JPH11249151A - Manufacture of liquid crystal panel - Google Patents

Manufacture of liquid crystal panel

Info

Publication number
JPH11249151A
JPH11249151A JP5047298A JP5047298A JPH11249151A JP H11249151 A JPH11249151 A JP H11249151A JP 5047298 A JP5047298 A JP 5047298A JP 5047298 A JP5047298 A JP 5047298A JP H11249151 A JPH11249151 A JP H11249151A
Authority
JP
Japan
Prior art keywords
container
substrates
bag
empty cell
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5047298A
Other languages
Japanese (ja)
Inventor
Makoto Yokozeki
誠 横関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP5047298A priority Critical patent/JPH11249151A/en
Publication of JPH11249151A publication Critical patent/JPH11249151A/en
Pending legal-status Critical Current

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  • Liquid Crystal (AREA)

Abstract

PROBLEM TO BE SOLVED: To perform the sticking of a liquid crystal panel while the accurate positioning is performed by putting a free cell to be stuck into a container and vacuum-packing it. SOLUTION: The one (free cell) (a) for which an array substrate and a color filter substrate are aligned and temporarily fixed is put in a metallic frame (b) and put in a poly bag (f) and it is put in a vacuum chamber and vacuum packed by using a seal heater. Thereafter, when it is taken out from the vacuum chamber and an atmospheric pressure is applied, a pressure is applied through the plastic bag (f) to the free cell (a) and a prescribed clearance is formed between the both substrates. In this case, since the metallic frame (b) is present, force for shifting the both substrates does not act. In the state, thermosetting is performed in the atmospheric pressure and after the setting is ended, the plastic bag (f) is opened. In such a manner, heating is performed without generating the disorder of the alignment of the both substrates, a thermosetting adhesive material is cured and the both substrates are stuck.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本願は部品を正確に位置あわ
せして張り合わせる技術に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for accurately aligning and attaching components.

【0002】[0002]

【従来の技術】従来の部品の張り合わせ方法について、
液晶表示装置に用いるアレイ基板とカラーフィルター基
板を張り合わせを例にして説明する。
2. Description of the Related Art A conventional method of bonding parts is described below.
The following describes an example in which an array substrate and a color filter substrate used in a liquid crystal display device are bonded to each other.

【0003】図21は従来の、アレイ基板hとカラーフ
ィルター基板kを張り合わせる方法の説明図である。張
合せた基板の液晶注入前の状態を空セルという。
FIG. 21 is an explanatory view of a conventional method of bonding an array substrate h and a color filter substrate k. The state of the bonded substrates before liquid crystal injection is called an empty cell.

【0004】まず、アレイ基板hにシール剤(熱硬化型
接着剤)jの印刷と光硬化型接着剤iを塗布をした後、
カラーフィルター基板kをアライメント(位置あわせ)
して貼り合わせ、紫外線で光硬化型接着剤iを硬化させ
て仮留めで固定する。
[0004] First, after printing a sealant (thermosetting adhesive) j and applying a photocuring adhesive i to the array substrate h,
Alignment (alignment) of color filter substrate k
Then, the photocurable adhesive i is cured by ultraviolet rays and fixed by temporary fixing.

【0005】この後、アレイ基板hとカラーフィルタ基
板kを互いに押しつけながら両基板のギャップを保持し
てから熱硬化させればよい。
[0005] Thereafter, the array substrate h and the color filter substrate k are pressed against each other while maintaining the gap between the two substrates, and then heat cured.

【0006】両基板を互いに押しつける方法として、図
22のようにポリ袋で真空包装する方法がある。
As a method of pressing both substrates together, there is a method of vacuum packaging in a plastic bag as shown in FIG.

【0007】しかしながら、アレイ基板hとカラーフィ
ルタ基板kの仮留め時の端面は図23のように揃ってい
ないため、真空包装後のポリ袋で基板をずらす力が働
く。
However, since the end faces of the array substrate h and the color filter substrate k at the time of temporary fixing are not aligned as shown in FIG. 23, a force for shifting the substrates by the plastic bag after vacuum packing acts.

【0008】さらに、加熱硬化のための熱で光硬化型接
着剤が軟化して部品がずれ正確に貼り合わせることが出
来ないという課題がある。
Further, there is another problem that the photocurable adhesive is softened by heat for heat curing and the components are displaced and cannot be bonded accurately.

【0009】[0009]

【課題を解決するための手段】貼り合わせる基板を容器
に入れて真空パックする。
A substrate to be bonded is placed in a container and vacuum-packed.

【0010】(作用)基板をずらす力が働かないように
なり、正確な位置あわせをしたまま貼り合わせることが
出来る。
(Function) Since the force for shifting the substrate does not work, it is possible to bond the substrates with accurate positioning.

【0011】[0011]

【発明の実施の形態】(発明の実施の形態1)図1、図
2、図3、図4は発明の第1の実施の形態の説明図であ
る。
(First Embodiment of the Invention) FIGS. 1, 2, 3 and 4 are explanatory views of a first embodiment of the present invention.

【0012】図1のようにアレイ基板とカラーフィルタ
ー基板をアライメントし、仮留めしたものa(以下空セ
ルという)を金属枠bの中に入れポリ袋fに入れて、そ
れを図2のように真空引き用チャンバgの中に入れてシ
ールヒータmを用いて真空包装する。
As shown in FIG. 1, an array substrate and a color filter substrate are aligned, and a temporarily fixed one a (hereinafter referred to as an empty cell) is put in a metal frame b and put in a plastic bag f, as shown in FIG. Then, it is placed in a vacuum evacuation chamber g and vacuum-packed using a seal heater m.

【0013】その後、真空引き用チャンバgから取り出
して、大気圧をかけるとポリ袋fを通じて空セルaに圧
力がかかり両基板に所定の隙間が出来る。
Thereafter, when the substrate is taken out of the evacuation chamber g and the atmospheric pressure is applied, pressure is applied to the empty cell a through the plastic bag f, and a predetermined gap is formed between both substrates.

【0014】そして、金属枠bがあるために、両基板を
ずらす力が働かない。この状態で大気圧中で加熱硬化し
て、硬化し終わった後にポリ袋を開封する。
Since the metal frame b is provided, no force acts to shift the two substrates. In this state, the resin is cured by heating under atmospheric pressure, and after the curing is completed, the plastic bag is opened.

【0015】以上にようにして、両基板のアライメント
の狂いを発生させずに加熱して熱硬化接着剤を硬化させ
て貼り合わせることが出来る。
As described above, it is possible to bond the two substrates by heating and curing the thermosetting adhesive without causing any misalignment between the substrates.

【0016】(発明の実施の形態2)次に、発明の実施
の形態をさらに改良した方法について説明する。
(Embodiment 2) Next, a method of further improving the embodiment of the invention will be described.

【0017】図5、図6は空セルを入れる容器を改良し
たものであり、空セル厚み分窪みをもうけ、かつ窪みは
空セルの下面と同じように平坦な面を持ったものであ
る。
FIGS. 5 and 6 show an improved container in which empty cells are placed. The hollow is provided with a thickness corresponding to the empty cell thickness, and the hollow has a flat surface like the lower surface of the empty cell.

【0018】このようにすることにより、以下のような
問題点を解決することが出来るという効果を得ることが
出来る。
By doing so, it is possible to obtain the effect that the following problems can be solved.

【0019】すなわち、容器の底が空セルの底面の一部
しか支えない形状で有れば、真空包装の後に袋の外側を
大気圧にすることにより、空セルが上から圧力を受けた
ときに空セルを変形させる力が働き、図7のように空セ
ルを変形させる。
That is, if the bottom of the container has a shape that supports only a part of the bottom surface of the empty cell, the outside of the bag is brought to atmospheric pressure after vacuum packaging, so that the empty cell receives pressure from above. The force that deforms the empty cell acts on the empty cell to deform the empty cell as shown in FIG.

【0020】空セルが変形するときに両基板の位置がず
れる。空セルがずれるときには、左右対称にずれるとは
限らないため、この変形を矯正しても位置ずれが発生し
て正確に貼り合わせることが出来ない場合がある。
When the empty cell is deformed, the positions of both substrates are shifted. When an empty cell shifts, it does not always shift symmetrically. Therefore, even if this deformation is corrected, a positional shift may occur and accurate bonding may not be performed.

【0021】それに対して、本実施の形態では、空セル
を下から反作用によって均一圧力をかけるために空セル
が変形せず上記のような問題点が発生しない。
On the other hand, in the present embodiment, since the uniform pressure is applied to the empty cells by the reaction from below, the empty cells are not deformed and the above-mentioned problems do not occur.

【0022】さらに、空セルを乗せる平坦な面のために
容器の剛性が増す。容器の剛性が増すことにより、容器
の変形により空セルが変形してアライメントがずれるの
を防止することが出来る。
Furthermore, the rigidity of the container is increased due to the flat surface on which the empty cells are placed. By increasing the rigidity of the container, it is possible to prevent the empty cells from being deformed due to the deformation of the container, thereby preventing the alignment from being shifted.

【0023】また、窪みの深さと空セルの厚さの差が大
きければ図8のようにポリ袋の一部に力がかかり袋が破
けることがあるが、本発明の実施の形態では窪みの厚さ
が空セルの厚さであるため、空セルを入れた容器の上面
に段差が発生しない。
If the difference between the depth of the depression and the thickness of the empty cell is large, a force may be applied to a part of the plastic bag as shown in FIG. 8 to break the bag. Is the thickness of the empty cell, so that no step occurs on the upper surface of the container containing the empty cell.

【0024】段差が発生しないことにより、ポリ袋が破
れるのを防止することが出来、また、空セルに上からか
かる圧力が均一にする事が出来る。
By preventing the occurrence of a step, the plastic bag can be prevented from being broken, and the pressure applied to the empty cell from above can be made uniform.

【0025】なお、貼り合わせる部品が平らな形である
場合は本実施の形態のように容器の底は平らで有ればよ
いが、部品の形が平らでない場合には、容器の底の形を
その部品の形に合わせればよく、部品の形に合わせるこ
とにより本実施の形態と同様部品に下から均一な力が働
き、部品が変形することによるアライメントのずれを防
止することが出来る。
When the components to be bonded are flat, the bottom of the container may be flat as in the present embodiment, but when the shape of the components is not flat, the bottom of the container may be formed. Can be adjusted to the shape of the component, and by adjusting the shape of the component, a uniform force acts on the component from below as in the present embodiment, and it is possible to prevent misalignment due to deformation of the component.

【0026】(発明の実施の形態3)次に、発明の実施
の形態1の異なる改良について説明する。
(Third Embodiment of the Invention) Next, different improvements of the first embodiment of the invention will be described.

【0027】真空包装用のポリ袋を容器よりもわずかに
大きいものを使用することにより、しわの発生を押さえ
るものである。
By using a plastic bag for vacuum packaging that is slightly larger than the container, the generation of wrinkles is suppressed.

【0028】このようにすることにより図9のようにポ
リ袋のしわによって空セルに押し圧が均一にかからなく
なるのを防止し空セルが変形することによるアライメン
トの狂いを防止することが出来る。
By doing so, it is possible to prevent the pressing pressure from being applied uniformly to the empty cells due to the wrinkling of the plastic bag as shown in FIG. 9, and to prevent the alignment from being deformed due to the deformation of the empty cells. .

【0029】また、袋の形を容器の形と同じ形にするこ
とが望ましく、同様の効果が得られる。
It is desirable that the shape of the bag is the same as the shape of the container, and the same effect can be obtained.

【0030】また、図10のように、容器の外側の端面
を図の如く楔状にすることによりしわを防止することが
出来同様な効果が得られる。
Further, as shown in FIG. 10, by forming the outer end surface of the container in a wedge shape as shown in FIG. 10, wrinkles can be prevented and the same effect can be obtained.

【0031】かつ真空包装機での気密保持に有利に働
く。 (発明の実施の形態4)次に、発明の実施の形態1のさ
らに異なる改良について説明する。
Further, it works favorably for maintaining airtightness in a vacuum packaging machine. (Embodiment 4) Next, further different improvements of Embodiment 1 of the invention will be described.

【0032】空セルを入れる容器に図11、図12、図
13、図14、図15のように真空引きするときの気道
をもうける。
An airway for evacuating the container as shown in FIG. 11, FIG. 12, FIG. 13, FIG. 14, and FIG.

【0033】そして、真空引きするときは、図16、図
17、図18に示すような装置を用いることにより、ポ
リ袋の口の方は低圧になるが、空セルは大気圧に押され
た状態である。
When evacuating, the apparatus shown in FIGS. 16, 17, and 18 is used to reduce the pressure at the mouth of the plastic bag, but press the empty cell to atmospheric pressure. State.

【0034】このようにすることにより、下記のような
問題点を解決することが出来る。すなわち、空セルの空
気の出口は図19のように小さいため、袋全体をチャン
バ内に入れて真空引きした場合には、真空引き中は空セ
ル内の圧力がチャンバ内の圧力よりも高くなり図20の
ように空セルが膨れ、仮留めした基板をはくりする力が
かかり、アライメントを狂わせる原因となる。
By doing so, the following problems can be solved. That is, since the air outlet of the empty cell is small as shown in FIG. 19, when the entire bag is put into the chamber and evacuated, the pressure in the empty cell becomes higher than the pressure in the chamber during evacuation. As shown in FIG. 20, the empty cells swell, and a force for peeling off the temporarily fixed substrate is applied, which causes a misalignment.

【0035】本発明の実施の形態では、必ず、空セル内
の圧力よりも高い圧力で空セルを押さえるために、この
ような不具合が発生しないものであります。
In the embodiment of the present invention, such an inconvenience does not occur because the empty cell is always pressed with a pressure higher than the pressure in the empty cell.

【0036】なお、真空引きによりセル内と、セルを押
さえる力の圧力差を発生させていたが、圧力差によって
空セルを適当な力で押さえることが出来ればよい。
Although a pressure difference between the inside of the cell and the force for holding the cell is generated by evacuation, it is sufficient that the empty cell can be held down by an appropriate force by the pressure difference.

【0037】たとえば、完全に真空にする必要はなく、
ある程度圧力を低くするだけでもよく、また真空引きす
る代わりに、大気圧のままシールしてその後大気圧より
も高圧状態で加熱しても良い。このようにしたときは、
真空引きするときに空セルが膨れるという問題点が発生
しないと言う効果がある。
For example, it is not necessary to make a complete vacuum,
Instead of reducing the pressure to some extent, instead of evacuating, it is also possible to seal at the atmospheric pressure and then heat it at a higher pressure than the atmospheric pressure. When you do this,
There is an effect that the problem that an empty cell swells when evacuating does not occur.

【0038】[0038]

【発明の効果】以上のように、貼り合わせる部品を仮留
めして容器に入れ、真空パックすることにより、正確な
位置あわせをしたまま貼り合わせることが出来る。又は
汎用熱処理炉とこの容器の組合せで安価な投資で生産能
力の拡大が短納期で出来る。
As described above, by temporarily fixing the parts to be bonded, placing the parts in a container, and performing vacuum packing, the parts can be bonded together with accurate positioning. Alternatively, with the combination of a general-purpose heat treatment furnace and this container, the production capacity can be expanded in a short time with a cheap investment.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態の説明図FIG. 1 is an explanatory diagram of an embodiment of the present invention.

【図2】部品の貼り合わせ方法の説明図FIG. 2 is an explanatory view of a method of bonding parts;

【図3】本発明の実施の形態の説明図FIG. 3 is an explanatory diagram of an embodiment of the present invention.

【図4】本発明の実施の形態の説明図FIG. 4 is an explanatory diagram of an embodiment of the present invention.

【図5】本発明の実施の形態の説明図FIG. 5 is an explanatory diagram of an embodiment of the present invention.

【図6】本発明の実施の形態の説明図FIG. 6 is an explanatory diagram of an embodiment of the present invention.

【図7】本発明の実施の形態の説明図FIG. 7 is an explanatory diagram of an embodiment of the present invention.

【図8】本発明の実施の形態の説明図FIG. 8 is an explanatory diagram of an embodiment of the present invention.

【図9】本発明の実施の形態の説明図FIG. 9 is an explanatory diagram of an embodiment of the present invention.

【図10】本発明の実施の形態の説明図FIG. 10 is an explanatory diagram of an embodiment of the present invention.

【図11】本発明の実施の形態の説明図FIG. 11 is an explanatory diagram of an embodiment of the present invention.

【図12】本発明の実施の形態の説明図FIG. 12 is an explanatory diagram of an embodiment of the present invention.

【図13】本発明の実施の形態の説明図FIG. 13 is an explanatory diagram of an embodiment of the present invention.

【図14】本発明の実施の形態の説明図FIG. 14 is an explanatory diagram of an embodiment of the present invention.

【図15】本発明の実施の形態の説明図FIG. 15 is an explanatory diagram of an embodiment of the present invention.

【図16】本発明の実施の形態の説明図FIG. 16 is an explanatory diagram of an embodiment of the present invention.

【図17】本発明の実施の形態の説明図FIG. 17 is an explanatory diagram of an embodiment of the present invention.

【図18】本発明の実施の形態の説明図FIG. 18 is an explanatory diagram of an embodiment of the present invention.

【図19】本発明の実施の形態の説明図FIG. 19 is an explanatory diagram of an embodiment of the present invention.

【図20】本発明の実施の形態の説明図FIG. 20 is an explanatory diagram of an embodiment of the present invention.

【図21】部品の貼り合わせ手順の説明図FIG. 21 is an explanatory diagram of a procedure for bonding parts;

【図22】従来の部品の貼り合わせ方法の説明図FIG. 22 is an explanatory view of a conventional method of bonding parts.

【図23】従来の部品の貼り合わせ方法の説明図FIG. 23 is an explanatory view of a conventional method of bonding parts.

【符号の説明】[Explanation of symbols]

a 空セル b 金属枠(容器) f ポリ袋 g 真空包装用チャンバ h アレイ基板 i 光硬化型接着剤(仮留め用) j シール剤(熱硬化型接着剤) k カラーフィルター基板 m シールヒータ a Empty cell b Metal frame (container) f Plastic bag g Vacuum packaging chamber h Array substrate i Light-curing adhesive (for temporary fixing) j Sealant (thermosetting adhesive) k Color filter substrate m Seal heater

Claims (13)

【特許請求の範囲】[Claims] 【請求項1】対となる基板同士をシール剤を介して貼り
合わせてセルを形成し、液晶をシール剤の開口部から基
板の間に注入することにより液晶パネルを製作する液晶
パネルの製造方法であって、基板同士をシール剤を介し
て貼り合わせるに際して、張り合わせる空セルを容器に
入れて真空パックすることを特徴とする製造方法。
1. A method of manufacturing a liquid crystal panel, wherein a pair of substrates are bonded to each other with a sealant therebetween to form a cell, and a liquid crystal is injected between the substrates through an opening of the sealant. A method for producing a substrate, comprising: attaching an empty cell to be attached to a container and performing vacuum packing when the substrates are attached to each other via a sealant.
【請求項2】張り合わせる空セルを入れて真空パックす
るための容器。
2. A container for containing an empty cell to be bonded and vacuum-packing.
【請求項3】窪みの大きさが張り合わせる空セルの大き
さである容器を用いることを特徴とする請求項1記載の
製造方法。
3. The method according to claim 1, wherein a container having a size corresponding to the size of the empty cell to be bonded is used.
【請求項4】窪みの大きさが張り合わせる空セルと同じ
大きさであることを特徴とする請求項2記載の容器。
4. The container according to claim 2, wherein the size of the hollow is the same as the size of the empty cell to be bonded.
【請求項5】袋の大きさが容器の大きさであるか又は少
し大きいことを特徴とする請求項1又は請求項3記載の
製造方法。
5. The method according to claim 1, wherein the size of the bag is equal to or slightly larger than the size of the container.
【請求項6】張り合わせる空セルを入れる容器と同じか
又は少し大きい袋。
6. A bag that is the same as or slightly larger than the container that holds the empty cells to be laminated.
【請求項7】袋の形が容器の形であることを特徴とする
請求項1又は請求項3又は請求項5記載の製造方法。
7. The method according to claim 1, wherein the shape of the bag is a shape of a container.
【請求項8】張り合わせる空セルを入れる容器と同じ形
の袋。
8. A bag having the same shape as a container for holding an empty cell to be laminated.
【請求項9】容器の外側に楔状の形状を有することを特
徴とする請求項1又は請求項3又は請求項5又は請求項
7記載の製造方法。
9. The method according to claim 1, wherein the container has a wedge-like shape outside the container.
【請求項10】外側に楔状の形状を有することを特徴と
する請求項2又は請求項4記載の容器。
10. The container according to claim 2, wherein the container has a wedge-like shape on the outside.
【請求項11】容器に気道を有することを特徴とする請
求項1又は請求項3又は請求項5又は請求項7又は請求
項9記載の製造方法。
11. The method according to claim 1, wherein the container has an airway.
【請求項12】気道を有することを特徴とする請求項2
又は請求項4又は請求項10記載の容器。
12. The method according to claim 2, further comprising an airway.
A container according to claim 4 or claim 10.
【請求項13】気道を有する容器に張り合せるべき空セ
ルを挿入しポリ袋に此の容器を挿入、袋の開口部と気道
の向きをあわせた状態で、開口部側を真空包装機のチャ
ンバ内に置き袋の上から容器を弾性体シールで挟んで真
空引きし、熱シール包装をする方法。
13. An empty cell to be bonded to a container having an airway is inserted, and the container is inserted into a plastic bag. With the opening of the bag and the direction of the airway aligned, the opening side is a chamber of a vacuum packaging machine. A method in which the container is sandwiched between elastic bags and evacuated from above the bag, and heat sealed.
JP5047298A 1998-03-03 1998-03-03 Manufacture of liquid crystal panel Pending JPH11249151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5047298A JPH11249151A (en) 1998-03-03 1998-03-03 Manufacture of liquid crystal panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5047298A JPH11249151A (en) 1998-03-03 1998-03-03 Manufacture of liquid crystal panel

Publications (1)

Publication Number Publication Date
JPH11249151A true JPH11249151A (en) 1999-09-17

Family

ID=12859848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5047298A Pending JPH11249151A (en) 1998-03-03 1998-03-03 Manufacture of liquid crystal panel

Country Status (1)

Country Link
JP (1) JPH11249151A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100424572C (en) * 2004-12-29 2008-10-08 乐金显示有限公司 Seal hardening furnace of liquid crystal display device having rack bar

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100424572C (en) * 2004-12-29 2008-10-08 乐金显示有限公司 Seal hardening furnace of liquid crystal display device having rack bar

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