JPH11230895A - Apparatus for measuring adhesion of resin-molded body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for highly accurately measuring an adhesion of a resin-molded body of plastic or the like. SOLUTION: An adhesion-measuring apparatus 1 moves a movable die plate 4 down thereby moving a connection jig 9 down via a compression force detection part 5, a compression rod 6, a tensile force detection part 7 and a tensile force rod 8, so that a resin-molded body 10 is pressed to a member 12 to be adhered. At this time, an entire outer side face of the resin-molded body 10 is held by a supporting member 14 of a clamp mechanism 13 to prevent the resin-molded body 10 from being deformed. The resin-molded body 10 is pressed to the member 12 to be adhered, and a compression pressure is detected by the compression force detection part 5. Then, after the holding of the resin- molded body 10 by the supporting member 14 of the clamp mechanism 13 is released, the movable plate 14 is moved up to pull up the connection jig 9 and the resin-molded body 10, thereby separating the resin-molded body 10 and member 12 to be adhered. An adhesion generated at this time is detected by the tensile force detection part 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for measuring the adhesion of a resin molded article, and more particularly to an apparatus for measuring the adhesion of a resin molded article with high accuracy.

[0002]

2. Description of the Related Art Conventionally, when producing a high-precision plastic molded product, a slight deformation at the time of releasing the molded product affects the quality of the molded product. On the other hand, the adhesion between the resin and the cavity wall surface greatly affects the transferability of the molded product.

[0003] Therefore, in order to ascertain the releasability or transferability of the resin molded body from the cavity wall surface, the adhesion force between the resin molded body and the cavity wall surface is accurately measured, and factors affecting the adhesion force are clearly defined. Device is required.

Conventionally, as a method of evaluating the adhesion, a method of measuring the contact angle of the cavity member has been used. However, this method cannot merely examine the difference in adhesion due to the difference in the resin used. In addition, it is not possible to examine the change in adhesion force with respect to temperature and pressure during molding.

Further, conventionally, Japanese Patent Application Laid-Open Nos. 63-144,026, 9-123231, and 5-
JP-A-149869 and the like have proposed methods for measuring the release resistance of a resin molded product. In each of these methods, after a resin molded product is molded, a load is detected via an ejector pin for releasing the resin. The resistance at that time is measured by a container.

[0006]

However, in the measurement of the mold release resistance of such a conventional resin molded article,
Since the mold release resistance of the resin depends on the position and size of the ejector pin, it can be evaluated for a specific molded product, but it has general versatility to understand the factors that affect the adhesion. I can't get any data. In the measurement of the mold release resistance of the resin molded product, if any air intervenes between the resin molded product and the contact surface, the separation from the portion where the air intervenes proceeds preferentially, and the adhesive force The measured values vary,
Although it is not possible to measure the adhesion force with high accuracy, in the above-mentioned conventional measuring method, air intervenes in a small clearance between the ejector pin and the insertion hole formed in the adhesion surface,
There was a problem that the peeling proceeded preferentially from the clearance portion, and the adhesion could not be measured accurately.

[0007] In view of the above, according to the first aspect of the present invention, a resin molded body is attached to one side of a pair of press members which are moved in a direction approaching and away from each other via a predetermined connecting member, and the other. The member to be adhered is exchangeably attached to the pressed member on the side in a state facing the resin molded body, and the pressing member is moved by the pressing means in a direction to approach to press the resin molded body and the member to be adhered at a predetermined pressure. The pressing force is detected by the compression force detecting means. At least, when the resin molded body and the member to be in close contact are pressed, the deformation of the resin molded body is held by holding the outer peripheral side surface of the resin molded body over the entire area. After that, the pressing member is moved in a direction to separate the press member by the pressing means, and the resin molded body and the member to be adhered are separated from each other. By measuring with the ejecting means, it is possible to prevent the resin molded body from being deformed at the time of pressing against the adhered member without forming an ejector pin insertion hole on the contact surface of the adhered member, and Adhesion force measurement system for resin moldings, which can accurately and easily measure the adhesion force of the resin, and accurately grasp the factors of the adhesion force (surface roughness of the contact surface, surface treatment, temperature, pressure). It is intended to provide.

According to a second aspect of the present invention, when the holding means detachably holds the resin molded body and presses the resin molded body and the member to be in close contact with each other, the holding means holds the resin molded body by the resin molding. By releasing the holding of the resin molded body by the holding means when the body and the member to be adhered are peeled off, it acts between the resin molded body and the holding means when the resin molded body is peeled from the member to be adhered. Provided is a resin molded body adhesion force measuring device capable of preventing a force from hindering separation between a resin molded body and a member to be adhered, and capable of measuring the adhesion force of the resin molded body with higher accuracy. It is intended to be.

According to a third aspect of the present invention, when the holding means is provided with a predetermined metal film on a surface in contact with the resin molded body, the resin molded body can be separated from the member to be adhered. The metal film prevents the molded body and the holding unit from coming into close contact with each other, thereby preventing the holding unit from hindering the separation between the resin molded body and the member to be adhered, and further increasing the adhesion of the resin molded body. It is an object of the present invention to provide a device for measuring the adhesion of a resin molded body, which can be measured with high accuracy.

According to a fourth aspect of the present invention, there is provided a holding member integrally formed with the resin molded body in a state in which the holding means holds the outer peripheral side surface of the resin molded body over the entire area, and a member which is in close contact with the resin molded body. Holds the holding member when is pressed,
A fixing member that releases the holding of the holding member when the resin molded body and the member to be in contact with each other are peeled off, so that the holding member and the resin molded body can be integrally moved; When pressing the molded body and the member to be in close contact with each other, the deformation of the resin molded body is appropriately prevented, and when the resin molded body is to be separated from the member to be in intimate contact, the holding member and the resin molded body are integrally moved. Thus, a resin molded body adhesion force measuring device capable of preventing the holding member from hindering the separation between the resin molded body and the member to be adhered, and capable of measuring the adhesion force of the resin molded body with higher accuracy. It is intended to provide.

According to a fifth aspect of the present invention, as the holding means,
By using a resin member provided with a predetermined resin layer between the connection member and the holding member attached to the resin molded body,
With a simple configuration, it is possible to prevent the holding member from hindering the separation between the resin molded body and the member to be adhered, and to measure the adhesion of the resin molded body with higher accuracy. It is an object of the present invention to provide an adhesion measuring device.

According to a sixth aspect of the present invention, the connecting member, the resin molded body, and the holding member are produced by integral molding, whereby the resin molded body can be produced simply and easily, and the adhesive force of the resin molded body can be obtained. It is an object of the present invention to provide an apparatus for measuring the adhesion of a resin molded body, which can measure the adhesion of a resin molded product with higher accuracy.

According to a seventh aspect of the present invention, a connecting member or /
A predetermined cut portion is formed on the contact surface of the holding member with the resin molded body, and the resin molded body is attached to the connection member or / and the holding member in a state where a part of the resin molded body enters the cut portion, thereby making connection. When the bonding between the member and / or the holding member and the resin molded body is made strong, peeling occurs between the connecting member and / or the holding member and the resin molded body when the resin molded body and the member to be adhered are separated. It is an object of the present invention to provide an apparatus for measuring the adhesive force of a resin molded product, which can prevent the occurrence of such a problem and can measure the adhesive force of the resin molded product with higher accuracy.

[0014]

According to the first aspect of the present invention, there is provided an apparatus for measuring the adhesion of a resin molded article, comprising: a pressing means for moving a pair of pressing members in a direction of approaching and separating from each other; A resin molded body attached to one side of the press member via a predetermined connecting member, a member to be adhered exchangeably attached to the other side of the press member in a state facing the resin molded body, and A compressive force detecting means for measuring the pressing force when the press member is moved in the approaching direction and the resin molded body and the member to be pressed are pressed, and a direction in which the press member is separated by the press means A tensile force detecting means for measuring an adhesive force between the resin molded body and the member to be adhered when the resin molded body and the member to be adhered are separated from each other; Comprising a holding means to prevent deformation of the resin molding an outer peripheral side surface of the resin molded body in the the body to be contact member is pressed and held over the entire area, and
The pressing means moves the pressing member in the approaching direction, and presses the resin molded body and the member to be brought into contact with each other in a state held by the holding means at a predetermined pressure. After being detected by the detecting means, the pressing means is moved in a direction separating the press member to separate the resin molded body and the adhered member, and the resin molded body and the adhered member at the time of the peeling are separated. The above-mentioned object is achieved by measuring the adhesion force with the tension force detecting means.

According to the above construction, of the pair of press members moved in the direction approaching and separating from each other,
A resin molded body is mounted on one side via a predetermined connecting member, and a member to be in contact with the resin molded body is exchangeably mounted on the other side of the pressing member in a state of facing the resin molded body, and the pressing member is moved in a direction to approach the pressing member by pressing means Then, the resin molded body and the member to be adhered are pressed with a predetermined pressure, and the pressing force is detected by the compression force detecting means. At least, when the resin molded body and the member to be adhered are pressed, the outer periphery of the resin molded body is pressed. The side surface is held by the holding means over the entire area to prevent deformation of the resin molded body, and thereafter, the pressing means is moved in a direction to separate the press member, and the resin molded body and the member to be adhered are peeled off. At this time, the adhesion between the resin molded body and the member to be adhered is measured by the tensile force detecting means, so that an ejector pin insertion hole is not formed on the contact surface of the member to be adhered, and the resin molded body and the member to be adhered are measured. Dense The resin molded body is prevented from being deformed when pressed against a member, and the adhesion of the resin molded body can be measured accurately and easily. Factors of the adhesion (surface roughness of the adhered surface, surface roughness) Process, temperature, and pressure) can be accurately grasped.

In this case, for example, as described in claim 2, the holding means detachably holds the resin molded body, and the apparatus for measuring the adhesive force of the resin molded body uses the press means to press the resin molded body. When the member is moved in the approaching direction to press the resin molded body and the adhered member, the resin molding is held by the holding means, and the press member is moved in the direction to separate by the pressing means. Then, when the resin molded body and the member to be adhered are separated from each other, the holding of the resin molded body by the holding means may be released.

According to the above construction, when the holding means detachably holds the resin molding and presses the resin molding and the member to be in close contact with each other, the holding means holds the resin molding by the holding means, and Since the holding of the resin molded body by the holding means is released when the adhered member is peeled off, the force acting between the resin molded body and the holding means when the resin molded body is peeled from the adhered member, It is possible to prevent the separation of the resin molded body and the member to be adhered from being hindered, and it is possible to measure the adhesion of the resin molded body with higher accuracy.

Further, for example, as set forth in claim 3, the holding means may include a predetermined metal film on a contact surface with the resin molded body.

According to the above construction, the holding means is provided with the predetermined metal film on the contact surface with the resin molded body. The metal film is used to prevent the holding means from sticking to each other, thereby preventing the holding means from hindering the separation between the resin molded body and the member to be adhered, and further improving the adhesion of the resin molded body. It can be measured with high accuracy.

Further, for example, as set forth in claim 4, the holding means includes a holding member formed integrally with the resin molded body in a state of holding the outer peripheral side surface of the resin molded body over the entire area. The holding member is held when the resin molded body and the member to be adhered are pressed, and the holding of the holding member is released when the resin molded body and the member to be adhered are released. A fixing member that enables the member and the resin molded body to be integrally movable may be provided.

According to the above arrangement, the holding member is formed integrally with the resin molded body while holding the outer peripheral side surface of the resin molded body over the entire region, and the resin molded body and the member to be brought into close contact with each other are pressed. When the holding member is held, the holding member is released and the holding member and the resin molded body can be integrally moved when the resin molded body and the member to be adhered are peeled off. Since it is provided with, when pressing the resin molded body and the member to be adhered, it is possible to appropriately prevent deformation of the resin molded body, and when peeling the resin molded body from the member to be adhered, By moving the holding member and the resin molded body integrally, it is possible to prevent the holding member from hindering the separation between the resin molded body and the member to be adhered, and to further enhance the adhesive force of the resin molded body. It can be measured with high accuracy.

Further, for example, as described in claim 5, the holding means may include a predetermined resin layer provided between the connecting member to which the resin molded body is attached and the holding member. Good.

According to the above configuration, since a holding means having a predetermined resin layer provided between the connection member to which the resin molded body is attached and the holding member is used, the structure is simple, and Further, it is possible to prevent the holding member from hindering the separation between the resin molded body and the member to be adhered, and it is possible to measure the adhesion of the resin molded body with higher accuracy.

Further, for example, as described in claim 6, the connection member, the resin molded body, and the holding member are
It may be manufactured by integral molding.

According to the above configuration, since the connecting member, the resin molded body, and the holding member are manufactured by integral molding, the resin molded body can be easily and easily manufactured, and the resin molded body can be manufactured easily. The adhesion can be measured with higher accuracy.

For example, as set forth in claim 7, the connection member and / or the holding member has a predetermined cut portion formed on a contact surface with the resin molded body, and the resin molded body is The cut portion may be attached to the connection member and / or the holding member in a state where a part thereof enters the cut portion.

According to the above configuration, a predetermined cut portion is formed on the contact surface of the connecting member and / or the holding member with the resin molded body, and the resin molded body is cut in such a state that a part of the resin molded body enters the cut portion. Since the connection member and / or the holding member are attached to the connection member and / or the holding member, the connection between the connection member and / or the holding member and the resin molding is strengthened. Separation between the holding member and the resin molded body can be prevented from occurring, and the adhesion of the resin molded body can be measured with higher accuracy.

[0028]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. It should be noted that the embodiments described below are preferred embodiments of the present invention, and therefore, various technically preferable limitations are added. However, the scope of the present invention is not limited to the following description. The embodiments are not limited to these embodiments unless otherwise specified.

FIGS. 1 to 6 are views showing a first embodiment of the apparatus for measuring the adhesion of a resin molded product according to the present invention.

FIG. 1 is a schematic front sectional view of an adhesion measuring device 1 to which a first embodiment of the resin molding adhesion measuring device of the present invention is applied. In FIG. 1, an adhesion measuring device 1 includes a plurality of guide poles 3 arranged vertically on a fixed die plate (press member) 2 having a flat shape, and a movable die plate (press member) is provided on the guide pole 3. 4 is arranged along the guide pole 3 so as to be movable in the vertical direction in FIG. The movable die plate 4 is moved up and down by a die plate driving mechanism (not shown). In the present embodiment, the movable die plate 4 is moved, but the fixed die plate 2 may be moved, or the movable die plate 4 and the movable die plate 2 may be moved.
May be moved. The fixed die plate 2, the guide pole 3, the movable die plate 4, and the die plate driving mechanism function as a press as a whole.

The movable die plate 4 has a compression force detecting section (compression force detecting means) 5 fixedly attached at the center thereof, and a lower end of the compression force detecting section 5 has a hollow box shape or the like. The compression rod 6 formed is fixed.

In the compression rod 6, a tensile force detecting section (tensile force detecting means) 7 is fixedly disposed. At the lower end of the tensile force detecting section 7, a hollow box having a closed top and bottom is provided. (B type)
Alternatively, a tension rod 8 formed in a cylindrical shape is fixed. As shown in FIG. 2, the tension rod 8 has an insertion hole 8a formed at the center of the lower plate portion.
The arm 9a of a connecting jig (connecting member) 9 which is formed in a substantially T-shape and has an arm 9a and a flat plate 9b is slidably inserted therein. The arm 9a of the connecting jig 9 has an insertion hole 6a formed at the center of the lower plate portion of the compression rod 6.
And the insertion hole 8a of the tension rod 8 and the insertion hole 6a of the compression rod 6 are formed on the same straight line.

The compression rod 6 of the arm 9a of the connection jig 9
The flat plate portion 9b is formed, for example, in a disk shape at the outer tip, and on the lower surface of the flat plate portion 9b of the connection jig 9,
The resin molded body 10 to be measured is formed in the same shape as the flat plate portion 9b. The connection jig 9 and the resin molded body 10 are integrally formed, and a stopper 11 that can abut on a lower plate of the tension rod 8 is fixed to a tip of the connection jig 9 in the tension rod 8. I have. The stopper 11 is formed in a size that cannot pass through the insertion hole 8a formed in the lower plate of the pull rod 8, and abuts on the lower plate of the pull rod 8 when the pull rod 8 is moved upward. And is pulled up by the pull rod 8. In addition, the flat plate portion 9 of the connection jig 9
b and the resin molded body 10 are not limited to the disk shape,
For example, it may be formed in a flat rectangular shape.

Referring again to FIG. 1, on the fixed die plate 2 below the resin molded body 10 formed on the lower end surface of the connection jig 9, a member 12 to be adhered is exchangeably fixed. As a method, a resin molded body whose surface roughness, surface treatment, and the like are changed in accordance with the measurement of the resin molded body 10 to be measured is fixed.

The compression rod 6 and the tension rod 8, the compression force detector 5, the tension detector 7, and the connecting jig 9 are arranged on the same straight line, and the movable die plate 4 is moved along the guide pole 3. When it is moved in the vertical direction, it moves along the arm 9a of the connecting jig 9 on the same straight line.

A clamp mechanism 13 is disposed on the fixed die plate 2 around the member 12 to be in close contact with the member 12 to be in contact with the member 12 at a predetermined distance. The clamp mechanism (holding means) 13 includes a holding member 14 that extends above the member to be adhered 12 and holds the resin molded body 10, and a supporting member (fixing member) 15 that supports the holding member 14. The clamp mechanism 13 moves the holding member 14 in the direction of the resin molded body 10 when the resin molded body 10 is pressed against the member to be adhered 12 to be in close contact with the periphery of the resin molded body 10 as described later. Thus, the deformation of the resin molded body 10 is prevented, and when the resin molded body 10 moves upward and is separated from the member to be adhered 10, the holding member 14 is moved in a direction separating from the resin molded body 10. Then, the holding of the resin molded body 10 is released. And
As shown in FIGS. 3 to 6, the holding members 14 are provided as a pair on the left and right in FIG. 1, and concave portions having the same shape as the outer peripheral shape of the resin molded body 10 are formed on opposing surfaces.
When the pair of holding members 14 come into contact with each other, they come into contact with the outer peripheral side surface of the resin molded body 10 and hold the resin molded body 10 over the entire outer peripheral side surface.

When the resin molded body 10 and the connection jig 9 are integrally formed, a predetermined undercut (cut portion) is provided on the lower surface of the flat plate portion 9b of the connection jig 9, and the resin molded body 10 is provided in the undercut. , The resin molded body 10 and the connection jig 9 are firmly and integrally fixed. For example, as shown in FIG. 7, when a screw hole 16 is formed in the lower end surface of the flat plate portion 9b of the connection jig 9 and the resin molded body 10 is formed in the lower end surface of the flat plate portion 9b, the resin molded body 10 becomes Screw hole 16
And the unevenness of the screw hole 16 serves as an undercut, whereby the resin molded body 10 and the connection jig 9 can be firmly and integrally fixed.

The adhesion measuring device 1 is used in any of a state where the resin molded body 10 is located at a standby position away from the member to be adhered 12 and a state where the resin molded body 10 is pressed against the member to be adhered 12. In addition, a thermostat (not shown) that covers the resin molded body 10 and the member to be adhered 12 attached to the connection jig 9 is provided, and the thermostat is heated and cooled by a temperature controller (not shown). The temperature of the atmosphere can be controlled in a wide range from a predetermined low temperature to a predetermined high temperature.

Although not shown, the thermostatic bath is formed by inserting the integrally molded resin molded body 10 and the connecting jig 9 into the thermostatic bath, and connecting the arm portion 9a to the insertion hole 6a of the compression rod 6 and the tension rod 8
A stopper 11 is attached to the tip of the arm 9a, and a window or the like is provided for installing the member to be adhered 12 on the fixed die plate 2.
This window can be closed by a door member that can be opened and closed. Note that the thermostatic bath may be vertically movable without providing a window in the thermostatic bath.

Then, the adhesive force measuring apparatus 1 heats the resin molded body 10 and the member to be adhered 12 housed in the thermostat to a predetermined temperature, and
Then, the resin molded body 10 is pressed against the member to be adhered 12, and the resin molded body 10 is peeled from the member to be adhered 12 from this pressed state, and the adhesive force is measured.

The compressing force detecting unit 5 and the tensile force detecting unit 7 are connected to a processing control unit such as a computer (not shown) via an amplifier and an A / D conversion unit (not shown). Analyzes the detection signals output from the compressive force detecting unit 5 and the tensile force detecting unit 7 via an amplifier, an A / D converter, and the like, and outputs the compressive force data and the tensile force data to a display unit (not shown). In addition, a recording unit (not shown) records and outputs on recording paper.

Next, the operation of the present embodiment will be described. When measuring the adhesion of the resin molded body 10, the adhesion measuring device 1 is configured such that the arm 9 a of the connecting jig 9 integrally formed with the resin molded body 10 to be measured includes the insertion hole 6 a of the compression rod 6 and the tension rod 8. The resin molded body 10 and the connecting jig 9 are attached to the adhesion measuring device 1 by inserting the stopper 11 at the tip of the arm 9a, and the member 12 to be adhered is fixed to the fixing die. It is set on the plate 2.

When the integrally molded resin molded body 10, the connecting jig 9 and the member to be adhered 12 are mounted in this manner, the movable die plate 4 is moved downward in FIG. That is, when the movable die plate 4 is moved in a direction to approach the fixed die plate 2 and the movable die plate 4 is moved downward, the compression force detecting unit 5 fixed to the movable die plate 4 detects the compression force. The compression rod 6 fixed to the section 5, the tension detection section 7 fixed to the compression rod 6, and the tension detection section 7
The pull rod 8, which is fixed at the same position, is moved downward together. Thus, the movable die plate 4 is moved downward, and the resin molded body 10 and the member to be adhered 12 are brought into close contact with each other.

When the resin molded body 10 comes into close contact with the member 12 to be adhered, the pair of holding members 14 of the clamp mechanism 13 are moved in the direction in which the pair of holding members 14 come close to each other, as shown by the left and right arrows in FIGS. By moving, the outer surface of the resin molded body 10 is held by the holding member 14.

In this state, the adhesion measuring device 1 moves the movable die plate 4 further downward by the die plate driving mechanism as shown by the downward arrow in FIG. The flat plate portion 9b of the jig 9 is pressed downward, and the resin molded body 10 is pressed against the member 12 to be adhered, so that a predetermined pressing force is applied to the resin molded body 10. The compression pressure at this time is detected by the compression force detector 5.

At this time, since the outer surface of the resin molded body 10 is covered and held by the holding member 14 of the clamp mechanism 13 without any gap, the deformation of the resin molded body 10 can be prevented, and the reproducibility can be improved. A highly accurate compression force, that is, an adhesion force can be measured.

Further, the pressing force is applied to the resin molding 10 only through the flat plate portion 9 b of the connection jig 9, and the holding force measuring device 1
4 and the flat plate portion 9b are set in shape, and the resin molded body 10 can be appropriately pressed against the member to be adhered 12.

Further, since the arm 9a of the connecting member 9 is slidably inserted into the insertion hole 6a of the compression rod 6 and the insertion hole 8a of the tension rod 8, as shown in FIG. No load is applied to the detection unit 7. As a result, without being limited by the allowable load of the tensile force detection unit 7,
A required compression load can be applied to the resin molded body 10. Further, as the tensile force detecting unit 7, a high-resolution tensile force detecting unit 7 adapted to the magnitude of the adhesion between the resin molded body 10 and the member to be adhered 12 can be used. It can be performed. Further, the initial pressure applied to the resin molded body 10 by the compression rod 6 by lowering the movable die plate 4 can be set arbitrarily, and the compression pressure at this time is determined by detecting the compression force as described above. By detecting with the part 5, the relationship between the contact force and the pressing force can be measured.

As described above, the movable die plate 4 is lowered while the outer surface of the resin molded body 10 is held by the holding member 14 of the clamp mechanism 13, and the resin molded body 10 is When the compression pressure at this time is detected by the compression force detector 5, for example, the ambient temperature in the constant temperature bath is raised to a predetermined temperature, and pressure is generated in the resin molded body 10. Is detected by the compression force detector 5 and cooled to a predetermined temperature again.

As described above, when the temperature of the atmosphere in the thermostat is controlled to heat and cool the resin molded body 10 and the member 12 to be adhered, a temperature distribution between the resin molded body 10 and the member 12 to be adhered is generated. Can be prevented, and the measurement accuracy of the adhesion can be improved.

Next, the movable die plate 4 is moved upward by the die plate driving mechanism, and the compression rod 6, the tensile force detector 7 and the tension rod 8 are moved together with the compression force detector 5.
Is moved upward, and the lower plate of the compression rod 6 is separated from the flat plate portion 9 b of the connection jig 9.

At this time, as shown by the left and right arrows in FIGS.
Is moved in a direction away from the resin molded body 10 to release the holding of the resin molded body 10 by the clamp mechanism 13.

As described above, the resin molded body 10 released from holding by the clamp mechanism 13 does not receive resistance from the holding member 14 of the clamp mechanism 13.

Further, the compression rod 6 and the tension rod 8 slide upward on the arm 9a of the connection jig 9 through the insertion holes 6a and 7a, and do not affect the measurement of the adhesion.

When the movable die plate 4 is further moved upward, the lower plate of the tension rod 8 comes into contact with the stopper 11 fixed to the upper end of the connection jig 9 and the resin molded integrally with the connection jig 9 is formed. The molded body 10 is to be lifted upward.

When the movable die plate 4 is further moved upward in this state, the separation between the resin molded body 10 and the member to be adhered 12 is started, and the adhesive force generated at that time is detected by the tensile force detector 7. . Thereafter, when the resin molded body 10 and the member to be adhered 12 are completely peeled off, the measurement of the adhesive force is terminated.

As described above, according to the adhesion measuring device 1 of the present embodiment, the deformation of the resin molded body 10 by the clamp mechanism 13 is prevented when the resin molded body 10 and the member to be adhered 12 are pressed. When the resin molded body 10 and the member to be adhered 12 are separated from each other, the resin molded body 10 is clamped by the clamp mechanism 13.
Is released, so that the adhesion force of the resin molded body 10 can be accurately and easily measured without forming an ejector pin insertion hole on the contact surface of the member 12 to be adhered. Factors of force (surface roughness of contact surface, surface treatment,
Temperature and pressure) can be accurately grasped.

Further, according to the adhesion measuring device 1 of the present embodiment, since the connecting jig 9 and the resin molded body 10 are integrally formed, it is easy to prepare a measurement sample, and the distance between these members is improved. Can be eliminated, and the operability and usability of measuring the adhesion can be improved.

Further, a screw hole 16 is formed at the lower end surface of the flat plate portion 9b of the connection jig 9, and a resin molded body 10 is formed at the lower end surface of the flat plate portion 9b.
6, the unevenness of the screw hole 16 serves as an undercut, and the resin molded body 10 and the connection jig 9 can be firmly and integrally fixed. When the resin molded body 10 is separated from the resin molded body 10, the peeling between the resin molded body 10 and the connection jig 9 can be prevented, and the adhesion of the resin molded body 10 can be more accurately measured.

In the measurement of the adhesion force, as described above, the resin molded body 10 released from the holding by the clamp mechanism 13 does not receive resistance from the holding member 14 of the clamp mechanism 13, and as shown in FIG. As shown by the upward arrow, when the connection jig 9 is moved upward, the connection jig 9 is moved upward together with the connection jig 9 to be separated from the member 12 to be adhered, and the adhesion force can be measured with high accuracy. it can.

Since the compression rod 6 and the tension rod 8, the compression force detector 5, the tension detector 7, and the connecting jig 9 are arranged on the same straight line, the movable die plate 4 is connected to the guide pole 3. When the resin molded body 10 is moved up and down along the vertical direction, the resin molded body 10 moves on the same straight line without being pressed or pulled in an oblique direction, and the adhesion can be accurately measured.

Further, since the member to be adhered 12 only needs to be set on the flat fixed die plate 2 in the thermostat,
There is almost no restriction on the shape, and it can be easily exchanged for the member to be adhered 12 having different surface roughness and surface treatment, and comparative measurement using the member to be adhered 12 under various conditions can be easily performed.

In the above-described embodiment, the deformation of the resin molded body 10 is prevented by bringing the holding member 14 of the clamp mechanism 13 into direct contact with the side surface of the resin molded body 10. A metal film such as an aluminum foil may be interposed between the molded body 10. With this configuration, when the holding member 14 is separated from the resin molded body 10, the holding member 14 of the clamp mechanism 13 and the resin molded body 10 come into close contact with each other, and the resin molded body 10 is moved upward, and the resin molded body 1 is moved.
It is possible to prevent a force from acting in a direction perpendicular to the moving direction of the resin molded body 10 when measuring the adhesive force between the resin molded body 10 and the object to be adhered 12, and to more accurately measure the adhesive force of the resin molded body 10. can do.

FIGS. 8 to 11 are views showing a second embodiment of the apparatus for measuring the adhesion of a resin molded product according to the present invention.

This embodiment is applied to an adhesion measuring device similar to that of the first embodiment, and in the description of this embodiment, the same as that of the first embodiment will be described. The same reference numerals are given to the same components, and detailed description thereof will be omitted.

FIG. 8 shows an adhesion measuring device 20 to which the second embodiment of the resin molding adhesion measuring device of the present invention is applied.
FIG. 2 is a schematic front sectional view of a portion of a connection jig 9 on which a member to be adhered 12 and a resin molded body 21 are formed.

In FIG. 8, in the adhesion measuring device 20, the member to be adhered 12 is fixedly mounted on the fixed die plate 2 and formed on the plate member 9 b of the connecting jig 9 on the member to be adhered 12. After the resin molded body 21 is pressed, it is peeled off.

The resin molded body 21 is integrally formed with a holding member 22 for covering the outer peripheral side surface of the resin molded body 21. The holding member 22 covers the entire outer peripheral side surface of the resin molded body 21 as shown in FIG. Have been made. As shown in FIG. 9, four fixing jigs (fixing members) 23 are provided around the member to be adhered 12. When pressed, the holding member 22
Is provided with an arm portion 23a for fixing. Arm part 23
a is a fixed position extending in the direction of the holding member 22 as shown in FIGS. 8 and 9, and as shown in FIGS. 10 and 11,
An open position where the fixing of the holding member 22 is released apart from the holding member 22 is rotatably disposed.

When measuring the adhesion, the adhesion measuring device 20 of the present embodiment integrally forms the resin molded body 21 and the holding member 22 with the connection jig 9, and forms the connection jig 9.
The arm 9a is inserted into the insertion hole 6a of the compression rod 6 and the insertion hole 8a of the tension rod 8, and the stopper 11 is attached to the tip of the arm 9a.
And the connecting jig 9 are attached to the adhesion measuring device 20, and the adhered member 12 is set on the fixed die plate 2. Then, the adhesion measuring device 20 is connected to the arm 2 of the fixing jig 23.
3a is located in the open position.

In this state, the movable die plate 4 is moved downward by the die plate drive mechanism in FIG. 8, that is, in a direction in which the movable die plate 4 approaches the fixed die plate 2, and is fixed to the movable die plate 4. Compression force detector 5, compression rod 6 fixed to compression force detector 5, tension detector 7 fixed to compression rod 6, and tension rod 8 fixed to tension detector 7 Are moved down together. In this way, the movable die plate 4 is moved downward, and the resin molded body 21 and the member to be adhered 12 are brought into close contact with each other.

When the resin molded body 21 is brought into close contact with the member 12 to be adhered, as shown in FIGS.
Is rotated to the fixed position, and the holding member 22 that covers the outer peripheral side surface of the resin molded body 21 is fixed by the arm portion 23a.

In this state, the adhesive force measuring device 20 moves the movable die plate 4 further downward by the die plate driving mechanism as shown by the downward arrow in FIG. The flat plate portion 9b of the jig 9 is pressed downward, and the resin molded body 21 is pressed against the member to be adhered 12 to apply a predetermined pressing force to the resin molded body 21. The compression pressure at this time is detected by the compression force detector 5.

At this time, the outer peripheral side surface of the resin molded body 21 is held by the holding member 22 fixed by the arm 23 a of the fixing jig 23.
Thus, the resin molded body 21 can be prevented from being deformed, and can be measured with high reproducibility and high precision, that is, the adhesion force.

As described above, the resin molding 2 is held by the holding member 22 fixed by the arm 23a of the fixing jig 23.
The movable die plate 4 is lowered while holding the outer peripheral side surface of the resin molding 1, and the resin molding 21 is pressed against the member to be adhered 12 by the compression rod 6.
When the pressure is detected, for example, the temperature of the atmosphere in the thermostat is raised to a predetermined temperature to generate a pressure in the resin molded body 21, the pressure at this time is detected by the compression force detection unit 5, and Cool to the temperature of

As described above, when the ambient temperature in the thermostat is controlled to heat and cool the resin molded body 21 and the member to be adhered 12, a temperature distribution between the resin molded body 21 and the member to be adhered 12 occurs. Can be prevented, and the measurement accuracy of the adhesion can be improved.

Next, the adhesion measuring device 20
3 by rotating the arm 23a from the fixed position to the release position to release the fixing of the holding member 22 by the arm 23a, and thereafter, the movable die plate 4 is moved upward by the die plate driving mechanism to be compressed. The compression rod 6, the tensile force detector 7, and the tension rod 8 are moved upward together with the force detector 5, and the lower plate of the compression rod 6 is separated from the flat plate 9b of the connection jig 9.

At this time, the resin molded body 21 released from the holding by the fixing jig 23 does not receive resistance from the fixing jig 23.

When the movable die plate 4 is further moved upward, the lower plate of the tension rod 8 comes into contact with the stopper 11 fixed to the upper end of the connection jig 9, and a resin molded body integrally formed with the connection jig 9. 21 is to be lifted upward.

When the movable die plate 4 is further moved upward in this state, the separation between the resin molded body 21 and the member to be adhered 12 is started, and the adhesive force generated at that time is detected by the tensile force detector 7. . Thereafter, when the resin molded body 21 and the member to be adhered 12 are completely peeled off, the measurement of the adhesive force is terminated.

In the measurement of the adhesion, as described above, the resin molded body 21 released from being fixed by the fixing jig 23 does not receive the resistance from the arm 23a of the fixing jig 23, as shown in FIG. When the connection jig 9 is moved upward, as shown by an upward arrow, the connection jig 9 is moved upward together with the connection jig 9 and peeled off from the member 12 to be adhered, and the resin molding 21 is adhered with high precision. Force can be measured. In addition, since the contact surface between the holding member 22 and the member to be adhered 12 has no adhesion, only the adhesion between the resin molded body 21 and the resin molded body 21 at the time of peeling of the member to be adhered 12 is accurately measured. can do.

As described above, according to the adhesion measuring device 20 of the present embodiment, the holding member 22 and the resin molded body 21 are formed integrally with the resin molded body 21 in a state of holding the outer peripheral side surface over the entire area. When pressing the resin molded body 21 and the member to be brought into close contact with each other, the holding member 22 is attached to the arm 2 of the fixing jig 23.
3a, the resin molded body 21 and the adhered member 12
When peeling off, the holding of the holding member 22 is released, and the holding member 22 and the resin molded body 21 can be integrally moved. Therefore, when pressing the resin molded body 21 and the member to be adhered 12, the deformation of the resin molded body 21 can be appropriately prevented, and when the resin molded body 21 is peeled from the member to be adhered 12, Holding member 22 and resin molded body 2
1 can be moved integrally to prevent the holding member 22 from hindering the separation between the resin molded body 21 and the member to be adhered 12, and the adhesion of the resin molded body 21 can be measured with higher accuracy. can do.

The adhesion measuring device 20 according to the present embodiment
According to the connection jig 9, the holding member 22, and the resin molding 2
1 is integrally molded, so that it is not necessary to fix these members by bonding or the like.
Can be easily measured.

When the connection jig 9, the holding member 22, and the resin molded body 21 are integrally formed, the flat plate portion 9b of the connection jig 9 and the holding member 22 are formed in the same manner as in the first embodiment.
An undercut such as a screw hole may be provided on one or both of the lower end surfaces, and the resin molded body 21 may be formed to enter the undercut. By doing so, the resin molded body 21, the connection jig 9, and the holding member 2
2 can be firmly and integrally fixed, and the adhesion of the resin molded body 21 can be measured more accurately.

FIGS. 12 to 14 are views showing a third embodiment of the apparatus for measuring the adhesion of a resin molded product according to the present invention.

The present embodiment is applied to the same adhesion measuring device as in the first embodiment, and in the description of the present embodiment, the same as in the first embodiment is applied. The same reference numerals are given to the same components, and detailed description thereof will be omitted.

FIG. 12 shows an adhesion measuring device 3 to which the third embodiment of the resin molding adhesion measuring device of the present invention is applied.
FIG. 2 is a schematic front sectional view of a portion of a connection jig 9 in which a member to be adhered 12 and a resin molded body 31 are formed.

In FIG. 12, the adhesion measuring device 30 comprises:
The adhered member 12 is fixedly mounted on the fixed die plate 2, and the resin molded body 31 formed on the flat plate portion 9 b of the connection jig 9 is pressed against the adhered member 12 and then peeled off.

The resin molded body 31 is integrally formed with a holding member 32 which covers the outer peripheral side surface at the lower end side over the whole area. As shown in FIG. While covering the entire circumference of the side,
It is manufactured with a resin molded body (resin layer) 31 interposed between the holding member 32 and the flat plate portion 9b of the connection jig 9.

When measuring the adhesion, the adhesion measuring device 30 of the present embodiment integrally forms the resin molded body 31 and the holding member 32 with the connection jig 9, and
The arm 9a is inserted into the insertion hole 6a of the compression rod 6 and the insertion hole 8a of the tension rod 8, and the stopper 11 is attached to the tip of the arm 9a.
And the connection jig 9 are attached to the adhesion measuring device 30, and the adhered member 12 is set on the fixed die plate 2.

In this state, the movable die plate 4 is moved downward by the die plate driving mechanism in FIG. 12, that is, in a direction in which the movable die plate 4 approaches the fixed die plate 2, and is fixed to the movable die plate 4. Compression force detector 5, compression rod 6 fixed to compression force detector 5, tension detector 7 fixed to compression rod 6, and tension rod 8 fixed to tension detector 7 Are moved down together. In this way, the movable die plate 4 is moved downward, and the resin molded body 31 and the member to be adhered 12 are brought into close contact with each other.

In this state, the adhesion measuring device 30 moves the movable die plate 4 by the die plate driving mechanism as shown in FIG.
As shown by a downward arrow, the flat plate portion 9b of the connection jig 9 is pushed downward by the lower plate of the compression rod 6 by the lower plate of the compression rod 6, and the resin molding interposed between the flat plate portion 9b and the holding member 32 is formed. The body 31 is also pressed downward, and the lower end surface of the resin molded body 31 whose entire outer peripheral side surface is covered with the holding member 32 is pressed against the upper surface of the member to be adhered 12, and a predetermined pressing force is applied to the resin molded body 31. Is given. The compression pressure at this time is detected by the compression force detector 5.

At this time, since the entire area of the outer peripheral side surface of the resin molded body 31 is covered and held by the holding member 32 without any gap, the deformation of the resin molded body 31 can be prevented, and the holding member 32 can be prevented. Since the resin molded body 31 is interposed between the resin member 31 and the flat plate portion 9b, the holding member 32 floats when pressed and prevents the resin molded body 31 from invading between the holding member 32 and the member to be adhered 12. With a simple configuration, it is possible to measure the compression force with high reproducibility and high accuracy, that is, the adhesion force.

As described above, the movable die plate 4 is lowered while the entire lower end outer peripheral side surface of the resin molded body 31 is held by the holding member 32, and the resin molded body 31 is held by the compression rod 6. When the compression pressure detector 5 detects the compression pressure at this time, for example, the temperature of the atmosphere in the constant temperature bath is raised to a predetermined temperature, and the pressure is generated in the resin molded body 31. The pressure is detected by the compressive force detecting unit 5 and is cooled again to a predetermined temperature.

As described above, when the temperature of the atmosphere in the thermostatic oven is controlled to heat and cool the resin molded body 31 and the member to be adhered 12, a temperature distribution between the resin molded body 31 and the member to be adhered 12 occurs. Can be prevented, and the measurement accuracy of the adhesion can be improved.

Next, the adhesive force measuring device 30 moves the movable die plate 4 upward by the die plate driving mechanism, and connects the compression rod 6, the tensile force detector 7, and the tensile rod 8 together with the compression force detector 5. By moving upward, the lower plate of the compression rod 6 is separated from the flat plate portion 9 b of the connection jig 9. When the movable die plate 4 is further moved upward, the lower plate of the tension rod 8 contacts the stopper 11 fixed to the upper end of the connection jig 9 and holds the resin molded body 31 integrally formed with the connection jig 9. An attempt is made to pull it upward together with the member 32.

When the movable die plate 4 is further moved upward in this state, as shown by an arrow in FIG. 14, peeling of the resin molded body 31 and the member to be adhered 12 starts, and the adhesion force generated at that time. Is detected by the tensile force detector 7.
Thereafter, when the resin molded body 31 and the member to be adhered 12 are completely peeled off, the measurement of the adhesive force is terminated.

In the measurement of the contact force, as described above, since the contact force does not act between the holding member 32 and the member to be contacted 12, the connecting jig 9 is moved as shown by the arrow in FIG. By moving the resin molded body 31 upward, only the adhesive force between the resin molded body 31 and the member to be adhered 12 acts, and the adhesive force of the resin molded body 31 can be accurately measured with high accuracy.

As described above, according to the adhesion measuring device 30 of the present embodiment, the resin molded body 31 is held between the flat plate portion 9b of the connection jig 9 to which the resin molded body 31 is attached and the holding member 32. What is provided as a resin layer is used. Therefore, with a simple configuration, it is possible to prevent the holding member 32 from hindering the separation between the resin molded body 31 and the member to be adhered 12, and the adhesion of the resin molded body 31 can be further improved with higher accuracy. Can be measured.

Further, the adhesion measuring device 30 of the present embodiment
According to the connection jig 9, the holding member 32, and the resin molded body 3,
1 is integrally molded, it is possible to eliminate the trouble of fixing these members by bonding or the like.
Can be easily measured.

When the connecting jig 9, the holding member 32, and the resin molded body 31 are integrally formed, the flat plate portion 9b of the connecting jig 9 and the holding member 32 are formed in the same manner as in the first embodiment.
An undercut such as a screw hole may be provided on one or both of the lower end surfaces, and the resin molded body 31 may be formed to enter the undercut. By doing so, the resin molded body 31, the connecting jig 9 and the holding member 3
2 can be firmly and integrally fixed, and the adhesion of the resin molded body 31 can be measured more accurately.

The invention made by the present inventor has been specifically described based on the preferred embodiments. However, the present invention is not limited to the above, and various modifications can be made without departing from the gist of the invention. It goes without saying that it is possible.

[0102]

According to the apparatus for measuring the adhesion of a resin molded product according to the first aspect of the present invention, a predetermined connection is made to one side of a pair of press members which are moved in a direction approaching and separating from each other. The resin molded body is attached via the member, the member to be in contact with the resin molded body is exchangeably attached to the other press member in a state facing the resin molded body, and the pressing member is moved in the approaching direction by the pressing means to form the resin molded body. The contact member is pressed with a predetermined pressure, and the pressing force is detected by the compression force detecting means. At least, when pressing the resin molded body and the contact member, the outer peripheral side surface of the resin molded body is held over the entire area. To prevent deformation of the resin molded body, and thereafter, the pressing member is moved in a direction to separate the press member, and the resin molded body and the member to be in close contact are peeled off. Since the adhesion force between the contact member and the contact member is measured by the tensile force detecting means, no insertion hole of the ejector pin is formed on the contact surface of the contact member, and the resin is pressed when the resin molded body and the contact member are pressed. Prevents deformation of the molded body and enables accurate and easy measurement of the adhesion of the resin molded body. Factors of the adhesion (surface roughness of the contact surface, surface treatment, temperature, pressure) Can be accurately grasped.

According to the apparatus for measuring adhesion of a resin molded product according to the second aspect of the present invention, the holding means detachably holds the resin molded product, and holds the resin molded product when the resin molded product and the member to be adhered are pressed. When the resin molded body is held by the means and the resin molded body and the member to be adhered are separated from each other, the holding of the resin molded body by the holding means is released. The force acting between the body and the holding means,
It is possible to prevent the separation of the resin molded body and the member to be adhered from being hindered, and it is possible to measure the adhesion of the resin molded body with higher accuracy.

According to the apparatus for measuring the adhesion of a resin molded product according to the third aspect of the present invention, the holding means is provided with a predetermined metal film on the contact surface with the resin molded product. A metal film is used to prevent the resin molded body and the holding unit from sticking to each other when the resin molded body is separated from the member to be adhered, and to prevent the holding unit from hindering the separation between the resin molded body and the member to be adhered. Thus, the adhesion of the resin molded body can be measured with higher accuracy.

According to the apparatus for measuring the adhesion of a resin molded product according to the fourth aspect of the present invention, the holding means is formed integrally with the resin molded product in a state of holding the outer peripheral side surface of the resin molded product over the entire area. The holding member holds the holding member when the resin molded body and the member to be adhered are pressed, and releases the holding member when the resin molded body and the member to be adhered are peeled off to release the holding member and the resin. And a fixing member that enables the molded body to move as a single body, so that when pressing the resin molded body and the member to be in close contact with each other, it is possible to appropriately prevent deformation of the resin molded body. When the resin molded body is separated from the adhered member, the holding member and the resin molded body are integrally moved to prevent the holding member from hindering the detachment between the resin molded body and the adhered member. To improve the adhesion of the resin molding Ri can be measured more accurately.

According to the apparatus for measuring the adhesion of a resin molded product of the present invention, a predetermined resin layer is provided as a holding means between the connecting member to which the resin molded product is attached and the holding member. Since it is used, it is possible to prevent the holding member from hindering the separation between the resin molded body and the member to be adhered with a simple configuration, and to further improve the adhesive force of the resin molded body with higher accuracy. Can be measured.

According to the apparatus for measuring the adhesion of a resin molded product according to the present invention, since the connecting member, the resin molded product and the holding member are produced by integral molding, the resin molded product can be made simple and easy. In addition to being easily manufactured, the adhesion of the resin molded body can be measured with higher accuracy.

According to the apparatus for measuring adhesion of a resin molded product of the present invention, a predetermined cut portion is formed on a contact surface of a connecting member and / or a holding member with the resin molded product, and the resin molded product is formed. Since the connection member and / or the holding member are attached to the connection member and / or the holding member in a state where a part thereof enters the cut portion, the connection between the connection member and / or the holding member and the resin molding is strengthened, At the time of peeling from the adhered member,
It is possible to prevent occurrence of peeling between the connection member and / or the holding member and the resin molded body, and it is possible to measure the adhesion of the resin molded body with higher accuracy.

[Brief description of the drawings]

FIG. 1 is a schematic front sectional view of an adhesion measuring device to which a first embodiment of an adhesion measuring device for a resin molded article of the present invention is applied.

FIG. 2 is an enlarged front sectional view of a connection jig portion of FIG. 1;

3 is an enlarged cross-sectional plan view of a holding member in a state where the resin molded body is held by a holding member of a clamp mechanism of the adhesion measuring device of FIG. 1;

FIG. 4 is an enlarged front sectional view of a holding member portion of the adhesion measuring device of FIG. 3;

5 is an enlarged plan sectional view of a holding member in a state where the holding of the resin molded body by the holding member of the clamp mechanism of the adhesion measuring device of FIG. 1 is released.

FIG. 6 is an enlarged front sectional view of a holding member portion of the adhesion measuring device of FIG. 5;

FIG. 7 is an enlarged front sectional view of a connection portion between a connection jig and a resin molded body of the adhesion measuring device of FIG. 1;

FIG. 8 is an enlarged view of a connection jig in a state in which the resin molded body of the adhesion measuring device to which the second embodiment of the resin molded body of the present invention is applied is pressed against the member to be adhered. FIG.

FIG. 9 is an enlarged plan sectional view of a connection jig portion of the adhesion measuring device of FIG. 8;

FIG. 10 is an enlarged front sectional view of a connection jig portion of the adhesion measuring device of FIG. 8 in a state where a resin molded body is separated from a member to be adhered.

11 is an enlarged plan sectional view of a connecting jig portion of the adhesion measuring device of FIG. 10;

FIG. 12 shows a third example of the apparatus for measuring the adhesion of a resin molded product according to the present invention.
The enlarged front sectional view of the connection jig part in the state where the resin molded object of the adhesion measuring device to which the embodiment of the present invention is applied is pressed against the member to be adhered.

FIG. 13 is an enlarged plan sectional view of a connection jig portion of the adhesion measuring device of FIG. 12;

FIG. 14 is an enlarged front sectional view of a connection jig portion of the adhesion measuring device of FIG. 12 in a state where a resin molded body is separated from a member to be adhered.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Adhesion force measuring device 2 Fixed die plate 3 Guide pole 4 Movable die plate 5 Compressive force detector 6 Compressor rod 7 Tensile force detector 8 Tension rod 8a Insertion hole 9 Connection jig 9a Arm 9b Flat plate 10 Resin molding 11 Stopper 12 Closed member 13 Clamping mechanism 14 Holding member 15 Support member 16 Screw hole 20 Adhesion force measuring device 21 Resin molded body 22 Holding member 23 Fixing jig 23a Arm 30 Adhesion force measuring device 31 Resin molded body 32 Holding member

Claims (7)

[Claims] 1. Press means for moving a pair of press members in a direction approaching and separating from each other, a resin molded body attached to one side of the press members via a predetermined connecting member, and A member to be adhered which is exchangeably attached to the other side of the member in a state facing the resin molded body, and wherein the pressing means is moved in a direction in which the press member approaches to the resin molded body and the member to be adhered. A compressive force detecting means for measuring the pressing force when pressed, and the pressing means when the pressing member is moved in a direction in which the pressing member is separated to separate the resin molded body and the adhered member. A tensile force detecting means for measuring an adhesion force between the resin molded body and the member to be adhered, and at least an outer peripheral side surface of the resin molded body when the resin molded body and the member to be adhered are pressed. Holding means for preventing deformation of the resin molded body by holding the resin molded body, wherein the press member is moved in a direction approaching by the press means, and the resin molded body is held by the holding means. And the pressed member are pressed at a predetermined pressure, and the pressing force is detected by the compression force detecting means, and then the pressing means is moved in a direction to separate the pressing member, and the resin molded body and the An adhesive force measuring device for a resin molded body, wherein the adhesive member is peeled off and the adhesive force between the resin molded body and the adhered member at the time of peeling is measured by the tensile force detecting means. 2. The resin molding apparatus according to claim 1, wherein said holding means detachably holds said resin molded body, and said adhesion measuring device for said resin molded body moves said press member in a direction approaching by said pressing means to form said resin molded body. When pressing the body and the member to be in contact with each other, the holding means holds the resin molded body, and the pressing means moves the press member in a direction to separate the member, and the resin molded body and the member to be contacted are 2. The apparatus for measuring adhesion of a resin molded product according to claim 1, wherein when the resin is released, the holding of the resin molded product by the holding means is released. 3. The apparatus according to claim 1, wherein said holding means includes a predetermined metal film on a contact surface with said resin molded body. 4. A holding member integrally formed with the resin molded body in a state of holding the outer peripheral side surface of the resin molded body over the entire area, and a pressing member pressing the resin molded body and the adhered member. When the holding is performed, the holding member is held, and when the resin molded body and the member to be adhered are separated, the holding of the holding member is released, and the holding member and the resin molded body are integrally moved. 2. The apparatus for measuring adhesion of a resin molded product according to claim 1, further comprising a fixing member capable of being used. 5. The resin molding device according to claim 4, wherein said holding means has a predetermined resin layer provided between said connecting member to which said resin molded body is attached and said holding member. Body adhesion measuring device. 6. An apparatus according to claim 4, wherein said connecting member, said resin molded body and said holding member are formed by integral molding. 7. A state in which a predetermined cut portion is formed on a contact surface of the connection member and / or the holding member with the resin molded body, and the resin molded body partially enters the cut portion. 7. The apparatus for measuring adhesion of a resin molded body according to claim 1, wherein the apparatus is attached to the connection member and / or the holding member.