JPH11238952A - Device identification device for common printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To identify number of devices used by utilizing few empty spaces for arranging chip components. SOLUTION: At least 2 rows of pads 12 for the mounting chip components are arranged in a device indication region 10 formed at a predetermined position of a component mounting surface 2. Device identification chip components are arranged with respect the pads 2 vertically, horizontally, and vertically or horizontally to form a specific arrangement form, and the device is identified by the arrangement form. When a plurality of chip identification chip components are to be arranged vertically and horizontally, they are arranged so as not to have the different chip components mounted on the same pads 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a common printed circuit board type discriminating apparatus for discriminating a used model based on an arrangement pattern of chip components.

[0002]

2. Description of the Related Art Conventionally, a printed circuit board on which chip parts are inserted and mounted by an automatic mounting machine can be used for different models by changing the type or position of the parts mounted on one printed circuit board. Is manufactured as a common printed circuit board. In this way, the common printed circuit board on which the component mounting with the model specified has been completed is labeled with a number or symbol indicating the model used, or is marked with the model used so that it can be distinguished.

[0003] However, an artificial method for distinguishing a model of a common printed circuit board from use by labeling or stamping requires man-hours such as labeling, and is a mass-produced product. There is a problem that the labeling and stamping may be performed incorrectly. To solve this problem, Japanese Patent Application No. Hei 2-40005 shown in FIG.
No. 2 (Japanese Patent Laid-Open No. 4-208589), a model to be used is determined based on an arrangement pattern of chip components. In FIG. 5, a model display unit 110 is formed at an empty position on the component mounting surface 102 of the printed circuit board 101 to indicate a used model of the printed circuit board 1 on which components are mounted.
The “RPM”, “RCM”, and “HA”
"M" are printed, and a pair of component mounting pads 113a, 113b, and 113c are formed corresponding to the model displays 112a to 112c.

In the model display section 110, for example, a chip resistor 115 is mounted on a pad 113a corresponding to "RPM" of the model display 112a. Therefore, it can be seen that the model used of the printed circuit board 101 is for the model “RPM” specified by the model display 112 a by mounting the resistor chip 115.

[0005]

However, in such a conventional determination of the model to be used utilizing the arrangement pattern by mounting the chip components, the arrangement position of the chip components and the model to be used have a one-to-one correspondence. Therefore, when the types of used models to be distinguished increase, there is a problem that the space of the model display unit 110 for arranging chip components according to the types increases.

[0006] In particular, there is a limited space available for discriminating a model on the component mounting surface of a common printed circuit board. As a result, it is difficult to discriminate a used model by mounting chip components as the number of models increases. was there. The present invention has been made in view of such conventional problems,
It is an object of the present invention to provide a device type discriminating device for a common printed circuit board capable of discriminating a large number of used models by arranging chip components using a small space.

[0007]

In order to achieve this object, the present invention is configured as follows. The present invention is a device for discriminating a model of a common printed circuit board for discriminating a model to be used. Pads used for mounting chip products are arranged in at least two rows on a model display formed at a predetermined position on a component mounting surface. One or more chip components for model determination are arranged vertically, horizontally or vertically and horizontally on the pad to form a unique configuration, and the model is determined based on the configuration. Here, when chip components for model identification are arranged vertically, horizontally or vertically and horizontally,
The chip components are arranged on the same pad so as not to overlap.
It should be noted that the chip components for model identification can be arranged in a combination of the vertical arrangement and the horizontal arrangement only when the pads are arranged in at least two rows and 3
This is the case where they are arranged in stages or more.

The pads arranged in at least two rows as described above are provided with a vertical arrangement of the chip components for model identification, a horizontal arrangement, and a combination of the vertical arrangement and the horizontal arrangement. For example, in the conventional case where two types of chip components can be arranged and two models are determined, according to the combination of the vertical arrangement, the horizontal arrangement, and the vertical and horizontal arrangement of the present invention, six types can be identified.

In the conventional case where three types of chip parts can be arranged and three types are determined, according to the combination of the vertical arrangement, the horizontal arrangement and the vertical and horizontal arrangement of the present invention, 21 types can be identified. As a result, more models can be discriminated from the placement of chip components by effectively utilizing the small empty space. Capacitors as chip components for model identification,
Using a chip component having a different resistance or the like, the model is determined based on the placement type of the chip component for model determination with respect to the pad and the type of the chip component. By determining the type of chip component for chip model determination in this way, the same mounting type can be classified into different groups, and the number of types can be determined by multiplying the number of chip component types by the number of mounting types.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an explanatory view of an embodiment of a device for determining the type of a common printed circuit board according to the present invention. FIG.
In the figure, reference numeral 1 denotes a common printed circuit board, which is a state before component mounting. On the component mounting surface 2 of the common printed circuit board 1,
A print mark 3 indicating a mounting position of an IC, a print mark 5 indicating a mounting position of a diode, a printing mark 7 indicating a mounting position of a terminal pin, and the like are formed by silk printing. For the print marks 3 and 5, pads 46 used for mounting rectangular components are formed by edging or the like. Further, regarding the print mark 7 indicating the mounting position of the terminal pin,
Printing of a predetermined number of pin holes 8 is provided.

At a vacant position on the component mounting surface 2 of the common printed circuit board 1 where no circuit pattern exists, a model display section 10 indicating a model of use of the common printed circuit board 1 is provided. The model display unit 10 includes a pad for mounting a chip component for model discrimination in the print frame 11, for example, two pads in the vertical direction.
The pads are formed in two rows, and the width between the pads arranged in the vertical and horizontal directions is the same length of one chip component.

FIG. 2 is an explanatory view of the model display in the embodiment in which the four pads 12 of the model display section 10 provided on the common printed circuit board 1 of FIG. 1 are arranged in two rows in two rows. FIG.
(A) shows the model display section 10 of FIG.
One pad 12 is arranged in a two-stage, two-row rectangular shape.
The chip components 15A, 15B, 15C, and 15D for model determination are selectively arranged on the pads 12 arranged in two rows and two rows as described above.

The chip parts 15A to 15A for model identification
The vertical and horizontal arrangement patterns of D are arranged so that chip components do not overlap on the same pad 12. For example, 15A and 1
Since the 5D implementation uses the common pad 12 on the upper right,
Only one of 15A and 15D can be mounted. Here, the placement shape that is the placement pattern of the model identification chip components 15A to 15D is expressed using the signs of the patterns A, B, C, and D. The relationship between the model number and the placement according to the arrangement of the model identification chip components 15A to 15D on the model display unit 10 is as shown in a correspondence table 13A on the right side. In the correspondence table 13A, the model numbers 1, 2, 4, and 5 indicate the case where the model identification chip parts 15A, 15B, 15C, and 15D are individually placed vertically or horizontally on the model display unit 10, and the patterns A,
B, C, and D.

On the other hand, the model number 3 is displayed in the model display section 10.
In this case, two chip components 15A and 15B for model identification are placed horizontally, and the pattern AB is placed. Also, the model number 6 is displayed on the model display section 10 as the chip part 15 for model determination.
C and 15D are placed vertically, and the pattern C
It becomes the shape of D. Further, the model number 7 is a case where no model discriminating chip component is placed on the model display section 10. As described above, in the model display section 10 of the present invention, one or two model identification chip components are vertically or horizontally placed on, for example, four pads 12 arranged in two rows and two rows. Thus, six types of placement patterns of model numbers 1 to 6 can be obtained, and seven types of model numbers can be expressed, including model number 7 when chip components are not arranged.

FIG. 2B is a view similar to FIG.
FIG. 10 is an explanatory diagram of a conventional model display section 110 in a case where two pads 12 are arranged in two rows and two rows, and shows a correspondence table 113 of model numbers and placement shapes on the right side. In the conventional model display unit 110, two model identification chip components 15A and 15B are provided.
Is placed horizontally, for example, so as to correspond one-to-one with the model number. Therefore, as shown in the correspondence table 113A, the model number 1 is the pattern A in which the model discriminating chip parts 15A are arranged.
And the model number 2 is the chip part 15 for model identification.
This is a pattern of pattern B in which only B is arranged.

FIG. 2A shows a model display section 10 of the present invention.
As is clear from the comparison between the conventional model display unit 110 of FIG. 2B and the conventional model display unit 110, in the present invention, when the same four pads are arranged in two rows and two rows, as shown in the correspondence table 13A. Seven types of placements can be expressed, including no chip parts, and a sufficient model discrimination display can be realized as compared with the conventional example in which only two types of placements can be expressed as in the correspondence table 113A.

Here, the model identification chip components 15A to 15D arranged on the model display section 10 may be appropriate chip components such as a resistor chip and a capacitor chip, and the model identification chip components are mounted on the common printed circuit board 1. Since the components are completely unrelated to the circuit, the lowest-priced chip component is used for model discrimination. FIG. 3 shows a state after components are mounted on the common printed circuit board 1 of FIG. 1 by an automatic mounting machine. The common printed circuit board 1 has IC1, IC2
The IC package 17 and the diode chip 16 are mounted. In addition, the model display section 10 has a model discriminating chip component 15 having a pattern AB corresponding to the model number 3 in the correspondence table 13A of FIG.
A and 15B are four pads 12 arranged in two rows and two stages.
Is implemented horizontally.

Here, the chip parts 15A, 15
As B, for example, a chip resistor is mounted. FIG. 4 shows another embodiment of the apparatus for determining the model of a common printed circuit board according to the present invention, in which a model display section 10 provided on the common printed circuit board 1 as shown in FIG. 1 is taken out and compared with a conventional example. FIG. 4A shows a model display unit 10 as another embodiment of the apparatus for determining the model of a common printed circuit board according to the present invention.
Are shown together with the correspondence table 13. In the model display section 10 of this embodiment, six pads 12 are arranged vertically in two rows and three rows.

With respect to such arrangement of the pads 12 in two rows and three stages, seven types of chip components 15A to 15G for model identification are selectively arranged. 7 model identification chip components 1
The arrangement forms of 5A to 15G can be classified into a single arrangement, a plurality of arrangements in a vertical or horizontal arrangement, and a plurality of arrangements by a combination of a vertical arrangement and a horizontal arrangement.

More specifically, as shown in a correspondence table 13B, the patterns A, B, C, D, E, F, and G of the model numbers 1, 2, 3, 8, 9, 11, and 12 are used for model identification. This is a case where the chip components 15A to 15G are individually arranged. The model numbers 4 to 7 correspond to the chip components 15A, 15B,
It is a plurality of horizontal arrangements by a combination of 15C. As a result, patterns AB, AC, BC, and ABC are obtained as standing shapes.

The model numbers 10, 13, 20, 21 are:
The four model identification chip parts 15D, 15E, 15F,
Stand-shaped patterns DE, F in which two 15Gs are vertically arranged.
G, DG, and EF. Further, the model numbers 14 to 19 correspond to the remaining six chip components 15A and 15C to 15G excluding the model identification chip component 15B located at the center.
Stationary patterns AF, AG, AFG, CD, CE, CD
E.

As a result, in the embodiment of the model display section 10 shown in FIG. 4A, as shown in the correspondence table 13B, 22 types of models including no layout of the model identification chip component of the model number 22 are provided. Can be expressed. FIG. 4B shows the model discrimination by the conventional model display section 110 in which the same six pads 12 are arranged in two rows and three rows, and the pattern A of the stationary shape like the model numbers 1 to 3 as shown in the correspondence table 113B. , B and C can be determined. Therefore, using the same pad arrangement in the same space as the conventional model display section 110, the model display section 10 of the present invention in FIG. Can be.

Further, according to the present invention, as the model discriminating chip components 15A to 15G used in the model display unit 10 of FIG. 2A and the model display unit 110 of FIG. By combining different resistor chips and capacitor chips, in the case of FIG.
13 models that are one less than double can be expressed, and FIG. 4 (A)
As for, 43 models that are one less than twice can be expressed. If another chip component whose external appearance is identifiable is used for model discrimination, the number of discriminated models can be increased according to the type of chip component for model discrimination.

The model discriminating chip component 15 arranged on the model display section 10 like the common printed circuit board 1 of FIG.
To determine the model based on the configuration of A and 15B, the model display unit 10 on the common printed circuit board 1 may be optically read to recognize the configuration, and the model number to be used may be recognized by referring to the correspondence table 13A of FIG. . Further, the operator artificially looks at the model display unit 10, recognizes any one of the arrangement patterns A to D or a combination thereof from the arrangement of the chip parts for model identification, and similarly identifies the model number of the correspondence table 13A. You may do so.

Further, the above embodiment has been described with reference to the mounting of chip components as an example, but ordinary circuit components may be used. Further, the present invention is not limited to the insert by the automatic mounting machine, and can be similarly applied to a case where components are mounted manually.

[0026]

As described above, according to the present invention, at least two types of pads are arranged vertically, horizontally, or vertically and horizontally on at least two rows of pads. More models can be determined using the same empty space as compared to the case where the arrangement of the chip parts and the conventional model correspond one-to-one.

Further, by using different chip components such as a capacitor and a resistor as the chip components for model identification, it is possible to divide the device into groups according to the types of the chip components. Can easily be determined.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a common printed circuit board showing an embodiment of the present invention before mounting.

FIG. 2 is an explanatory diagram showing a relationship between a placement type of chip components and a model number in a model display section of FIG. 1 in comparison with a conventional example.

FIG. 3 is an explanatory view of a common printed circuit board showing a state where components are mounted in FIG. 1;

FIG. 4 is an explanatory diagram showing a relationship between a placement type of chip components and a model number in a model display unit according to another embodiment of the present invention in comparison with a conventional example.

FIG. 5 is an explanatory diagram of a model determination based on a conventional chip component arrangement.

[Explanation of symbols]

 1: Common printed circuit board 2: Component mounting surface 3, 5, 7: Printing mark 4, 6, 12: Pad 8: Pin hole 10: Model display section 11: Printing frame 13A, 13B: Correspondence table 14: Component mounting mark 15A １５15G: Chip part for model discrimination 16: Diode chip 17: IC package

Claims (3)

[Claims] In a device for discriminating a model of a common printed circuit board for discriminating a model to be used, pads used for mounting chip products are arranged in at least two rows on a model display section formed at a predetermined position on a component mounting surface. ,
A common printed circuit board type discriminating device, wherein one or more chip components for model discrimination are arranged vertically, horizontally, or vertically and horizontally on the pad to form a unique placement shape, and the model is determined based on the placement shape. . 2. In the apparatus for determining the type of a common printed circuit board according to claim 1, wherein the chip components for model determination are arranged vertically, horizontally or vertically and horizontally so that the chip components are not overlapped on the same pad. A device for determining the model of a common printed circuit board. 3. A device for determining the model of a common printed circuit board according to claim 1 or 2, wherein different chip components such as a capacitor and a resistor are used as the chip component for determining the model.
An apparatus for determining the model of a common printed circuit board, wherein the model is determined based on the type of the chip component for model determination with respect to the pad and the type of the chip component.