JPH11243232A - Ｌｅｄ表示装置 - Google Patents

Ｌｅｄ表示装置

Info

Publication number
JPH11243232A
JPH11243232A JP10352136A JP35213698A JPH11243232A JP H11243232 A JPH11243232 A JP H11243232A JP 10352136 A JP10352136 A JP 10352136A JP 35213698 A JP35213698 A JP 35213698A JP H11243232 A JPH11243232 A JP H11243232A
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting diode
phosphor
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP10352136A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11243232A5 (enExample
Inventor
Yoshinori Shimizu
義則 清水
Akimasa Sakano
顕正 阪野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Priority to JP10352136A priority Critical patent/JPH11243232A/ja
Publication of JPH11243232A publication Critical patent/JPH11243232A/ja
Publication of JPH11243232A5 publication Critical patent/JPH11243232A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP10352136A 1998-11-25 1998-11-25 Ｌｅｄ表示装置 Withdrawn JPH11243232A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10352136A JPH11243232A (ja) 1998-11-25 1998-11-25 Ｌｅｄ表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10352136A JPH11243232A (ja) 1998-11-25 1998-11-25 Ｌｅｄ表示装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP21814997A Division JP2927279B2 (ja) 1996-07-29 1997-07-28 発光ダイオード

Publications (2)

Publication Number Publication Date
JPH11243232A true JPH11243232A (ja) 1999-09-07
JPH11243232A5 JPH11243232A5 (enExample) 2004-09-02

Family

ID=18422028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10352136A Withdrawn JPH11243232A (ja) 1998-11-25 1998-11-25 Ｌｅｄ表示装置

Country Status (1)

Country Link
JP (1) JPH11243232A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057376A (ja) * 2000-05-31 2002-02-22 Matsushita Electric Ind Co Ltd Ｌｅｄランプ
JP2002064220A (ja) * 2000-06-09 2002-02-28 Seiwa Electric Mfg Co Ltd 発光ダイオードランプ及びそれに用いられる蛍光体
JP2003029670A (ja) * 2001-07-11 2003-01-31 Sony Corp 表示パネル及び画像表示装置
WO2003019072A1 (en) * 2001-08-23 2003-03-06 Yukiyasu Okumura Color temperature-regulable led light
KR100393130B1 (ko) * 2001-03-14 2003-07-31 대주전자재료 주식회사 리튬을 포함하는 백색 발광다이오드용 알루미늄산이트륨황색 형광체 및 그 제조방법
JP2004080046A (ja) * 2000-05-31 2004-03-11 Matsushita Electric Ind Co Ltd Ｌｅｄランプおよびランプユニット
JP2007311663A (ja) * 2006-05-19 2007-11-29 Sharp Corp 発光装置の製造方法、発光装置、および発光装置の製造装置
JP2007324275A (ja) * 2006-05-31 2007-12-13 Toyoda Gosei Co Ltd 発光装置
US7691765B2 (en) 2005-03-31 2010-04-06 Fujifilm Corporation Translucent material and manufacturing method of the same
JP2012080106A (ja) * 2008-08-29 2012-04-19 Lite Pa Co Ltd 発光ダイオード表示装置
WO2012160521A1 (en) 2011-05-24 2012-11-29 Ecole Polytechnique Federale De Lausanne (Epfl) Color conversion films comprising polymer-substituted organic fluorescent dyes

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057376A (ja) * 2000-05-31 2002-02-22 Matsushita Electric Ind Co Ltd Ｌｅｄランプ
JP2004080046A (ja) * 2000-05-31 2004-03-11 Matsushita Electric Ind Co Ltd Ｌｅｄランプおよびランプユニット
JP2002064220A (ja) * 2000-06-09 2002-02-28 Seiwa Electric Mfg Co Ltd 発光ダイオードランプ及びそれに用いられる蛍光体
KR100393130B1 (ko) * 2001-03-14 2003-07-31 대주전자재료 주식회사 리튬을 포함하는 백색 발광다이오드용 알루미늄산이트륨황색 형광체 및 그 제조방법
JP2003029670A (ja) * 2001-07-11 2003-01-31 Sony Corp 表示パネル及び画像表示装置
WO2003019072A1 (en) * 2001-08-23 2003-03-06 Yukiyasu Okumura Color temperature-regulable led light
EP1462711A4 (en) * 2001-08-23 2010-03-24 Yukiyasu Okumura LED LIGHT WITH ADJUSTABLE COLOR TEMPERATURE
US7691765B2 (en) 2005-03-31 2010-04-06 Fujifilm Corporation Translucent material and manufacturing method of the same
JP2007311663A (ja) * 2006-05-19 2007-11-29 Sharp Corp 発光装置の製造方法、発光装置、および発光装置の製造装置
JP2007324275A (ja) * 2006-05-31 2007-12-13 Toyoda Gosei Co Ltd 発光装置
JP2012080106A (ja) * 2008-08-29 2012-04-19 Lite Pa Co Ltd 発光ダイオード表示装置
WO2012160521A1 (en) 2011-05-24 2012-11-29 Ecole Polytechnique Federale De Lausanne (Epfl) Color conversion films comprising polymer-substituted organic fluorescent dyes

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