JPH11221693A - Solder alloy - Google Patents
Solder alloyInfo
- Publication number
- JPH11221693A JPH11221693A JP2489998A JP2489998A JPH11221693A JP H11221693 A JPH11221693 A JP H11221693A JP 2489998 A JP2489998 A JP 2489998A JP 2489998 A JP2489998 A JP 2489998A JP H11221693 A JPH11221693 A JP H11221693A
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- Prior art keywords
- alloy
- weight
- tin
- bismuth
- added
- Prior art date
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は電子機器における
金属接合において使用される「はんだ合金」に係り、特
に鉛を含有しないで公害のない「はんだ合金」に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a "solder alloy" used for metal bonding in electronic equipment, and more particularly to a "solder alloy" containing no lead and having no pollution.
【０００２】[0002]
【従来の技術】はんだ接合を行う際には「はんだ合金」
は所望の接合温度を有し、接合時にぬれ性が良好である
こと、また延性，熱疲労強度，耐食性に優れていること
が必要である。さらに「はんだ合金」は環境上の配慮か
ら鉛を含有しないことが望まれる。2. Description of the Related Art When soldering, a "solder alloy" is used.
Must have a desired joining temperature, have good wettability at the time of joining, and have excellent ductility, thermal fatigue strength and corrosion resistance. Further, it is desired that the “solder alloy” does not contain lead from environmental considerations.
【０００３】従来の「はんだ合金」としては、スズ‐鉛
Sn-Pb 合金、スズ‐銀Sn-Ag 合金，スズ‐アンチモンSn
-Sb 合金、スズ- ビスマスSn-Bi 系合金等があげられ
る。[0003] Conventional solder alloys include tin-lead.
Sn-Pb alloy, tin-silver Sn-Ag alloy, tin-antimony Sn
-Sb alloy, tin-bismuth Sn-Bi alloy, and the like.
【０００４】[0004]
【発明が解決しようとする課題】代表的なスズ‐鉛Sn-P
b 合金である63Sn-37Pb （共晶温度183 ℃）は鉛を含有
するので対環境性の点で望ましくない。装置の構成上、
複数回の「はんだ接合」を行なう場合に接合温度の異な
る複数種類の「はんだ合金」を使用する必要があり、さ
らに半導体部品の信頼性を保証するために半導体部品は
ピーク温度125 ℃付近までのヒートサイクル耐久性が必
要であるために溶融温度が約１８０℃で鉛フリーの低温
「はんだ合金」が必要となる。[Problems to be Solved by the Invention] Typical tin-lead Sn-P
The alloy 63Sn-37Pb (eutectic temperature 183 ° C) contains lead, which is not desirable in terms of environmental friendliness. Due to the configuration of the device,
When performing multiple “solder joints”, it is necessary to use multiple types of “solder alloys” with different joining temperatures, and in order to guarantee the reliability of the semiconductor parts, the semiconductor parts must be used at a peak temperature of around 125 ° C. The need for heat cycle durability requires a lead-free low-temperature "solder alloy" with a melting temperature of about 180 ° C.
【０００５】スズ‐鉛Sn-Pb 合金に代わる「はんだ合
金」でPbを含有しない「はんだ合金」であるスズ‐アン
チモンSn-Sb 合金は溶融温度が232-245 ℃であり、また
スズ‐銀Sn-Ag 合金（3.5 ％銀）は共晶点が221 ℃であ
り溶融温度がそれぞれ高い。スズ- ビスマスSn-Bi 系合
金の一つであるSn7.5Bi2Ag0.5Cu は溶融温度が200-220
℃で、接合温度として240-250 を要する。またSn7.5Bi2
Ag0.5Cu のようにビスマスを数％含有するものは延性が
低く、加工性や強度上の問題があり、さらに液相線／固
相線の固液共存領域が広く部品によっては接合時にビス
マスの濃度偏析を生じ、剥離を生じる（リフトオフ現
象）場合もある。[0005] A tin-antimony Sn-Sb alloy, which is a "solder alloy" that does not contain Pb and is a "solder alloy" that replaces the tin-lead Sn-Pb alloy, has a melting temperature of 232-245 ° C and a tin-silver Sn The eutectic point of the -Ag alloy (3.5% silver) is 221 ° C and the melting temperature is high. The melting temperature of Sn7.5Bi2Ag0.5Cu, one of the tin-bismuth Sn-Bi alloys, is 200-220.
At 240C, a bonding temperature of 240-250 is required. Also Sn7.5Bi2
A material containing bismuth, such as Ag0.5Cu, has low ductility, has problems in workability and strength, and has a wide solid-liquid coexistence region of liquidus / solidus. In some cases, concentration segregation occurs and separation occurs (lift-off phenomenon).
【０００６】鉛フリーで且つ溶融温度の低い「はんだ合
金」としてスズをベースとしてインジウムを添加したSn
-In 合金が検討されている。Sn-In 合金は共晶点が118
℃である。さらに他の鉛フリーの低温「はんだ合金」で
あるBi-In 合金は共晶点が75℃である。上述した鉛フリ
ーの低温「はんだ合金」は耐熱温度が低過ぎる。この発
明は上述の点に鑑みてさなれその目的は、スズ- ビスマ
スSn-Bi 系合金を改良して、延性や熱強度に優れるとと
もに鉛フリーの低温「はんだ合金」を提供することにあ
る。[0006] Sn as a lead-free and low-melting-point “solder alloy” with tin-based indium addition
-In alloys are being considered. Eutectic point of Sn-In alloy is 118
° C. Another lead-free, low-temperature “solder alloy”, the Bi-In alloy, has a eutectic point of 75 ° C. The above-mentioned lead-free low-temperature “solder alloy” has a too low heat-resistant temperature. An object of the present invention is to improve a tin-bismuth Sn-Bi alloy to provide a lead-free low-temperature "solder alloy" which is excellent in ductility and thermal strength.
【０００７】[0007]
【課題を解決するための手段】上述の目的はこの発明に
よればスズを主成分とし、ビスマスを３０ないし５８重
量％、ゲルマニウムを０．１重量％以下含有することに
より達成される。上述の発明においてアンチモンを５重
量％以下含有すること、銀を２重量％以下含有するこ
と、またはアンチモンを５重量％以下と銀を２重量％以
下含有することが有効である。According to the present invention, the above objects can be attained by containing tin as a main component, 30 to 58% by weight of bismuth and 0.1% by weight or less of germanium. In the above invention, it is effective to contain 5% by weight or less of antimony, 2% by weight or less of silver, or 5% by weight or less of antimony and 2% by weight or less of silver.
【０００８】スズを主成分とし、ビスマスを３０ないし
５８重量％含有するスズ- ビスマスSn-Bi 系合金は溶融
温度が180 ℃近辺にある。スズを主成分とし、ビスマス
を３０ないし５８重量％含有するスズ- ビスマスSn-Bi
合金に、ゲルマニウムを０．１重量％以下添加するとス
ズ- ビスマスSn-Bi 合金の強度が増加する。アンチモン
の５重量％以下もしくは銀の２重量％以下または両者を
添加すると引っ張り強度はさらに高まる。[0008] A tin-bismuth Sn-Bi alloy containing tin as a main component and containing 30 to 58% by weight of bismuth has a melting temperature around 180 ° C. Tin-bismuth Sn-Bi containing tin as a main component and containing 30 to 58% by weight of bismuth
If germanium is added to the alloy in an amount of 0.1% by weight or less, the strength of the tin-bismuth Sn-Bi alloy increases. Addition of up to 5% by weight of antimony or up to 2% by weight of silver or both increases the tensile strength further.
【０００９】上述したアンチモン，銀，またはゲルマニ
ウムの添加量においてはスズ- ビスマスSn-Bi 系合金の
延性は良好に維持される。With the above-mentioned added amount of antimony, silver or germanium, the ductility of the tin-bismuth Sn-Bi-based alloy is well maintained.
【００１０】[0010]
【発明の実施の形態】「はんだ合金」は、Sn,Bi,Sb,Ag,
Ge, の各原料を電気炉中で溶解して調製することができ
る。各原料は純度99.99 重量％以上のものを使用した。
Snは主成分である。Biが30ないし58重量％以下、Geが0.
1 重量％以下添加される。Sb5 重量％以下もしくはAg2
重量％以下またはSb5 重量％以下とAg2 重量％以下の両
者がSnを主成分としBiが30ないし58重量％以下、Geが0.
1 重量％以下のスズ- ビスマスSn-Bi 系合金に添加され
る。BEST MODE FOR CARRYING OUT THE INVENTION "Solder alloy" refers to Sn, Bi, Sb, Ag,
Ge, can be prepared by melting each material in an electric furnace. Each raw material used had a purity of 99.99% by weight or more.
Sn is a main component. Bi is 30 to 58% by weight or less, Ge is 0.
1% by weight or less is added. Sb5 wt% or less or Ag2
% By weight or less than 5% by weight of Sb and not more than 5% by weight of Ag2 both contain Sn as the main component, 30 to 58% by weight of Bi, and 0.1% of Ge.
Added to 1% by weight or less of tin-bismuth Sn-Bi alloy.
【００１１】図１はこの発明のスズ- ビスマスSn-Bi 系
合金につき伸び（％）のBi添加量（ｗｔ％）依存性を示
す線図である。図中○はSn-Bi 合金の示す特性点、◇は
Sn-Bi-Ag合金の示す特性点、□はSn-Bi-Sb合金の示す特
性点である。伸び測定におけるひずみ速度は0.2 ％／ｓ
である。Sn-Bi 合金（○）の延性はBi添加量とともに増
し、ピークを過ぎると共晶組成（Bi58％）に向けて漸減
することがわかる。共晶組成における融点は139 ℃であ
る。Bi30-50 ％の範囲ではSn-Bi 合金の伸びは50-90 ％
である。Sn-Ag 合金（3.5 ％銀）は伸びが20-30 ％であ
り、また鉛フリーのスズ- ビスマスSn-Bi 系合金である
Sn7.5Bi2Ag0.5Cu （溶融温度は約200 ℃）が伸び10％を
示すことを考慮すると、Bi30-50 ％の範囲でのSn-Bi 合
金の伸びは充分に大きい。これはSn-Pb 「はんだ合金」
と同等レベルの延性である。Sn-Bi-Ag合金（◇）、Sn-B
i-Sb合金（□）の延性はBi30-58 ％の範囲でSn-Bi 合金
（○）よりも低下するがまだ充分に大きいことがわか
る。FIG. 1 is a diagram showing the dependency of elongation (%) on the amount of added Bi (wt%) for the tin-bismuth Sn—Bi-based alloy of the present invention. In the figure, ○ indicates characteristic points of the Sn-Bi alloy, and Δ indicates
Characteristic points indicated by the Sn-Bi-Ag alloy, and □ are characteristic points indicated by the Sn-Bi-Sb alloy. The strain rate in elongation measurement is 0.2% / s
It is. It can be seen that the ductility of the Sn-Bi alloy (○) increases with the amount of Bi added, and gradually decreases after the peak toward the eutectic composition (Bi 58%). The melting point in the eutectic composition is 139 ° C. In the range of Bi30-50%, the elongation of Sn-Bi alloy is 50-90%
It is. Sn-Ag alloy (3.5% silver) has an elongation of 20-30% and is a lead-free tin-bismuth Sn-Bi alloy
Considering that Sn7.5Bi2Ag0.5Cu (melting temperature is about 200 ° C) shows an elongation of 10%, the elongation of Sn-Bi alloy in the range of Bi30-50% is sufficiently large. This is Sn-Pb "solder alloy"
The same level of ductility. Sn-Bi-Ag alloy (◇), Sn-B
It can be seen that the ductility of the i-Sb alloy (□) is lower than that of the Sn-Bi alloy (○) in the range of Bi30-58%, but is still sufficiently large.
【００１２】図２はこの発明のスズ- ビスマスSn-Bi 系
合金（Bi43重量％）につき引っ張り強度のGe添加量依存
性を示す線図である。引っ張り強度試験は直径3mm の試
験片を用い、引っ張り速度を0.2 ％／ｓにして室温で測
定した。Sn-Bi 合金（Bi43重量％）にSb,Ag,Geを添加す
ると引っ張り強度が増大することがわかる。Geを添加す
るとSnの酸化が防止される。スズに43重量％のビスマス
を添加した合金（Sn43Bi），スズに43重量％のビスマス
と2 重量％のAgを添加した合金（Sn43Bi2Ag ），スズに
43重量％のビスマスと2 重量％のSbを添加した合金（Sn
43Bi2Sb ），スズに43重量％のビスマスと5 重量％のSb
を添加した合金（Sn43Bi5Sb ）のそれぞれにGeを0.05重
量％添加すると引っ張り強度が一様に増加する。Geを0.
1 重量％添加するとSbを含む合金の強度はさらに増す
が、Agを含む合金の強度は飽和して減少に転ずる。FIG. 2 is a diagram showing the dependence of the tensile strength on the amount of Ge added to the tin-bismuth Sn-Bi alloy (Bi 43% by weight) of the present invention. The tensile strength test was performed at room temperature using a test piece having a diameter of 3 mm at a tensile speed of 0.2% / s. It can be seen that the addition of Sb, Ag and Ge to the Sn-Bi alloy (Bi 43% by weight) increases the tensile strength. Addition of Ge prevents oxidation of Sn. Alloy containing 43 wt% bismuth in tin (Sn43Bi), alloy containing 43 wt% bismuth and 2 wt% Ag in tin (Sn43Bi2Ag), tin
Alloy containing 43 wt% bismuth and 2 wt% Sb (Sn
43Bi2Sb), 43% by weight of bismuth and 5% by weight of Sb in tin
When 0.05% by weight of Ge is added to each of the alloys (Sn43Bi5Sb) to which Cr is added, the tensile strength uniformly increases. Ge to 0.
When 1 wt% is added, the strength of the alloy containing Sb further increases, but the strength of the alloy containing Ag saturates and starts to decrease.
【００１３】図３はこの発明のスズ- ビスマスSn-Bi 系
合金（Bi43重量％）につき伸び（％）のGe添加量依存性
を示す線図である。Sb,Ag,Geをスズ- ビスマスSn-Bi 合
金（Bi43重量％）に添加すると伸びはSn-Bi 合金（Bi43
重量％）より低下する。Geを0.05重量％より0.1 重量％
に増大するとSbを含む合金はAgを含む合金に比して伸び
（％）が小さくなるがGe0.1 重量％においてなお30％の
伸びを示し充分に使用可能である。FIG. 3 is a graph showing the dependency of the elongation (%) on the amount of Ge added for the tin-bismuth Sn—Bi-based alloy (Bi 43% by weight) of the present invention. When Sb, Ag, and Ge are added to a tin-bismuth Sn-Bi alloy (Bi43% by weight), the elongation increases with the Sn-Bi alloy (Bi43
% By weight). Ge 0.1% by weight from 0.05% by weight
As the alloy content increases, the alloy containing Sb has a smaller elongation (%) than the alloy containing Ag, but the alloy still shows 30% elongation at 0.1% by weight of Ge and can be used sufficiently.
【００１４】図４はこの発明のスズ- ビスマスSn-Bi 系
合金（Bi43重量％）につき温度100℃におけるクリープ
速度のGe添加量依存性を示す線図である。スズに43重量
％のビスマスを添加した合金（Sn43Bi），スズに43重量
％のビスマスと2 重量％のAgを添加した合金（Sn43Bi2A
g ）はほぼ同程度のクリープ抵抗を示す。Geを0.05重量
％より0.1 重量％に増大するとクリープ速度は小さくな
り、クリープ抵抗が増すからGe添加の効果が認められ
る。スズに43重量％のビスマスと2 重量％のSbを添加し
た合金（Sn43Bi2Sb ），スズに43重量％のビスマスと5
重量％のSbを添加した合金（Sn43Bi5Sb ）はGeを0.05重
量％添加するとクリープ抵抗が顕著に増大する。これは
GeとSbの相乗効果による。FIG. 4 is a graph showing the dependence of the creep rate at 100 ° C. on the amount of Ge added for the tin-bismuth Sn—Bi-based alloy (Bi 43% by weight) of the present invention. Alloy with Sn added 43% by weight of bismuth (Sn43Bi), Alloy with Sn added 43% by weight of bismuth and 2% by weight of Ag (Sn43Bi2A
g) shows almost the same creep resistance. When Ge is increased from 0.05% by weight to 0.1% by weight, the creep rate decreases and the creep resistance increases, so that the effect of Ge addition is recognized. Alloy (Sn43Bi2Sb) with 43 wt% bismuth and 2 wt% Sb added to tin, 43 wt% bismuth and 5 wt%
The alloy (Sn43Bi5Sb) to which Sb is added by weight% has a remarkable increase in creep resistance when 0.05% by weight of Ge is added. this is
Due to the synergistic effect of Ge and Sb.
【００１５】図５はこの発明のスズ- ビスマスSn-Bi 系
合金（Bi43重量％）につき温度100℃と温度120 ℃の範
囲におけるクリープ速度の温度依存性をスス- 鉛Sn-Pb
合金の特性とともに示す線図である。熱強度を調べるた
めに上述と同様の試験片を用い、クリープ試験を行っ
た。スズに43重量％のビスマスを添加した合金（Sn43B
i），スズに43重量％のビスマスと2 重量％のSbを添加
した合金（Sn43Bi2Sb ），スズに43重量％のビスマスと
2 重量％のSbと0.05重量％のGeを添加した合金（Sn43Bi
2Sb0.05 Ge），スズ-鉛Sn-Pb 合金（63Sn-37Pb ）はほ
ぼ同程度のクリープ温度特性を示す。特にスズに43重量
％のビスマスを添加した合金（Sn43Bi）にSbを添加する
と温度100-120℃で安定したクリープ抵抗を示し、スズ
に43重量％のビスマスと2 重量％のSbと0.05重量％のGe
を添加した合金（Sn43Bi2Sb0.05 Ge）はスズ- 鉛Sn-Pb
合金（63Sn-37Pb ）とほぼ同等なクリープ温度特性を示
す。スズに43重量％のビスマスを添加した合金（Sn43B
i）にSbとGeを添加した際のクリープ特性はスズに30重
量％のビスマスを添加した合金（Sn30Bi）とスズに58重
量％のビスマスを添加した合金（Sn58Bi）においても同
様に認められた。FIG. 5 shows the temperature dependence of the creep rate of the tin-bismuth Sn-Bi-based alloy (Bi 43% by weight) in the range of 100 ° C. and 120 ° C. by using Sn—Pb.
It is a diagram shown with the characteristic of an alloy. In order to examine the thermal strength, a creep test was performed using the same test piece as described above. Alloy containing 43% by weight of bismuth added to tin (Sn43B
i), an alloy containing 43% by weight of bismuth and 2% by weight of Sb added to tin (Sn43Bi2Sb), 43% by weight of bismuth to tin
Alloy (Sn43Bi) containing 2% by weight of Sb and 0.05% by weight of Ge
2Sb0.05Ge) and tin-lead Sn-Pb alloy (63Sn-37Pb) show almost the same creep temperature characteristics. In particular, when Sb was added to an alloy containing 43% by weight of bismuth (Sn43Bi) in tin, a stable creep resistance was exhibited at a temperature of 100-120 ° C, and 43% by weight of bismuth, 2% by weight of Sb and 0.05% by weight of tin were added. Ge
Alloy (Sn43Bi2Sb0.05 Ge) with tin added is tin-lead Sn-Pb
It shows a creep temperature characteristic almost equivalent to that of the alloy (63Sn-37Pb). Alloy containing 43% by weight of bismuth added to tin (Sn43B
The creep characteristics when Sb and Ge were added to i) were also observed in an alloy containing 30% by weight of bismuth in tin (Sn30Bi) and an alloy in which 58% by weight of bismuth was added to tin (Sn58Bi). .
【００１６】[0016]
【発明の効果】この発明によればスズを主成分とし、ビ
スマスを３０ないし５８重量％、ゲルマニウムを０．１
重量％以下含有するので、延性と熱強度に優れ鉛フリー
の低温「はんだ合金」が得られる。このスズ- ビスマス
Sn-Bi 系合金にアンチモンもしくは銀またはアンチモン
と銀の両者を添加すると熱強度が同等以上に良好な鉛フ
リーのスズ- ビスマスSn-Bi 系低温「はんだ合金」が得
られる。。According to the present invention, tin is a main component, 30 to 58% by weight of bismuth, and 0.1% of germanium.
Since it is contained by weight% or less, a lead-free low-temperature "solder alloy" having excellent ductility and thermal strength can be obtained. This tin-bismuth
If antimony or silver or both antimony and silver are added to a Sn-Bi alloy, a lead-free tin-bismuth Sn-Bi-based low-temperature "solder alloy" having a thermal strength equal to or better than that of a solder is obtained. .
【図１】この発明のスズ- ビスマスSn-Bi 系合金につき
伸び（％）のBi添加量（ｗｔ％）依存性を示す線図FIG. 1 is a diagram showing the dependency of elongation (%) on the amount of added Bi (wt%) for a tin-bismuth Sn—Bi based alloy of the present invention.
【図２】この発明のスズ- ビスマスSn-Bi 系合金（Bi43
重量％）につき引っ張り強度のGe添加量依存性を示す線
図FIG. 2 shows a tin-bismuth Sn—Bi alloy (Bi43) of the present invention.
(% By weight) shows the dependence of the tensile strength on the amount of Ge added.
【図３】この発明のスズ- ビスマスSn-Bi 系合金（Bi43
重量％）につき伸び（％）のGe添加量依存性を示す線図FIG. 3 shows a tin-bismuth Sn—Bi alloy (Bi43
(% By weight) shows the dependency of elongation (%) on the amount of Ge added.
【図４】この発明のスズ- ビスマスSn-Bi 系合金（Bi43
重量％）につき温度100 ℃におけるクリープ速度のGe添
加量依存性を示す線図FIG. 4 shows a tin-bismuth Sn—Bi-based alloy (Bi43
(% By weight) shows the dependence of the creep rate at 100 ° C on the Ge addition amount.
【図５】この発明のスズ- ビスマスSn-Bi 系合金（Bi43
重量％）につき温度100 ℃と温度120 ℃の範囲における
クリープ速度の温度依存性をスス- 鉛Sn-Pb 合金の特性
とともに示す線図FIG. 5 shows a tin-bismuth Sn—Bi alloy (Bi43) of the present invention.
(% By weight) A diagram showing the temperature dependence of the creep rate in the temperature range of 100 ° C and 120 ° C, together with the characteristics of the Sn-Pb alloy.
Claims (4)
５８重量％、ゲルマニウムを０．１重量％以下含有する
ことを特徴とする「はんだ合金」。1. A "solder alloy" comprising tin as a main component, 30 to 58% by weight of bismuth and 0.1% by weight or less of germanium.
１に記載の「はんだ合金」。2. The "solder alloy" according to claim 1, which contains 5% by weight or less of antimony.
の「はんだ合金」。3. The “solder alloy” according to claim 1, which contains 2% by weight or less of silver.
以下含有する請求項１に記載の「はんだ合金」。4. An antimony content of 5% by weight or less and silver of 2% by weight.
The "solder alloy" according to claim 1, which contains:
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02489998A JP3353686B2 (en) | 1998-02-05 | 1998-02-05 | Solder alloy |
| US09/244,034 US6156132A (en) | 1998-02-05 | 1999-02-04 | Solder alloys |
| DE19904765A DE19904765B4 (en) | 1998-02-05 | 1999-02-05 | Using an alloy as a lead-free solder alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02489998A JP3353686B2 (en) | 1998-02-05 | 1998-02-05 | Solder alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11221693A true JPH11221693A (en) | 1999-08-17 |
| JP3353686B2 JP3353686B2 (en) | 2002-12-03 |
Family
ID=12151038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02489998A Expired - Lifetime JP3353686B2 (en) | 1998-02-05 | 1998-02-05 | Solder alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3353686B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008183590A (en) * | 2007-01-30 | 2008-08-14 | Oki Electric Ind Co Ltd | Semiconductor device |
| JP2010167472A (en) * | 2009-01-26 | 2010-08-05 | Fujitsu Ltd | Solder, soldering method, and semiconductor device |
| JP2014524354A (en) * | 2011-08-02 | 2014-09-22 | アルファ・メタルズ・インコーポレイテッド | High impact toughness solder alloy |
| WO2015019966A1 (en) * | 2013-08-05 | 2015-02-12 | 千住金属工業株式会社 | Lead-free solder alloy |
| JP2018122322A (en) * | 2017-01-31 | 2018-08-09 | 株式会社タムラ製作所 | Lead-free solder alloy, solder paste, electronic circuit board and electronic control device |
| JP6477965B1 (en) * | 2018-03-08 | 2019-03-06 | 千住金属工業株式会社 | Solder alloy, solder paste, solder ball, flux cored solder and solder joint |
| JP2019527145A (en) * | 2016-08-11 | 2019-09-26 | ベイジン コンポー アドバンスト テクノロジー カンパニー リミテッドＢｅｉｊｉｎｇ Ｃｏｍｐｏ Ａｄｖａｎｃｅｄ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． | SnBiSb low-temperature lead-free solder |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008183590A (en) * | 2007-01-30 | 2008-08-14 | Oki Electric Ind Co Ltd | Semiconductor device |
| JP2010167472A (en) * | 2009-01-26 | 2010-08-05 | Fujitsu Ltd | Solder, soldering method, and semiconductor device |
| JP2014524354A (en) * | 2011-08-02 | 2014-09-22 | アルファ・メタルズ・インコーポレイテッド | High impact toughness solder alloy |
| EP3907037A1 (en) * | 2011-08-02 | 2021-11-10 | Alpha Assembly Solutions Inc. | High impact toughness solder alloy |
| WO2015019966A1 (en) * | 2013-08-05 | 2015-02-12 | 千住金属工業株式会社 | Lead-free solder alloy |
| JP5679094B1 (en) * | 2013-08-05 | 2015-03-04 | 千住金属工業株式会社 | Lead-free solder alloy |
| JP2019527145A (en) * | 2016-08-11 | 2019-09-26 | ベイジン コンポー アドバンスト テクノロジー カンパニー リミテッドＢｅｉｊｉｎｇ Ｃｏｍｐｏ Ａｄｖａｎｃｅｄ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． | SnBiSb low-temperature lead-free solder |
| US11479835B2 (en) | 2016-08-11 | 2022-10-25 | Beijing Compo Advanced Technology Co., Ltd. | SnBiSb series low-temperature lead-free solder and its preparation method |
| JP2018122322A (en) * | 2017-01-31 | 2018-08-09 | 株式会社タムラ製作所 | Lead-free solder alloy, solder paste, electronic circuit board and electronic control device |
| WO2019171978A1 (en) * | 2018-03-08 | 2019-09-12 | 千住金属工業株式会社 | Solder alloy, solder paste, solder ball, resin-flux cored solder, and solder joint |
| JP2019155471A (en) * | 2018-03-08 | 2019-09-19 | 千住金属工業株式会社 | Solder alloy, solder paste, solder ball, resin cored solder, and solder joint |
| JP6477965B1 (en) * | 2018-03-08 | 2019-03-06 | 千住金属工業株式会社 | Solder alloy, solder paste, solder ball, flux cored solder and solder joint |
| TWI679078B (en) * | 2018-03-08 | 2019-12-11 | 日商千住金屬工業股份有限公司 | Solder alloy, solder paste, solder ball, turpentine |
| US11241760B2 (en) | 2018-03-08 | 2022-02-08 | Senju Metal Industry Co., Ltd. | Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint |
Also Published As
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| JP3353686B2 (en) | 2002-12-03 |
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