JPH11224644A - Semiconductor fabrication device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce vibration generated by the rotation of discs in a semiconductor fabrication device. SOLUTION: Rotating motors 7a, 7b are fixed back to back. Discs having the same size and weight are placed at both ends of the rotating motors 7a, 7b individually. The rotating motors 7a, 7b cancel the vibration generated by the rotation of the discs 6a, 6b by rotating the discs 6a, 6b reversely to each other at the same timing. Thereby, the vibration is prevented from being transmitted through a chamber to a wafer transferring system.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus for processing a wafer while rotating the disk while holding the wafer in a chamber in which the pressure is lower than the atmospheric pressure. The present invention relates to an ion implanter having a holding disk.

[0002]

2. Description of the Related Art FIG. 23 is a schematic diagram showing the relationship between an ion implanter and a wafer transfer system. FIG. 23 shows a cross section viewed from the side of the ion implanter and the wafer transfer system. In the ion implanter 1, ions are implanted into the wafer 2. After the processing of the wafer 2 is completed by the ion implanter 1, the wafer 2 is transferred from the ion implanter 1 to the cassette 3 by the shuttle 4.
Transported to During the ion implantation, the wafer 2 is irradiated with the ion beam 11 while the wafer 2 is held on the disk 6 inside the chamber 5. FIG. 24 is a front view showing the disk 6 viewed from the front. However, the scales of FIG. 23 and FIG. 24 are different. As shown in FIG. 24, a plurality of wafers 2 are held on the surface of the disk 6. At the time of ion implantation, the disk 6
Driven by and spinning. The rotation motor 7 is fixed to the housing 8 by a motor fixing bracket 9. The wafer transfer system includes a cassette 3, a shuttle 4, and a horizontal disk 10. Disk 6
When the ion implantation is completed, the disk 10 rotates and becomes the disk 10 at the position shown by the two-dot chain line for carrying the wafer 2.

FIG. 25 is a schematic view of an ion implanter. FIG. 25 shows a cross section of the chamber 5 of the ion implanter as viewed from above. As shown in FIG.
Support the housing 8. Scan shaft 14
Is driven by the scan shaft motor 15,
The ion beam 11 scans the wafer 2 by moving the housing 8 in the direction indicated by the arrow 16.

The disk 6 has a diameter of about 1 m and weighs about 50 kg. The rotation motor 7 directly connected to the disk 6 has an outer diameter of about 20 cm. This rotation motor 7 is used for ion implantation.
It rotates at a rotation speed of about 1000 rpm. Further, the scanning motor 15 rotates at a rotational speed of several hundred rpm during ion implantation. By these motors 7 and 15,
Since the disk 6 rotates and moves, vibration occurs. This vibration is transmitted to the wafer transfer system as indicated by an arrow 17 in FIG. 23, and for example, a wafer 2a protruding from the cassette 3 may come out.

[0005]

The conventional semiconductor manufacturing apparatus is constructed as described above.
Vibration occurs because the disk 6 is driven by such a driving means. 2. Description of the Related Art A semiconductor device, such as a wafer, which has been processed by a semiconductor manufacturing apparatus, is waiting for a transport process, for example, as a post-process of the semiconductor device. For example, there is a problem that this vibration may cause a conveyance abnormality when the conveyance is performed in the subsequent process.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is intended to suppress a vibration accompanying the drive of a disk of a semiconductor manufacturing apparatus and to transport a semiconductor device such as a processed wafer. An object of the present invention is to reduce abnormalities caused by vibration in a post-process of the processing.

[0007]

According to a first aspect of the present invention, a semiconductor manufacturing apparatus supports first and second disks provided inside a chamber for holding a wafer, and supports the first and second disks. And driving means for rotating the first and second disks in the circumferential direction, respectively, and supporting means attached to the chamber for supporting the driving means, wherein the driving means comprises: The apparatus is characterized in that the first and second disks are driven such that the vibration generated when the first disk is driven is canceled by the vibration generated when the second disk is driven.

[0008] A semiconductor manufacturing apparatus according to a second aspect of the present invention comprises:
In the semiconductor manufacturing apparatus of the invention, the first and second
Are provided at symmetrical positions with respect to the drive unit, and the drive unit rotates the first and second disks in opposite directions at substantially the same timing.

According to a third aspect of the present invention, in the semiconductor manufacturing apparatus according to the first aspect, the support means includes one shaft, and the first and second disks maintain a predetermined distance from the shaft. And the drive unit is provided in the same direction, and the first and second driving means are arranged to cancel the vibration generated when the first disk is driven on the shaft by the vibration generated when the second disk is driven. 2 is driven.

According to a fourth aspect of the present invention, there is provided a semiconductor manufacturing apparatus comprising:
In the semiconductor manufacturing apparatus of the present invention, a sensor for detecting vibrations of the first and second disks, and the first means for controlling the driving means based on a detection result of the sensor.
And a control circuit for adjusting the relationship between the centers of gravity of the second disks.

According to a fifth aspect of the present invention, there is provided a semiconductor manufacturing apparatus, comprising: a disk provided inside a chamber for holding a wafer; driving means for supporting the disk and rotating the disk in a circumferential direction; A supporting means attached to the chamber for supporting a driving means; and an auxiliary means abutting on the disk to assist in supporting the disk, the auxiliary means abutting on the disk and supporting the disk. Rotates with the rotation of
An auxiliary wheel having elasticity, and auxiliary wheel supporting means attached to the chamber for rotatably supporting the auxiliary wheel are provided.

According to a sixth aspect of the present invention, there is provided a semiconductor manufacturing apparatus comprising:
In the semiconductor manufacturing apparatus of the present invention, the supporting means supports the driving means such that the driving means moves on a predetermined straight line, and the auxiliary wheel supporting means includes a supporting wheel parallel to the predetermined straight line. The auxiliary wheels are supported so as to move on a straight line at the same speed as the driving means.

According to a seventh aspect of the present invention, there is provided a semiconductor manufacturing apparatus provided in a chamber, the disk having a surface for holding a wafer, and a disk for supporting the disk and rotating the disk in a circumferential direction. Driving means, supporting means attached to the chamber to support the driving means, and a sensor for detecting the vibration of the disk, the disk is movable according to the detection result of the sensor It is characterized by further having a heavy weight.

According to an eighth aspect of the present invention, there is provided a semiconductor manufacturing apparatus comprising:
In the semiconductor manufacturing apparatus of the invention, the weight is provided on a back surface of the disk, and is configured to be movable along a plurality of straight lines extending radially from the center of the disk.

According to a ninth aspect of the present invention, there is provided a semiconductor manufacturing apparatus comprising:
In the semiconductor manufacturing apparatus according to the present invention, the weight is a part of the disk and includes a plurality of regions movable in one axis direction.

A semiconductor manufacturing apparatus according to a tenth aspect of the present invention is the semiconductor manufacturing apparatus according to the seventh aspect, wherein:
It further comprises a cavity filled with a magnetic fluid, wherein the weight is a magnetic material in the magnetic fluid.

In a semiconductor manufacturing apparatus according to an eleventh aspect of the present invention, in the semiconductor manufacturing apparatus of the tenth aspect, the disk further has a plurality of electromagnets radially arranged on a back surface side, and the electromagnet includes: It is controlled according to the detection result of the sensor.

A semiconductor manufacturing apparatus according to a twelfth aspect of the present invention is the semiconductor manufacturing apparatus according to the tenth aspect, further comprising an electromagnet provided on a side surface of the disk so as to be separated from the disk. On / off control is performed according to the detection result of the sensor and in synchronization with the rotation of the disk.

According to a thirteenth aspect of the present invention, there is provided a semiconductor manufacturing apparatus provided inside a chamber and having a surface for holding a wafer, and a disk for supporting the disk and rotating the disk in a circumferential direction. A driving unit; a supporting unit attached to the chamber for supporting the driving unit; and a shock absorber for buffering vibration transmitted from the driving unit to the chamber.

According to a fourteenth aspect of the present invention, in the semiconductor manufacturing apparatus of the thirteenth aspect, the supporting means further includes a scan shaft for moving the disk in one axial direction by moving the driving means. The shock absorber is mounted between the scan shaft and the chamber.

According to a fifteenth aspect of the present invention, in the semiconductor manufacturing apparatus of the thirteenth aspect, a sensor for detecting a force applied from the driving means to the supporting means,
A fixing device provided for fixing the driving unit to the support unit, the fixing unit being capable of adjusting a force applied to the driving unit in accordance with a detection result of the sensor, further comprising: It is characterized in that it exists between a supporting means and the driving means.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, a semiconductor manufacturing apparatus according to a first embodiment of the present invention will be described with reference to FIGS. FIGS. 1 and 2 show an ion implanter as an example of the semiconductor manufacturing apparatus according to the first embodiment. FIG. 1 is a schematic view of the semiconductor manufacturing apparatus according to the first embodiment as viewed from the side, and FIG. 2 is a schematic view of the semiconductor manufacturing apparatus as viewed from the front. The semiconductor manufacturing apparatus shown in FIGS. 1 and 2 is provided with a chamber 5 for forming an atmosphere which is more dilute than the atmosphere, as in the conventional case. At the time of ion implantation, the inside of the chamber 5 is almost in a vacuum state.

While the wafer 2 is held in the chamber 5 and ion implantation is performed on the wafer 2, the semiconductor manufacturing apparatus according to the first embodiment has the first and second semiconductor devices having substantially the same shape and weight. Second disk 6
a, 6b. In the semiconductor manufacturing apparatus according to the first embodiment, the disks 6a and 6b are provided at symmetrical positions with respect to the rotating motors 7a and 7b as driving means. The symmetrical positions are preferably the rotating shafts 21a and 21 that apply a driving force to the disks 6a and 6b, respectively.
1b is the position where the center coincides. Here, the rotation motors 7a and 7b both rotate in the same direction, for example, clockwise. However, since the rotation motors 7a and 7b are arranged back to back, the disks 6a and
The rotation directions of 6b are opposite to each other. As shown in FIG. 2, when viewed from the front, the disk 6a rotates in the direction of the arrow 23 (clockwise), while the disk 6b on the back surface rotates in the direction opposite to the arrow 23 (counterclockwise). Rotate. The rotation motors 7a, 7b are motor fixing brackets 9a, 9
It is fixed to the housing 20 by b. This housing 20 corresponds to the housing 8 shown in FIG. The disks 6a and 6b are supported by a scan shaft 14 attached to a housing 20, similarly to a conventional semiconductor manufacturing apparatus. The movement of the disks 6a and 6b in the direction of the arrow 16 is the same as in the prior art. The disks 6a and 6b rotate in the direction of the arrow 22 each time the ion implantation on one of the disks is completed in order to receive alternate ion implantation and to carry the wafer 2 after the ion implantation.

Rotating motors 7a and 7b as driving means
Drives the disks 6a and 6b in opposite directions at substantially the same timing and at substantially the same rotational speed. By driving in this manner, the vibrations generated when the disks 6a and 6b are activated cancel each other, and the vibration transmitted to the wafer transfer system is reduced.

In the first embodiment, the case where the disks 6a and 6b have the same shape and the same weight are described. However, even if the disks 6a and 6b have different shapes, the moments of inertia of the disks 6a and 6b are different. If they are the same, the same effects as those of the semiconductor manufacturing apparatus described in the first embodiment can be obtained. However, even if the moment of inertia is different, the vibration can be reduced as compared with the conventional case. The scan shaft 14 may be attached to any of the side surfaces 5a to 5d of the chamber 5, and has the same effects as those of the semiconductor manufacturing apparatus described in the first embodiment. The number of disks may be an even number. For example, in the case of four disks, the disks 5a and 5b and the disks 5c and 5d are mounted on the four surfaces of the housing 25 as shown in FIG.
What is necessary is just to arrange | position at the position which becomes mutually symmetrical across 5. The housing 25 houses, for example, four motors. The housing 25 corresponds to the housing 20, and the relationship with other members is described in Embodiment 1.
Is the same as the relationship between the housing 20 and other members.

Embodiment 2 FIG. In the semiconductor manufacturing apparatus according to the first embodiment, when the centers of gravity of the disks 6a and 6b are displaced from the centers of the disks, one function of alleviating vibration accompanying rotation of the disks 6a and 6b is provided by the semiconductor manufacturing apparatus according to the second embodiment. Have. Second Embodiment A semiconductor manufacturing apparatus according to a second embodiment will be described with reference to FIGS. FIG. 4 is a block diagram showing a system for controlling a sensor for detecting vibration generated by a disk and a rotation motor. The vibration generated by the rotational movement of the disks 6a and 6b due to the displacement of the centers of gravity of the disks 6a and 6b is detected by, for example, a sensor 26 attached to the housing 20. When the vibration is detected by the sensor 26, the control circuit 27 slightly changes the speed of the rotation motors 7a and 7b to change the position where the centers of gravity of the disks 6a and 6b overlap. The control circuit 27 searches for a state in which the vibration becomes minimum using the sensor 26, and makes the rotation speeds of the rotation motors 7a and 7b the same when the vibration becomes minimum. FIG.
FIG. 3 is a conceptual diagram showing the relationship between the position of the center of gravity of two disks and the direction of a force generated thereby. In the state shown in FIGS. 5A and 5C, the center of gravity 2
8 and the center of gravity 29 of the disk 6b are located at positions rotated by 180 degrees about the rotation axis 21a.
The centrifugal force applied to 29 has a relation of canceling. FIG.
In the state shown in FIG. 5B and FIG.
Center of gravity 28 of disk 6b and center of gravity 21 of disk 6b
, The centrifugal force is generated in the directions of arrows 30 and 31 (the longitudinal direction of the scan shaft 14), and the sum of the centrifugal forces is applied to the scan shaft 14. By controlling the rotation of the disks 6a and 6b by the control circuit 27 to achieve such a state, the force in the direction perpendicular to the longitudinal direction of the scan shaft 14 can be reduced, and the disks 6a and 6b can be controlled.
By rotating b, the vibration generated on the scan shaft 14 can be reduced.

Embodiment 3 In the semiconductor manufacturing apparatus according to the first embodiment, disks 6a and 6
Although b is provided on the opposite side with respect to the rotation motors 7a and 7b, the effect can be obtained if it is provided on the same side as shown in FIGS. The interval between the disks 6e and 6f is constant. The rotation motor drives the disk 6f so as to generate vibration in a mode that is generated when the disk 6e is driven and cancels the vibration transmitted through the scan shaft 14. For this purpose, torque must be applied to the rotating shafts 21e and 21f by a rotating motor in a predetermined relationship. Here, the disks 6e and 6f are rotated almost simultaneously in opposite directions, but the disks 6e and 6f
In order to cancel the vibrations that occur, the timings at which the disks 6e and 6f start to rotate may be shifted, or the disks 6e and 6f may be rotated in the same direction. Further, by the configuration described in the second embodiment, the rotational speed can be adjusted to adjust the positional relationship between the centers of gravity of the disks 6e and 6f, thereby reducing the vibration.

Embodiment 4 The first embodiment and the third embodiment may be combined, and the same effects as those of the semiconductor manufacturing apparatus of the first embodiment and the semiconductor manufacturing apparatus of the third embodiment can be obtained. 8, the disks 6g and 6h are provided on the opposite sides of the housing 32, and the disks 6i and 6j are provided on the opposite sides of the housing 33. The housings 32 and 33 are connected by a connecting member 34. For example, FIG.
Is attached to the scan shaft 14 shown in FIG. When the structure of FIG. 8 is attached to the scan shaft 14 of FIG. 7, the disks 6g and 6i or the disks 6h and 6j are arranged vertically instead of being arranged sideways like the disks 6e and 6f. When a wafer processed using these disks 6g to 6j is carried, the disks 6h to 6j rotate around the intermediate point of the connecting member 34.

Embodiment 5 Next, a semiconductor manufacturing apparatus according to a fifth embodiment will be described with reference to FIGS. 9 and 10 show an ion implanter as an example of the semiconductor manufacturing apparatus. FIG. 9 is a schematic view of the semiconductor manufacturing apparatus viewed from the side, and FIG. 10 is a schematic view of the semiconductor manufacturing apparatus viewed from the front. 9 and 10, the same reference numerals as those shown in FIG. 23 or FIG.
3 or a portion corresponding to the same reference numeral in FIG.
The difference between the semiconductor manufacturing apparatus shown in FIGS. 9 and 10 and the semiconductor manufacturing apparatus shown in FIGS.
Is provided with auxiliary means for assisting the support of the disk 6 vertically below.

The auxiliary means comes into contact with the disk 6 and rotates as the disk 6 rotates. The auxiliary means 35 has elasticity, and an auxiliary means mounted on the chamber 5 for rotatably supporting the auxiliary wheel 35. And a wheel support 36. The auxiliary wheel 35 is formed of an elastic body, for example, hard rubber. When the disk 6 rotates clockwise, the auxiliary wheels 3
5 rotates counterclockwise as indicated by arrow 38. The disk 6 is horizontally moved by the scan shaft 14 in the direction of arrow 16. The auxiliary wheel support 36 moves horizontally along the side wall of the chamber 5 at the same speed as the horizontal movement of the disk 6. Therefore, the distance between the auxiliary wheel 35 and the disk 6 is kept constant, and the auxiliary wheel 35
The force that supports is almost unchanged. In addition, the auxiliary wheels 35
Is smoothly rotated by the auxiliary wheel support 36 and is made of an elastic body, so that it does not become a new vibration source by rotating while being in contact with the disk 6. Auxiliary wheel 35
Moves passively, and there is no motor for driving the auxiliary wheel 35 on the auxiliary wheel support 36.

As described above, the load caused by the weight of the disk 6 on the rotating motor stored in the scan shaft 14 and the housing 8 is reduced by the auxiliary wheels 35, and the vibration generated when the disk 6 rotates is suppressed. You. In the fifth embodiment, the case where the number of the auxiliary wheels 35 is one has been described. However, the number of the auxiliary wheels may be plural. I just need.

Embodiment 6 FIG. Next, a semiconductor manufacturing apparatus according to a sixth embodiment will be described with reference to FIGS. FIGS. 11 to 13 show a disk of an ion implanter and members around the disk as an example of a disk of a semiconductor manufacturing apparatus. FIG. 11 is a schematic view of the disk of the semiconductor manufacturing apparatus as viewed from the side, and FIG. 12 is a schematic view of the disk of the semiconductor manufacturing apparatus as viewed from the back. FIG. 13 is a conceptual diagram illustrating control of the rotation motor when suppressing vibration. 11 to 13, the same reference numerals as those shown in FIG. 23 or FIG. 24 correspond to the same reference numerals in FIG. 23 or FIG. Therefore, FIGS.
Although not shown, the disk 6 shown in FIGS.
Exist in the chamber 5 in the same manner as in the prior art in relation to other members. The difference between the semiconductor manufacturing apparatus shown in FIGS. 11 to 13 and the semiconductor manufacturing apparatus shown in FIGS. 23 to 25 is that a weight for aligning the center of gravity of the disk 6 with the center of the disk 6 is provided on the back surface of the disk 6, Is provided on the surface of the housing 8, and its weight is configured to be able to move on the disk 6 according to the detection result of the sensor.

As shown in FIGS. 11 and 12, a plurality of weights 40 are arranged on the back surface of the disk 6. Each weight 40 is supported by a rod 41. Weight 4
The hole drilled in the center of 0 has a female thread, and a rod 41 with a male thread is passed through this screw hole. The rod 41 is rotated by an actuator 42 provided at the center of the back surface of the disk 6. When the rod 41 rotates, the weight 40 moves away from the center of the disk 6 or approaches the center according to the rotation direction. That is, the weight 40 can move radially. Such a configuration is suitable for correcting the eccentricity of the disk 6 because the moving direction of each weight 40 is limited to the diametric direction.

The balance of the disk 6 is poor,
When the position of the center of gravity of the disk 6 does not coincide with the rotation axis 21 of the disk 6, the center of gravity of the disk 6 moves by changing the position of the weight 40, and the position of the center of gravity of the disk 6 and the rotation axis 2
1 can be matched. Vibration is suppressed by matching the position of the center of gravity of the disk 6 with the rotating shaft 21. The position of the center of gravity of the disk 6 is completely
Even if it does not come on 1, the effect of suppressing vibration occurs only by the position of the center of gravity approaching the rotating shaft 21.

Next, the position adjustment of the weight 40 of the disk 6 will be described with reference to FIG. In FIG. 13, the weight 4
Although the description of 0 is omitted, it is assumed that the weight 40 exists as in FIGS. First, weight 40
The disk 6 is rotated without moving. If the disk 6 is eccentric, the disk 6 vibrates, and the vibration is transmitted to the housing 8 and the sensor 43 detects the vibration. The control circuit 44 is notified by the sensor 43 that vibration has occurred. The control circuit 44 instructs the actuator 42 to move the weight 40 while searching for a state in which the vibration of the disk 6 is reduced based on the vibration information provided from the sensor 44. That is, it is only necessary that the vibration be reduced by moving the weight 40. If the vibration increases, the weight 40 is moved toward the opposite side or the movement is stopped. The weight 40 is arranged so that the vibration of the disk 60 is minimized by repeating such adjustment.

In the description of the sixth embodiment, the case where there are a plurality of weights 40 has been described. However, even if there is only one weight, the weight is moved to an arbitrary position on the disk 6 while rotating the disk 6. If possible, Embodiment 6
The same effects as those described above can be obtained.

In the above description of the sixth embodiment, the sensor 43 is attached to the housing 8. However, the sensor 43 may be attached to a rotating motor inside the housing 8, or may be attached to the disk 6, or A sensor that senses vibration by contact may be used, and the same effects as in the sixth embodiment can be obtained.

Embodiment 7 In the sixth embodiment, the eccentricity of the disk 6 is corrected by moving the weight 40 attached to the outside of the disk 6, but the eccentricity of the disk may be corrected by deforming the disk. In the semiconductor manufacturing apparatus according to the seventh embodiment shown in FIGS. 14 and 15, the end of disk 6k is deformed. An area 45 at the end of the disk 6k is configured to be movable in one axial direction.

The area 45 is formed by the actuator not shown in FIG. 14 and FIG.
Move while rotating. Area 45 of disk 6k
By moving the center of gravity of the disk 6k to the center of the disk 6k. However, even if the center of gravity of the disk 6k does not coincide with the center of the disk 6k, the vibration decreases as they approach each other. As described in the sixth embodiment, the semiconductor manufacturing apparatus of the seventh embodiment includes the sensor 43 and the control circuit 44 shown in FIG. 13 so that the vibration is reduced while rotating the disk 6k. Adjusted.

Embodiment 8 FIG. In the sixth embodiment, the eccentricity of the disk 6 is corrected by moving the solid weight 40 attached to the outside of the disk 6, but a capsule in which a fluid is sealed is attached to the outside of the disk 6,
The eccentricity may be corrected by partially changing the weight of the fluid inside the capsule.

The semiconductor manufacturing apparatus according to the eighth embodiment will be described with reference to FIGS. 16 and 17 show a disk of an ion implanter as an example of a disk of the semiconductor manufacturing apparatus. FIG. 16 is a schematic diagram of a disk of the semiconductor manufacturing apparatus according to the eighth embodiment as viewed from the back surface, and FIG. 17 is a schematic diagram of a disk of the semiconductor manufacturing device of the eighth embodiment viewed from the side. A capsule 50 enclosing a magnetic fluid is attached to the back surface of the disk 6. Hereinafter, this capsule is called a balance capsule. The balance capsule 50 has a donut shape when viewed from the back surface, and has a kamaboko shape having a thickness closer to the center of the disk 6 when viewed from the side surface. A plurality of electromagnets 51 are attached to the back surface of the balance capsule 50, that is, the surface that is not in contact with the back surface of the disk 6. The electromagnets 51 are radially arranged around the rotation shaft 21 as viewed from the back.

When adjusting the center of gravity of the disk 6, one or more of the electromagnets 51 are activated, and the magnetic substance in the magnetic fluid is attracted to the electromagnet 51. Then, since the weight of the attracted portion increases, the center of gravity of the disk 6 moves. ON / OFF of these electromagnets 51 is individually controlled. Further, the magnetic force of the electromagnet 51 may be changed individually. Adjustment of the center of gravity of the disk 6 is performed in the same manner as in the sixth embodiment. The semiconductor manufacturing apparatus according to the eighth embodiment includes a sensor 43 and a control circuit 4 shown in FIG.
4, the on / off of the electromagnet 51 or the magnetic force thereof is adjusted so that the vibration is reduced while rotating the disk 6. In such a configuration, dust generation is suppressed because there is no movable part for adjusting the eccentricity.

Embodiment 9 In the eighth embodiment, the eccentricity is corrected by partially changing the weight of the magnetic fluid inside the balance capsule 50 attached to the outside of the disk 6 by the plurality of electromagnets 51. The weight of the magnetic fluid may be partially changed. FIG. 18 shows a disk of an ion implanter and members around the disk in the configuration of the semiconductor manufacturing apparatus according to the ninth embodiment. As shown in FIG. 18, the inside of the disk 61 is hollow. The magnetic fluid 55 is sealed in the hollow portion of the disk 6l. The vibration of the disk 6l is detected by the sensor 56. A current is supplied to the electromagnet 57 from a control circuit (not shown) based on the detection result of the sensor 56, and the electromagnet 57 is controlled to be turned on and off by the control circuit. The electromagnet 57 is fixed to a chamber or the like (not shown). For example, when the electromagnet 57 is turned on and off in synchronization with the rotation of the disk 61, the magnetic force acts only on a predetermined portion of the disk 61, and the magnetic substance in the magnetic fluid can be attracted to that position. Where the magnetic material is attracted and the magnetic material is dense, the portion becomes heavy, and the electromagnet 57 suppresses the vibration together with the force for attracting the disk 6l. The on / off control of the electromagnet 57 is performed while rotating the disk 61 similarly to the sixth embodiment and the like, and a point where the vibration is reduced is searched.

Embodiment 10 FIG. FIG. 19 is a schematic diagram showing a partial cross section of a semiconductor manufacturing apparatus according to Embodiment 10 of the present invention. The semiconductor manufacturing apparatus shown in FIG. 19 is an ion implanter. The semiconductor manufacturing apparatus according to the tenth embodiment shown in FIG. 19 includes a chamber 5 for forming an atmosphere more dilute than the atmosphere therein, and a disk 6 having a surface for holding the wafer 2 in the chamber 5. A rotating motor 7 as driving means for supporting the disk 6 and rotating it in the circumferential direction, and supporting means attached to the chamber 5 for supporting the rotating motor 7. . This support means includes a certain housing 8, a scan shaft 14, a support base 71, and a scan shaft motor 15. The shock absorber 70 is mounted between the support 5 supporting the scan shaft 14 and the chamber 5.

The difference between the semiconductor manufacturing apparatus according to the tenth embodiment shown in FIG. 19 and the conventional semiconductor manufacturing apparatus shown in FIG. 24 is that the scan shaft 14 is mounted on a support 71 and the support 71 is 70 is attached to the chamber 5. Therefore, the vibration transmitted from the scan shaft 14 to the chamber 5 is reduced by the shock absorber 70. In other words, both the vibration generated by rotating the disk 6 and the vibration generated by moving the scan shaft 14
Is attenuated. The shock absorber 70 is configured by a member that absorbs vibration, such as a spring or rubber.

Embodiment 11 FIG. In the tenth embodiment, the case where the shock absorber 70 is provided between the scan shaft 14 and the chamber 5 has been described. However, as described in the eleventh embodiment, the shock absorber is provided between the support unit and the driving unit. May be provided. FIG. 20 is a schematic diagram showing the relationship between the shock absorbers and sensors used in the eleventh embodiment and the driving means. As shown in FIGS. 20 and 21, a fixing device 60 is attached between the housing 8 and the rotation motor 7. The sensor 61 is also mounted between the housing 8 and the rotation motor 7 similarly to the fixing device 60. The distribution of the force by which the rotating motor 7 presses the housing 8 is detected by a plurality of sensors 61 mounted around the rotating motor 7. This distribution is determined by the control circuit 66. The control circuit 66 applies a force to the fixing device 60 in such a direction as to suppress the vibration of the rotation motor 7. The vibration of the rotation motor 7 is reduced by such an operation of the fixing device 60.

As shown in FIG. 22, the fixing device 60 includes a motor 65, a screw 64 attached to a rotating shaft of the motor 65, and a metal fitting 63 paired with the screw 64. Between the fixing device 60 and the rotation motor 7, there is provided a shock absorber 62 attached at the tip of a fitting 63. The screw 64 passes through a screw hole provided in the metal fitting 63, and the metal fitting 63 makes the tightening of the rotation motor 7 stronger or weaker depending on the direction in which the screw 64 rotates. The motor 65 is fixed to the housing 8. Also,
The shock absorber 62 is in contact with the rotation motor 7 and absorbs vibration transmitted from the rotation motor 7 to the housing 8.
Due to the deformation of the shock absorber 62 and the movement of the metal fitting 62, the vibration transmitted from the rotation motor 7 to the housing 8 can be reduced while the vibration of the rotation motor 7 is reduced. Here, the shock absorber 62 is provided between the fixing device 60 and the rotation motor 7, but may be provided between the fixing device 60 and the support means, and the same effect as in the eleventh embodiment is obtained.

[0048]

As described above, according to the semiconductor manufacturing apparatus of the first aspect, the vibration generated by the first disk and the vibration generated by the second disk cancel each other, so that the vibration is generated during driving. There is an effect that vibration can be reduced and vibration can be prevented from being applied to the outside of the semiconductor manufacturing apparatus, for example, the vibration can be prevented from being transmitted from the semiconductor manufacturing apparatus to the wafer transfer system via the chamber. .

According to the semiconductor manufacturing apparatus of the present invention, the first and second disks are provided at symmetrical positions with the driving means interposed therebetween, and are rotated in opposite directions at substantially the same timing. With such a configuration, there is an effect that a configuration in which the vibration generated by the first disk and the vibration generated by the second disk cancel each other can be easily realized.

According to the semiconductor manufacturing apparatus of the third aspect, it is sufficient that the vibrations of the first and second disks transmitted through one shaft cancel each other out, so that the vibration generated by the first disk can be reduced. There is an effect that a configuration in which vibrations generated by the second disk cancel each other can be easily realized.

According to the semiconductor manufacturing apparatus of the fourth aspect, the drive means can be controlled by the control circuit based on the detection result of the sensor so that the vibrations of the first and second disks are reduced. There is an effect that vibration caused by the eccentricity of the second disk can be reduced.

According to the semiconductor manufacturing apparatus of the fifth aspect, since the support of the disk is assisted by the auxiliary wheels, the supporting means can be prevented from being deformed by the force generated by the rotation of the disk, and the disk can be prevented from being deformed. This has the effect of reducing vibrations associated with the rotation of.

According to the semiconductor manufacturing apparatus of the sixth aspect, the vibration accompanying the rotation of the disk can be reduced by the auxiliary wheels in response to the linear movement while rotating the disk. .

According to the semiconductor manufacturing apparatus of the seventh aspect, the position of the center of gravity can be adjusted by the weight and the center of gravity is brought to the center of the disk, so that the vibration accompanying the rotation of the disk can be reduced. There is.

According to the semiconductor manufacturing apparatus of the present invention, each weight is configured to be movable along a plurality of straight lines extending radially from the center of the disk along the back surface of the disk. Since the eccentricity of the disk is adjusted by this, there is an effect that a semiconductor manufacturing apparatus whose center of gravity can be easily adjusted can be obtained.

According to the semiconductor manufacturing apparatus of the ninth aspect, since the plurality of weights are part of the disk,
This has the effect that the disk can be made relatively small.

According to the semiconductor manufacturing apparatus of the tenth aspect, there is an effect that dust generation can be suppressed by eliminating a movable portion.

According to the semiconductor manufacturing apparatus of the eleventh aspect, the electromagnets are arranged radially, and there is an effect that a semiconductor manufacturing apparatus whose center of gravity can be easily adjusted can be obtained.

According to the semiconductor manufacturing apparatus of the twelfth aspect, there is an effect that the number of electromagnets can be reduced.

According to the semiconductor manufacturing apparatus of the thirteenth aspect, the vibration transmitted from the support means to the chamber can be absorbed by the shock absorber, and the vibration can be prevented from being transmitted to the outside of the semiconductor manufacturing apparatus. .

According to the semiconductor manufacturing apparatus of the present invention, the vibration generated when the scan shaft moves the disk together with the vibration accompanying the rotation of the disk is absorbed by the shock absorber to reduce the vibration transmitted to the chamber. There is an effect that can be.

According to the semiconductor manufacturing apparatus of the fifteenth aspect, there is an effect that the vibration transmitted to the chamber can be reduced while suppressing the fluctuation of the motor by the fixture.

[Brief description of the drawings]

FIG. 1 is a schematic side view of one configuration of a semiconductor manufacturing apparatus according to a first embodiment.

FIG. 2 is a schematic diagram of one configuration of the semiconductor manufacturing apparatus according to the first embodiment as viewed from the front;

FIG. 3 is a schematic view of a main part of another configuration of the semiconductor manufacturing apparatus according to the first embodiment as viewed from above.

FIG. 4 is a block diagram illustrating one configuration of a semiconductor manufacturing apparatus according to a second embodiment.

FIG. 5 is a conceptual diagram showing the relationship between the position of the center of gravity of two disks and the direction of the force generated thereby.

FIG. 6 is a schematic side view of one configuration of a semiconductor manufacturing apparatus according to a third embodiment.

FIG. 7 is a schematic diagram illustrating one configuration of a semiconductor manufacturing apparatus according to a third embodiment as viewed from the front;

FIG. 8 is a schematic view of a main part of one configuration of a semiconductor manufacturing apparatus according to a fourth embodiment as viewed from above.

FIG. 9 is a schematic view of one configuration of a semiconductor manufacturing apparatus according to a fifth embodiment as viewed from the side.

FIG. 10 is a schematic diagram illustrating one configuration of a semiconductor manufacturing apparatus according to a fifth embodiment as viewed from the front;

FIG. 11 is a schematic view of a disk of a semiconductor manufacturing apparatus according to a sixth embodiment as viewed from the side.

FIG. 12 is a schematic diagram of a disk of the semiconductor manufacturing apparatus according to the sixth embodiment as viewed from the back.

FIG. 13 is a conceptual diagram illustrating control of a rotation motor when suppressing vibration in a semiconductor manufacturing apparatus according to a sixth embodiment.

FIG. 14 is a schematic diagram of a disk of the semiconductor manufacturing apparatus according to the seventh embodiment as viewed from the back.

FIG. 15 is a schematic diagram of a disk of the semiconductor manufacturing apparatus according to the seventh embodiment as viewed from the side.

FIG. 16 is a schematic diagram of a disk of the semiconductor manufacturing apparatus according to the eighth embodiment as viewed from the back surface.

FIG. 17 is a schematic side view of a disk of the semiconductor manufacturing apparatus according to the eighth embodiment.

FIG. 18 is a schematic diagram illustrating a main part of a configuration example of a semiconductor manufacturing apparatus according to a ninth embodiment;

FIG. 19 is a schematic diagram of a configuration example of a semiconductor manufacturing apparatus according to a tenth embodiment as viewed from the side.

FIG. 20 is a schematic diagram illustrating a main part of a configuration example of a semiconductor manufacturing apparatus according to an eleventh embodiment;

21 is a cross-sectional view showing a relationship between the fixing device, the rotation motor, and the housing of FIG.

FIG. 22 is a side view of an example of the configuration of the fixing device of FIG. 20.

FIG. 23 is a schematic view showing a relationship between a conventional semiconductor manufacturing apparatus and subsequent steps.

24 is a schematic diagram of the semiconductor manufacturing apparatus of FIG. 23 when viewed from above.

25 is a front view of a disk used in the semiconductor manufacturing apparatus of FIG.

[Explanation of symbols]

1 ion implanter, 5 chamber, 6, 6a-6l disk, 7 rotation motor, 14 scan shaft,
15 Scan motor, 26, 43, 56 sensors, 2
7, 44 control circuit, 35 auxiliary wheel, 36 auxiliary wheel support, 40 weight, 41 rod, 42 actuator, 50 balance capsule, 51, 57 electromagnet, 5
5 Magnetic fluid, 60 fixture, 62, 70 shock absorber.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masao Togawa 4-1-1 Mizuhara, Itami-shi, Hyogo Ryoden Semiconductor System Engineering Co., Ltd. (72) Inventor Yasushi Sho 4-1-1, Mizuhara, Itami-shi, Hyogo Ryoden Semiconductor System Engineering Co., Ltd. (72) Inventor Takaaki Inuchi 4-1-1, Mizuhara, Itami-shi, Hyogo Ryoden Semiconductor System Engineering Co., Ltd. (72) Keita Shoji 4-1-1, Mizuhara, Itami-shi, Hyogo (72) Inventor Hiroyuki Akai 4-1-1 Mizuhara, Itami-shi, Hyogo Ryoden Semiconductor System Engineering Co., Ltd. (72) Inventor Tsuneyuki Nishimura Rui Itami-shi, Hyogo Yonchome address 1 Ryoden semi-conductor system engineering shares in the company

Claims (15)

[Claims] 1. A first and second disk provided inside a chamber for holding a wafer, and supporting the first and second disks and circumferentially moving the first and second disks. A driving unit for rotating each of the driving units; and a supporting unit attached to the chamber to support the driving unit, wherein the driving unit generates vibration generated when the first disk is driven by the second disk. A semiconductor manufacturing apparatus for driving the first and second disks so that the first disk is canceled by vibration generated during driving. 2. The first and second disks are provided at symmetrical positions with respect to the driving unit, and the driving unit moves the first and second disks in opposite directions at substantially the same timing. 2. The semiconductor manufacturing apparatus according to claim 1, wherein the semiconductor manufacturing apparatus is rotated. 3. The support means includes a single shaft, the first and second disks are provided on the shaft at predetermined intervals and in the same direction, and the driving means includes The method according to claim 1, wherein the first and second disks are driven such that vibrations generated when the first disk is driven in the shaft are canceled by vibrations generated when the second disk is driven. The semiconductor manufacturing apparatus according to the above. 4. A sensor for detecting vibrations of the first and second disks, and controlling the driving means based on a detection result of the sensor to determine a relationship between the centers of gravity of the first and second disks. The semiconductor manufacturing apparatus according to claim 1, further comprising a control circuit for adjusting. 5. A disk provided inside the chamber for holding a wafer, a driving unit for supporting the disk and rotating the disk in a circumferential direction, and the chamber for supporting the driving unit. And supporting means for abutting the disk to assist in supporting the disk, wherein the auxiliary means abuts the disk and rotates with the rotation of the disk, and has elasticity. A semiconductor manufacturing apparatus comprising: an auxiliary wheel having the auxiliary wheel; and an auxiliary wheel supporting means attached to the chamber for rotatably supporting the auxiliary wheel. 6. The support means supports the drive means so that the drive means moves on a predetermined straight line, and the auxiliary wheel support means comprises a support wheel on a straight line parallel to the predetermined straight line. The semiconductor manufacturing apparatus according to claim 5, wherein the auxiliary wheel is supported so that the auxiliary wheel moves at the same speed as the driving unit. 7. A disk provided inside the chamber and having a surface for holding a wafer, a driving unit for supporting the disk and rotating the disk in a circumferential direction, and supporting the driving unit. And a sensor for detecting vibration of the disk, wherein the disk further has a movable weight in accordance with a detection result of the sensor. Semiconductor manufacturing equipment. 8. The apparatus according to claim 7, wherein the weight is provided on a back surface of the disk, and is configured to be movable along a plurality of straight lines extending radially from the center of the disk. Semiconductor manufacturing equipment. 9. The semiconductor manufacturing apparatus according to claim 7, wherein the weight is a part of the disk and includes a plurality of areas movable in one axis direction. 10. The semiconductor manufacturing apparatus according to claim 7, wherein the disk further has a cavity filled with a magnetic fluid, and the weight is a magnetic material in the magnetic fluid. . 11. The disk according to claim 10, further comprising a plurality of electromagnets radially arranged on a back surface side, wherein the electromagnets are controlled in accordance with a detection result of the sensor. 4. The semiconductor manufacturing apparatus according to claim 1. 12. An electromagnet provided on a side surface of the disk so as to be separated from the disk, wherein the electromagnet is turned on / off in response to a detection result of the sensor and in synchronization with rotation of the disk. The semiconductor manufacturing apparatus according to claim 10, wherein: 13. A disk provided inside the chamber and having a surface for holding a wafer, a driving unit for supporting the disk and rotating the disk in a circumferential direction, and supporting the driving unit. A semiconductor manufacturing apparatus, comprising: a support unit attached to the chamber to perform vibration; and a buffer that buffers vibration transmitted from the driving unit to the chamber. 14. The support unit further includes a scan shaft for moving the disk in one axis direction by moving the drive unit, and the shock absorber is attached between the scan shaft and the chamber. The semiconductor manufacturing apparatus according to claim 13, wherein: 15. A sensor for detecting a force applied to the supporting means from the driving means, and a sensor provided for fixing the driving means to the supporting means, wherein the driving means is provided in accordance with a detection result of the sensor. 14. The semiconductor manufacturing apparatus according to claim 13, further comprising a fixing device capable of adjusting an applied force, wherein the shock absorber is provided between the support unit and the driving unit.