JPH11226950A - Manufacture of prepreg and laminated plate - Google Patents

Manufacture of prepreg and laminated plate

Info

Publication number
JPH11226950A
JPH11226950A JP3724898A JP3724898A JPH11226950A JP H11226950 A JPH11226950 A JP H11226950A JP 3724898 A JP3724898 A JP 3724898A JP 3724898 A JP3724898 A JP 3724898A JP H11226950 A JPH11226950 A JP H11226950A
Authority
JP
Japan
Prior art keywords
resin
prepreg
kneading
resin composition
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3724898A
Other languages
Japanese (ja)
Inventor
Kazuyuki Najima
和行 名島
Wataru Kosaka
弥 小坂
Takahiro Nakada
高弘 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP3724898A priority Critical patent/JPH11226950A/en
Publication of JPH11226950A publication Critical patent/JPH11226950A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a good and stable quality laminated plate which is manufactured without atmospheric pollution, and with the saving of natural resources and energy at a low manufacturing cost. SOLUTION: This manufacturing method is for prepregs formed of a sheetlike fiber base material, on at least, the surface of which, a powder like resin composition obtained by kneading and uniformly dispersing a resin and other components with the help of a kneading machine and then grinding the kneaded product is present. Preferably the prepreg manufacturing method is to knead the components which form the resin composition prior to kneading and are either solid or at least, one of which is liquid. The method for manufacturing the laminated plate is to thermally press one piece of the prepreg thus obtained or laminate plural pieces of the prepreg and thermally press these laminated pieces.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、特に電気機器、電
子機器、通信機器等に使用される印刷回路板用として好
適なプリプレグ及び積層板の製造方法に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a prepreg and a laminate which are particularly suitable for a printed circuit board used for electric equipment, electronic equipment, communication equipment and the like.

【0002】[0002]

【従来の技術】プリント回路板については小型化、高機
能化の要求が強くなる反面、価格競争が激しく、特にプ
リント回路板に用いられる多層積層板やガラス布基材エ
ポキシ樹脂積層板、ガラス不織布を中間層基材とし、ガ
ラス織布を表面層基材とした構成で、エポキシ樹脂を含
浸させ加熱加圧成形した積層板(以下、コンポジット積
層板という)は、価格の低減が大きな課題となってい
る。また、近年地球の温暖化対策や環境汚染の減少が要
求されてきた。従来これらに用いられるプリプレグや積
層板の製造工程では、基材への樹脂含浸や樹脂の均一性
から多量の溶剤が用いられてきた。一方この大量の溶剤
は塗布乾燥工程で蒸発して製品中に存在せずそのまま大
気放出されるか、燃焼処理装置で処理されて炭酸ガス等
にして大気に放出されてきた。この為大気汚染や地球温
暖化の原因となる問題があった。一方では、基材への樹
脂含浸などの製造上の問題から溶剤の削減、及びこれに
よる低コスト化が困難であった。
2. Description of the Related Art As for printed circuit boards, demands for downsizing and high functionality are becoming stronger, but price competition is fierce. In particular, multilayer laminated boards, glass cloth base epoxy resin laminated boards, and glass nonwoven fabrics used for printed circuit boards are particularly important. Is a middle layer base material and a glass woven fabric is used as a surface layer base material, and a laminated board formed by impregnating with epoxy resin and heating and pressing (hereinafter referred to as a composite laminated board) is a major issue in terms of cost reduction. ing. In recent years, measures against global warming and reduction of environmental pollution have been required. Conventionally, a large amount of solvent has been used in a process of manufacturing a prepreg or a laminated board used for these in view of resin impregnation of the base material and uniformity of the resin. On the other hand, this large amount of solvent evaporates in the coating and drying step and is released to the atmosphere as it is without being present in the product, or it is treated by a combustion treatment device and released to the atmosphere as carbon dioxide gas or the like. Therefore, there is a problem that causes air pollution and global warming. On the other hand, it has been difficult to reduce the amount of solvent and thereby reduce the cost due to manufacturing problems such as resin impregnation of the base material.

【0003】無溶剤化の技術として、低融点の樹脂や液
状の樹脂を加熱混合して均一混合して塗布する研究がな
されてきたが、十分な均一混合が出来ない、連続生産時
加温温度の低下による設備への固結や加熱時熱硬化性樹
脂のゲル化、これによる設備の掃除の困難性があり、連
続的な生産が困難であった。一方粉末状樹脂をそのまま
塗布する場合、均一な混合塗布が出来ず、部分的な硬化
の発生や基材への含浸が出来ない問題があった。
[0003] As a technique for eliminating the solvent, studies have been made on heating and mixing a low-melting-point resin or a liquid resin to uniformly mix and apply the solution. However, the heating temperature during continuous production is not sufficient. In addition, there is a problem that solidification of the thermosetting resin during heating and gelation of the thermosetting resin due to a decrease in the temperature, and difficulty in cleaning the facility due to the consolidation, make continuous production difficult. On the other hand, when the powdery resin is applied as it is, there is a problem that uniform mixing and application cannot be performed, and partial curing occurs and impregnation of the substrate cannot be performed.

【0004】[0004]

【発明が解決しようとする課題】本発明は、従来製造が
困難であった無溶剤樹脂の使用によるプリプレグ、ある
いは積層板を得んとして研究した結果、樹脂及び硬化剤
等を特定の方法で混練、均一分散し粉末化して使用する
こと、特に粉末状の樹脂及び硬化剤等、あるいは無溶剤
の液状樹脂及び硬化剤等を使用し、混練により均一分散
させ取りだした後微粉砕し、シート状繊維基材に散布な
いし塗布等により均一に存在させ、加熱溶融することに
より基材への含浸性が従来の溶剤を使用した樹脂と同等
であるとの知見を得、更にこの知見に基づき種々研究を
進めて本発明を完成するに至ったものである。
SUMMARY OF THE INVENTION The present invention has been studied to obtain a prepreg or a laminate using a solventless resin, which has been conventionally difficult to produce. As a result, the resin and the curing agent are kneaded by a specific method. , Using uniformly dispersed and powdered, especially using powdered resin and hardener, or non-solvent liquid resin and hardener, etc. It was found that the uniform impregnation of the base material was the same as that of a resin using a conventional solvent by heating and melting the base material by spraying or applying it evenly on the base material. The present invention has been completed to complete the present invention.

【0005】[0005]

【課題を解決するための手段】本発明は、樹脂及び他の
成分を混練機にて混練して均一分散させた後粉砕して得
た粉末状樹脂組成物を、シート状繊維基材の少なくとも
表面に存在させることを特徴とするプリプレグの製造方
法、に関するものであり、好ましくは、樹脂組成物を構
成する各成分が混練前において固形であるか、成分の少
なくとも1成分が混練前において液状であり、これらの
成分を混練するプリプリグの製造方法、であり、この得
られたプリプリグを1枚又は複数枚重ね合わせ、加熱加
圧することを特徴とする積層板の製造方法、に関するも
のである。
According to the present invention, a powdery resin composition obtained by kneading a resin and other components with a kneading machine, uniformly dispersing the mixture, and then pulverizing the mixture is at least one of a sheet-like fiber base material. A method for producing a prepreg, characterized in that it is present on the surface, and preferably, each component constituting the resin composition is solid before kneading, or at least one of the components is in a liquid state before kneading. The present invention relates to a method for producing a prepreg in which these components are kneaded, and to a method for producing a laminate, comprising laminating one or more of the obtained prepregs and heating and pressing.

【0006】本発明において、用いられる樹脂として
は、一般的には、熱硬化性樹脂であり、エポキシ樹脂、
ポリイミド樹脂、ポリエステル樹脂、フェノール樹脂、
メラミン樹脂およびこれらの変性樹脂が好ましく使用さ
れるが、その他、熱可塑性樹脂、天然樹脂等の樹脂も使
用され、それらに限定されるものではない。熱硬化性樹
脂では、エポキシ樹脂が望ましいが、このほか、ポリイ
ミド樹脂、ポリエステル樹脂、フェノール樹脂などを用
いることができる。熱硬化性樹脂がエポキシ樹脂の場
合、粉末状の硬化剤としては、芳香族アミン系やノボラ
ック樹脂系が望ましいが、酸無水物系なども用いること
ができる。更には、硬化促進剤を使用することが好まし
い。かかる硬化促進剤としては、イミダゾール系、第3
級アミン系、ホスフィン系等を用いることができる。こ
れらの各成分は上記のものに限定されるものではない。
[0006] In the present invention, the resin used is generally a thermosetting resin, such as an epoxy resin,
Polyimide resin, polyester resin, phenol resin,
Melamine resins and their modified resins are preferably used, but other resins such as thermoplastic resins and natural resins are also used, and are not limited thereto. As the thermosetting resin, an epoxy resin is desirable, but in addition, a polyimide resin, a polyester resin, a phenol resin, or the like can be used. When the thermosetting resin is an epoxy resin, the curing agent in the form of powder is preferably an aromatic amine-based resin or a novolak resin-based resin, but may be an acid anhydride-based resin. Further, it is preferable to use a curing accelerator. As such curing accelerators, imidazole-based, third
Secondary amines, phosphines and the like can be used. These components are not limited to those described above.

【0007】これらの樹脂組成物を構成する各成分は、
混練機により混練され均一分散される。混練機から取り
出され粉砕される。混練機による混練条件は、樹脂の軟
化点、液状の場合は粘度、や硬化剤等の他の成分の種
類、配合量等により適宜決定されるが、好ましくは、混
練時の樹脂温度が樹脂の軟化点より10−30℃程度高
い温度になるような条件として、樹脂粘度が低く硬化剤
等が樹脂に均一に分散し易くし、更に可使時間を保った
状態で取り出す。
The components constituting these resin compositions are as follows:
The mixture is kneaded by a kneader and uniformly dispersed. It is taken out of the kneader and crushed. The kneading conditions of the kneading machine are appropriately determined depending on the softening point of the resin, the viscosity in the case of a liquid, the type of other components such as a curing agent, the amount of the resin, and the like. As a condition for raising the temperature to about 10 to 30 ° C. higher than the softening point, the resin is taken out in a state where the resin viscosity is low, the curing agent and the like are easily dispersed uniformly in the resin, and the pot life is maintained.

【0008】本発明において、樹脂組成物中の樹脂及び
硬化剤、充填材等の他の各成分は、溶剤等により低粘度
の溶液状にしたものではなく、固形あるいは無溶剤の液
状のものが使用される。固形のものはフレーク状、粒状
又は粉末状が望ましい。ブロック状のものは予め粉砕し
て使用することが好ましい。液状のものは溶剤を使用し
ていないものであれは特に限定されるものではない。溶
剤等のごとくプリプレグや積層板の段階で蒸発等により
無くなるものは避けるべきである。これらは、固形同
士、液状同士若しくはこれらの併用したものが使用され
る。
In the present invention, other components such as a resin, a curing agent, and a filler in the resin composition are not made into a low-viscosity solution with a solvent or the like, but are solid or non-solvent liquid. used. The solid is preferably in the form of flakes, granules or powder. It is preferable that the block-like material is ground before use. The liquid is not particularly limited as long as it does not use a solvent. It should be avoided that the solvent disappears due to evaporation at the stage of the prepreg or the laminate, such as a solvent. These are used as solids, liquids or a combination thereof.

【0009】本発明において、粉末状樹脂組成物は、混
練機により混練し、均一分散し、その後取りだし冷却後
粉砕するが、この粉末状樹脂組成物を、シート状繊維基
材に均一な散布ないし塗布により存在させるが、この粉
末状樹脂組成物をシート状基材に存在させる方法は、シ
ート状繊維基材上面から振りかける方法、静電塗装法、
流動浸漬法、スプレーによる吹き付け法、各種コーター
による塗布法等がある。この際、散布ないし塗布される
粉末状樹脂組成物の粒径は、通常1000μm以下であ
り、好ましくは0.1〜500μmであり、更に好まし
くは0.1〜200μmである。かかる粒径は、粉体の
散布ないし塗布時の流動性、加熱溶融時の流れ性や表面
の滑らかさの改良、シート状繊維基材への樹脂の含浸性
の改良、重量分布等の安定化のために適している。な
お、シート状繊維基材は、予め、60−100℃程度に
加熱しておけば、粉末状樹脂組成物をシート状繊維基材
に存在せしめたときに基材によく付着し、その後の加熱
により基材の内部によく浸透し、良好なプリプレグが得
られる。本発明に用いられる樹脂粉体はそのままでも使
用することができるが、耐熱性、耐燃性、耐トラッキン
グ性等を付与するために、無機充填材を加えるとことが
出来る。
In the present invention, the powdery resin composition is kneaded by a kneader, uniformly dispersed, then taken out, cooled and pulverized. This powdery resin composition is uniformly dispersed or spread on a sheet fiber base material. Although present by application, a method of causing the powdery resin composition to be present on the sheet-like substrate is a method of sprinkling from the upper surface of the sheet-like fiber substrate, an electrostatic coating method,
There are a fluid immersion method, a spraying method using a spray, a coating method using various coaters, and the like. At this time, the particle size of the powdery resin composition to be sprayed or applied is usually 1000 μm or less, preferably 0.1 to 500 μm, and more preferably 0.1 to 200 μm. Such a particle size can be used to improve the flowability of powder during spraying or application, the flowability during heating and melting, the smoothness of the surface, the improvement of impregnation of resin into the sheet-like fiber base material, and the stabilization of weight distribution and the like. Suitable for In addition, if the sheet-like fiber base material is previously heated to about 60 to 100 ° C., the powder-like resin composition adheres well to the base material when the sheet-like fiber base material is present in the sheet-like fiber base material, and the subsequent heating is performed. Thereby, it penetrates well into the inside of the base material, and a good prepreg is obtained. Although the resin powder used in the present invention can be used as it is, an inorganic filler can be added to impart heat resistance, flame resistance, tracking resistance and the like.

【0010】混練機は、2本ロール、3本ロール、単軸
押出機(単軸混練機)、2軸押出機(2軸混練機)、ニーダ
ー、コ・ニーダー、KCK(Kishihiro Continuous Knea
der(連続混練押出機))、ヘンシェルミキサー等があ
る。また、一般に混練機で処理する前にプレ混合を行う
ことが望ましく、このような混合機としては、ヘンシェ
ルミキサー、ライカイ機、リボンブレンダー、プラネタ
リーミキサー、ボールミル、メカノケミカル処理機、ホ
モミキサー、ディスパーザー、攪拌釜等が挙げられる。
また、これらの併用系でも良い。
The kneading machine is a two-roll, three-roll, single-screw extruder (single-screw kneader), twin-screw extruder (two-screw kneader), kneader, co-kneader, KCK (Kishihiro Continuous Kneader).
der (continuous kneading extruder)), Henschel mixer and the like. In addition, it is generally desirable to perform pre-mixing before processing in a kneading machine. Examples of such a mixing machine include a Henschel mixer, a Raikai machine, a ribbon blender, a planetary mixer, a ball mill, a mechanochemical processing machine, a homomixer, and a disperser. And a stirring pot.
A combination of these may be used.

【0011】本発明において、シート状繊維基材として
は、ガラスクロス、ガラス不繊布、ガラスペーパー等の
ガラス繊維基材の他、紙、合成繊維等からなる織布や不
織布、金属繊維、カーボン繊維、鉱物繊維等からなる織
布、不織布、マット類等が挙げられ、これらの基材の原
料は単独又は混合して使用してもよい。
In the present invention, examples of the sheet-like fiber base material include glass fiber base materials such as glass cloth, glass non-woven cloth and glass paper, as well as woven and non-woven fabrics made of paper and synthetic fibers, metal fibers, and carbon fibers. And woven fabrics, nonwoven fabrics, mats and the like made of mineral fibers, etc., and these base materials may be used alone or in combination.

【0012】以上のようにして得られたプリプレグは、
この1枚又は複数枚を、必要により銅箔等の金属箔を重
ね合わせ、通常の方法により加熱加圧して積層板に成形
される。本発明によるプリプレグ及び積層板の製造方法
は、得られたプリプレグあるいは積層板の性能を実質的
に変えることなく、無溶剤による省資源化及び大気汚染
の低減化が図られ、溶剤を蒸発させ、燃焼させるための
熱エネルギーも不要となる。プリフレグ及び積層板製造
時において、溶剤がもともと存在しないため反応が速
く、乾燥、成形時間が短縮され、さらに低コスト化をも
達成することができる。本発明の考え方は、固形成分
(樹脂、硬化剤等)あるいは無溶剤の液状成分(樹脂、
硬化剤等)を使用し、混練機により混練、均一分散する
ことにより、各成分の均一な結合分散、シート状基材へ
の均一な含浸、含浸された樹脂組成物の均一な反応が可
能となったものである。なお、通常の樹脂ワニスを使用
してプリプレグ及び積層板を製造する場合、樹脂等の不
揮発分が40〜60重量%程度、溶剤が60〜40重量
%ていどである。従って、粉末状樹脂を使用し、溶剤を
使用しないことによる上記の効果は非常に大きいといえ
る。
The prepreg obtained as described above is
One or more of the sheets are laminated with a metal foil such as a copper foil as necessary, and heated and pressed by a usual method to form a laminate. The method for producing a prepreg and a laminate according to the present invention, without substantially changing the performance of the obtained prepreg or laminate, resource saving and air pollution are reduced by using no solvent, and the solvent is evaporated. Thermal energy for burning is also unnecessary. During the production of the pre-flag and the laminate, the reaction is fast because there is no solvent originally, the drying and the molding time are shortened, and the cost can be reduced. The concept of the present invention is that a solid component (resin, curing agent, etc.) or a solventless liquid component (resin,
Kneading and uniform dispersion using a kneading machine using a curing agent, etc., enables uniform bonding and dispersion of each component, uniform impregnation of the sheet-like substrate, and uniform reaction of the impregnated resin composition. It has become. When prepregs and laminates are manufactured using ordinary resin varnishes, the non-volatile content of the resin and the like is about 40 to 60% by weight and the solvent is 60 to 40% by weight. Therefore, it can be said that the above-mentioned effect by using a powdery resin and not using a solvent is very large.

【0013】[0013]

【実施例】次に、本発明の実施例を比較例とともに具体
的に説明する。本発明はこれらの実施例により何ら限定
されるものではない。
Next, examples of the present invention will be specifically described together with comparative examples. The present invention is not limited by these examples.

【0014】〔実施例1〕粉末状のエポキシ樹脂(油化
シェル製臭素化エポキシ樹脂Ep5048,エポキシ当
量675)100重量部、粉末状の硬化剤(ジシアンジ
アミド)5重量部、粉末状の硬化促進剤(2−エチル−
4−メチルイミダゾール)1重量部の比率で混合し直径
12吋の2本ロールを用い、高速側回転数20rpm、
高速側ロール温度60℃、低速側ロール温度30℃、回
転比1.5:1にて30回処理し、シート状で取りだし
冷風にて冷却後、微粉砕機にて平均粒径200μmに粉
砕した。この処理した粉末状樹脂組成物を100g/m
2 のガラスクロスの片面上に60メッシュ篩いで50g
/m2 になるように均一に散布した。その後、170℃
の乾燥機で30秒加熱した後、ガラスクロスを上下反対
にし、もう一方の面に60メッシュ篩いで50g/m2
になるように均一に散布し、170℃の乾燥機で3分間
乾燥してプリプレグを得た。このプリプレグを2枚重ね
合わせ、さらにその上下に厚さ18μmの銅箔を重ね合
わせ、温度165℃、圧力60kg/cm2 で90分間
加熱加圧成形して、厚さ0.22mmの銅張積層板を作
製した。
Example 1 100 parts by weight of a powdery epoxy resin (brominated epoxy resin Ep5048, oil equivalent shell, epoxy equivalent: 675), 5 parts by weight of a powdery curing agent (dicyandiamide), powdery curing accelerator (2-ethyl-
4-methylimidazole) mixed at a ratio of 1 part by weight, using two rolls having a diameter of 12 inches, and rotating at a high speed side of 20 rpm.
Treated 30 times at a high-speed roll temperature of 60 ° C., a low-speed roll temperature of 30 ° C., and a rotation ratio of 1.5: 1, took out a sheet, cooled with cold air, and pulverized with a fine pulverizer to an average particle size of 200 μm. . 100 g / m of the treated powdery resin composition
50g with a sieve 60 mesh on one side of 2 of the glass cloth
/ M 2 . Then 170 ° C
After heating with a dryer for 30 seconds, the glass cloth was turned upside down, and the other surface was sifted through a 60-mesh sieve to 50 g / m 2.
And dried with a dryer at 170 ° C. for 3 minutes to obtain a prepreg. Two prepregs are laminated, and a copper foil having a thickness of 18 μm is laminated on the upper and lower sides of the prepreg, and is heated and pressed at a temperature of 165 ° C. and a pressure of 60 kg / cm 2 for 90 minutes to form a copper-clad laminate having a thickness of 0.22 mm. A plate was made.

【0015】〔実施例2〕固形状のエポキシ樹脂(油化
シェル製臭素化エポキシ樹脂Ep5048,エポキシ当
量675)100重量部、粉末状の硬化剤(ジシアンジ
アミド)5重量部、粉末状の硬化促進剤(2−エチル−
4−メチルイミダゾール)1重量部の比率で混合したも
のを温度100℃で溶融液状化し、ヘンシェルミキサー
を用い、回転数500rpmにて、20分処理し、バッ
トに板状に取りだし冷風にて冷却後、微粉砕機にて平均
粒径200μmに粉砕した。この処理した粉末状樹脂組
成物を100g/m2 のガラスクロスの片面上に60メ
ッシュ篩いで50g/m2 になるように均一に散布し
た。その後、170℃の乾燥機で30秒加熱した後、ガ
ラスクロスを上下反対にし、もう一方の面に60メッシ
ュ篩いで50g/m2 になるように均一に散布し、17
0℃の乾燥機で3分間乾燥してプリプレグを得た。この
プリプレグを2枚重ね合わせ、さらにその上下に厚さ1
8μmの銅箔を重ね合わせ、温度165℃、圧力60k
g/cm2 で90分間加熱加圧成形して、厚さ0.22
mmの銅張積層板を作製した。
Example 2 100 parts by weight of a solid epoxy resin (brominated epoxy resin Ep5048, oil equivalent shell, epoxy equivalent: 675), 5 parts by weight of a powdery curing agent (dicyandiamide), powdery curing accelerator (2-ethyl-
4-Methylimidazole) 1 part by weight of the mixture was melted and liquefied at a temperature of 100 ° C., treated with a Henschel mixer at a rotation speed of 500 rpm for 20 minutes, taken out into a vat in a plate shape, and cooled with cold air. And pulverized to an average particle size of 200 μm with a fine pulverizer. The treated powdery resin composition was uniformly sprayed on one surface of a 100 g / m 2 glass cloth with a 60-mesh sieve to 50 g / m 2 . Then, after heating in a dryer at 170 ° C. for 30 seconds, the glass cloth was turned upside down, and uniformly sprayed on the other surface with a 60-mesh sieve to 50 g / m 2.
The prepreg was dried by drying at 0 ° C. for 3 minutes. Two prepregs are stacked, and a thickness of 1
8μm copper foil is superimposed, temperature 165 ℃, pressure 60k
g / cm 2 for 90 minutes under heat and pressure.
mm copper-clad laminate was prepared.

【0016】〔実施例3〕粉末状のエポキシ樹脂(油化
シェル製臭素化エポキシ樹脂Ep5048,エポキシ当
量675)100重量部、粉末状の硬化剤(ジシアンジ
アミド)5重量部、粉末状の硬化促進剤(2−エチル−
4−メチルイミダゾール)1重量部の比率で混合し単軸
押出機を用い、シリンダー温度50℃、L/D=20、
回転数100rpmで処理し、押し出されきた材料を冷
風にて冷却後、微粉砕機にて平均粒径200μmに粉砕
した。この処理した粉末状樹脂組成物を100g/m2
のガラスクロスの片面上に60メッシュ篩いで50g/
2 になるように均一に散布した。その後、170℃の
乾燥機で30秒加熱した後、ガラスクロスを上下反対に
し、もう一方の面に60メッシュ篩いで50g/m2
なるように均一に散布し、170℃の乾燥機で3分間乾
燥してプリプレグを得た。このプリプレグを2枚重ね合
わせ、さらにその上下に厚さ18μmの銅箔を重ね合わ
せ、温度165℃、圧力60kg/cm2 で90分間加
熱加圧成形して、厚さ0.22mmの銅張積層板を作製
した。
Example 3 100 parts by weight of a powdery epoxy resin (brominated epoxy resin Ep5048 manufactured by Yuka Shell, epoxy equivalent: 675), 5 parts by weight of a powdery curing agent (dicyandiamide), powdery curing accelerator (2-ethyl-
4-methylimidazole), mixed at a ratio of 1 part by weight, using a single screw extruder, cylinder temperature 50 ° C., L / D = 20,
The material was processed at a rotation speed of 100 rpm, and the extruded material was cooled by cold air and then pulverized by a fine pulverizer to an average particle diameter of 200 μm. 100 g / m 2 of this treated powdery resin composition
60g sieve on one side of a glass cloth of 50g /
m 2 . Then, after heating with a dryer at 170 ° C. for 30 seconds, the glass cloth was turned upside down, and evenly sprayed on the other surface with a 60-mesh sieve to 50 g / m 2. After drying for a minute, a prepreg was obtained. Two prepregs are laminated, and a copper foil having a thickness of 18 μm is laminated on the upper and lower sides of the prepreg, and is heated and pressed at a temperature of 165 ° C. and a pressure of 60 kg / cm 2 for 90 minutes to form a copper-clad laminate having a thickness of 0.22 mm. A plate was made.

【0017】〔比較例1〕平均粒径150μmの粉末状
のエポキシ樹脂(油化シェル製臭素化エポキシEp50
48)100重量部、平均粒子径15μmの粉末状の硬
化剤(ジシアンジアミド)5重量部、平均粒径15μm
の粉末状の硬化促進剤1重量部の比率で混合したものを
手で5分間混ぜ合わせたのち、この粉体を100℃で加
温して溶かした後、樹脂固形分で100g/m2 になる
ように100g/m2 のガラスクロスを浸けて含浸させ
て170℃の乾燥機で2分間乾燥してプリプレグを得
た。このプリプレグを2枚重ね合わせ、さらにその上下
に厚さ18μmの銅箔を重ね合わせ、温度165℃、圧
力60kg/cm2 で90分間加熱加圧成形して、厚さ
0.22mmの銅張積層板を作製した。
Comparative Example 1 A powdery epoxy resin having an average particle size of 150 μm (brominated epoxy Ep50 manufactured by Yuka Shell Co., Ltd.)
48) 100 parts by weight, 5 parts by weight of a powdery curing agent (dicyandiamide) having an average particle diameter of 15 μm, and an average particle diameter of 15 μm
After mixing by hand for 5 minutes, the mixture was mixed at a ratio of 1 part by weight of a powdery curing accelerator, and the powder was heated at 100 ° C. to dissolve, and then the resin solid content was reduced to 100 g / m 2 . A 100 g / m 2 glass cloth was soaked and impregnated to obtain a prepreg by drying at 170 ° C. for 2 minutes. Two prepregs are laminated, and a copper foil having a thickness of 18 μm is laminated on the upper and lower sides of the prepreg, and is heated and pressed at a temperature of 165 ° C. and a pressure of 60 kg / cm 2 for 90 minutes to form a copper-clad laminate having a thickness of 0.22 mm. A plate was made.

【0018】〔比較例2〕平均粒径150μmの粉末状
のエポキシ樹脂(油化シェル製臭素化エポキシEp50
48)100重量部、平均粒子径15μmの粉末状の硬
化剤(ジシアンジアミド)5重量部、平均粒径15μm
の粉末状の硬化促進剤1重量部の比率で混合したものを
メチルセルソルブ100重量部に溶かした。このワニス
を樹脂固形分で100g/m2 になるように100g/
2 のガラスクロスを浸けて含浸させた後、170℃の
乾燥機で3分間乾燥してプリプレグを得た。このプリプ
レグを2枚重ね合わせ、さらにその上下に厚さ18μm
の銅箔を重ね合わせ、温度165℃、圧力60kg/c
2 で90分間加熱加圧成形して、厚さ0.22mmの
銅張積層板を作製した。
Comparative Example 2 A powdery epoxy resin having an average particle size of 150 μm (brominated epoxy Ep50 manufactured by Yuka Shell Co., Ltd.)
48) 100 parts by weight, 5 parts by weight of a powdery curing agent (dicyandiamide) having an average particle diameter of 15 μm, and an average particle diameter of 15 μm
Was mixed with 100 parts by weight of methylcellosolve. This varnish was added to 100 g / m 2 so that the solid content of the varnish became 100 g / m 2.
After impregnating with impregnating a glass cloth of m 2, the glass cloth was dried with a dryer at 170 ° C. for 3 minutes to obtain a prepreg. Two prepregs are stacked, and a thickness of 18 μm
165 ° C, pressure 60kg / c
It was heated and pressed at m 2 for 90 minutes to produce a copper-clad laminate having a thickness of 0.22 mm.

【0019】以上の実施例及び比較例で得られたプリプ
レグについては、ガラスクロスへの樹脂の含浸性を測定
し、銅張積層板については、成形性、引張り強さ、銅箔
引剥し強さ、半田耐熱性を測定した。その結果を表1に
示す。
For the prepregs obtained in the above Examples and Comparative Examples, the impregnating property of the glass cloth with the resin was measured. For the copper-clad laminate, the moldability, tensile strength, and copper foil peeling strength were measured. , And solder heat resistance were measured. Table 1 shows the results.

【0020】[0020]

【表1】 [Table 1]

【0021】(測定方法) 1.含浸性:ガラス繊維間のボイドの有無を、プリプレ
グを実体顕微鏡にて確認した。 2.成形性:銅張積層板の銅箔をエッチングして、目視
により硬化剤等の析出の有無を観察し、分散性の評価を
する。 3.引張り強さ:銅張積層板の銅箔をエッチングして、
10×100mmに切断後テンシロンにて引張り強度を
測定した。 4.銅箔引剥し強さ:JIS C 6481による 5.半田耐熱性:50×50mm角の積層板を、260
℃の半田浴に3分間フロートさせ、ふくれの有無を測定
した。
(Measurement method) Impregnating property: The presence or absence of voids between glass fibers was confirmed with a prepreg under a stereoscopic microscope. 2. Formability: The copper foil of the copper-clad laminate is etched, and the presence or absence of precipitation of a curing agent or the like is visually observed to evaluate the dispersibility. 3. Tensile strength: Etching copper foil of copper clad laminate,
After cutting to 10 × 100 mm, the tensile strength was measured with Tensilon. 4. 4. Copper foil peel strength: according to JIS C6481 Solder heat resistance: A laminate of 50 × 50 mm square was converted to 260
The sample was floated in a solder bath at a temperature of 3 ° C. for 3 minutes, and the presence or absence of blister was measured.

【0022】なお、製造コストについては、実施例の方
法は溶剤を使用しないので、実施例で得られた積層板は
比較例2で得られたものに比べ30〜40%程度低コス
ト化することができた。また、比較例1については、設
備への樹脂付着物が硬化して清掃が困難となった。
As for the manufacturing cost, since the method of the embodiment does not use a solvent, the cost of the laminate obtained in the embodiment is reduced by about 30 to 40% as compared with that obtained in the comparative example 2. Was completed. Further, in Comparative Example 1, the resin adhering matter to the equipment hardened and cleaning became difficult.

【0023】[0023]

【発明の効果】本発明の方法は、有機溶剤を使用しない
ので、大気汚染が無く、省資源化することができ、溶剤
を蒸発させ、燃焼させるための熱エネルギーも不要とな
る。プリフレグ及び積層板製造時において、溶剤がもと
もと存在しないため反応が速く、乾燥、成形時間が短縮
される。そして、好ましくは固形成分(樹脂、硬化剤
等)、あるいは無溶剤液状成分(樹脂、硬化剤等)を使
用し、各成分を混練機により混練、均一分散して得られ
た粉末状樹脂組成物を使用することにより、シート繊維
状基材への均一な含浸、含浸された樹脂組成物の均一な
反応が可能となる。従って、得られたプリプレグ及び積
層板は品質も安定しており、良好な特性を有している。
そして、低コスト化の点で優れており、工業的な積層板
の製造方法として好適である。
According to the method of the present invention, since no organic solvent is used, there is no air pollution, resources can be saved, and thermal energy for evaporating and burning the solvent is not required. In the production of pre-flags and laminates, the reaction is fast because no solvent is originally present, and the drying and molding time are reduced. A powdery resin composition obtained by kneading and uniformly dispersing each component with a kneading machine, preferably using a solid component (resin, curing agent, etc.) or a solventless liquid component (resin, curing agent, etc.) By using, the sheet fibrous base material can be uniformly impregnated, and the impregnated resin composition can be uniformly reacted. Therefore, the quality of the obtained prepregs and laminates is stable and has good characteristics.
It is excellent in terms of cost reduction, and is suitable as an industrial method for manufacturing a laminate.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 樹脂及び他の成分を混練機にて混練して
均一分散させた後粉砕して得た粉末状樹脂組成物を、シ
ート状繊維基材の少なくとも表面に存在させることを特
徴とするプリプレグの製造方法。
1. A powdery resin composition obtained by kneading and uniformly dispersing a resin and other components in a kneading machine, and then pulverizing the resin and the powdered resin composition to be present at least on the surface of a sheet-like fiber base material. Prepreg manufacturing method.
【請求項2】 樹脂組成物を構成する各成分が混練前に
おいて固形であり、これらの固形成分を溶融混練する請
求項1の記載のプリプリグの製造方法。
2. The method for producing a prepreg according to claim 1, wherein the components constituting the resin composition are solid before kneading, and these solid components are melt-kneaded.
【請求項3】 樹脂組成物を構成する成分の少なくとも
1成分が混練前において液状であり、これらの成分を混
練する請求項1の記載のプリプリグの製造方法。
3. The method of claim 1, wherein at least one of the components constituting the resin composition is in a liquid state before kneading, and the components are kneaded.
【請求項4】 請求項1,2又は3記載の方法により得
られたプリプリグを、1枚又は複数枚重ね合わせ、加熱
加圧することを特徴とする積層板の製造方法。
4. A method for producing a laminate, comprising laminating one or more prepregs obtained by the method according to claim 1, 2, or 3 and heating and pressing.
JP3724898A 1998-02-19 1998-02-19 Manufacture of prepreg and laminated plate Pending JPH11226950A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3724898A JPH11226950A (en) 1998-02-19 1998-02-19 Manufacture of prepreg and laminated plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3724898A JPH11226950A (en) 1998-02-19 1998-02-19 Manufacture of prepreg and laminated plate

Publications (1)

Publication Number Publication Date
JPH11226950A true JPH11226950A (en) 1999-08-24

Family

ID=12492341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3724898A Pending JPH11226950A (en) 1998-02-19 1998-02-19 Manufacture of prepreg and laminated plate

Country Status (1)

Country Link
JP (1) JPH11226950A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102658696A (en) * 2012-04-17 2012-09-12 上虞市精亮工贸有限公司 Natural bamboo fiber enhanced plastic plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102658696A (en) * 2012-04-17 2012-09-12 上虞市精亮工贸有限公司 Natural bamboo fiber enhanced plastic plate

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