JPH11227185A - Ink jet recording head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ink jet recording head having a mounting part where connection can be made well with external wiring. SOLUTION: The ink jet recording head comprises a diaphragm defining at least a part of a pressure generating room 12 communicating with a nozzle opening in which at least the upper surface serves as a lower electrode 60, a piezoelectric oscillator including a piezoelectric layer 70 formed on the surface of the diaphragm, an upper electrode 80 formed thereon and a piezoelectric active section 320 formed in a region facing the room 12, and a channel forming substrate 10 having mounting parts 331, 332, i.e., joints of internal wiring for supplying power to the active section 320 with external wiring. The mounting parts 331, 332 are formed thicker than the periphery parts. According to the structure, resistance against heat, pressure, and the like, can be enhanced at the time of mounting and good wiring is realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure generating chamber which is in communication with a nozzle opening for discharging ink droplets, and which is constituted by a vibrating plate. The present invention relates to an ink jet recording head that ejects ink droplets by displacement of a layer.

[0002]

2. Description of the Related Art A part of a pressure generating chamber which communicates with a nozzle opening for discharging ink droplets is constituted by a vibrating plate. There are two types of ink-jet recording heads that eject ink droplets from a piezoelectric vibrator, one that uses a longitudinal vibration mode piezoelectric vibrator that expands and contracts in the axial direction of the piezoelectric vibrator, and the other that uses a flexural vibration mode piezoelectric vibrator. Has been put to practical use.

In the former method, the volume of the pressure generating chamber can be changed by bringing the end face of the piezoelectric vibrator into contact with the vibrating plate, so that a head suitable for high-density printing can be manufactured. A complicated process of cutting the piezoelectric vibrators into a comb-tooth shape in accordance with the arrangement pitch of the nozzle openings, and a work of positioning and fixing the separated piezoelectric vibrators in the pressure generating chambers, which complicates the manufacturing process. There is.

On the other hand, in the latter, a piezoelectric vibrator can be formed on a diaphragm by a relatively simple process of sticking a green sheet of a piezoelectric material according to the shape of a pressure generating chamber and firing the green sheet. However, due to the use of flexural vibration, a certain area is required, and there is a problem that high-density arrangement is difficult.

On the other hand, in order to solve the latter disadvantage of the recording head, a uniform piezoelectric material layer is formed by a film forming technique over the entire surface of the diaphragm as disclosed in Japanese Patent Application Laid-Open No. 5-286131. A proposal has been made in which this piezoelectric material layer is cut into a shape corresponding to the pressure generating chambers by lithography, and a piezoelectric vibrator is formed so as to be independent for each pressure generating chamber.

[0006] According to this, the work of attaching the piezoelectric vibrator to the diaphragm is not required, and the precision of the lithography method is used.
In addition to the fact that the piezoelectric vibrator can be manufactured by a simple and simple method, there is an advantage that the thickness of the piezoelectric vibrator can be reduced and high-speed driving is possible. In this case, the piezoelectric vibrator corresponding to each pressure generating chamber can be driven by providing at least only the upper electrode for each pressure generating chamber while the piezoelectric material layer is provided on the entire surface of the vibration plate.

[0007]

In any case, the above-described ink jet recording head requires a semiconductor integrated circuit (IC) for driving the piezoelectric vibrator, and is mounted near the ink jet recording head. I have. That is, in the related art, a method of arranging an IC near a piezoelectric vibrator and wiring by connection, wire bonding, soldering, or the like via an anisotropic conductive film (ACF) has been adopted.

[0008] However, in the mounting portion to which the wiring to the outside is provided, since stress such as heating and pressurization is applied, adhesion is required, but the adhesion between the silicon dioxide film and the wiring is low. Not good. When pressure is applied, the thickness of the wiring of the mounting portion is preferably thicker, but there is a problem that the wiring needs to be made as thin as possible so as not to hinder the displacement of the piezoelectric vibrator.

In view of such circumstances, it is an object of the present invention to provide an ink jet recording head having a mounting portion that can be connected well to external wiring.

[0010]

According to a first aspect of the present invention, there is provided a vibration plate which forms a part of a pressure generating chamber communicating with a nozzle opening and at least an upper surface of which functions as a lower electrode. A piezoelectric vibrator comprising: a piezoelectric layer formed on the surface of the vibration plate; and an upper electrode formed on the surface of the piezoelectric layer, and a piezoelectric active portion formed in a region facing the pressure generating chamber. An ink jet recording head comprising a flow path forming substrate having a mounting portion that is a connection portion between an internal wiring and an external wiring for supplying electricity to the piezoelectric active portion, wherein the thickness of the mounting portion is An ink jet recording head is characterized by being thicker than the surrounding film.

According to the first aspect, the durability against heat, pressure, and the like during mounting can be improved, and good wiring can always be realized.

According to a second aspect of the present invention, in the first aspect, a lead electrode is connected to the upper electrode of the piezoelectric active portion via a contact portion, and the lead electrode extends to the mounting portion. Provided in the ink jet recording head.

In the second aspect, electricity is supplied from the mounting section to the piezoelectric active section via the lead electrode.

According to a third aspect of the present invention, in the first or second aspect, an insulator layer is formed on an upper surface of the upper electrode,
The contact portion is formed in a contact hole formed in the insulator layer.

In the third aspect, the contact portion is formed in the contact hole.

According to a fourth aspect of the present invention, in the second or third aspect, the piezoelectric active portion is formed in a region facing the pressure generating chamber, and the contact portion faces the pressure generating chamber. An ink jet recording head is provided in an area.

According to the fourth aspect, since the piezoelectric active portion does not cross the boundary between the pressure generating chamber and the peripheral wall, the durability is improved.

According to a fifth aspect of the present invention, in any one of the second to fourth aspects, the vibration plate comprises an elastic film and a lower electrode film, and the periphery of the mounting portion comprises only the elastic film; The mounting portion has a structure in which the internal wiring is formed on the elastic film and the lower electrode film.

In the fifth aspect, the adhesion of the mounting portion to the flow path forming substrate is improved.

According to a sixth aspect of the present invention, in any one of the first to fourth aspects, the diaphragm comprises an elastic film and a lower electrode film, and the periphery of the mounting portion comprises only the elastic film; The mounting portion has a structure in which the internal wiring is formed on the piezoelectric layer formed on the vibration plate and the upper electrode film.

In the sixth aspect, the adhesion of the mounting portion to the flow path forming substrate is improved.

According to a seventh aspect of the present invention, in the fifth or sixth aspect, the mounting portion has a layer other than the lower electrode, the piezoelectric layer, and the upper electrode formed below the internal wiring. The ink jet recording head is characterized in that:

In the seventh aspect, for example, a mounting portion can be formed by providing an insulator layer as a lower layer.

According to an eighth aspect of the present invention, in any one of the first to seventh aspects, only the portion of the internal wiring connected to the mounting portion is a thick film. Ink-jet recording head.

According to the eighth aspect, the ninth aspect of the present invention, in which the durability of the mounting portion can be improved without changing the overall film thickness of the internal wiring, is any one of the first to eighth aspects. In the aspect, the mounting portion has a plurality of upper electrode contact portions connected to the upper electrodes of the plurality of piezoelectric body active portions, and the total thickness of these upper electrode contact portions is the same. Ink-jet recording head.

In the ninth aspect, mounting can be performed satisfactorily and reliably.

According to a tenth aspect of the present invention, in the ninth aspect, the mounting portion includes a lower electrode contact portion connected to a lower electrode provided in common to all of the plurality of piezoelectric active portions. The thickness of the lower electrode contact portion is the same as the thickness of the lower electrode contact portion.

In the tenth aspect, mounting can be performed satisfactorily and reliably.

According to an eleventh aspect of the present invention, in any one of the first to tenth aspects, the flow path forming substrate is formed of ceramics, and each layer of the piezoelectric vibrator is formed by pasting or printing a green sheet. Ink-jet recording head.

In the eleventh aspect, the head can be easily manufactured.

According to a twelfth aspect of the present invention, in any one of the first to tenth aspects, the pressure generating chamber is formed on a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric vibrator is formed of a thin film and a thin film. An ink jet recording head is formed by a lithography method.

In the twelfth aspect, an ink jet recording head having high-density nozzle openings can be manufactured in a large amount and relatively easily.

According to a thirteenth aspect of the present invention, in any one of the first to twelfth aspects, a reservoir communicating with the pressure generating chamber is defined on the flow path forming substrate, and the nozzle having the nozzle opening is provided. An ink jet recording head is characterized in that the plates are joined.

According to the thirteenth aspect, an ink jet recording head that discharges ink from the nozzle openings can be easily realized.

According to a fourteenth aspect of the present invention, in any one of the first to thirteenth aspects, the flow path forming substrate includes a common ink chamber for supplying ink to the pressure generating chamber, A flow path unit for forming a flow path communicating with the nozzle opening is joined to the ink jet recording head.

In the fourteenth aspect, ink is ejected from the nozzle openings via the flow path unit.

[0037]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail based on embodiments.

FIG. 1 is an assembly perspective view showing an ink jet recording head according to one embodiment of the present invention.
FIG. 3 is a plan view and a diagram showing a cross-sectional structure in a longitudinal direction of one of the pressure generating chambers.

As shown in the figure, the flow path forming substrate 10 is formed of a silicon single crystal substrate having a plane orientation (110) in this embodiment. As the flow path forming substrate 10, usually 150 to 3
A thickness of about 00 μm is used.
Those having a thickness of about 0 to 280 μm, more preferably about 220 μm are suitable. This is because the arrangement density can be increased while maintaining the rigidity of the partition wall between the adjacent pressure generating chambers.

One surface of the flow path forming substrate 10 is an opening surface, and the other surface is formed with a 0.1 to 2 μm-thick elastic film 50 made of silicon dioxide previously formed by thermal oxidation.

On the other hand, the opening surface of the flow path forming substrate 10 is anisotropically etched on a silicon single crystal substrate,
A nozzle opening 11 and a pressure generating chamber 12 are formed.

Here, in the anisotropic etching, when a silicon single crystal substrate is immersed in an alkaline solution such as KOH, the substrate is gradually eroded, and the first (111) plane perpendicular to the (110) plane and the first (111) plane The second (11) which forms an angle of about 70 degrees with the (111) plane and forms an angle of about 35 degrees with the above (110).
1) plane appears, and the etching rate of the (111) plane is about 1/18 as compared with the etching rate of the (110) plane.
This is performed using the property of being 0. By such anisotropic etching, two first (111)
Precision processing can be performed based on the depth processing of a parallelogram formed by two surfaces and two oblique second (111) surfaces, and the pressure generating chambers 12 can be arranged at high density.

In this embodiment, the long side of each pressure generating chamber 12 is formed by the first (111) plane, and the short side is formed by the second (111) plane. The pressure generating chamber 12 is provided on the flow path forming substrate 1.
It is formed by etching until it reaches the elastic film 50 almost through 0. The amount of the elastic film 50 that is attacked by the alkaline solution for etching the silicon single crystal substrate is extremely small.

On the other hand, each nozzle opening 11 communicating with one end of each pressure generating chamber 12 is formed narrower and shallower than the pressure generating chamber 12. That is, the nozzle opening 11 is formed by partially etching (half-etching) the silicon single crystal substrate in the thickness direction. In addition,
Half etching is performed by adjusting the etching time.

Here, the size of the pressure generating chamber 12 for applying the ink droplet ejection pressure to the ink and the size of the nozzle opening 11 for ejecting the ink droplet depend on the amount of the ejected ink droplet, the ejection speed, and the ejection frequency. Optimized. For example,
When recording 360 ink droplets per inch, the nozzle openings 11 need to be formed with a groove width of several tens of μm with high accuracy.

Further, each pressure generating chamber 12 and a common ink chamber 31 described later are connected to each pressure generating chamber 1 of the sealing plate 20 described later.
The ink is supplied from a common ink chamber 31 through the ink supply communication port 21 formed at a position corresponding to one end of the pressure generation chamber 12. Distributed to

The sealing plate 20 is provided with an ink supply communication port 21 corresponding to each of the pressure generating chambers 12 and has a thickness of, for example, 0.1 to 1 mm and a linear expansion coefficient of 300 ° C. or less. , For example, 2.5-4.5 [× 10 ⁻⁶ / ° C.]. In addition, the ink supply communication port 21
Each of the pressure generating chambers 1 is, as shown in FIGS.
It may be one slit hole 21A crossing the vicinity of the second ink supply side end or a plurality of slit holes 21B. The sealing plate 20 is provided on one side with the flow path forming substrate 10.
, And also serves as a reinforcing plate for protecting the silicon single crystal substrate from impacts and external forces. Also, sealing plate 2
0 forms one wall surface of the common ink chamber 31 on the other surface.

The common ink chamber forming substrate 30 forms the peripheral wall of the common ink chamber 31, and is formed by punching a stainless steel plate having an appropriate thickness according to the number of nozzles and the ink droplet ejection frequency. . In the present embodiment, the thickness of the common ink chamber forming substrate 30 is 0.2 mm.

The ink chamber side plate 40 is made of a stainless steel substrate, and one surface thereof constitutes one wall surface of the common ink chamber 31. In the ink chamber side plate 40, a thin wall 41 is formed by forming a concave portion 40a by half etching on a part of the other surface, and an ink introduction port 42 for receiving ink supply from the outside is punched and formed. ing. The thin wall 41 is for absorbing pressure generated at the time of ink droplet ejection toward the side opposite to the nozzle opening 11, and is unnecessary for the other pressure generating chambers 12 via the common ink chamber 31. Prevents positive or negative pressure from being applied.
In the present embodiment, the ink chamber side plate 40 is made 0.2 mm in consideration of rigidity required at the time of connection between the ink introduction port 42 and an external ink supply means, and a part of the thickness is 0.02 mm.
The thickness of the ink chamber side plate 40 may be 0.02 mm from the beginning in order to omit the formation of the thin wall 41 by half etching.

On the other hand, the thickness of the elastic film 50 on the side opposite to the opening surface of the flow path forming substrate 10 is, for example, about 0.5 μm.
A lower electrode film 60, a piezoelectric film 70 having a thickness of, for example, about 1 μm, and an upper electrode film 80 having a thickness of, for example, about 0.1 μm are formed by lamination in a process to be described later. (Piezoelectric element). Further, on the peripheral wall in the longitudinal direction of the pressure generating chamber 12, the lead electrode 10
A mounting portion for supplying electricity to the piezoelectric active portion via the contact portion 0 is formed.

As described above, each pressure generating chamber 1 of the elastic film 50
2, a piezoelectric vibrator is provided independently for each pressure generating chamber 12. In the present embodiment, the lower electrode film 60 is a common electrode of the piezoelectric vibrator, and the upper electrode film 80 Are used as the individual electrodes of the piezoelectric vibrator, but there is no problem even if this is reversed for convenience of the drive circuit and wiring. In the present embodiment, the piezoelectric films 70 are individually provided corresponding to the respective pressure generating chambers 12. However, the piezoelectric films are provided entirely, and the upper electrode film 80 is provided corresponding to each of the pressure generating chambers 12. They may be provided individually.
In any case, a pressure active portion is formed for each pressure generating chamber 12.

Here, a process for forming the piezoelectric film 70 and the like on the flow path forming substrate 10 made of a silicon single crystal substrate will be described with reference to FIG.

As shown in FIG. 4A, first, a silicon single crystal substrate wafer serving as the flow path forming substrate 10 is
Thermal oxidation is performed in a diffusion furnace at 0 ° C. to form an elastic film 50 made of silicon dioxide.

Next, as shown in FIG. 4B, a lower electrode film 60 is formed by sputtering. Pt or the like is preferable as the material of the lower electrode film 60. This is because a piezoelectric film 70 to be described later, which is formed by sputtering or a sol-gel method, has a thickness of 600 to 100
This is because it is necessary to perform crystallization by firing at a temperature of about 0 ° C. That is, the material of the lower electrode film 70 must be able to maintain conductivity at such a high temperature and in an oxidizing atmosphere. In particular, when PZT is used as the piezoelectric film 70, the conductivity of the material by diffusion of PbO is increased. It is desirable that there is little change in sex, and Pt is preferred for these reasons.

Next, as shown in FIG. 4C, a piezoelectric film 70 is formed. The piezoelectric film 70 can be formed by sputtering, but in this embodiment, a so-called sol in which a metal organic substance is dissolved and dispersed in a solvent is applied, dried and gelled, and further baked at a high temperature. A so-called sol-gel method for obtaining a piezoelectric film 70 made of an oxide is used. As a material for the piezoelectric film 70, a lead zirconate titanate (PZT) -based material is suitable when used in an ink jet recording head.

Next, as shown in FIG. 4D, an upper electrode film 80 is formed. The upper electrode film 80 only needs to be a material having high conductivity, and many metals such as Al, Au, Ni, and Pt, and a conductive oxide can be used. In the present embodiment, P
t is formed by sputtering.

Next, as shown in FIG.
The piezoelectric film 70 and the upper electrode film 80 are patterned.

First, as shown in FIGS. 5A and 5B, the piezoelectric film 70 and the upper electrode film 80 are patterned together to form a piezoelectric active portion 320. Then, FIG.
As shown in (c), only the lower electrode film 60 is patterned to form a mounting base 340 made of the lower electrode film 60.

The thus formed piezoelectric active portion 320
Are patterned in a region facing the pressure generating chamber 12, and the upper electrode film 80 of one end of the piezoelectric active portion 320 is formed.
A contact hole 90 formed in the insulator layer 90;
The lead electrode 100 is connected via a.

FIG. 6 shows a process for forming such an insulator layer.
Shown in

First, as shown in FIG. 6A, an insulator layer 90 is formed so as to cover the periphery of the upper electrode film 80, the side surfaces of the piezoelectric film 70 and the lower electrode film 60. This insulator layer 9
In this embodiment, 0 is a negative photosensitive polyimide.

Next, as shown in FIG. 6B, by patterning the insulator layer 90, each of the pressure generating chambers 12 is formed.
A contact hole 90a is formed in a portion corresponding to the vicinity of the end on the ink supply side. The contact hole 90
a may be provided at a portion of the pressure generating chamber 12 corresponding to the piezoelectric active portion 320, and may be provided at, for example, a central portion or a nozzle-side end portion.

Next, as shown in FIG. 6C, for example,
After a conductor such as Cr-Au is formed on the entire surface, the lead electrode 100 is formed by patterning. The lead electrode 100 transmits a drive signal to the upper electrode film 80.
It is formed so as to have a width as narrow as possible so that it can be reliably supplied.

The above is the film forming process. After forming the film in this manner, the silicon single crystal substrate is anisotropically etched with the above-described alkali solution to form the pressure generating chamber 12 and the like (see FIG. 6C).

In the above-described series of film formation and anisotropic etching, a number of chips are simultaneously formed on one wafer, and after the process is completed, a flow path forming substrate having one chip size as shown in FIG. Divide every ten. Further, the divided flow path forming substrate 10 is sequentially adhered and integrated with the sealing plate 20, the common ink chamber forming substrate 30, and the ink chamber side plate 40 to form an ink jet recording head.

FIG. 7 shows a plan view and a cross section of a main part of the ink jet type recording head thus formed.

As shown in FIGS. 7A and 7B, the lead electrodes 100 connected to the respective piezoelectric active portions 320 are patterned up to the end of the flow path forming substrate 10, and the end is formed. And an upper electrode contact portion 331 as a mounting portion. The upper electrode contact portion 331 is arranged in a row at the end of the flow path forming substrate 10 and includes a mounting base portion 340 formed of a lower electrode film formed on the elastic film 50 and the lead electrode 100 patterned thereon. . Here, the mounting base 340
Are patterned together in the step of FIG. 5C.

Further, the lower electrode contact portion 3 is provided at the end of the mounting portion.
32 are provided. The lower electrode contact portion 332 is mounted on the mounting base 340 similarly formed of the lower electrode film.
It is formed by patterning the lead electrode 105 connected to “0”. Here, the other end of the lead electrode 105 is connected to the lower electrode film 60 patterned up to the peripheral portion of the pressure generating chamber 12 via a contact hole 90 b formed in the insulator layer 90.

The upper electrode contact portion 331 formed as described above
And an anisotropic conductive film (AC
F) or connection with an external device using solder or the like.

In the present embodiment, the mounting base 3
Since only the elastic film 50 is provided around the mounting portion 40, the thickness of only the mounting portion becomes larger than that of the surrounding portion, and the pressure and the like during mounting can be easily made. Further, since the lead electrodes 100 and 105 of the mounting portion are provided not through the elastic film 50 directly but through the mounting base portion 340 made of the lower electrode film, the adhesion between the mounting portion and the flow path forming substrate 10 is improved. improves. Further, in the case of solder mounting, since a conductive material is used for the mounting base portion 340, heat conduction to the piezoelectric active portion 320 can be delayed.

The ink jet head constructed as described above takes in ink from an ink inlet 42 connected to external ink supply means (not shown), and fills the interior from the common ink chamber 31 to the nozzle opening 11 with ink. Thereafter, according to a recording signal from an external driving circuit (not shown), the lower electrode film 60 is connected from the mounting portion via the lead electrode 100.
A voltage is applied between the first electrode film 80 and the upper electrode film 80 to cause the elastic film 50, the lower electrode film 60, and the piezoelectric film 70 to bend and deform.
Ink droplets are ejected.

In the present embodiment, the mounting base 340 of the mounting portion is formed only of the lower electrode film 60. However, the present invention is not limited to this. For example, as shown in FIG. Alternatively, the lead electrode 100 may be patterned on the mounting base 340A including the piezoelectric layer 70 and the upper electrode film 80 to form the upper electrode contact 331A. As a result, the durability of the mounting portion is further improved, and pressurization during mounting can be easily performed. Further, for example, the insulating layer 90 may be stacked on the lower electrode film 60, the piezoelectric layer 70, and the upper electrode film 80 to form a mounting base, or the lower electrode film 60 and the insulating layer 90 may form a mounting base. You may. Further, another layer may be separately formed to serve as a mounting base. Furthermore, lead electrode 1
Only the end of 00 may be formed as a thick film to form a mounting portion.

In any case, it is only necessary that all the mounting portions have the same film thickness and be thicker than the surroundings.

(Other Embodiments) The embodiments of the present invention have been described above, but the basic configuration of the ink jet recording head is not limited to the above.

For example, in addition to the sealing plate 20 described above, the common ink chamber forming plate 30 may be made of glass ceramic, and the thin film 41 may be made of glass ceramic as a separate member. Changes are free.

In the above-described embodiment, the nozzle openings are formed on the end surface of the flow path forming substrate 10. However, the nozzle openings protruding in a direction perpendicular to the surface may be formed.

FIG. 9 is an exploded perspective view of the embodiment configured as described above, and FIG. 10 is a cross-sectional view of the flow path thereof. In this embodiment, the nozzle opening 11 is formed in the nozzle substrate 120 opposite to the piezoelectric vibrator, and the nozzle communication port 22 that connects the nozzle opening 11 and the pressure generating chamber 12 is formed with the sealing plate 20 and the common ink. It is arranged so as to penetrate the chamber forming plate 30, the thin plate 41A and the ink chamber side plate 40A.

In this embodiment, the thin plate 41
A is basically the same as the above-described embodiment except that the ink chamber side plate 40A and the ink chamber side plate 40A are separate members, and the opening is formed in the ink chamber side plate 40. Is omitted.

Here, also in this embodiment, as in the above-described embodiment, by providing the mounting portion on the flow path forming substrate, the durability of the mounting portion can be improved, and the element due to the delay of heat conduction can be improved. Is prevented from being destroyed.

Further, needless to say, the present invention can be similarly applied to an ink jet recording head of a type in which a common ink chamber is formed in a flow path forming substrate.

In each of the embodiments described above, a thin-film type ink jet recording head which can be manufactured by applying a film forming and lithography process is described as an example.
Of course, the present invention is not limited to this. For example, a piezoelectric film is formed by laminating substrates to form a pressure generating chamber, or a piezoelectric film is formed by attaching a green sheet or by screen printing, or a piezoelectric film formed by crystal growth. The present invention can be applied to ink jet recording heads having various structures, such as those that form a recording medium.

Further, in each of the above-described embodiments, an elastic film is provided as a diaphragm in addition to the lower electrode film. However, the lower electrode film may also serve as the elastic film.

Further, the example in which the insulator layer is provided between the piezoelectric vibrator and the lead electrode has been described. However, the present invention is not limited to this. The conductive film may be thermally welded, and the anisotropic conductive film may be connected to the lead electrode, or may be connected using various bonding techniques such as wire bonding.

As described above, the present invention can be applied to ink jet recording heads having various structures, as long as the gist of the present invention is not contradicted.

[0085]

As described above, according to the present invention,
By providing the mounting base only in the mounting portion and making the film thickness of only the mounting portion larger than the surroundings, it is possible to easily perform pressure or the like at the time of mounting. In addition, since the lead electrodes are provided on the mounting base of the mounting portion, the adhesion of the mounting portion to the flow path forming substrate is improved, and the connection with the external wiring can be performed satisfactorily.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an ink jet recording head according to an embodiment of the present invention.

FIG. 2 is a plan view and a cross-sectional view of FIG. 1, showing an ink jet recording head according to an embodiment of the present invention.

FIG. 3 is a view showing a modification of the sealing plate of FIG. 1;

FIG. 4 is a view showing a thin film manufacturing process according to an embodiment of the present invention.

FIG. 5 is a diagram showing a thin film manufacturing process according to an embodiment of the present invention.

FIG. 6 is a view showing a thin film manufacturing process according to an embodiment of the present invention.

FIG. 7 is a plan view and a cross-sectional view of a main part of an ink jet recording head according to an embodiment of the present invention.

FIG. 8 is a view showing a modified example of the ink jet recording head of the present invention.

FIG. 9 is an exploded perspective view of an ink jet recording head according to another embodiment of the present invention.

FIG. 10 is a cross-sectional view illustrating an ink jet recording head according to another embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 10 flow path forming substrate 11 nozzle opening 12 pressure generating chamber 50 elastic film 60 lower electrode film 70 piezoelectric film 80 upper electrode film 90 insulator layer 100 lead electrode 320 piezoelectric active portion 331 upper electrode contact portion 332 lower electrode contact portion 340 Mounting base

Claims (14)

[Claims] 1. A vibrating plate constituting a part of a pressure generating chamber communicating with a nozzle opening and having at least an upper surface serving as a lower electrode, a piezoelectric layer formed on a surface of the vibrating plate, and a piezoelectric layer formed on the vibrating plate. An internal wiring for supplying electricity to the piezoelectric active part, comprising a piezoelectric vibrator comprising an upper electrode formed on the surface and a piezoelectric active part formed in a region facing the pressure generating chamber; An ink jet recording head including a flow path forming substrate having a mounting portion that is a connection portion to an external wiring, wherein the thickness of the mounting portion is larger than the thickness of the surrounding portion. 2. The device according to claim 1, wherein a lead electrode is connected to the upper electrode of the piezoelectric active portion via a contact portion, and the lead electrode extends to the mounting portion. Inkjet recording head. 3. An insulating layer according to claim 1, wherein an insulating layer is formed on an upper surface of the upper electrode, and the contact portion is formed in a contact hole formed in the insulating layer. Inkjet recording head. 4. The method according to claim 2, wherein the piezoelectric active portion is formed in a region facing the pressure generating chamber, and the contact portion is provided in a region facing the pressure generating chamber. Characteristic inkjet recording head. 5. The device according to claim 2, wherein the diaphragm is formed of an elastic film and a lower electrode film, the periphery of the mounting portion is formed of only the elastic film, and the mounting portion is
An ink jet recording head having a structure in which the internal wiring is formed on the elastic film and the lower electrode film. 6. The device according to claim 1, wherein the diaphragm is formed of an elastic film and a lower electrode film, the periphery of the mounting portion is formed of only the elastic film, and the mounting portion is
An ink jet recording head having a structure in which the internal wiring is formed on the piezoelectric layer formed on the diaphragm and the upper electrode film. 7. The inkjet according to claim 5, wherein the mounting portion has a layer other than the lower electrode, the piezoelectric layer, and the upper electrode formed below the internal wiring. Type recording head. 8. The ink jet recording head according to claim 1, wherein only the portion of the internal wiring connected to the mounting portion is a thick film. 9. The mounting portion according to claim 1, wherein the mounting portion has a plurality of upper electrode contact portions connected to the upper electrodes of the plurality of piezoelectric active portions. Wherein the total film thickness is the same. 10. The lower electrode contact portion according to claim 9, wherein the mounting portion has a lower electrode contact portion connected to a lower electrode provided commonly to all of the plurality of piezoelectric active portions. An ink jet recording head, wherein the film thickness of the ink jet recording head is the same as the film thickness of the lower electrode contact portion. 11. The ink jet type according to claim 1, wherein the flow path forming substrate is formed of ceramics, and each layer of the piezoelectric vibrator is formed by pasting or printing a green sheet. Recording head. 12. The pressure generating chamber according to claim 1, wherein the pressure generating chamber is formed on a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric vibrator is formed by a thin film and a lithography method. An ink jet recording head, comprising: 13. The flow channel forming substrate according to claim 1, wherein a reservoir communicating with the pressure generating chamber is defined in the flow path forming substrate, and a nozzle plate having the nozzle opening is joined thereto. Inkjet recording head. 14. The flow path forming substrate according to claim 1, wherein a common ink chamber for supplying ink to the pressure generating chamber and a flow communicating the pressure generating chamber and the nozzle opening are provided in the flow path forming substrate. An ink jet recording head, wherein a flow path unit forming a path is joined to the ink jet recording head.