JPH11251706A - Substrate for connecting electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the fraction defective of a substrate for connecting electronic parts as a module, by surely and easily executing the repair of defective electronic parts. SOLUTION: A substrate for connecting electronic parts has electrode pads which are used for making electrical contact with electrode terminals provided to electronic parts 110, 120, and 130 while maintaining prescribed correspondence relations with the terminals wiring patterns 102,... 102 which are respectively connected to the electrode pads while maintaining prescribed correspondence relations with the pads and lands 101,..., 101 for test which are formed on the surface of the substrate around the mounting positions of the parts 110, 120, and 130, while maintaining prescribed correspondence relations with the patterns 102,..., 102 and used for testing the propriety of the parts 110, 120, and 130, in a state where the lands 101,..., 101 are electrically contacted with the patterns 102,..., 102.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for mounting electronic components, and more particularly, to a BGA (Ball Grid).
Array) and CSP (Chip Size Pac)
The present invention relates to a board suitable for a semiconductor module such as an MCM (multi-chip module) in which a plurality of electronic components such as an LSI package such as a semiconductor chip and a bare chip and a flip chip are mounted on a single board.

[0002]

2. Description of the Related Art Conventionally, as a board for connecting electronic parts of this kind, for example, Japanese Patent Publication No. 5-3138 (publication date: January 14, 1993, title of invention: semiconductor device, see FIG. 4)
There is something like that shown in

In a conventional electronic component connection board 1, a BGA
A plurality of electrode pads 2,..., 2 were formed at equal pitches on the substrate 1 in order to mount a plurality of electronic components 5, 6, 7, such as a package, an LSI package such as a CSP, and a bare chip or a flip chip. . Similarly, on a substrate 8 of a multi-chip module in which a plurality of electronic components 5, 6, and 7 are flip-chip mounted on a single substrate 8, a plurality of electrode pads 9,. It had been. Each of these electrode pads 2,...
, 9 were wire-bonded via conductive leads in a one-to-one correspondence.

[0004]

However, in such a conventional board for connecting electronic components, a plurality of electrode pads 2,... 2, and electrode pads 9,. As a result of testing as a module after mounting the electronic component, if a module defect is found, it is difficult to determine which electronic component mounted on the defective module is defective. . As a result, there is a problem that the entire module must be treated as a defect.

SUMMARY OF THE INVENTION An object of the present invention is to solve such a conventional problem. In particular, the present invention is directed to making an electrical contact while maintaining a predetermined correspondence with an electrode terminal provided on an electronic component. A wiring pattern having an electrode pad and being connected to each of the electrode pads while maintaining a predetermined correspondence; and Formed and provided with test lands for testing the quality of electronic components with wiring patterns and electrical contacts.Connecting jigs such as probes to the test lands and mounting them on the module Quality test for each electronic component that has been performed can be performed individually, the determination of the defective electronic component can be performed simply and accurately, and the repair of the defective electronic component can be performed reliably and simply. Results are an object of the present invention to greatly reduce the percent defective as a module.

Second, it is an object to unify contact jigs such as probes used for a test, and as a result, to significantly reduce the cost and the manufacturing period required for the contact jig. .

[0007]

According to a first aspect of the present invention, an electronic component connecting board for mounting electronic components 110, 120, and 130 is provided. It has an electrode pad for making an electrical contact while maintaining a predetermined correspondence with the electrode terminals provided on the components 110, 120, and 130, and connecting and maintaining a predetermined correspondence with each of the electrode pads. , 102 and the wiring patterns 102,..., 102 are formed on the surface of the base body around the mounting position of the electronic components 110, 120, 130 while maintaining a predetermined correspondence with each of the wiring patterns 102,. The wiring patterns 102,.
An electronic component connection board 10 having a hardware configuration including test lands 101,..., 101 for testing the quality of the electronic components 110, 120, and 130 while having electrical contact with the electronic components 110, 120, and 130.

According to the first aspect of the present invention, a contact jig such as a probe is connected to test lands 101,.
01 can be individually tested for pass / fail of each of the electronic components 110, 120, and 130 mounted on the module, and the determination of the defective electronic components 110, 120, and 130 can be easily and accurately performed. Parts 110, 120, 1
30 repairs can be performed reliably and easily, and as a result,
The defective rate as a module can be greatly reduced.

According to a second aspect of the present invention, in the electronic component connecting board 10 according to the first aspect, each of the test lands 101,.
The electronic component connection board 10 has a hardware configuration and is formed at regular intervals along a predetermined outer peripheral frame outside the mounting positions of 120 and 130.

According to the second aspect of the present invention, the first aspect is provided.
, Test lands 101,..., 1
01 are formed at equal intervals to unify contact jigs such as probes used for testing.
As a result, it is possible to significantly reduce the cost and the manufacturing period required for the contact jig.

According to a third aspect of the present invention, in the electronic component connecting board 10 according to the first aspect, when the outer peripheral frame is constituted by a predetermined side, a predetermined number of the test lands 101,. , 101 are electronic component connection boards 10 having a hardware configuration formed along predetermined corresponding sides at intervals set for the corresponding sides.

[0012] According to the third aspect of the present invention, the first aspect is provided.
And a predetermined number of test lands 10
1,..., 101 are formed along predetermined corresponding sides at intervals set for each corresponding side, thereby unifying a contact jig such as a probe used for a test.
As a result, it is possible to significantly reduce the cost and the manufacturing period required for the contact jig.

According to a fourth aspect of the present invention, in the electronic component connection board 10 according to the first aspect, when the outer peripheral frame is constituted by predetermined sides, a predetermined number of the test lands 101,. , 101 are formed along a predetermined corresponding side at a first pitch A (B) which is an interval set to the corresponding side, and the remaining test lands 10 are formed.
1,..., 101 are hardware-structured electronic component connections formed along the remaining corresponding sides at a second pitch nA (nB), which is an integer multiple of the first pitch A (B). Substrate 10.

According to the invention described in claim 4, according to claim 1 of the present invention,
And a predetermined number of test lands 10
, 101 are formed along a predetermined corresponding side at a first pitch A (B) which is an interval set to the corresponding side, and in addition, the remaining test lands 101,. Second pitch n which is an integer multiple of one pitch A (B)
· A (n · B) is formed along the remaining corresponding sides to unify the contact jigs such as probes used for the test, and as a result, a large cost required for the contact jigs In addition, the production time can be significantly reduced.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Various embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 is a top view for explaining a first embodiment of an electronic component connection board 10 according to the present invention.

The electronic component connecting board 10 shown in FIG.
GA (Ball Grid Array) and CSP (C
MC in which a plurality of electronic components 110, 120, and 130 such as a bare chip and a flip chip are mounted on a single substrate, such as an LSI package such as a chip size package.
This is a substrate suitable for a semiconductor module such as M (multi-chip module).

In the following, the electronic components 110, 120, 13
A description will be given by taking a multi-chip module in which a plurality of flip chips are mounted as 0 as an example.

The electronic component connecting board 10 of the present embodiment comprises:
, 102, test land 10
, 101 are the hardware configuration.

The flip-chip connection substrate 10 includes:
Polyimide substrate or glass epoxy substrate (FR-4, FR
-5), a BT resin substrate, a ceramic substrate or the like can be used.

Each of the wiring patterns 102,..., 102 is connected to each of the flip-chip connection electrode pads while maintaining a one-to-one correspondence.

The flip chip connection electrode pad is an electrode for making an electrical contact while maintaining a one-to-one correspondence with bumps (electrode terminals) provided on each of the flip chips 110, 120, and 130.

Each of the test lands 101,..., 101 has a one-to-one correspondence with each of the wiring patterns 102,.
30 are formed on the surface of the flip-chip connection substrate 10 around each of the mounting positions of the wiring patterns 30, and the wiring patterns 102,.
Flip chip 1 with electrical contact 2
Lands for testing the quality of each of 10, 120, and 130.

Also, test lands 101,..., 101
Are copper (element symbol: Cu), silver (element symbol: A)
g), tungsten (element symbol: W) or the like on a base pattern (film thickness = several μm), nickel (element symbol: Ni) plating is performed about 1 to 2 μm, and gold (element symbol: A)
u) It is formed by performing plating of about 0.2 to 1.0 μm.

The test lands 101,..., 101 formed in this manner can be adapted to a narrow pitch.

As described above, according to the first embodiment, the contact jig such as the probe is connected to the test land 1.
, 101, and mounted on the multi-chip module.
The test of the pass / fail of each of the 130 can be performed individually, the determination of the defective flip chip can be performed simply and accurately, and the repair of the defective flip chip can be performed reliably and simply, as a result, as a multi-chip module Can be greatly reduced.

(Second Embodiment) FIG. 2 is a top view for explaining a second embodiment of the electronic component connection board 10 of the present invention. Note that the same parts as those already described in the first embodiment are denoted by the same reference numerals, and redundant description will be omitted.

The electronic component connecting board 10 shown in FIG. 2 is different from the test lands 101,..., 101 of the first embodiment in that the test lands 1 connected to the wiring 102 are used.
, 101 are flip chips 110, 1
It is characterized in that it is formed at equal intervals A (or B) along a predetermined outer peripheral frame outside each of the mounting positions 20 and 130.

In this embodiment, at equal intervals A (or B)
Is set to about several mm to which a contact jig such as a probe used for a test can be attached.

As described above, according to the second embodiment, a contact jig such as a probe is connected to the test land 1.
, 101, and mounted on the multi-chip module.
The test of the pass / fail of each of the 130 can be performed individually, the determination of the defective flip chip can be performed simply and accurately, and the repair of the defective flip chip can be performed reliably and simply, as a result, as a multi-chip module Can be greatly reduced.

In addition, test lands 101,.
By forming each of the 101's at equal intervals A (or B), the contact jigs such as probes used for testing are unified, and as a result, a large cost and manufacturing time required for the contact jig are required. Significant reduction can be achieved.

(Third Embodiment) FIG. 3 is a top view for explaining a third embodiment of the electronic component connection board 10 of the present invention. The same parts as those already described in the first embodiment or the second embodiment are denoted by the same reference numerals, and redundant description will be omitted.

The electronic component connecting board 10 shown in FIG. 3 has a configuration in which a predetermined number of test lands 101,... The feature is that the lands 101,..., 101 are formed along predetermined corresponding sides at intervals set for each corresponding side.

Specifically, when the outer peripheral frame is a quadrangle formed by four sides, as shown in FIG. 3, a predetermined number of test lands 101,. Is formed along a predetermined corresponding side at a first pitch A, and the remaining test lands 101,
, 101 are formed along the remaining corresponding sides at a second pitch 2 × A (n = 2), which is twice as long as the first pitch A.

Similarly, a predetermined number of test lands 101,
, 101 are formed along a predetermined corresponding side at a first pitch B which is an interval set to the corresponding side, and at the same time, the remaining test lands 101,.
Are formed along the remaining corresponding sides at a second pitch of 2 × B (n = 2), which is twice as long as.

As described above, according to the third embodiment, a contact jig such as a probe is connected to the test land 1.
, 101, and mounted on the multi-chip module.
The test of the pass / fail of each of the 130 can be performed individually, the determination of the defective flip chip can be performed simply and accurately, and the repair of the defective flip chip can be performed reliably and simply, as a result, as a multi-chip module Can be greatly reduced.

In addition, a predetermined number of test lands 10
, 101 are formed along a predetermined corresponding side at a first pitch A (B), which is an interval set to the corresponding side, and the remaining test lands 101,.
(B) an integer multiple (in the present embodiment, twice, that is, n
= 2), and formed along the remaining corresponding sides at a second pitch n · A (n · B), which is an interval of 2), thereby unifying a contact jig such as a probe used for a test. As a result, it is possible to greatly reduce the cost required for the contact jig and the production period.

[0038]

According to the first aspect of the present invention, a contact jig such as a probe can be connected to a test land to individually execute a quality test for each electronic component mounted on a module. In addition, the defective electronic component can be easily and accurately determined, and the repair of the defective electronic component can be reliably and simply performed. As a result, the defective rate of the module can be significantly reduced.

According to the invention described in claim 2, according to claim 1
In addition to the effects described in the above, by forming the test lands at equal intervals, the contact jigs such as probes used for testing are unified, and as a result, a large amount of contact jigs are required. The cost and production time can be significantly reduced.

According to the invention described in claim 3, according to claim 1
In addition to the effects described in the above, a predetermined number of test lands are formed along predetermined corresponding sides at intervals set for each corresponding side, so that a contact jig such as a probe used for testing is formed. As a result, it is possible to greatly reduce the cost and manufacturing time required for the contact jig.

According to the invention described in claim 4, according to claim 1,
In addition to the effects described in the above, a predetermined number of test lands are formed along the predetermined corresponding side at a first pitch which is an interval set to the corresponding side, and in addition, the remaining test lands are By being formed along the remaining corresponding sides at the second pitch which is an integral multiple of one pitch, the contact jigs such as probes used for testing are unified, and as a result, the contact jigs Enormous cost and a significant reduction in the production period can be achieved.

[Brief description of the drawings]

FIG. 1 is a top view for explaining a first embodiment of an electronic component connection board of the present invention.

FIG. 2 is a top view for explaining a second embodiment of the electronic component connection board of the present invention.

FIG. 3 is a top view for explaining a third embodiment of the electronic component connection board of the present invention.

FIG. 4 is a top view for explaining a conventional electronic component connection substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Electronic component connection board 101 ... Test land 102 ... Wiring pattern 110,120,130 ... Electronic component A, B ... First pitch n-A, n-B ... Second pitch

Claims (4)

[Claims] An electronic component connection board for mounting an electronic component, comprising: an electrode pad for making an electrical contact while maintaining a predetermined correspondence with an electrode terminal provided on the electronic component; A wiring pattern connected to each of the electrode pads while maintaining a predetermined correspondence, and formed on a surface of a base body around a mounting position of the electronic component while maintaining a predetermined correspondence to each of the wiring patterns; An electronic component connection board, comprising: the wiring pattern; and a test land for testing the quality of the electronic component with the electrical contact. 2. The electronic component connection according to claim 1, wherein each of the test lands is formed at regular intervals along a predetermined outer peripheral frame outside a mounting position of the electronic component. Substrate. 3. When the outer peripheral frame is constituted by predetermined sides, a predetermined number of the test lands are formed along predetermined corresponding sides at intervals set for the corresponding sides. The electronic component connection board according to claim 1, wherein: 4. When the outer peripheral frame is constituted by a predetermined side, a predetermined number of the test lands are formed along a predetermined corresponding side at a first pitch which is an interval set to the corresponding side. 2. The electronic component connection according to claim 1, wherein the remaining test lands are formed along the remaining corresponding sides at a second pitch that is an integer multiple of the first pitch. 3. Substrate.