JPH11248579A - Manufacture of capacitive pressure sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve yield by recognizing the defect of a signal processing integrated circuit or a pressure sensor element before completion of assembly. SOLUTION: Before a pressure sensor element 1 is housed in a housing case 10, a condition where the force which is substantially equal to that applied to the pressure sensor element 1 at caulking work is applied to the pressure sensor element 1 is prepared. Under the condition, while a pressure sensing surface 2a is applied with a specified fluid pressure, an adjusting pin is brought into contact with an adjusting electrode provided on a circuit pattern on the pressure sensor element 1 to actuate an output adjusting means of a signal processing integrated circuit 8, for output-adjusting of the pressure sensor element 1. After completion of output, the pressure sensor element 1 is used for assembly to provide a capacitive pressure sensor unit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a capacitance type pressure sensor unit of a type which detects a pressure based on a change in capacitance.

[0002]

2. Description of the Related Art FIG. 8 is a longitudinal sectional view showing the structure of a conventional capacitance type pressure sensor unit.

This capacitance type pressure sensor unit has a pressure sensor element 1 for detecting the pressure of a fluid based on a change in capacitance. The pressure sensor element 1 has an electrode (not shown) on the front surface and a first surface having a back surface as a pressure sensing surface 2a.
And a second insulating member which is combined with the first insulating substrate 2 having an unillustrated electrode on the back surface facing the electrode of the first insulating substrate 2 at a predetermined distance from the electrode of the first insulating substrate 2 And a base 3. Surface 3a of second insulating substrate 3
Is formed with a circuit pattern, and the connection conductor pattern of the circuit pattern is electrically connected to each electrode in the pressure sensor element 1 described above.

[0004] On the surface 3a of the second insulating substrate 3 of the pressure sensor element 1, a connector 5 is superimposed. This connector 5 is a connector body (connector housing) 6 made of insulating resin which is arranged such that the end face of the base 6a is in contact with the surface 3a of the second insulating base 3 of the pressure sensor element 1.
And a plurality of connector terminals 7 incorporated in the connector main body 6.

On the surface 3a of the second insulating substrate 3 of the pressure sensor element 1, a signal processing integrated circuit 8 such as a CMOS IC which is electrically connected to a circuit pattern and processes the output of the pressure sensor element 1 is provided. Is installed. The signal processing integrated circuit 8 includes an output adjusting unit.

The connection electrodes of the circuit pattern on the surface 3a of the second insulating substrate 3 and the connector terminals 7 in the connector body 6
Are electrically connected by a flexible circuit board 9. As shown in FIG. 9, an adjustment electrode (not shown) used when operating the output adjustment means of the signal processing integrated circuit 8 is provided on a part 9 a in the longitudinal direction of the flexible circuit board 9.

The pressure sensor element 1 on which the signal processing integrated circuit 8 is mounted and the base 6a of the connector body 6 of the connector 5 are housed in a metal housing case 10. The storage case 10 includes a bottom wall portion 10a in which a fluid inlet 11 for introducing a fluid to be measured is formed,
A peripheral wall portion 10b having one end connected to the bottom wall portion 10a, a cylindrical portion 10c surrounding the fluid introduction port 11 and continuously provided at the center of the bottom wall portion 10a, and provided on the outer periphery of the distal end of the cylindrical portion 10c. The pressure sensor element 1 is housed in the peripheral wall portion 10b such that the pressure sensing surface 2a faces the bottom wall portion 10a. Between the pressure sensing surface 2a of the first insulating substrate 2 in the pressure sensor element 1 and the bottom wall 10a, there is provided a fluid chamber 12 into which a fluid to be pressure-measured enters. The peripheral wall 1 is located between the pressure sensing surface 2a and the bottom wall 10a.
On the inner periphery of Ob, a sealing member 13 made of an O-ring for sealing the fluid chamber 12 is arranged. Connector 5 is
The outer periphery of the base 6 a of the connector main body 6 is fixed to the storage case 10 by pressing the end 10 e of the storage case 10 by crimping as shown in the drawing. The locking portion of the connector body 5 and the end 10e of the storage case 10 by swaging is sealed by an external seal 14 by applying an adhesive or the like.

In such a capacitance type pressure sensor unit, the fluid to be pressure-measured via the fluid inlet 11 is the fluid chamber 1.
2, the pressure acts on the pressure sensing surface 2a of the first insulating substrate 2 of the pressure sensor element 1, whereby the capacitance between the opposing electrodes in the pressure sensor element 1 changes.
This change in capacitance is detected by the signal processing integrated circuit 8, and is extracted to the outside via the connector 5 as an electric signal.

By the way, in the manufacturing stage of such a capacitance type pressure sensor unit, a predetermined output is applied to a required pressure acting on the pressure sensing surface 2a of the first insulating substrate 2 of the pressure sensor element 1. An adjustment operation for adjusting the output from the signal processing integrated circuit 8 is required.

Conventionally, such an adjusting operation is performed by using an adjusting hole 15 provided in the connector body 6 facing the plate surface of the flexible circuit board 9 as shown in FIG. To contact an adjustment pin (not shown) with an adjustment electrode provided on the flexible circuit board 9 in advance,
This is done by operating the output adjusting means of the signal processing integrated circuit 8. When the output adjustment of the signal processing integrated circuit 8 was completed, the adjustment hole 15 was filled with a resin or fitted with a cap to close it.

FIGS. 8 and 9 show an example in which the signal processing integrated circuit 8 is mounted on the surface 3a of the second insulating substrate 3 of the pressure sensor element 1. 8 is mounted on a circuit board side separate from the second insulating substrate 3, and the signal processing integrated circuit 8 is mounted on the circuit board.
May be provided.

[0012]

However, in such a conventional method for manufacturing a capacitance type pressure sensor, the output of the signal processing integrated circuit 8 is adjusted after the assembly of the capacitance type pressure sensor is completed. Therefore, if the signal processing integrated circuit 8 or the pressure sensor element 1 is found to be defective during output adjustment, the entirety of the assembled capacitive pressure sensor becomes defective. There was a problem.

In the conventional method of manufacturing a capacitance type pressure sensor, after the output adjustment is completed, the adjustment hole 15 is filled with a resin or a cap is closed to close the adjustment hole 15. There is a problem that causes the density to decrease.

An object of the present invention is to manufacture a capacitance type pressure sensor capable of increasing the yield as compared with the conventional one, since it is known that the integrated circuit for signal processing or the pressure sensor element or the like is defective before the assembly is completed. It is to provide a method.

Another object of the present invention is to provide a method of manufacturing a capacitance type pressure sensor which can easily adjust the output of a signal processing integrated circuit before assembling a connector or a storage case.

Another object of the present invention is to provide a method of manufacturing a capacitance type pressure sensor which can easily detect a failure of a pressure sensor element before assembling a connector or a storage case.

[0017]

According to the present invention, there is provided a capacitance type pressure sensor to be manufactured according to the present invention, comprising a first insulating substrate having electrodes on a front surface and a back surface serving as a pressure sensing surface; Sensor element consisting of a second insulating substrate combined with a first insulating substrate having an electrode on the back surface facing the electrode of the insulating substrate at a predetermined interval, and a pressure sensor element having an end face of the base portion A connector having a connector body made of an insulating resin disposed so as to be in contact with the surface of the second insulating substrate, and a circuit formed on the surface of the second insulating substrate and electrically connected to the electrodes A pattern, an integrated circuit for signal processing electrically connected to the circuit pattern for processing the output of the pressure sensor element, a bottom wall formed with a fluid inlet for introducing a fluid to be measured under pressure, and the bottom wall And a peripheral wall portion having one end connected to the pressure sensor. The pressure sensor element and the base of the connector body are housed so as to form a fluid chamber into which the fluid to be measured enters between the pressure sensing surface of the probe and the bottom wall portion, and caulking is performed on the end of the peripheral wall portion. A metal storage case configured to prevent the base of the connector main body from coming off, and disposed between the pressure sensing surface and the bottom wall and between the fluid chamber and the peripheral wall and the pressure sensor element. A sealing member for preventing the fluid to be measured from leaking through the gap, and the signal processing integrated circuit includes an output adjusting means.

In addition, as the capacitance type pressure sensor unit to be manufactured by the present invention, a metal support ring is fitted to the outside of the base of the connector body of the connector, and the support ring is joined together with the metal support ring. There is also a structure in which the base of the connector main body is housed in the peripheral wall of the storage case, and the base of the connector main body is secured to the end of the peripheral wall by a caulking process via a support ring.

In the method of manufacturing the capacitance type pressure sensor unit according to the present invention, first, the output adjustment means of the signal processing integrated circuit is operated on the circuit pattern provided on the surface of the second insulating substrate of the pressure sensor element. The electrode for adjustment used in the process is included.

Before the pressure sensor element is stored in the storage case, a state is created in which substantially the same force as the force applied to the pressure sensor element during caulking is applied to the pressure sensor element. In this state, after applying a predetermined fluid pressure to the pressure sensing surface, the adjustment pin is brought into contact with the adjustment electrode to operate the output adjustment means of the signal processing integrated circuit to adjust the output of the pressure sensor element. When the output adjustment is completed, assembly is performed using the pressure sensor element to manufacture a capacitance type pressure sensor unit.

Such a method of manufacturing a capacitance type pressure sensor unit according to the present invention can be similarly carried out by a method of manufacturing a capacitance type pressure sensor unit using a support ring.

In the method of manufacturing a capacitance type pressure sensor unit according to the present invention, the output of the signal processing integrated circuit is adjusted before assembling the capacitance type pressure sensor unit. It can be seen that the pressure sensor element is defective. Even in the output adjustment before assembling the capacitance type pressure sensor unit, a state where substantially the same force as the force applied to the pressure sensor element is applied to the pressure sensor element at the time of caulking is created, and in this state a predetermined state is applied to the pressure sensing surface The fluid pressure is applied to adjust the output, so that the output can be adjusted under substantially the same conditions as in the completed state of the capacitive pressure sensor unit. Further, according to the method of the present invention, since it is not necessary to provide an adjustment hole in the connector main body, the liquid-proof property or the waterproof property can be improved.

In the present invention, the output adjustment of the signal processing integrated circuit before assembling the capacitance type pressure sensor unit as described above is carried out by a type using no support ring and a type using the support ring. This can be done as follows.

First, in a method of manufacturing a capacitance type pressure sensor unit without using a support ring, an output adjustment of a signal processing integrated circuit is performed on a circuit pattern provided on a surface of a second insulating substrate of a pressure sensor element. An adjustment electrode used when operating the means is included.

In this method, the sealing member of the storage case,
A one-sided opening-shaped storage formed substantially in the same shape as the storage part for storing the base of the pressure sensor element and the connector main body and configured to apply a predetermined fluid pressure to the pressure sensing surface of the pressure sensor element. A first jig having a chamber, and a contact portion in contact with the surface of the second insulating substrate of the pressure sensor element at the base of the connector body, having substantially the same shape and formed of the same material as the connector body. A simulated base member, a simulated seal member formed of the same material and in the same shape as the seal member, and a fitting portion combined with the first jig and fitted into the opening of the storage chamber, and the adjustment electrode. And a second jig configured to be able to contact the tip of the adjustment pin electrically connected to the adjustment electrode.

Then, the simulated seal member is stored in the storage chamber of the first jig, the pressure sensor element is stored thereon, and the simulated base is disposed on the surface of the second insulating substrate of the pressure sensor element. Next, the fitting portion of the second jig is fitted into the storage chamber of the first jig, and the same force as the force applied to the pressure sensor element at the time of caulking the pressure sensor element via the simulated base is applied. A force is applied between the first jig and the second jig so as to be applied, and a predetermined fluid pressure is applied to the pressure sensing surface of the pressure sensor element;
In this state, the adjustment pin is brought into contact with the adjustment electrode to operate the output adjustment means of the signal processing integrated circuit to adjust the output of the pressure sensor element. The capacitance type pressure sensor unit is manufactured using the pressure sensor element whose output adjustment has been completed in this way, and the output adjustment is not performed after swaging.

In a method of manufacturing a capacitance type pressure sensor unit using a support ring, an output adjusting means of a signal processing integrated circuit is provided on a circuit pattern provided on a surface of a second insulating substrate of a pressure sensor element. The electrode for adjustment used when operating is included.

In this method, the sealing member of the storage case,
A one-sided opening-shaped storage formed substantially in the same shape as the storage part for storing the base of the pressure sensor element and the connector main body and configured to apply a predetermined fluid pressure to the pressure sensing surface of the pressure sensor element. A first jig having a chamber, and a contact portion in contact with the surface of the second insulating substrate of the pressure sensor element at the base of the connector body, having substantially the same shape and formed of the same material as the connector body. A simulated base, a simulated support ring formed of the same material and in the same shape as the support ring, a simulated seal member formed of the same material and in the same shape as the seal member, and stored in combination with the first jig. A second jig provided with a fitting portion fitted into the opening of the chamber, and configured so that the tip of an adjustment pin electrically connected to the adjustment electrode can be brought into contact with the adjustment electrode; With tools .

The simulated seal member is accommodated in the accommodation chamber of the first jig, the pressure sensor element is accommodated thereon, and the simulated base and the simulated support ring are placed on the surface of the second insulating substrate of the pressure sensor element. And place. Next, the fitting portion of the second jig is fitted into the storage chamber of the first jig, and the force applied to the pressure sensor element at the time of caulking the pressure sensor element via the simulation base and the simulation support ring. A force is applied between the first jig and the second jig so that the same force is applied, a predetermined fluid pressure is applied to the pressure sensing surface of the pressure sensor element, and the adjustment pin is adjusted in that state. The output adjustment means of the signal processing integrated circuit is operated by bringing the pressure sensor element into contact with the electrodes for adjusting the output of the pressure sensor element. Then, a capacitance type pressure sensor unit is manufactured using the pressure sensor element whose output adjustment has been completed as described above, and the output adjustment is not performed after the caulking.

In any of these methods, since simulated parts are used except for the pressure sensor element and the integrated circuit for signal processing, the signal processing is performed without damaging other parts of the capacitive pressure sensor unit. The output adjustment of the integrated circuit can be easily performed before assembling the connector or the storage case. Further, these simulated parts have an advantage that they can be used repeatedly.

Next, in the case of a type in which the signal processing integrated circuit is not provided on the surface of the second insulating substrate, the capacitance type pressure sensor has electrodes on the surface and the back surface is a pressure sensing surface. The first insulating substrate includes a first insulating substrate, and a second insulating substrate combined with the first insulating substrate having an electrode on a back surface facing the electrode of the first insulating substrate at a predetermined interval. The pressure sensor element and the end face of the base are the second
A connector having a connector body made of insulating resin disposed so as to be in contact with the surface of the insulating substrate, an output electrode formed on the surface or side surface of the second insulating substrate and electrically connected to the electrode; A signal processing integrated circuit electrically connected to the output electrode to process the output of the pressure sensor element; a bottom wall formed with a fluid inlet for introducing a fluid to be measured under pressure; and one end connected to the bottom wall. The pressure sensor element and the base of the connector main body so as to form a fluid chamber in which a fluid to be pressure-measured enters between the pressure sensing surface of the pressure sensor element and the bottom wall. A metal storage case configured to prevent the base of the connector main body from coming off by caulking applied to the end of the connector body, and a metal housing case disposed between the pressure sensing surface and the bottom wall portion from the fluid chamber to the peripheral wall portion. Formed between the pressure sensor element ; And a seal member for preventing the leakage of the pressure fluid to be measured through the gap, the signal processing integrated circuit is provided with an output adjusting means.

In such a capacitance type pressure sensor unit, defective pressure sensor elements are detected as follows. That is, before the pressure sensor element is stored in the storage case, a state is created in which substantially the same force as the force applied to the pressure sensor element during caulking is applied to the pressure sensor element. In this state, after applying a predetermined fluid pressure to the pressure sensing surface, the adjustment pin is brought into contact with the output electrode to measure the characteristics of the pressure sensor element. A capacitance-type pressure sensor unit is manufactured using the pressure sensor element whose characteristics of the pressure sensor element have been measured.

This makes it possible to easily detect the failure of the pressure sensor element before assembling the connector or the storage case.

[0034]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a first embodiment of a method for manufacturing a capacitance type pressure sensor unit according to the present invention.
FIG. 2 is a plan view of the pressure sensor element used in FIG. 1 and a signal processing integrated circuit mounted on the surface thereof.

As shown in FIG. 2, a circuit pattern 4 is formed on the surface 3a of the second insulating substrate 3 of the pressure sensor element 1, and connection conductor patterns 4a to 4c of the circuit pattern 4 are formed.
c is electrically connected to each electrode of the pressure sensor element 1. Surface 3a of second insulating substrate 3 of pressure sensor element 1
Is mounted with a signal processing integrated circuit 8 such as a CMOS IC which is electrically connected to the circuit pattern 4 and processes the output of the pressure sensor element 1 as shown in FIG.

The circuit pattern 4 on the surface 3a of the second insulating substrate 3 includes the respective lead legs 8a of the signal processing integrated circuit 8.
Are connected to each other.

In the method of manufacturing the capacitance type pressure sensor unit of the first example, the first jig 17 and the simulated base 18 are used.
, A simulated seal member 19 and a second jig 20. The first jig 17 includes the storage case 10 shown in FIG.
Seal member 13, pressure sensor element 1, connector body 6
Is formed in substantially the same shape as the storage portion for storing the base 6a, and has a one-sided opening in which a fluid introduction hole 21 is formed so that a predetermined fluid pressure can be applied to the pressure sensing surface 2a of the pressure sensor element 1. It has become. Simulated base 18
Has substantially the same shape as the contact portion of the base portion 6a of the connector main body 6 of FIG. 8 which comes into contact with the surface 3a of the second insulating base 3 of the pressure sensor element 1 described above.
It is formed of the same material as. Further, the simulated seal member 19
Are formed of the same material and in the same shape as the seal member 13 of FIG.

The second jig 20 is the first jig 1 described above.
7 is provided with a fitting portion 20a fitted in the opening of the storage chamber 17a and shown in FIG.
6, an adjustment pin 2 electrically connected to the adjustment electrode 16;
2 are configured to be able to come into contact with each other.

The storage chamber 17a of the first jig 17 as described above
Accommodates the simulated seal member 19, and accommodates the pressure sensor element 1 thereon.
The simulated base 18 is arranged on the surface 3a.

Next, the fitting portion 20a of the second jig 20 is
The first jig 17 is fitted to the storage chamber 17a of the first jig 17 so that the same force as the force applied to the pressure sensor element 1 at the time of caulking the pressure sensor element 1 via the simulated base 18 is applied. And a second jig 20. In this state, a predetermined fluid pressure is applied to the pressure sensing surface 2a of the first insulating substrate 2 of the pressure sensor element 1 from the fluid introduction hole 21. In this state, the adjustment pin 22 is brought into contact with the adjustment electrode 16 of the circuit pattern 4 on the surface 3a of the second insulating substrate 3, and the output adjustment means of the signal processing integrated circuit 8 is operated to operate the pressure sensor element 1 Output adjustment.

When the output adjustment of the pressure sensor element 1 is completed in this way, the signal-processing integrated circuit 8 whose output has been adjusted is taken out together with the pressure sensor element 1 from the storage chamber 17a of the first jig 17, and the drawing is completed. As shown in FIG. 3, a sealing member 13 made of an O-ring is housed on the outer peripheral side of a bottom wall portion 10a in a metal housing case 10, and a pressure sensor element 1 is housed thereon. Second insulating substrate 3
The base 6a of the connector main body 6 in the connector 5 is arranged on the surface 3a of the connector 5. The inner end side of each connector terminal 7 of the connector 5 penetrates one end side of the flexible circuit board 9 in advance, and is connected to a corresponding wiring pattern on the flexible circuit board 9 by soldering. In this state, the connector body 6 is tilted so that one end of the base 6a rises so that the respective adjustment electrodes 16 shown in FIG. 2 can be seen from the outside. In this state, the wiring pattern on the other end side of the flexible circuit board 9 is connected to each adjustment electrode 16 by soldering. When the soldering is completed, the base 6a of the connector body 6 is entirely placed on the surface 3a of the second insulating base 3, and the outer periphery of the base 6b of the connector body 6 is placed on the end 1 of the storage case 10.
It is fixed to the storage case 10 by pressing as shown in FIG. The locking portion of the connector body 5 and the end 10e of the storage case 10 by swaging is sealed by an external seal 14 by applying an adhesive or the like.

By manufacturing the capacitance-type pressure sensor unit in this way, it is not necessary to adjust the output after swaging.

In such a method of manufacturing a capacitance type pressure sensor unit, the output of the signal processing integrated circuit 8 is adjusted before assembling the capacitance type pressure sensor unit.
It can be seen that the signal processing integrated circuit 8 and the pressure sensor element are defective during output adjustment. Further, according to the method of the present invention, it is not necessary to provide the adjustment hole 15 as shown in FIG. 8 in the connector main body 6, and the liquid resistance can be improved.

FIG. 4 is a longitudinal sectional view showing a second example of the embodiment of the method of manufacturing the capacitance type pressure sensor unit according to the present invention. This second example shows an example in which the present invention is applied to a method of manufacturing a capacitance type pressure sensor unit having a structure using a support ring 23 as shown in FIG.

As shown in FIG. 5, the capacitance type pressure sensor unit having the structure using the support ring 23 has the connector body 6 of the connector 5 having the base 6a mounted on the surface 3a of the second insulating base 3. A metal support ring 23 is fitted to the outside of the base 6a, and the base 6a of the connector body 6 is housed in the peripheral wall 10b of the storage case 10 together with the support ring 23. The support ring 23
The structure is such that the end portion 10e of the peripheral wall portion 10 is prevented from coming off by caulking. Support ring 2
A seal member 24 made of an O-ring supported by a groove on the outer periphery of the support ring 23 is interposed between the base member 3 and the peripheral wall portion 10b of the storage case 10 to perform sealing. Other structures are the same as those in FIG.

In the method of manufacturing the capacitance type pressure sensor unit of the first example, the first jig 17 and the simulated base 18 are used.
, A simulated seal member 19, a simulated support ring 25, and a second jig 20. The first jig 17 is formed in substantially the same shape as the storage part for storing the seal member 13, the pressure sensor element 1, the base 6a of the connector body 6, and the support ring 23 shown in FIG. The structure has a one-sided open storage chamber 17a in which a fluid introduction hole 21 is formed so that a predetermined fluid pressure can be applied to the pressure sensing surface 2a of the pressure sensor element 1. The simulated base 18 has substantially the same shape as the contact portion of the base 6a of the connector main body 6 shown in FIG. 5 which contacts the surface 3a of the second insulating base 3 of the pressure sensor element 1, and It is formed of the same material as. Further, the simulated support ring 25 is formed of the same material and in the same shape as the support ring 23 shown in FIG. Also, the simulated seal member 19
Are formed of the same material and in the same shape as the seal member 13 shown in FIG. Further, the second jig 20 includes a fitting portion 20a which is combined with the first jig 17 and is fitted into the opening of the storage chamber 17a, and the adjusting electrode 16 shown in FIG.
Adjustment pin 22 electrically connected to the adjustment electrode 16
Is configured to be able to contact the front end of the main body.

First, the storage room 1 of the first jig 17 as described above
The simulated seal member 19 is accommodated in 7a, the pressure sensor element 1 is accommodated thereon, and the simulated base 18 and the simulated support ring 2 are placed on the surface 3a of the second insulating base 3 of the pressure sensor element 1.
And 5 are arranged. Next, the fitting portion 20a of the second jig 20 is fitted into the storage chamber 17a of the first jig 17, and the simulated base 18
And between the first jig 17 and the second jig 20 so that the same force as the force applied to the pressure sensor element 1 at the time of caulking the pressure sensor element 1 via the simulated support ring 25 is applied. Apply force. In this state, a predetermined fluid pressure is applied to the pressure sensing surface 2a of the pressure sensor element 1. In this state, the output of the pressure sensor element 1 is adjusted by bringing the adjustment pin 22 into contact with the adjustment electrode 16 shown in FIG. 2 and operating the output adjustment means of the signal processing integrated circuit 8.

When the output adjustment of the pressure sensor element 1 is completed in this manner, the signal-processing integrated circuit 8 whose output has been adjusted is taken out of the storage chamber 17a of the first jig 17 together with the pressure sensor element 1, and As shown in FIG. 5, a sealing member 13 made of an O-ring is housed on the outer peripheral side of a bottom wall 10a in a metal housing case 10, and a pressure sensor element 1 is housed thereon. The base 6a of the connector body 6 of the connector 5 is arranged on the surface 3a of the first insulating base 3, and the support ring 2 is mounted on the outer periphery of the base 6a.
3 is mounted on the surface 3a of the second insulating substrate 3.
The seal member 24 is previously supported in the groove on the outer periphery of the support ring 23. The inner end side of each connector terminal 7 of the connector 5 penetrates one end side of the flexible circuit board 9 in advance, and is connected to a corresponding wiring pattern on the flexible circuit board 9 by soldering. In this state, the connector body 6 is tilted so that one end of the base 6a rises,
Each adjustment electrode 16 shown in FIG. 2 is made visible from the outside. In this state, the wiring pattern on the other end side of the flexible circuit board 9 is connected to each adjustment electrode 16 by soldering. When the soldering is completed, the base 6a of the connector body 6 is entirely placed on the surface 3a of the second insulating base 3, and the outer periphery of the base 6b of the connector body 6 and the upper end of the support ring 23 are attached to the storage case 10. The end 10e is fixed to the storage case 10 by pressing the end 10e as shown in the drawing.

By manufacturing the capacitance type pressure sensor unit in this manner, it is not necessary to adjust the output after swaging, and the same effect as in the first example can be obtained.

FIG. 6 is a longitudinal sectional view showing a third embodiment of the method of manufacturing the capacitance type pressure sensor unit according to the present invention, and FIG. 7 is a diagram illustrating the manufacture of the capacitance type pressure sensor unit of the third example. It is a longitudinal section showing the structure of the capacitance type pressure sensor unit manufactured through the method.

As shown in FIG. 6, unlike the first and second examples, the signal processing integrated circuit 8 is not mounted on the surface 3a of the second insulating base 3 of the pressure sensor element 1. Although not shown, only a plurality of output electrodes of the pressure sensor element 1 are provided. The signal processing integrated circuit 8 is mounted on a circuit board 26 as shown in FIG. Although not shown, a circuit pattern similar to that shown in FIG. 2 is provided on the surface of the circuit board 26. The circuit pattern is provided with a plurality of adjustment electrodes to which each lead leg of the signal processing integrated circuit 8 is connected. ing.

In the method of manufacturing the capacitance type pressure sensor unit of the third example, the first jig 17 is used as in the first example.
, A simulation base 18, a simulation seal member 19, and a second jig 20 are used. The first jig 17 is formed in substantially the same shape as the storage portion that stores the seal member 13, the pressure sensor element 1, and the base 6 a of the connector body 6 of the storage case 10 of FIG. It has a one-sided opening in which a fluid introduction hole 21 is formed so that a predetermined fluid pressure can be applied to the pressure sensing surface 2a. The simulated base 18 has substantially the same shape as the contact portion of the base 6a of the connector main body 6 in FIG. 7 that comes into contact with the surface 3a of the second insulating base 3 of the pressure sensor element 1. It is formed of the same material. Further, the simulated seal member 19
Are formed of the same material and in the same shape as the seal member 13 of FIG.

The second jig 20 is the first jig 1 described above.
7 and a fitting portion 20a fitted into the opening of the storage chamber 17a and electrically connected to the output electrode of the pressure sensor element 1 on the surface 3a of the second insulating base 3. The configuration is such that the tip of the adjustment pin 22 can be brought into contact. A signal processing integrated circuit 8 that processes the output of the pressure sensor element 1 is connected to the adjustment pin 22 as necessary.

The storage room 17a of the first jig 17 as described above
Accommodates the simulated seal member 19, and accommodates the pressure sensor element 1 thereon, and the second insulating base 3 of the pressure sensor element 1.
The simulated base 18 is arranged on the surface 3a.

Next, the fitting portion 20a of the second jig 20 is
The first jig 17 is fitted to the storage chamber 17a of the first jig 17 so that the same force as the force applied to the pressure sensor element 1 at the time of caulking the pressure sensor element 1 via the simulated base 18 is applied. And a second jig 20. In this state, a predetermined fluid pressure is applied to the pressure sensing surface 2a of the first insulating substrate 2 of the pressure sensor element 1 from the fluid introduction hole 21. In this state, the adjustment pin 22 is brought into contact with the output electrode on the surface 3a of the second insulating substrate 3, and the characteristics of the pressure sensor element 1 are measured. Based on the measurement result, the failure of the pressure sensor element 1 can be detected. Pressure sensor element 1
If the pressure sensor element 1 is found to be defective, it is replaced with another pressure sensor element 1 and the characteristics of the pressure sensor element 1 after the replacement are measured in the same manner, and a good pressure sensor element 1 is used.

When the measurement of the characteristics of the pressure sensor element 1 is completed in this way, the signal processing integrated circuit 8 is connected to the adjustment pins 22 that are in contact with the output electrodes on the surface 3a of the second insulating substrate 3. I do. In this state, the pressure sensor element 1
A predetermined fluid pressure is applied to the pressure sensing surface 2a of the first insulating substrate 2 from the fluid introduction hole 21, and in this state, the output adjusting means of the signal processing integrated circuit 8 is operated to operate the pressure sensor element 1. The output adjustment of the signal processing integrated circuit 8 corresponding to.

After the output adjustment of the signal processing integrated circuit 8 is completed in this manner, the pressure sensor element 1 is taken out from the storage chamber 17a of the first jig 17, and as shown in FIG. The seal member 13 made of an O-ring is stored on the outer peripheral side on the bottom wall 10a in the storage case 10, and the pressure sensor element 1 is stored thereon. In this case, the base 27a of each metal terminal fitting 27 is connected in advance to each output electrode on the surface 3a of the second insulating substrate 3 of the pressure sensor element 1 by soldering. Tip 27 of each metal terminal fitting 27
b, soldered and connected to each electrode of the circuit pattern of the circuit board 26 on which the adjusted signal processing integrated circuit 8 is mounted in advance, and the circuit board 26 is connected to the second insulating substrate by these metal terminal fittings 27. 3 above.

In this state, the inner end 7a side of each connector terminal 7 of the connector 5 is passed through each through hole 26a of the circuit board 26 and connected to each land portion of the circuit pattern of the circuit board 26 by soldering. Next, the base 6 a of the connector main body 6 of the connector 5 is arranged on the second insulating base 3 in the storage case 10. Next, the outer periphery of the base 6b of the connector body 6 is fixed to the storage case 10 by pressing the end 10e of the storage case 10 by crimping as shown in the drawing. The locking portion of the connector body 5 and the end 10e of the storage case 10 by swaging is sealed by an external seal 14 by applying an adhesive or the like.

By manufacturing the capacitance type pressure sensor unit in this way, it is not necessary to adjust the output after swaging.

In such a method of manufacturing the capacitance type pressure sensor unit, the output of the signal processing integrated circuit 8 is adjusted before assembling the capacitance type pressure sensor unit.
It can be seen that the signal processing integrated circuit 8 or the pressure sensor element is defective when the output is adjusted. Further, according to the method of the present invention, it is not necessary to provide the adjustment hole 15 as shown in FIG. 8 in the connector main body 6, and the liquid resistance can be improved.

[0061]

According to the method of manufacturing the capacitance type pressure sensor unit of the present invention, the output of the signal processing integrated circuit is adjusted before the assembly of the capacitance type pressure sensor unit. It can be seen that the integrated circuit or the pressure sensor element is defective. Further, according to the method of the present invention, it is not necessary to provide an adjustment hole in the connector main body, so that the liquid-proof property can be improved.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a first example of an embodiment of a method of manufacturing a capacitance type pressure sensor unit according to the present invention.

FIG. 2 is a plan view of the pressure sensor element used in FIG. 1 and a signal processing integrated circuit mounted on the surface thereof.

FIG. 3 is a longitudinal sectional view showing a structure of a capacitance type pressure sensor unit manufactured through a method of manufacturing the capacitance type pressure sensor unit of the first example.

FIG. 4 is a longitudinal sectional view showing a second example of the embodiment of the method of manufacturing the capacitance type pressure sensor unit according to the present invention.

FIG. 5 is a longitudinal sectional view showing a structure of a capacitance type pressure sensor unit manufactured through a method of manufacturing a capacitance type pressure sensor unit of a second example.

FIG. 6 is a longitudinal sectional view showing a third example of the embodiment of the method of manufacturing the capacitance type pressure sensor unit according to the present invention.

FIG. 7 is a longitudinal sectional view showing a structure of a capacitance type pressure sensor unit manufactured through a method of manufacturing a capacitance type pressure sensor unit of a third example.

FIG. 8 is a longitudinal sectional view showing a structure of a conventional capacitance type pressure sensor unit.

FIG. 9 is a side view showing a connection relationship between a pressure sensor element and a flexible circuit board in a conventional capacitance type pressure sensor unit.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 pressure sensor element 2 first insulating substrate 2 a pressure sensing surface 3 second insulating substrate 3 a surface 4 circuit pattern 4 a, 4 b connection conductor pattern 5 connector 6 connector body (connector housing) 6 a base 7 connector terminal 8 signal processing Integrated circuit 8a Lead leg 9 Flexible circuit board 10 Storage case 10a Bottom wall 10b Peripheral wall 10c Tube 10d Screw 10e End 11 Fluid inlet 12 Fluid chamber 13 Seal material 14 External seal 15 Adjustment hole 16 Adjustment electrode Reference Signs List 17 First jig 17a Storage chamber 18 Simulated base 19 Simulated seal member 20 Second jig 20a Fitting portion 21 Fluid introduction hole 22 Adjusting pin 23 Support ring 24 Seal member 25 Simulated support ring 26 Circuit board 27 Metal terminal Fitting 27a Base 27b Tip

Claims (5)

[Claims] 1. A first insulating substrate having an electrode on a front surface and a back surface serving as a pressure sensing surface, and an electrode on a rear surface facing the electrode of the first insulating substrate at a predetermined interval. A pressure sensor element comprising a second insulating substrate combined with the first insulating substrate; and a base arranged such that an end face of the base contacts the surface of the second insulating substrate of the pressure sensor element. A connector having a connector body made of an insulating resin, a circuit pattern formed on the surface of the second insulating base and electrically connected to the electrode, and a connector electrically connected to the circuit pattern. A signal processing integrated circuit for processing the output of the pressure sensor element, a bottom wall having a fluid inlet for introducing a fluid to be measured, and a peripheral wall having one end connected to the bottom wall; The pressure sensing surface of the pressure sensor element; The pressure sensor element and the base of the connector body are housed so as to form a fluid chamber in which the fluid to be measured enters between the bottom wall and a caulking process performed on an end of the peripheral wall. A metal storage case configured to prevent the base of the connector main body from coming off; and a pressure sensor disposed between the pressure sensing surface and the bottom wall, from the fluid chamber to the peripheral wall and the pressure sensor. A sealing member for preventing the pressure-measured fluid from leaking through a gap formed between the pressure-measuring element and the element, wherein the signal processing integrated circuit includes an output adjusting unit. The method for manufacturing the pressure sensor element, wherein the circuit pattern provided on the surface of the second insulating base of the pressure sensor element is used for operating the output adjustment means of the signal processing integrated circuit. Including the electrode, before storing the pressure sensor element in the storage case,
A state in which substantially the same force as the force applied to the pressure sensor element is applied to the pressure sensor element at the time of the caulking is created, and in that state, a predetermined fluid pressure is applied to the pressure sensing surface, and the adjustment is performed. The output adjustment means of the signal processing integrated circuit is operated by bringing an adjustment pin into contact with an electrode for adjustment of the output of the pressure sensor element, and the capacitance is adjusted by using the pressure sensor element after the output adjustment is completed. A method for manufacturing a capacitance type pressure sensor unit, characterized by manufacturing a pressure type pressure sensor unit. 2. A first insulating substrate having an electrode on a front surface and a back surface serving as a pressure sensing surface, and an electrode on the rear surface facing the electrode of the first insulating substrate at a predetermined interval. A pressure sensor element comprising a second insulating substrate combined with the first insulating substrate; and a base arranged such that an end face of the base contacts the surface of the second insulating substrate of the pressure sensor element. A connector having a connector body made of an insulating resin, a circuit pattern formed on the surface of the second insulating base and electrically connected to the electrode, and a connector electrically connected to the circuit pattern. A signal processing integrated circuit for processing the output of the pressure sensor element, a bottom wall having a fluid inlet for introducing a fluid to be measured, and a peripheral wall having one end connected to the bottom wall; The pressure sensing surface of the pressure sensor element; The pressure sensor element and the base of the connector body are housed so as to form a fluid chamber in which the fluid to be measured enters between the bottom wall and a caulking process performed on an end of the peripheral wall. A metal storage case configured to prevent the base of the connector main body from coming off; and a pressure sensor disposed between the pressure sensing surface and the bottom wall, from the fluid chamber to the peripheral wall and the pressure sensor. A sealing member for preventing the pressure-measured fluid from leaking through a gap formed between the pressure-measuring element and the element, wherein the signal processing integrated circuit includes an output adjusting unit. The method for manufacturing the pressure sensor element, wherein the circuit pattern provided on the surface of the second insulating base of the pressure sensor element is used for operating the output adjustment means of the signal processing integrated circuit. An electrode is included, the seal member of the storage case, the pressure sensor element, and a storage portion for storing the base portion of the connector main body are formed in substantially the same shape and are formed on the pressure sensing surface of the pressure sensor element. A first jig having a single-sided opening-shaped storage chamber formed so as to be able to apply a predetermined fluid pressure; and a second jig of the second insulating base of the pressure sensor element at the base of the connector body. A simulated base having substantially the same shape as a contact portion that contacts a surface and formed of the same material as the connector body; a simulated seal member formed of the same material and in the same shape as the seal member; A fitting portion to be fitted into the opening of the storage chamber in combination with the first jig; and a tip of an adjustment pin electrically connected to the adjustment electrode being brought into contact with the adjustment electrode. A second jig configured so as to be able to hold the simulated seal member in the storage chamber of the first jig, and storing the pressure sensor element thereon, Disposing the simulated base on the surface of the second insulating base of the pressure sensor element, fitting the fitting portion of the second jig into the storage chamber of the first jig, A force is applied between the first jig and the second jig so that the same force as the force applied to the pressure sensor element during the caulking is applied to the pressure sensor element via the simulation base. And applying the predetermined fluid pressure to the pressure sensing surface of the pressure sensor element, and in this state, bringing the adjustment pin into contact with the adjustment electrode, thereby setting the output adjustment means of the signal processing integrated circuit. Actuate to adjust the output of the pressure sensor element, Using the pressure sensor element to which completion to produce a capacitive pressure sensor unit, method of manufacturing the capacitive pressure sensor unit, characterized in that no output adjusted after the caulking. 3. A first insulating substrate having an electrode on a front surface and a back surface serving as a pressure sensing surface, and an electrode on the rear surface facing the electrode of the first insulating substrate at a predetermined interval. A pressure sensor element comprising a second insulating substrate combined with the first insulating substrate; and a base arranged such that an end face of the base contacts the surface of the second insulating substrate of the pressure sensor element. A connector having a connector main body made of an insulating resin, a metal support ring fitted outside the base of the connector main body of the connector, and formed on the surface of the second insulating base. A circuit pattern electrically connected to the electrode; a signal processing integrated circuit electrically connected to the circuit pattern to process an output of the pressure sensor element; and a fluid inlet for introducing a fluid to be measured under pressure. Formed bottom wall A peripheral wall portion having one end connected to the bottom wall portion, wherein the pressure is formed between the pressure sensing surface of the pressure sensor element and the bottom wall portion so as to form a fluid chamber into which the fluid to be measured enters. The sensor element is housed, the base part of the connector body is housed together with the support ring, and the base part of the connector body is prevented from coming off by caulking performed on an end of the peripheral wall part. A metal storage case, and the pressure-measured fluid is disposed between the pressure sensing surface and the bottom wall portion and through a gap formed between the peripheral wall portion and the pressure sensor element from the fluid chamber. A sealing member for preventing leakage of the pressure sensor, wherein the signal processing integrated circuit includes an output adjusting unit, and wherein the second type of the pressure sensor element is provided. Insulation The circuit pattern provided on the surface of the base includes an adjustment electrode used when operating the output adjustment means of the signal processing integrated circuit, and before storing the pressure sensor element in the storage case. ,
A state in which substantially the same force as the force applied to the pressure sensor element is applied to the pressure sensor element at the time of the caulking is created, and in that state, a predetermined fluid pressure is applied to the pressure sensing surface, and the adjustment is performed. The output adjustment means of the signal processing integrated circuit is operated by bringing an adjustment pin into contact with an electrode for adjustment of the output of the pressure sensor element, and the capacitance is adjusted by using the pressure sensor element after the output adjustment is completed. A method for manufacturing a capacitance type pressure sensor unit, characterized by manufacturing a pressure type pressure sensor unit. 4. A first insulating substrate having an electrode on the front surface and a back surface serving as a pressure sensing surface, and an electrode on the rear surface facing the electrode of the first insulating substrate at a predetermined interval. A pressure sensor element comprising a second insulating substrate combined with the first insulating substrate; and a base arranged such that an end face of the base contacts the surface of the second insulating substrate of the pressure sensor element. A connector having a connector main body made of an insulating resin, a metal support ring fitted outside the base of the connector main body of the connector, and formed on the surface of the second insulating base. A circuit pattern electrically connected to the electrode; a signal processing integrated circuit electrically connected to the circuit pattern to process an output of the pressure sensor element; and a fluid inlet for introducing a fluid to be measured under pressure. Formed bottom wall A peripheral wall portion having one end connected to the bottom wall portion, wherein the pressure is formed between the pressure sensing surface of the pressure sensor element and the bottom wall portion so as to form a fluid chamber into which the fluid to be measured enters. A metal element configured to house the sensor element, the base of the connector main body, and the support ring, and to prevent the base of the connector main body from coming off by caulking applied to an end of the peripheral wall. A storage case, wherein the fluid to be measured is leaked from the fluid chamber through a gap formed between the peripheral wall and the pressure sensor element, which is disposed between the pressure sensing surface and the bottom wall. A method of manufacturing a capacitance-type pressure sensor unit, wherein the signal processing integrated circuit includes an output adjusting unit, wherein the second insulating base of the pressure sensor element is provided. The above The circuit pattern provided on the surface includes an adjustment electrode used when operating the output adjustment means of the signal processing integrated circuit, the seal member of the storage case, the pressure sensor element, and the connector body The base has a one-sided opening formed substantially in the same shape as a storage portion for storing the support ring, and formed so as to apply a predetermined fluid pressure to the pressure sensing surface of the pressure sensor element. A first jig having a storage chamber; and a connector having substantially the same shape as a contact portion of the base of the connector body, which is in contact with the surface of the second insulating base of the pressure sensor element, and A simulated base formed of the same material as the main body; a simulated support ring formed of the same material and in the same shape as the support ring; and a same material and the same as the seal member A simulated seal member formed in a shape, a fitting portion combined with the first jig and fitted in the opening of the storage chamber, and electrically connected to the adjustment electrode with the adjustment electrode. And a second jig configured so that the tip of the adjustment pin to be contacted can be prepared. The simulated seal member is stored in the storage chamber of the first jig. The pressure sensor element is housed, and the simulated base and the simulated support ring are arranged on the surface of the second insulating base of the pressure sensor element, and the fitting portion of the second jig is disposed. The same force as the force applied to the pressure sensor element at the time of the caulking is applied to the pressure sensor element via the simulation base and the simulation support ring by fitting into the storage chamber of the first jig. Force between the first jig and the second jig And apply
The predetermined fluid pressure is applied to the pressure sensing surface of the pressure sensor element, and in this state, the adjustment pin is brought into contact with the adjustment electrode to activate the output adjustment means of the signal processing integrated circuit, and The output of the pressure sensor element is adjusted, a capacitance type pressure sensor unit is manufactured using the pressure sensor element for which the output adjustment has been completed, and the output adjustment is not performed after the caulking. Of manufacturing a pressure sensor unit. 5. A first insulating substrate having an electrode on a front surface and a back surface serving as a pressure sensing surface, and an electrode on a rear surface facing the electrode of the first insulating substrate at a predetermined interval. A pressure sensor element comprising a second insulating substrate combined with the first insulating substrate; and a base arranged such that an end face of the base contacts the surface of the second insulating substrate of the pressure sensor element. A connector having a connector main body made of an insulating resin, an output electrode formed on the surface or side surface of the second insulating base, and electrically connected to the electrode; and a connector electrically connected to the output electrode. A signal processing integrated circuit for processing the output of the pressure sensor element, a bottom wall having a fluid inlet for introducing a fluid to be measured, and a peripheral wall having one end connected to the bottom wall; In front of the pressure sensing surface of the pressure sensor element The pressure sensor element and the base of the connector main body are housed so as to form a fluid chamber into which the fluid to be measured enters between the bottom wall, and the caulking process is performed on an end of the peripheral wall. A metal storage case configured to prevent the base of the connector main body from coming off; a metal storage case disposed between the pressure sensing surface and the bottom wall, from the fluid chamber to the peripheral wall and the pressure sensor element. A sealing member for preventing the fluid to be measured from leaking through a gap formed between the signal processing integrated circuit and the signal processing integrated circuit. In the manufacturing method, before storing the pressure sensor element in the storage case,
A state in which substantially the same force as the force applied to the pressure sensor element is applied to the pressure sensor element at the time of the caulking is created, and in that state, a predetermined fluid pressure is applied to the pressure sensing surface, and then the output is applied. Measuring a characteristic of the pressure sensor element by bringing an adjustment pin into contact with an electrode; and manufacturing a capacitance-type pressure sensor unit using the pressure sensor element for which the measurement of the characteristic has been completed. Of manufacturing a pressure sensor unit.