100 parts of wood, non-emulsifying MDI mixed with a soap as a surfactant was spray-coated in an amount of 5% based on the solid content of the adhesive, and formed into a plate shape. Then, by hot pressing, temperature: 160 ° C.-180 ° C., pressure: 29 kgf / cm 2 −
31 kgf / cm 2 , time: 3 minutes,
A 5 mm thick particle board was obtained. The particle board had no problem in strength performance (bending strength, wet bending strength, etc.).
【００１３】[0013]
【比較例】重量で、接着剤を木片（チップ）１００部当
り１５部適用することならびに非乳化タイプのＭＤＩに
界面活性剤としての石鹸を塗布しないことの他は、実施
例１におけると同じ条件で１５ｍｍ厚さのパーティクル
ボードを製造した。熱圧締成形時間は、３分３０秒間を
要した。COMPARATIVE EXAMPLE The same conditions as in Example 1 except that 15 parts by weight of adhesive were applied per 100 parts of wood chips (chips) and no soap as a surfactant was applied to non-emulsifying type MDI. Produced a particle board having a thickness of 15 mm. The hot press molding time required 3 minutes and 30 seconds.
【００１４】本発明によれば、熱圧締成形時間が約１５
％短縮でき、生産性を高め得ることが分る。According to the present invention, the hot press molding time is about 15 hours.
% Can be reduced and productivity can be increased.
【００１５】[0015]
【発明の効果】本発明によるときは、熱圧締成形時間を
１５％程度短縮することができ、生産性を大きく高め得
るとともに接着剤使用量を減少せしめ得る。According to the present invention, the time for hot press molding can be reduced by about 15%, the productivity can be greatly increased, and the amount of adhesive used can be reduced.
Claims (1)
して板状にフォーミングした後、熱圧締成形するパーテ
ィクルボードの製造方法において、木片に先ず熱硬化性
合成樹脂接着剤を塗布し、次いで非乳化ＭＤＩ及び界面
活性剤からなる接着剤を塗布して板状にフォーミングし
た後、熱圧締成形することを特徴とするパーティクルボ
ードの製造方法。1. A method for producing a particle board in which a thermosetting synthetic resin adhesive is applied to a wooden piece and formed into a plate shape, and then thermocompression molded, a thermosetting synthetic resin adhesive is first applied to the wooden piece. And then applying an adhesive comprising non-emulsified MDI and a surfactant, forming the mixture into a plate, and then performing hot pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10685698A JPH11254410A (en) | 1998-03-12 | 1998-03-12 | Manufacture of particle board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10685698A JPH11254410A (en) | 1998-03-12 | 1998-03-12 | Manufacture of particle board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11254410A true JPH11254410A (en) | 1999-09-21 |
Family
ID=14444242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10685698A Pending JPH11254410A (en) | 1998-03-12 | 1998-03-12 | Manufacture of particle board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11254410A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104029270A (en) * | 2014-06-24 | 2014-09-10 | 绥阳兴翰轮盘制造有限公司 | Cornstalk particle board processing method |
| CN104526831A (en) * | 2014-12-19 | 2015-04-22 | 江南大学 | Straw plate and preparing method thereof |
-
1998
- 1998-03-12 JP JP10685698A patent/JPH11254410A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104029270A (en) * | 2014-06-24 | 2014-09-10 | 绥阳兴翰轮盘制造有限公司 | Cornstalk particle board processing method |
| CN104526831A (en) * | 2014-12-19 | 2015-04-22 | 江南大学 | Straw plate and preparing method thereof |
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