JPH11251006A - Lead frame, lead frame assembly and relevant method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an improved lead frame and a lead frame assembly for housing such improved lead frame. SOLUTION: A bent section 28 of a circuit trace segment is so bent as to get over a neighboring circuit trace segment 18 and circuit trace segments 20 and 22. A remote contact segment 30 of the bent section 28 is so arranged as to be adjacent and parallel to a remote contact segment of the circuit trace segment 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

FIELD OF THE INVENTION The present invention relates to electrical connectors, and more particularly, but not exclusively, to providing a lead frame assembly that acts as an electrical connector with an insert molded insulative housing. Related to lead frames.

[0002]

2. Description of the Related Art In an insert-molded insulated housing having a large number of contacts constituting an electrical connector, it is necessary to design all circuit traces in one plane because of one progressive type. While it is practically desirable to make all contacts in a single leadframe stamped on a push die, such a configuration involves an electrical connector and the components or systems connecting the electrical connector. The disadvantage is that the flexibility in routing connection points provided by the insulating housing for electrical contact is reduced. A known technique for increasing the versatility of the routing between connection points of an insert-molded insulating housing is to increase the number of embossings. In this technique, two or more leadframes are provided to route the connection points of each insulating housing. However, this method not only complicates the structure by increasing the number of parts arranged in the injection mold, but also
The complexity of the charging tool and the cycle time of the process can also be adversely affected, requiring additional embossing dies. All of these factors increase product manufacturing costs.

[0003]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an improved lead frame and a lead frame assembly containing such an improved lead frame. Another problem to be solved is to provide an improved leadframe with improved flexibility of leadframe connection point routing. Another problem to be solved is to increase the flexibility of leadframe connection point routing in a leadframe assembly that includes a number of contacts all formed on a single leadframe stamped into a progressive stamping die. That is.

Another problem to be solved is an improved leadframe with improved flexibility of leadframe connection point routing and a leadframe assembly containing such an improved leadframe and being less expensive than previously manufactured. And to provide. Another problem to be solved is to provide an improved leadframe assembly that has the flexibility of connection point routing and uses contacts provided by a single stamping. Another problem to be solved is to provide an improved method of making a lead frame. Another problem to be solved is to provide an improved method of making a lead frame assembly.

[0005]

SUMMARY OF THE INVENTION In accordance with the present invention, there is provided a leadframe including a bottom segment and a plurality of circuit trace segments extending from the bottom segment. Each circuit trace segment extends from a first end adjacent to the bottom segment to an opposite remote contact segment. Each distant contact segment is parallel,
At least one circuit trace segment includes a section that overlies at least one adjacent circuit trace segment. The far contact segment of the circuit trace segment including the one section is located on one side of an adjacent circuit trace segment, and the first end of the far contact segment of the circuit trace segment including the one section is adjacent to the adjacent circuit trace segment. Located on the opposite side of the segment. A leadframe assembly including the above-described leadframe is also disclosed, and a method of making the above-described leadframe and leadframe assembly is also disclosed.

[0006]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an embodiment of a lead frame according to the present invention; FIG. Leadframe 10 includes a bottom segment and a plurality of circuit tray segments. The lead frame 10 is, for example, a bottom segment 12.
And a plurality of circuit trace segments 14, 16, 18, 20, 22 extending from the bottom segment. The number of circuit trace segments can be increased or decreased as desired. Each circuit trace segment extends from a first end adjacent the bottom segment 12 to an opposite end that includes the far contact segment. For example, the circuit trace segment 14 extends from the first end 24 to an opposite end that includes the far contact segment 26.

Each remote contact segment is parallel to each other as illustrated in FIG. At least one circuit trace segment includes a bent section 28 that overlies at least one adjacent circuit trace segment. By "jumping over" is meant a situation in which the one section bent up from a circuit trace segment crosses over one or more other circuit trace segments without contacting them. In the embodiment illustrated in FIG. 1, the bending section 28 includes the circuit trace segments 18, 20, 22.
Is getting over. The far contact segment 30 of the circuit trace segment 16 is located on one side 32 of the circuit trace segment 18, and the first end 34 is located on the opposite side 36 of the circuit trace segment 18.

As shown in FIG. 1, the distal contact segments 26, 30 and the first ends 24, 34 extend in a first plane. With the exception of circuit trace segment 16, all of the circuit trace segments illustrated in FIG. 1 extend substantially continuously in such a first plane from each first end to each remote contact segment. For example, circuit trace segment 14 extends substantially continuously in such a first plane from first end 24 to remote contact segment 26. The bent section 28 of the circuit trace segment 16 extends in a second plane parallel to the first plane, as also apparent from FIG.

In the embodiment of FIG. 1, each circuit trace segment is substantially orthogonal to bottom segment 12 while arrow 38
A length portion extending in the direction of. First ends, such as first ends 24, 34, for example, all extend in the direction of arrow 38. The bent section 28 of the circuit trace segment 16 extends in the direction of arrow 40 substantially parallel to the bottom segment 12. In one embodiment, all of the far contact segments are equally spaced, and all first ends are parallel to each other but not equally spaced. For example, in the embodiment of FIG. 1, all the far contact segments are equally spaced, and the number 42 between adjacent far contact segments is
Are substantially equal. Similarly, all first ends are parallel to each other but are not equally spaced. FIG.
The distances represented by arrows 44 and 46 are substantially equal to each other, but different from the different distances represented by arrows 48 and 50.

In one embodiment, at least one circuit trace segment includes one or more remote contact segments. For example, in the embodiment of FIG. 1, the circuit trace segment 20 branches at the location indicated by reference numeral 52 into two remote contact segments 54 and 56. The lead frame of the present invention is useful in making the lead frame assembly of the present invention. For example, FIG. 2 shows a leadframe assembly 58 that includes a leadframe 10 of the type illustrated in FIG. 1 and a plastic leadframe insulating housing 60. Insulated leadframe housing 60 can electrically and mechanically match harness connector 62 in a conventional manner.

In one embodiment of the present invention, a portion of the lead frame is embedded in a plastic lead frame insulating housing. For example, in the embodiment illustrated in FIG. 3, such a portion of the lead frame is represented by phantom line 64, and the portion embedded in the plastic lead frame insulating housing is represented by numeral 66. For more information,
One section of each circuit trace segment 14-22 is embedded in a portion 66 of a plastic leadframe insulating housing. The bent section 28 of the circuit trace segment is also embedded in this section 66.
Each circuit trace segment is a remote contact segment 26,
3 include exposed distal contact segments such as 54, 56, 30 that extend in a first direction 68 away from portion 66 and are parallel to each other as illustrated in FIG. is there. Each circuit trace segment 14-22 further includes an exposed end segment 70, 72, 74, 76, 78 extending away from portion 66 and extending in a second direction 80 opposite the first direction 68. Also included.

Hereinafter, a method for manufacturing the lead frame 10 will be described. In one embodiment, a sheet of conductive material, such as a sheet of copper, is cut into a desired shape. For example, a thin plate of conductive material can be cut into the shape shown in FIG. Cutting is performed such that a bottom segment 12 and a plurality of circuit trace segments 14-22 are provided. Each circuit trace segment extends from a first end, such as a first end 24 adjacent the bottom segment 12, to a remote contact segment, such as the remote contact segment 26 of the circuit trace segment 14, All but one of the far contact segments are cut such that they are parallel to each other as shown in FIG. In this embodiment, the bent section 28 of the circuit trace segment 16 is substantially orthogonal to the bottom segment 12. The far contact segment 30 of the circuit trace segment 16 extends along a direction of an arrow 82 that is substantially parallel to the bottom segment 12 and substantially orthogonal to the bent section 28 of the circuit trace segment 16. The sheet of conductive material can be cut such that at least one circuit trace segment, such as, for example, circuit trace segment 20 includes one remote contact segment, such as, for example, remote contact segments 54 and 56. In one embodiment, such a cutting step can be performed by a conventional stamping operation.

The at least one circuit trace segment is bent or folded until at least one section of the at least one circuit trace segment passes over at least one adjacent circuit trace segment. For example, as shown in FIG. 5, the circuit trace segment 16 is bent until its bent section 28 rides over the adjacent circuit trace segment 18 and circuit trace segments 20 and 22. 4, the far contact segment 30 of the bent bending section 28
Becomes parallel and adjacent to the far contact segment 84 of the circuit trace segment 22. Cutting, bending or bending circuit trace segments
It can be performed in a single operation using a conventional die. Cutting may be performed such that each circuit trace segment includes a length that extends in a direction substantially orthogonal to bottom segment 12.

After cutting and bending, the far contact segment 30 and the first end 34 of the circuit trace segment 16 are located on each side of the circuit trace segment 18. Then, the cut sheet is extended to a first plane. After the above bending, bending section 2
8 in a second plane parallel to this first plane,
The lead frame has the configuration of the lead frame 19 in FIG. From FIG. 4 it is clear that after cutting, the far contact segment of the circuit trace segment and all of its opposite ends are not equally spaced.
From FIG. 5, it is clear that after the bending described above, all the far contact segments are equally spaced, even though the distance between the opposite ends of these far contact segments has not changed. .

[0015] In one embodiment, the leadframe may be plated in a conventional manner. For example, the lead frame 10 shown in FIG.
An aluminum inlay can be provided at the length indicated by arrow 86 on -22. The fabrication of the leadframe of the present invention can form a plurality of leadframes from a conductive material in a continuous process that is continuously fed from one processing stage to another. For example, FIG. 6 illustrates the formation of a plurality of leadframes from a conductive material in a progressive die, and
2 schematically illustrates the situation where each lead frame is transported by a progressive die (not shown) to rolls 88 and 90 and then to a plating process (not shown), carried by the strips forming the second. .

A leadframe according to the present invention is useful in making a leadframe assembly according to the present invention. For example, the leadframe insulating housing 60 of FIGS. 2 and 3 can be made by a conventional extrusion process. More specifically, during the extrusion of the lead frame 10, the lead frame 10 is embedded in a plastic lead frame insulating housing 60,
The outline indicated by the imaginary line 64 is embedded in the lead frame insulating housing at the position of the embedded part 66.
Thus, the portion of each circuit trace segment 14-22 inside the virtual line 64 is the circuit trace segment 1
4, for example, a length of the remote contact segment 26 extends from the buried portion 66 in a first direction indicated by the arrow 68 and at least a length of each first end. For example, the length portion 70 is indicated by an arrow 8
It is embedded in a state extending from the embedded portion 66 in the second direction indicated by 0. Using conventional insert injection molding operations, the lead frame can be embedded in the insulated housing as described.

After completion of the extrusion, the lead frame 10
At the location of each circuit trace segment 14-22 to remove excess material, indicated by the numeral 92, including the bottom segment, and to extend the long contact portions such as the far contact segment 26 and the length portion 70. Only the ends are exposed. The remote contact segment is a male member in the form of a prong and has a structure and arrangement for insertion into the female connector 94 of the harness connector 62, and the length 70 may be other if desired, such as a welding conductor. It has a structure and an arrangement for electrically and mechanically connecting one or more components.

By bending the bent section 28 of the circuit trace segment 16 over an adjacent circuit trace segment, a single embossing provides a complex routing plane. In essence, circuit traces can be formed in complex planes and formed so that they fold over each other, thereby forming a flat pattern or material that can increase routing flexibility in a single embossing operation. Is done. Although the present invention has been described with reference to the embodiments, it should be understood that various modifications can be made within the present invention.

[0019]

An improved leadframe and a leadframe assembly for accommodating such an improved leadframe are provided. An improved leadframe with improved flexibility of leadframe connection point routing is provided.
Increased flexibility of leadframe connection point routing in a leadframe assembly that includes multiple contacts all formed on a single leadframe stamped into one progressive stamping die. An improved leadframe with improved flexibility in leadframe connection point routing and a leadframe assembly that houses such an improved leadframe and that is less expensive than previously manufactured are provided. An improved leadframe assembly is provided that has the flexibility of connection point routing and uses contacts provided by a single stamping. An improved method of making a lead frame is provided. An improved method for making a leadframe assembly is provided.

[Brief description of the drawings]

FIG. 1 is a perspective view of one embodiment of a lead frame of the present invention.

FIG. 2 is a perspective view of a lead frame assembly according to the present invention in an aligned state for electrically connecting to a harness connector.

FIG. 3 is a sectional view of the lead frame assembly shown in FIG.
It is sectional drawing cut | disconnected along 3.

FIG. 4 is a plan view of a lead frame material used in manufacturing a lead frame embodiment of the present invention.

FIG. 5 is a plan view of the lead frame material of FIG. 4 which is bent to become a lead frame similar to the lead frame of FIG. 1;

FIG. 6 is a perspective view illustrating a transfer device useful for making a lead frame embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Lead frame 12 Bottom segment 14, 16, 18, 20, 22 Circuit trace segment 24, 34 First end 26, 30, 54, 56 Remote contact segment 28 Bending section 58 Lead frame assembly 60 Lead frame insulating housing 62 Harness connector

Claims (20)

[Claims] 1. A lead frame, comprising: a bottom segment; and a plurality of circuit trace segments extending from the bottom segment, each circuit trace segment having a first end adjacent to the bottom segment. Extending toward the remote contact segment opposite the one end, each of the remote contact segments being parallel, at least one circuit trace segment including a section that jumps over at least one adjacent circuit trace segment;
A far contact segment of the at least one circuit trace segment including the section is located on one side of the at least one adjacent circuit trace segment, and a first end of the at least one circuit trace segment including the section is A leadframe positioned opposite the at least one adjacent circuit trace segment. 2. Each of the far contact segments and each of the first ends extend in a first plane, and a plurality of circuit trace segments are substantially directed from the first end to the far contact segments. 2. The lead frame of claim 1 wherein at least one circuit trace segment including a section extending continuously over the at least one adjacent circuit trace segment extends in a second plane parallel to the first plane. 3. The lead frame of claim 1, wherein all of the far contact segments are equally spaced, and all of the first ends are parallel to each other and are not evenly spaced. 4. Each of the circuit trace segments has a length extending in a direction substantially orthogonal to the bottom segment, and at least one circuit trace segment including a section that extends over at least one adjacent circuit trace segment. The leadframe of claim 1 wherein said section extends in a direction substantially parallel to said bottom segment. 5. The leadframe of claim 1, wherein at least one circuit segment includes one or more remote contact segments. 6. A lead frame assembly, comprising: an insulated lead frame housing; and a lead frame that is a lead frame and is partially embedded in the lead frame insulated housing portion, wherein the lead frame includes a plurality of lead frames. Circuit trace segments, wherein each circuit trace segment includes a section embedded in the leadframe insulative housing portion and an exposed and mutually parallel remote portion extending in a first direction away from the leadframe insulative housing portion. At least one circuit trace segment having a contact segment and an exposed end segment extending away from the leadframe insulating housing portion in a second direction opposite the first direction; At least one adjacent circuit trace segment And wherein a remote contact segment of the at least one circuit trace segment is positioned on one side of the at least one adjacent circuit trace segment, wherein the remote contact segment of the at least one circuit trace segment is positioned on one side of the at least one adjacent circuit trace segment. A lead frame assembly in which an end segment of one circuit trace segment includes a plurality of circuit trace segments located on the opposite side of the at least one adjacent circuit trace segment. 7. Each of the far contact segments and each of the end segments extend in a first plane, and a plurality of circuit trace segments in a plurality of circuit trace segments are substantially directed from the end segment to the far contact segment. A section of at least one adjacent circuit trace segment that extends over at least one adjacent circuit trace segment and that is embedded in the leadframe insulating housing portion is parallel to the first plane. 7. The leadframe assembly of claim 6, wherein said leadframe assembly extends in said two planes. 8. The leadframe assembly of claim 6, wherein all of the distal contact segments are equally spaced, and all end sections are parallel to each other and are not evenly spaced. 9. Each of the circuit trace segments has a length extending in a direction substantially orthogonal to a leadframe insulating housing portion in which a section of each circuit trace segment is embedded, and at least one circuit trace segment. 7. The leadframe assembly of claim 6, wherein a section that surmounts at least one adjacent circuit trace segment and is embedded in the leadframe insulating housing portion extends in a direction substantially parallel to the leadframe insulating housing portion. . 10. The leadframe assembly of claim 6, wherein at least one circuit trace segment includes one or more remote contact segments. 11. A method for forming a lead frame, comprising: (a) forming a sheet of conductive material in the shape of a bottom segment and a plurality of circuit trace segments, and wherein each circuit trace segment is formed of a bottom segment; Cutting to extend from the first end toward the far contact segment; (b) bending at least one circuit trace segment until it gets over at least one adjacent circuit trace segment. 12. The method of claim 11, wherein steps (a) and (b) are performed using a progressive die. 13. The method as recited in claim 13, wherein the step of cutting includes cutting a sheet of conductive material into a first plane, wherein step (b) includes at least one circuit trace segment in a second plane parallel to the first plane. 12. The method of claim 11 including folding in at least one adjacent circuit trace segment in the plane of. 14. Step (a) comprises cutting a sheet of conductive material such that the far contact segments of each circuit trace segment are not evenly spaced and each first end is not evenly spaced. 12. The method of claim 11 wherein step (b) includes folding one section of each remote contact segment until the remote contact segments are evenly spaced. 15. The step (a) comprising cutting the conductive sheet material such that each circuit trace segment includes a length extending in a direction substantially orthogonal to the bottom segment; 12.) The method of claim 11, wherein said step of folding includes bending a section of at least one circuit trace segment until substantially parallel to said bottom segment. 16. The method of claim 11, wherein step (a) includes cutting the conductive sheet material such that at least one circuit trace segment includes one or more remote contact segments. 17. A method of forming a leadframe assembly, comprising: (a) forming a sheet of conductive material in the shape of a bottom segment and a plurality of circuit trace segments, each circuit trace segment being a first of the bottom segments. (B) bending at least one circuit trace segment until it rides over at least one adjacent circuit trace segment forming a lead frame; (c) Embedding one section of each circuit trace segment of the plurality of circuit trace segments forming the leadframe into a portion of the leadframe insulating housing, wherein at least some length of each remote contact segment is the leadframe insulating housing; Part one from the first (D) each circuit trace segment, wherein at least a length of each first end extends from a portion of the insulated leadframe housing in a second direction. Trimming a bottom segment from a lead frame assembly. 18. The method of claim 17, comprising performing steps (a) and (b) using a progressive stamping die and performing step (c) by insert injection molding. 19. Step (a) includes cutting the conductive sheet material such that each circuit trace segment includes a length that extends in a direction substantially orthogonal to the bottom segment. 18.) The method of claim 17, wherein the method further comprises: folding a section of at least one circuit trace segment until the section is substantially parallel to the bottom segment. 20. The method of claim 17, wherein step (a) comprises cutting the conductive sheet material such that at least one circuit trace segment includes one or more remote contact segments.