JPH11226863A - Surface polishing device with work fluid removing mechanism and work fluid removing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a work fluid of polishing fluid, rinse fluid, etc., left on a work surface of a surface plate to be removed easily and automatically. SOLUTION: A suction water head 17 of a work fluid removing mechanism 6 set up in a surface polishing device is connected to a suction pump 22, the suction water head 17 is brought into contact with a work surface of a surface plate 2 after a work-finished workpiece is removed, the surface plate 2 is rotated, also while moving the suction water head 17 in the radial direction of the surface plate, a work fluid on the work surface is sucked by the suction pump 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for polishing the surface of a substantially flat work such as a semiconductor wafer or a magnetic disk substrate. The present invention relates to a means for removing a working fluid to be removed.

[0002]

2. Description of the Related Art For example, in a surface polishing apparatus such as a polishing apparatus for polishing the surface of a semiconductor wafer, when the wafer is taken out after polishing is completed, the surface of the wafer is liable to dry or undergo chemical changes such as oxidation. Therefore, at the end of polishing, a rinse liquid such as pure water is supplied to clean the wafer or wet the surface, and then take out the wafer.

[0003] When the removal of the wafer is completed, the next unprocessed wafer is supplied to each carrier and polishing is performed again. At this time, if the rinsing liquid remains on the work surface of the platen, the wafer is removed. Is easily lifted and slides sideways, so that it may not be well accommodated in the holding hole of the carrier and may protrude from the holding hole, or may jump out of the carrier at the start of processing and be damaged.

Therefore, conventionally, the liquid was manually wiped off using a water-absorbing material such as sponge or cloth.
It was inefficient and required a lot of labor and time. In addition, there is a problem in terms of hygiene, such as that hands and clothes are easily contaminated by a rinse liquid mixed with an abrasive.

[0005]

A technical object of the present invention is to provide a surface polishing apparatus for polishing a surface of a work, in which a processing liquid such as a polishing liquid or a rinsing liquid remaining on a work surface of a surface plate is simply and automatically processed. In order to be able to be removed.

[0006]

According to the present invention, there is provided a sun gear and an internal gear which are concentrically arranged, and meshes with both gears to perform planetary movement around the sun gear. A plurality of work carriers, upper and lower surface plates for polishing the work held by the work carriers from both sides, a processing liquid supply mechanism for supplying a processing liquid to the polishing portion, and a work surface remaining on the work surface of the surface plate. A machining fluid removal mechanism for removing the machining fluid to be removed, and the machining fluid removal mechanism is
A suction head having a water suction port communicating with the suction pump, wherein the water suction head is movable between a water suction position for sucking the processing liquid on the surface of the surface plate and a standby position away from the surface plate. A feature is provided a planar polishing apparatus with a working fluid removing mechanism.

In the present invention, it is desirable that the water absorbing head in the working fluid removing mechanism is configured to suck the working fluid while moving in a radial direction of the base at a fixed position in a circumferential direction of the base. Further, the water absorbing head may be provided with a brush that comes into contact with the work surface of the surface plate.

According to one specific embodiment of the present invention, the working fluid removing mechanism is provided in one set, and is provided with a water-absorbing head which can be turned upside down, so that the working surface of the upper and lower stools can be removed. Can absorb the processing fluid.

According to another specific embodiment of the present invention,
Two sets of the above-mentioned machining fluid removing mechanisms are provided, and the machining fluids on the working surfaces of the upper and lower platens can be individually absorbed by these removing means.

Further, in the method for removing a working fluid according to the present invention, the water absorbing head provided with a water suction port communicating with a suction pump is brought into contact with a work surface of the surface plate at a fixed position in a circumferential direction of the surface plate. The processing liquid on the work surface is sucked by the water absorbing head while rotating the board.

In this case, it is desirable to suck the working fluid while moving the water absorbing head in the radial direction of the surface plate.

As described above, according to the present invention, the processing liquid such as the polishing liquid and the rinsing liquid remaining on the work surface of the platen can be easily and automatically removed by the water suction head connected to the suction pump. For this reason, not only the removal efficiency is very good, but also the processing liquid does not adhere to hands or clothes, so that it is safe and sanitary.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an example of a planar polishing apparatus according to the present invention. This polishing apparatus removes a processing liquid such as a polishing liquid or a rinsing liquid remaining on a work surface of a surface plate. It has substantially the same configuration as a known polishing apparatus except that a machining fluid removing mechanism 6 is provided. That is,
1 is an airframe, 2 is a lower surface plate rotatably arranged at a fixed position on the airframe 1, 3 is an upper surface plate arranged above the lower surface plate 2 so as to be able to move up and down and rotate freely, 4 Reference numeral denotes a rotatable sun gear located at the center of the lower stool 2, and reference numeral 5 denotes a rotatable internal gear surrounding the outer periphery of the lower stool 2.

The lower platen 2 and the two gears 4 and 5 are connected to a drive source (not shown) so that the lower platen 2 is driven at a required speed in a required direction. In the lowered position for polishing, the hook 7 is
, And is driven at a required speed in a required direction by a drive source (not shown) via the driver 8. In the figure, reference numeral 9 denotes an air cylinder for moving the upper stool 3 up and down.

As can be seen from FIG. 3, a plurality of work carriers 10 having a gear 10a on the outer periphery are arranged at equal intervals around the sun gear 4 on the lower surface plate 2, as shown in FIG. The outer gear 10 a meshes with the sun gear 4 and the internal gear 5, and revolves around the sun gear 4 while rotating by rotation of the two gears 4, 5. Then, both surfaces of the work W accommodated in the work holding holes 10b of the respective carriers 10 that move in the planetary motion are polished to the polishing pads 11 adhered to the working surfaces of the rotating upper and lower platens 2 and 3.
It is configured to be polished.

The upper surface plate 3 is provided with a processing liquid supply mechanism 13 for supplying a polishing liquid and a rinsing liquid to the work W. The machining liquid supply mechanism 13 selectively supplies a polishing liquid or a rinsing liquid to the workpiece W from a liquid supply port 14 opened on a work surface of the upper surface plate 3 through a gutter 15 and a liquid supply tube 16 communicating with a liquid supply source. After the polishing with the polishing liquid is performed, a rinse liquid is supplied.

The machine body 1 is provided with the machining fluid removing mechanism 6 for removing machining fluid remaining on the work surfaces (pad surfaces) of the surface plates 2 and 3. The working fluid removing mechanism 6 in this embodiment is for removing the working fluid on the lower stool 2, and as shown in FIG. 2, has one or a plurality of water absorbing ports 18 on a lower water absorbing surface 17 a. Arm 19 for supporting the water absorbing head 17
Is supported by a supporting device 20 so as to be vertically movable and extendable and contractable, and the water suction port 18 is connected to a suction pump 22 through a through hole 21 inside the support arm 19. As a result, the water absorption head 17 sucks the processing liquid on the lower surface plate 2 (the position shown in FIG. 2) and the standby position away from the lower surface plate 2 (FIG. 1).
(Position shown in FIG. 2). And
In the water absorbing position, the working fluid is sucked from the water absorbing port 18 while moving in the radial direction of the lower stool 2 with the water absorbing surface 17a of the lower surface of the water absorbing head 17 in contact with the work surface of the lower stool 2. Is configured.

The water absorbing surface 17a of the water absorbing head 17 has
A brush 23 having a relatively short length is provided, and the water absorption surface 17a comes into contact with the work surface of the surface plate through the brush 23, whereby the water absorption surface 17a and the work surface are separated. While securing a moderate gap for water absorption between,
Pads can also be dressed. In addition, it is possible to prevent foreign substances from being indiscriminately sucked.

In the polishing apparatus having the above configuration, the work W is polished in the same manner as a known polishing apparatus.
That is, the work W is held in the work W holding hole 10 b of each work carrier 10, and the carriers 10 are planetary-moved around the sun gear 4 by the rotation of the sun gear 4 and the internal gear 5, while rotating the upper and lower carriers. The work W is polished by sandwiching the work W from both sides by the surface plates 2 and 3. At this time, the polishing liquid is supplied to the polishing section from the processing liquid supply mechanism 13 through the upper surface plate 3.

When the polishing of the workpiece W by the polishing liquid is completed, the supply of the polishing liquid from the working liquid supply mechanism 13 is stopped, and instead, a rinse liquid such as pure water is supplied to the work W to wash out the polishing liquid. After that, the rotation of both the stools 2 and 3 and the two gears 4 and 5 are stopped. Then, the upper platen 3 is raised, and the processed work is carried out by a loading mechanism (not shown).

When the unloading of the processed work is completed, as shown in FIGS. 2 and 3, the support arm 19 of the working fluid removing mechanism 6 is extended, and the water absorbing head 17 moves to the water absorbing position on the lower surface plate 2. The brush 23 provided on the water absorbing head 17 contacts the work surface of the lower stool 2. When the lower platen 2 rotates at a slow speed and the water absorbing head 17 moves once or plural times in the radial direction of the lower platen 2, the rinsing liquid on the work surface is sucked from the water inlet 18. Removed. At this time, the brush 23 on the lower surface of the water absorbing head 17 keeps an appropriate suction gap between the water absorbing head 17 and the work surface of the lower stool 2 and removes foreign substances such as sludge on the work surface. The pad is dressed by rubbing the work surface. Further, while the suction operation is being performed, each of the work carriers 10 is caused to rotate only at a fixed position by controlling the number of rotations and the rotation direction of the sun gear 4 and the internal gear 5, and obstructs water absorption by the water absorption head 17. It is held so that it does not become.

When the suction of the rinsing liquid is completed, the support arm 19 is retracted, the water absorbing head 17 is shifted to the standby position, and the unprocessed work is supplied to each work carrier 10 to perform the next processing.

In the first embodiment, the water absorbing head 17 of the working fluid removing mechanism 6 is formed to be smaller than the width of the working surface of the lower stool 2, and the working fluid is moved in the radial direction on the working surface. However, the water absorption head 17 can be formed to have the same length as the width of the work surface, whereby the lower platen 2 is rotated while the water absorption head is stationary on the work surface. The working fluid can be sucked in only by itself.

Further, in the above embodiment, the brush 23 is provided on the water absorbing surface 17a of the water absorbing head 17, but it is not always necessary to provide such a brush 23, and by providing a projection having an appropriate height, the suction is performed. A gap may be ensured.

Further, in the above embodiment, the water absorbing head 17 of the machining fluid removing mechanism 6 is configured to shift between the water absorbing position and the standby position by the expansion and contraction of the support arm 19. By turning around the support shaft 25, it is also possible to configure so as to shift between the water absorption position and the standby position.

Further, in the above-described embodiment, the processing fluid removal mechanism 6 sucks the processing fluid on the lower platen 2. However, by configuring the water absorbing head 17 so as to be able to be turned upside down, one processing fluid is removed. The upper and lower platens 2,
The working fluid remaining on the work surface of No. 3 can be sucked.

However, it is also possible to provide another working fluid removing mechanism 6 similar to that of the first embodiment so that the working fluid adhering to the work surface of the upper stool 3 is sucked. In this case, it goes without saying that in the working fluid removing mechanism 6 for the upper stool 3, the water absorbing head 17 is provided upward.

[0028]

As described above, according to the present invention, a processing liquid such as a polishing liquid or a rinsing liquid remaining on the work surface of the surface plate can be easily and automatically removed by a water absorbing head connected to a suction pump. it can. For this reason, not only the removal efficiency is very good, but also the processing liquid does not adhere to hands or clothes, so that it is safe and sanitary.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing one embodiment of a planar polishing apparatus according to the present invention.

FIG. 2 is an enlarged sectional view of a main part of FIG.

FIG. 3 is a plan view of a main part of FIG. 1;

[Explanation of symbols]

2 Lower surface plate 3 Upper surface plate 4 Sun gear 5 Internal gear 6 Working fluid removing mechanism 10 Work carrier 13 Working fluid supply mechanism 17 Water absorption head 18 Water absorption port 22 Suction pump 23 Brush

Claims (7)

[Claims] 1. A sun gear and an internal gear which are concentrically located, a plurality of work carriers which mesh with these two gears and perform planetary motion around the sun gear, and a work held by the work carrier is moved from both sides. Upper and lower platens that are sandwiched and polished,
A machining fluid supply mechanism for supplying a machining fluid to the polishing unit, and a machining fluid removal mechanism for removing a machining fluid remaining on the work surface of the surface plate, wherein the machining fluid removal mechanism is connected to a suction pump. It has a water absorbing head provided with a communicating water inlet, and the water absorbing head is freely movable between a water absorbing position on the surface of the surface plate for sucking the working fluid and a standby position away from the surface plate. Polishing machine with a working fluid removal mechanism. 2. The planar polishing apparatus according to claim 1, wherein
The water absorbing head in the machining fluid removing mechanism is configured to suck the machining fluid while moving in a radial direction of the surface plate at a fixed position in a circumferential direction of the surface plate. 3. The planar polishing apparatus according to claim 1, wherein the water absorbing head in the working fluid removing mechanism has a brush that comes into contact with a work surface of the surface plate. 4. The planar polishing apparatus according to claim 1, further comprising a set of the working fluid removing mechanism, and a water absorbing head which can be turned upside down.
It is characterized by being able to absorb the working fluid on the working surfaces of the upper and lower platens. 5. The planar polishing apparatus according to claim 1, further comprising two sets of said working fluid removing mechanisms, wherein said removing means removes working fluid on the working surfaces of the upper and lower platens. It is characterized by being able to absorb water individually. 6. A sun gear and an internal gear which are concentrically arranged, a plurality of work carriers which mesh with these two gears and make a planetary movement around the sun gear, and a work held by the work carrier from both sides. A method for removing a working fluid remaining on a work surface of a surface plate after processing of a work in a flat surface polishing apparatus having upper and lower surface plates for sandwiching and polishing the surface, wherein a water suction port communicating with a suction pump is provided. The water absorbing head provided is brought into contact with the work surface of the surface plate at a fixed position in the circumferential direction of the surface plate,
A method for removing a working fluid, wherein the working fluid on the work surface is sucked by the water absorbing head while rotating the surface plate. 7. The method according to claim 6, wherein the processing liquid is sucked while moving the water absorbing head in a radial direction of the surface plate.