JP3433660B2 - Actuator and ink jet recording head - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an actuator in which a drive IC is mounted on a flow path forming substrate having a piezoelectric vibrator, and an ink jet recording head in which a nozzle forming member is laminated.

[0002]

2. Description of the Related Art A part of a pressure generating chamber communicating with a nozzle opening for ejecting ink droplets is composed of a vibrating plate, and this vibrating plate is deformed by a piezoelectric vibrator to pressurize ink in the pressure generating chamber to open the nozzle opening. There are two types of inkjet recording heads that eject ink droplets, one that uses a longitudinal vibration mode piezoelectric vibrator that expands and contracts in the axial direction of the piezoelectric vibrator, and one that uses a flexural vibration mode piezoelectric vibrator. Has been put to practical use.

The former allows the volume of the pressure generating chamber to be changed by bringing the end surface of the piezoelectric vibrator into contact with the vibration plate, so that a head suitable for high-density printing can be manufactured, while the piezoelectric vibrator is manufactured. Problem that the manufacturing process is complicated because it requires a difficult process of cutting the combs into a comb shape in accordance with the arrangement pitch of the nozzle openings and a work of positioning and fixing the cut piezoelectric vibrators in the pressure generating chamber. There is.

On the other hand, in the latter, the piezoelectric vibrator can be attached to the vibrating plate by a relatively simple process of sticking a green sheet of a piezoelectric material in conformity with the shape of the pressure generating chamber and firing the same. However, due to the use of flexural vibration, there is a problem that a certain area is required and high-density arrangement is difficult.

On the other hand, in order to eliminate the disadvantage of the latter recording head, a uniform piezoelectric material layer is formed over the entire surface of the diaphragm by a film forming technique as disclosed in Japanese Patent Laid-Open No. 5-286131. It has been proposed that the piezoelectric material layer is cut into a shape corresponding to the pressure generating chamber by a lithographic method and a piezoelectric vibrator is formed so as to be independent for each pressure generating chamber.

According to this, the work of attaching the piezoelectric vibrator to the diaphragm becomes unnecessary, and the precision of the lithography method
Further, not only the piezoelectric vibrator can be built by a simple method, but there is an advantage that the piezoelectric vibrator can be made thin and high speed driving becomes possible.

Further, in this case, for example, a silicon single crystal substrate is used as the substrate, and the flow passages such as the pressure generating chamber and the reservoir are formed by anisotropic etching to reduce the opening area of the pressure generating chamber as much as possible. It is possible to improve the recording density.

[0008]

In any of the ink jet recording heads described above, a semiconductor integrated circuit (IC) or the like for driving the piezoelectric vibrator is required, and is mounted near the ink jet recording head. There is. That is, conventionally, a method has been adopted in which an IC is arranged near the piezoelectric vibrator and wiring is performed by wire bonding or the like.

However, in particular, as the recording density is improved, the mounting space for ICs and the like and the space for wiring between the piezoelectric vibrators and ICs and the like become an issue for downsizing the recording head. Further, such a problem also exists in an actuator having a similar piezoelectric vibrator.

In view of such circumstances, it is an object of the present invention to provide an actuator and an ink jet recording head in which an IC is mounted efficiently and with good workability.

[0011]

According to a first aspect of the present invention for solving the above problems, a pressure generating chamber is defined and a piezoelectric vibrator is provided on one side of the pressure generating chamber via a vibration plate. One side of an actuator equipped with a flow path forming substrate
A driving member for driving the piezoelectric vibrator, which has a fixing member for forming a wiring pattern, and bonding the piezoelectric vibrator side of the flow path forming substrate to the wiring pattern side to hold and fix the flow path forming substrate. An integrated circuit is mounted on the surface of the fixing member opposite to the one surface, and the wiring pattern is fixed to the fixed surface.
The driving integrated circuit and the driving integrated circuit,
An actuator characterized by being connected to a piezoelectric vibrator .

In the first aspect, the actuator can be constructed by simply mounting the driving integrated circuit on the fixing member for holding the flow path forming substrate, and downsizing and high density can be realized.

According to a second aspect of the present invention, in the first aspect, a contact portion for connecting to a driving electrode of the piezoelectric vibrator is arranged on the surface of the flow path forming substrate on the fixed member side. The connection part at the other end of the drive wiring is arranged corresponding to the contact part on the surface of the fixing member on the flow path forming substrate side, and the contact part and the connection part are pressure-bonded to each other. The actuator is characterized in that

In the second aspect, the flow path forming substrate is joined to the fixing member, whereby the wiring connection with each piezoelectric vibrator is made and the assembling becomes easy.

According to a third aspect of the present invention, in the first or second aspect, the fixing member is provided with a connection terminal for connecting with an external device, and the external device is connected via the connection terminal. An actuator is characterized in that a drive signal is connected to the drive integrated circuit.

In the third aspect, connection with an external device becomes easy.

According to a fourth aspect of the present invention, in any one of the first to third aspects, a nozzle forming member having a nozzle opening communicating with the pressure generating chamber is provided on the other surface side of the flow path forming substrate. The inkjet recording head is characterized by being joined to form a head chip.

In the fourth aspect, the ink jet type recording head can be constructed only by mounting the driving integrated circuit on the fixing member for holding the head chip, and the miniaturization and high density can be realized.

According to a fifth aspect of the present invention, in the fourth aspect, the flow path forming substrate is a silicon single crystal substrate,
In the ink jet recording head, the fixing member is formed of a material having a linear expansion coefficient close to that of the silicon single crystal substrate.

In the fifth aspect, even if the ambient temperature changes, extra stress is not generated in the piezoelectric vibrator.

A sixth aspect of the present invention is an ink jet recording head according to the fourth or fifth aspect, characterized in that the fixing member is made of a material selected from the group consisting of glass ceramics and aluminum nitride. is there.

In the sixth aspect, the ink jet recording head is resistant to temperature changes.

According to a seventh aspect of the present invention, in the fourth aspect, the flow path forming substrate and the nozzle forming member are formed of ceramics, and each layer of the piezoelectric vibrator is formed by sticking or printing a green sheet. The inkjet recording head is characterized by the fact that

In the seventh aspect, the head chip can be easily manufactured.

According to an eighth aspect of the present invention, in any one of the fourth to seventh aspects, a reservoir communicating with the pressure generating chamber is defined in the flow path forming substrate, and the nozzle forming member is formed of the reservoir. The inkjet recording head is characterized by being a nozzle plate having nozzle openings.

In the eighth aspect, it is possible to easily realize an ink jet recording head which ejects ink from the nozzle openings.

According to a ninth aspect of the present invention, in any one of the fourth to seventh aspects, the nozzle forming member includes a common ink chamber for supplying ink to the pressure generating chamber, the pressure generating chamber and the nozzle. An ink jet recording head is characterized in that it is a flow path unit that forms a passage communicating with an opening.

In the ninth aspect, ink is ejected from the nozzle openings via the flow path unit.

In a tenth aspect of the present invention according to any one of the fourth to ninth aspects, an ink supply port communicating with the pressure generating chamber is opened on the surface of the flow path forming substrate on the fixing member side. On the other hand, the ink jet recording head is characterized in that the fixing member is provided with an ink supply channel facing the ink supply port and communicating with each other.

In the tenth aspect, the fixing member also serves as a member for supplying ink, and the size can be further reduced.

[0031]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below in detail based on an embodiment.

(Embodiment 1) FIG. 1 is an exploded perspective view showing an ink jet recording head according to an embodiment of the present invention, and FIG. 2 is a sectional structure of each pressure generating chamber in the longitudinal direction. FIG.

As shown in the figure, the flow path forming substrate 10 is a silicon single crystal substrate having a plane orientation (110) in this embodiment. The flow path forming substrate 10 is usually 150 to 3
A thickness of about 00 μm is used, preferably 18
The thickness is preferably about 0 to 280 μm, more preferably about 220 μm. This is because the array density can be increased while maintaining the rigidity of the partition wall between the adjacent pressure generating chambers.

One surface of the flow path forming substrate 10 is an opening surface, and the other surface is provided with an elastic film 50 of 0.1 to 2 μm in thickness made of silicon dioxide formed by thermal oxidation in advance.

On the other hand, the opening surface of the flow path forming substrate 10 is anisotropically etched to form a silicon single crystal substrate.
Row 1 of pressure generating chambers 12 partitioned by a plurality of partition walls 11
3 in two rows and reservoirs 14 corresponding to each pressure generating chamber 12
And an ink supply port 15 that connects each pressure generating chamber 12 and each reservoir 14 with a constant fluid resistance. The elastic film 50 corresponding to each reservoir 14 has an ink introduction hole 16 for supplying ink to the reservoir 14 from the outside.

In the anisotropic etching, when a silicon single crystal substrate is dipped in an alkaline solution such as KOH, it is gradually eroded to form a first (111) plane perpendicular to the (110) plane and the first (111) plane. Of the second (11) which forms an angle of about 70 degrees with the (111) plane of the above and forms an angle of about 35 degrees with the above (110).
1) plane appears, and the etching rate of the (111) plane is about 1/18 of the etching rate of the (110) plane.
This is performed by utilizing the property of being 0. By such anisotropic etching, two first (111)
Precision machining can be performed based on the depth machining of the parallelogram formed by the plane and the two diagonal (111) planes, and the pressure generating chambers 12 can be arranged at high density.

In this embodiment, the long side of each pressure generating chamber 12 is formed by the first (111) plane, and the short side is formed by the second (111) plane. The pressure generating chamber 12 is provided in the flow path forming substrate 1
It is formed by etching through almost 0 to reach the elastic film 50. Here, the elastic film 50 is
The amount of the alkaline solution that etches the silicon single crystal substrate is extremely small. Each ink supply port 15 communicating with one end of each pressure generating chamber 12 is formed shallower than the pressure generating chamber 12. That is, the ink supply port 15
Is formed by halfway etching the silicon single crystal substrate in the thickness direction. The half etching is performed by adjusting the etching time.

On the opening surface side of the flow path forming substrate 10,
A nozzle plate 18 having a nozzle opening 17 that communicates with the side opposite to the ink supply port 15 of each pressure generating chamber 12 is fixed via an adhesive or a heat-welding film. The nozzle plate 18 has a thickness of, for example, 0.1 to 1
mm, a coefficient of linear expansion of 300 ° C. or less, for example, 2.5 to
It is made of glass ceramics of 4.5 [× 10 ⁻⁶ / ° C.] or rust-free steel. The nozzle plate 18 entirely covers one surface of the flow path forming substrate 10 with one surface, and also serves as a reinforcing plate that protects the silicon single crystal substrate from impact and external force.

Here, the size of the pressure generating chamber 12 that applies the ink droplet ejection pressure to the ink and the size of the nozzle opening 17 that ejects the ink droplet depend on the amount of the ejected ink droplet, the ejection speed, and the ejection frequency. Optimized. For example,
When recording 360 ink droplets per inch, it is necessary to accurately form the nozzle openings 17 with a diameter of several tens of μm.

On the other hand, a thickness of, for example, about 0.5 μm is formed on the elastic film 50 on the side opposite to the opening surface of the flow path forming substrate 10.
The lower electrode film 60, the piezoelectric film 70 having a thickness of, for example, about 1 μm, and the upper electrode film 80 having a thickness of, for example, about 0.1 μm are laminated in a process described later to form a piezoelectric vibrator. (Piezoelectric element). In this way, the elastic film 50
In a region facing each pressure generating chamber 12, a piezoelectric vibrator is provided independently for each pressure generating chamber 12. In this embodiment, the lower electrode film 60 is used as a common electrode of the piezoelectric vibrator,
Although the upper electrode film 80 is used as an individual electrode of the piezoelectric vibrator, there is no problem even if the upper electrode film 80 is reversed for convenience of the drive circuit and wiring. In any case, the piezoelectric active portion is formed for each pressure generating chamber 12. In the present embodiment, as will be described later in detail, the piezoelectric film 70 and the upper electrode film 80 are formed for each pressure generating chamber 12.

Here, a process of forming the piezoelectric film 70 and the like on the flow path forming substrate 10 made of a silicon single crystal substrate will be described with reference to FIG.

As shown in FIG. 3A, first, about 110 wafers of a silicon single crystal substrate to be the flow path forming substrate 10 are prepared.
An elastic film 50 made of silicon dioxide is formed by thermal oxidation in a 0 ° C. diffusion furnace.

Next, as shown in FIG. 3B, the lower electrode film 60 is formed by sputtering. Pt or the like is suitable as the material of the lower electrode film 60. This is because the piezoelectric film 70 to be described later, which is formed by the sputtering or sol-gel method, is 600 to 100 in the air atmosphere or the oxygen atmosphere after the film formation.
This is because it is necessary to fire and crystallize at a temperature of about 0 ° C. That is, the material of the lower electrode film 60 must be able to maintain the conductivity under such a high temperature and oxidizing atmosphere, and particularly when PZT is used as the piezoelectric film 70, the conductivity due to the diffusion of PbO. It is desirable that the change in sex is small, and Pt is preferable for these reasons.

Next, as shown in FIG. 3C, a piezoelectric film 70 is formed. Although sputtering can be used to form the piezoelectric film 70, in the present embodiment, a so-called sol in which a metal organic material is dissolved / dispersed in a solvent is applied, dried, gelled, and fired at a higher temperature to form a metal. A so-called sol-gel method for obtaining the piezoelectric film 70 made of an oxide is used. As a material for the piezoelectric film 70, a lead zirconate titanate (PZT) -based material is suitable for use in an inkjet recording head.

Next, as shown in FIG. 3D, an upper electrode film 80 is formed. The upper electrode film 80 may be made of a material having high conductivity, and many metals such as Al, Au, Ni, Pt, etc., conductive oxides, etc. can be used. In this embodiment, P
t is deposited by sputtering.

Next, as shown in FIG. 3E, the upper electrode film 80 and the piezoelectric film 70 are patterned so that the piezoelectric vibrators are arranged for the respective pressure generating chambers 12. FIG. 3E shows the case where the piezoelectric film 70 is patterned in the same pattern as the upper electrode film 80, but as described above, the piezoelectric film 70 does not necessarily have to be patterned. This is because, when a voltage is applied using the pattern of the upper electrode film 80 as an individual electrode, the electric field is applied only between the respective upper electrode films 80 and the lower electrode film 60 which is the common electrode, and other regions are not affected. This is because it has no effect. However, in this case, a large voltage must be applied to obtain the same excluded volume. Therefore, it is preferable to pattern the piezoelectric film 70 as well. Further, after that, the lower electrode film 60 may be patterned to remove, for example, the arm portions in the vicinity of the boundary portions on both sides of the pressure generating chamber 12, whereby the displacement amount can be improved.

Here, the patterning is performed by forming a resist pattern and then performing etching or the like.

The resist pattern is formed, for example, by applying a negative resist by spin coating or the like and performing exposure, development and baking using a mask having a predetermined shape. Of course, a positive resist may be used instead of the negative resist.

The etching is performed using a dry etching device, for example, an ion milling device, until the silicon dioxide film is exposed. After etching, the resist pattern is removed using an ashing device or the like.

As the dry etching method, other than the ion milling method, a reactive etching method or the like may be used. It is also possible to use wet etching instead of dry etching, but the patterning accuracy is somewhat inferior to the dry etching method, and the upper electrode film 8 is formed.
Since the material of 0 is also limited, it is preferable to use dry etching.

The above is the film forming process. After forming the film in this manner, as shown in FIG. 3F, the silicon single crystal substrate is anisotropically etched by the above-described alkaline solution to form the pressure generating chamber 12 and the like. In addition,
In the series of film formation and anisotropic etching described above, a large number of chips are simultaneously formed on a single wafer, and after the process is completed, each flow path forming substrate 10 of one chip size as shown in FIG. To divide.

The head chip including the flow path forming substrate 10 and the nozzle plate 18 is fixed to the fixing member 120 as shown in FIGS. 4 and 5. 4 is an exploded perspective view, and FIG. 5 is a plan view and a sectional view.

The fixing member 120 is made of a material such as glass ceramic or aluminum nitride having a linear expansion coefficient close to that of the flow path forming substrate 10, and has a concave portion 121 for holding the flow path forming substrate 10 on one surface. Have.
The recess 121 may have a size that holds the head chip, but may have a size that fits around the head chip and holds it from the surroundings.

A wiring pattern 130 facing the pattern of the upper electrode film 80 facing each pressure generating chamber 12 is formed at the joining position of the flow path forming substrate 10 in the recess 121, and one end portion 131 of this wiring pattern 130 is formed. To the end portions 80 of the upper electrode film 80 via the anisotropic conductive adhesive 135.
a is joined. On the other hand, the wiring pattern 130 extends through the fixing member 120 to the opposite surface, and the other end portion is the IC wiring portion 132.

A concave portion 122 is formed on the other end surface of the fixing member 120, and the driving IC 14 is formed in the concave portion 122.
0 is implemented. The terminals 141 of the driving IC 140 and the IC wiring portions 132 corresponding to these terminals are connected by wire bonding 145. The driving IC 140 and the wire bonding 145 are covered with the mold 150.

An ink supply path 125, which is a through groove, is formed on both sides of the concave portion 122 of the fixing member 120 and at a position facing the ink introducing port 16 of the flow path forming substrate 10, and each ink introducing port 16 is formed. A flow passage sealing material 160 having a through hole 161 corresponding to the above and communicating each ink introduction port 16 with the ink supply passage 125 is provided between the fixing member 120 and the flow passage forming substrate 10. An ink supply unit (not shown) is provided at the other end of the ink supply path 125.

Further, the fixing member 120 includes a driving IC.
Wiring for supplying a signal to 140 is provided, and one end of the wiring serves as a driving terminal 170. The flexible printed circuit 180 for connecting to an external device is connected to the driving terminal 170.

The ink jet recording head thus constructed takes in ink from the ink introducing port 16 which is connected to the external ink supplying means (not shown) through the ink supplying path 125, and internally from the reservoir 14 to the nozzle opening 17. After being filled with ink, a voltage is applied between the lower electrode film 60 and the upper electrode film 80 in accordance with a recording signal output from the driving IC 140 by a signal from an external device (not shown), and the elastic film 50 and the piezoelectric film By flexurally deforming 70 and 70, the pressure in the pressure generating chamber 12 increases and ink droplets are ejected from the nozzle openings 17.

In this embodiment described above, the driving IC 140 is attached to the fixing member 120 for holding and fixing the nozzle tip.
By mounting, it is possible to easily configure an ink jet recording head and to save the mounting space.

Further, the fixing member 120 is connected to the flow path forming substrate 10
Since it is made of a material having a linear expansion coefficient close to the linear expansion coefficient of 1, the piezoelectric vibrator does not generate extra stress even when the environmental temperature changes.

(Second Embodiment) FIG. 6 shows a cross section of an ink jet recording head according to a second embodiment.

The present embodiment is the same as the above-mentioned embodiment except that the connection of the driving IC 140 to the wiring pattern of the fixing member 120 is made through bumps instead of wire bonding.

That is, in this embodiment, the driving IC 1
40A has bumps 141 for wiring, and the fixing member 120
It can be mounted by directly bonding to the IC wiring portion 132 of the wiring pattern 130 by thermocompression bonding, ultrasonic pressure bonding, or the like.

Needless to say, bumps may be provided on the wiring portion 132 side, and of course the mounting method of the driving IC is not limited to these.

(Other Embodiments) Although the embodiments of the present invention have been described above, the basic structure of the ink jet recording head is not limited to the above.

For example, in the above-described embodiment, the reservoir 14 is formed together with the pressure generating chamber 12 in the flow path forming substrate 10. However, a flow path unit for forming the common ink chamber as a separate member is provided in the flow path forming substrate 10. You may provide in piles.

FIG. 7 shows an exploded perspective view of the head chip according to the embodiment configured as described above, and FIG. 8 shows a sectional view of a head using the head chip. In this embodiment, the sealing plate 200, the common ink chamber forming plate 210, the thin plate 220, and the ink chamber side plate 230 are provided between the nozzle plate 18A having the nozzle openings 17A and the flow path forming substrate 10A.
And the pressure generating chamber 12 so as to penetrate them.
A nozzle communication port 31 that connects A and the nozzle opening 17A is arranged.

That is, the sealing plate 200, the common ink chamber forming plate 210 and the thin plate 220 define the common ink chamber 32, and the pressure generating chambers 12A and the common ink chamber 32 are formed in the sealing plate 200. The ink is communicated through the ink communication hole 33 provided. Further, the sealing plate 200 is also provided with an ink introduction hole 16A for introducing ink into the supply ink chamber 32 from the outside. Further, the ink chamber side plate 230 located between the thin plate 220 and the nozzle plate 18A has a penetrating portion 35 formed at a position facing each supply ink chamber 32, and a nozzle opening generated when ejecting an ink droplet is formed. The thin plate 220 is allowed to absorb the pressure directed to the side opposite to 17A, whereby unnecessary positive or negative pressure is applied to the other pressure generating chamber 12A via the common ink chamber 32. It is possible to prevent pressure from being applied. The thin plate 220 and the ink chamber side plate 230 may be integrally formed.

As shown in FIG. 8, the head chip thus formed has the same fixing member 1 as in the above-described embodiment.
It is fixed at 20.

In each of the embodiments described above, the thin film type ink jet recording head which can be manufactured by applying the film forming and the lithographic process is taken as an example. However, the present invention is not limited to this, for example, crystal growth. The piezoelectric film may be formed by Further, for example, the substrate may be formed by laminating ceramic sheets to form a pressure generating chamber, and the piezoelectric film may be formed by attaching a green sheet or by screen printing. Furthermore, the present invention can be applied to ink jet recording heads having various structures.

Further, in each of the above-mentioned embodiments, the elastic film is provided as the diaphragm in addition to the lower electrode film, but the lower electrode film may also serve as the elastic film.

Further, in each of the above-mentioned embodiments, the upper electrode film is directly connected to the wiring pattern of the fixing member, but it may be connected via the lead electrode connected to the upper electrode film.

As described above, the present invention can be applied to ink jet recording heads having various structures as long as it does not violate the gist thereof.

[0074]

As described above, in the present invention,
By mounting the drive IC on the fixing member that holds and fixes the head chip, the actuator and the ink jet recording head can be easily configured, and the mounting space can be saved. In addition, since the fixing member is made of a material having a linear expansion coefficient close to that of the flow path forming substrate, the piezoelectric vibrator does not generate extra stress even when the environmental temperature changes.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a head chip of an inkjet recording head according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the head chip according to the first embodiment of the invention.

FIG. 3 is a diagram showing a thin film manufacturing process according to the first embodiment of the present invention.

FIG. 4 is an exploded perspective view of the ink jet recording head according to the first embodiment of the present invention.

5A and 5B are views showing a plane and a cross section of the ink jet recording head according to the first embodiment of the invention.

FIG. 6 is a sectional view of an ink jet recording head according to a second embodiment of the invention.

FIG. 7 is an exploded perspective view of a head chip according to another embodiment of the present invention.

FIG. 8 is a sectional view of an ink jet recording head according to another embodiment of the present invention.

[Explanation of symbols] 10 Flow path forming substrate 11 partitions 12 Pressure generation chamber 14 Reservoir 15 Ink supply port 16 ink inlet 17 nozzle opening 18 nozzle plate 50 elastic membrane 60 Lower electrode film 70 Piezoelectric film 80 Upper electrode film 120 fixing member 130 wiring pattern 140,140A drive IC 160 flow path sealant 170 Drive terminal 180 Flexible printed circuit board

Continuation of front page (56) Reference JP-A-7-304168 (JP, A) JP-A-3-187756 (JP, A) JP-A-9-277516 (JP, A) JP-A-9-226115 (JP , A) JP 7-235708 (JP, A) JP 9-123449 (JP, A) JP 5-57892 (JP, A) JP 5-147215 (JP, A) JP 63-37958 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) B41J 2/045 B41J 2/055

Claims (10)

(57) [Claims] 1. An actuator comprising a flow path forming substrate which defines a pressure generating chamber and has a piezoelectric vibrator on one side of the pressure generating chamber via a vibration plate, wherein a wiring pattern is formed on one side. A driving member for driving the piezoelectric vibrator, which has a fixing member for bonding the piezoelectric vibrator side of the flow path forming substrate to the wiring pattern side and holding and fixing the flow path forming substrate. from said one surface of the integrated circuit is the fixing member is mounted on the opposite side, and the distribution
A line pattern extends through the fixing member,
An actuator characterized in that a dynamic integrated circuit is connected to the piezoelectric vibrator . 2. The contact portion connected to a drive electrode of the piezoelectric vibrator is disposed on a surface of the flow path forming substrate on the side of the fixed member, while the flow path of the fixed member is provided. The connection portion at the other end of the drive wiring is arranged corresponding to the contact portion on the surface on the side of the formation substrate, and the contact portion and the connection portion are pressure-bonded to each other. Actuator. 3. The driving circuit according to claim 1, wherein the fixing member is provided with a connection terminal for connecting with an external device, and a drive signal from the external device is supplied through the connection terminal. An actuator characterized by being connected to. 4. The head chip according to claim 1, wherein a nozzle forming member having a nozzle opening communicating with the pressure generating chamber is joined to the other surface side of the flow path forming substrate. Inkjet recording head characterized in that 5. The flow path forming substrate according to claim 4, wherein the flow path forming substrate is made of a silicon single crystal substrate, and the fixing member is made of a material having a linear expansion coefficient close to that of the silicon single crystal substrate. An inkjet recording head characterized by: 6. The ink jet recording head according to claim 4, wherein the fixing member is made of a material selected from the group consisting of glass ceramics and aluminum nitride. 7. The ink jet system according to claim 4, wherein the flow path forming substrate and the nozzle forming member are formed of ceramics, and each layer of the piezoelectric vibrator is formed by sticking or printing a green sheet. Recording head. 8. The flow passage forming substrate according to claim 4, wherein a reservoir communicating with the pressure generating chamber is defined, and the nozzle forming member is a nozzle plate having the nozzle opening. An ink jet recording head characterized by the above. 9. The nozzle forming member according to claim 4, wherein the nozzle forming member includes a common ink chamber that supplies ink to the pressure generating chamber, and a flow path that connects the pressure generating chamber and the nozzle opening. An ink jet recording head, characterized in that it is a flow path unit that forms a. 10. The ink supply port communicating with the pressure generating chamber is opened on the surface of the flow path forming substrate on the side of the fixing member, while the fixing member is formed on the surface of the fixing member side. An ink jet recording head, characterized in that an ink supply channel is provided facing the ink supply port and communicating with each other.