JPH11220076A - Semiconductor device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To dispense with punch-out with a metal mold such as a punch, and to miniaturize a package drastically. SOLUTION: A specified number of individual semiconductor chips 4 is mounted on a printed wiring board 2, the electrodes of the respective semiconductor chips 4 and electrodes 3 on the surface of the printed wiring board 2 are connected electrically by wire bondings 6, and the surface of the printed wiring board 2 is batch sealed with molding resin 7. Four edges of the printed wiring boards 2 encapsulated with the respective molding resins 7 are cut with a dicer or the like, and a semiconductor device 1 is formed as a structure in which the end surfaces of all the edges of the mold resin 7 match with end surfaces of the respective edges of the printed wiring board 2. Thereby the semiconductor chips can be arranged in a matrix form, and the printed wiring board 2 can be miniaturized, so that a package can be miniaturized, and the mounting area of a semiconductor device can be reduced drastically.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a method of manufacturing the same, and more particularly, to a BGA (Ball Grid).
The present invention relates to a technology that is effective when applied to miniaturization of a surface-mount type semiconductor device such as an array.

[0002]

2. Description of the Related Art According to studies made by the present inventor, a BGA semiconductor device, which is a type of surface mount type package, has a plurality of semiconductor chips mounted on the surface of a printed wiring board and is provided on the printed wiring board. The electrodes and the electrodes provided on each semiconductor chip are electrically connected by a bonding wire such as a gold wire, sealed with a molding resin or a potting resin, and then the outer peripheral portion of the molding resin in which the semiconductor chip is sealed. An individual semiconductor device is formed by punching out a nearby printed wiring board with a die cutting device or the like.

As an example describing this type of semiconductor device in detail, see Nikkei P. on May 31, 1993.
Published by Company B, Susumu Kayama, Kunihiko Naruse (supervised), "Practical Course V
LSI Packaging Technology (Bottom) "P173, P174
This document describes the structure of BGA and the like.

[0004]

However, it has been found by the present inventors that the above-described semiconductor device and its manufacturing method have the following problems.

In recent years, semiconductor devices have been required to have high performance such as miniaturization, large storage capacity, and high speed, and semiconductor chips tend to be large.

Therefore, the distance between the outer peripheral portion of the mold resin in which the semiconductor chip is sealed and the outer peripheral portion of the printed wiring board is shortened, and the printed wiring is secured in order to secure a space for punching the above-mentioned die cutting device. There is a problem that the size of the substrate is increased and it is difficult to reduce the size of the package.

An object of the present invention is to provide a semiconductor device which does not require punching with a die such as a punch and can greatly reduce the size of a package, and a method of manufacturing the same.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0009]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the semiconductor device of the present invention has a structure in which at least one end face of the printed wiring board on which the semiconductor chip is mounted coincides with one end face of a package in which the semiconductor chip is sealed with a resin. It is.

Further, the semiconductor device of the present invention has at least one end surface of a printed wiring board on which a semiconductor chip is mounted, one end surface of a package in which the semiconductor chip is sealed with a resin, and one end surface of the semiconductor chip. Have the same structure.

Further, in the method of manufacturing a semiconductor device according to the present invention, there is provided a step of preparing an individual semiconductor chip and a printed wiring board on which a predetermined number of semiconductor chips are mounted, mounting the semiconductor chip on the printed wiring board, After electrically connecting the electrodes of the printed wiring board and the electrodes of the semiconductor chip, and electrically connecting the electrodes of the printed wiring board and the electrodes of the semiconductor chip, all the semiconductor chips are connected. The method includes a step of collectively sealing with resin and a step of cutting the sealed resin and the printed wiring board together to form individual packages.

Further, a method of manufacturing a semiconductor device according to the present invention
The resin and the printed wiring board are cut by a dicer.

Further, in the method of manufacturing a semiconductor device according to the present invention, a step of preparing a chip group having at least two adjacent semiconductor chips and a printed wiring board on which the chip group is mounted; Mounting the chip group and electrically connecting the electrode portions of the printed wiring board to the electrode portions formed on the individual semiconductor chips in the chip group; and electrically connecting the electrode portion of the printed wiring board to the electrode portion of the chip group. After performing a typical connection, a step of sealing the chip group with a resin, and a step of cutting the chip group sealed with the resin together with the resin and the printed wiring board to form individual packages Things.

Further, a method of manufacturing a semiconductor device according to the present invention
The chip group, the resin, and the printed wiring board are cut by a dicer.

As described above, since the semiconductor chips can be arranged in a matrix, the size of the printed wiring board can be reduced, so that the package can be reduced in size and the mounting area of the semiconductor device can be significantly reduced.

In addition, since the resin sealing can be performed at a time, the manufacturing efficiency of the semiconductor device can be improved.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view of a semiconductor device according to Embodiment 1 of the present invention, and FIGS. 2 to 6 are explanatory views of a manufacturing process of the semiconductor device according to Embodiment 1 of the present invention. is there.

In the first embodiment, a semiconductor device 1 which is a BGA package which is a kind of surface mount type is shown in FIG.
As shown in FIG. 1, a printed wiring board 2 which is a multilayer wiring board made of, for example, a BT (bismaleimide-based resin) material is provided.

The surface of the printed wiring board 2 has an electrode 3 at a position near an outer peripheral portion of a semiconductor chip described later.
Is provided. Further, electrodes 3 a are formed in an array on the back surface of the printed wiring board 2, and the predetermined electrodes 3 and the predetermined electrodes 3 a are electrically connected to each other by wiring formed on the printed wiring board 2. ing.

On the electrode 3a formed on the back surface of the printed wiring board 2, a spherical solder, that is, a so-called solder ball (external terminal) B is electrically connected and arranged.
Instead of lead.

Further, a semiconductor chip 4 is adhered to the surface of the printed wiring board 2 by an adhesive 5, and the electrodes 4 a formed on the semiconductor chip 4 are connected to the printed wiring board 2 near the outer peripheral portion of the semiconductor chip 4. Are electrically connected to the electrodes 3 formed on the surface of the substrate 1 via bonding wires 6.

The semiconductor chip 4 mounted on the surface of the printed wiring board 2 is sealed with a mold resin 7 to form a package. Furthermore, in the semiconductor device 1, the package and the printed wiring board 2 have the same size, that is, a structure in which the end faces of all sides of the mold resin 7 as the package coincide with the end faces of the respective sides of the printed wiring board 2. ing.

Next, the manufacturing process of the semiconductor device 1 will be described.

First, as shown in FIG. 2, for example, six individual semiconductor chips 4 are adhered to the printed wiring board 2 with an adhesive, and then, as shown in FIG. And electrode 3 on the surface of printed wiring board 2
Is electrically connected by wire bonding 6.

Then, as shown in FIG. 4, the surface of the printed wiring board 2 is collectively sealed with a mold resin 7 in order to seal the vicinity of the periphery of the six semiconductor chips 4 (FIG. 3).

Next, as shown in FIG. 5, a package is formed on the printed wiring board 2 in which the semiconductor chip 4 is sealed with the molding resin 7 by cutting the dotted line portions. Here, the end surfaces of all sides of the molded resin 7 formed by cutting have a structure that matches the end surfaces of the respective sides of the printed wiring board 2.

As shown in FIG. 6, the mold resin 7 serving as a package is cut by a dicer which is cut by a blade BL which is an ultra-thin outer peripheral blade attached to the tip of a spindle which rotates at a high speed. This is performed by cutting the sealing portion and the printed wiring board 2 at the same time.

After the package is formed, the above-mentioned solder bump is attached to the electrode 3a formed on the back surface of the printed wiring board 2, and the semiconductor device 1 (FIG. 1) is formed by electrical connection. Become.

As a result, in the present embodiment, the printed wiring board 2 does not require a space for punching with a die such as a punch, so that the size of the printed wiring board 2 can be reduced, and the semiconductor device 1 can be significantly reduced in size. Can be

Further, since the molding of the plurality of semiconductor devices 1 can be performed at once, the manufacturing efficiency can be improved.

Further, in the semiconductor device 1 according to the present embodiment, the end faces of all sides of the mold resin 7 and the end faces of the respective sides of the printed wiring board 2 have the same structure. By employing a structure in which one side of the printed wiring board is coincident, the size of the semiconductor device can be reduced.

For example, in the case of a package structure in which three sides coincide with each other, as shown in FIG. 7A, six individual semiconductor chips are mounted on the printed wiring board 2, and the surface is molded resin 7 (hatched portion). Thus, only the dotted line portions of the printed wiring board 2 which are collectively sealed can be formed by cutting with a dicer or the like described above.

As a result, the hatched portion of the printed wiring board 2 remains without being cut, and the mold resin 7 and the printed wiring board 2 on three sides as shown in FIG.
Can be formed.

Next, in the case of a package structure in which two sides coincide, four semiconductor chips are mounted on the printed wiring board 2 as shown in FIG. It can be formed by sealing with the mold resin 7 (hatched portion) in a lump and cutting the dotted line portion with a dicer or the like.

Therefore, the hatched portion of the printed wiring board 2 remains without being cut, and the end surfaces of the mold resin 7 on two sides and the printed wiring board 2 coincide with each other as shown in FIG. A package can be formed.

In the case of a package structure in which only one side coincides, as shown in FIG. 9A, two semiconductor chips are mounted on the printed wiring board 2, and then the surface of the printed wiring board 2 is removed. It can be formed by sealing with the mold resin 7 (hatched portion) in a lump and cutting the dotted line portion with a dicer or the like.

Therefore, the hatched portion of the printed wiring board 2 remains without being cut, and the end surfaces of the mold resin 7 on one side and the printed wiring board 2 as shown in FIG. A package can be formed.

The hatching in FIGS. 7 to 9
It shows the mold resin 7 and does not show a cross section.

(Second Embodiment) FIG. 10 is a sectional view of a semiconductor device according to a second embodiment of the present invention, and FIG. 11 is an explanatory view of a manufacturing process of the semiconductor device according to the second embodiment of the present invention.

In the second embodiment, as shown in FIG. 10, a semiconductor device 1a which is a BGA package which is a kind of surface mount type is a multilayer wiring board made of, for example, a BT (bismaleimide resin) material. Printed wiring board 8
Is provided.

On the front and back surfaces of the printed wiring board 8, electrodes 9 and 9a are formed in an array, and the predetermined electrodes 9 and the predetermined electrodes 9a on the back surface of the printed wiring board 8, respectively, are formed. Are electrically connected by wiring.

A spherical solder, a so-called solder ball B, is electrically connected and arranged on the electrode 8a of the printed wiring board 8, and serves as a lead.

Further, a semiconductor chip 10 is mounted on the surface of the printed wiring board 8, and the electrodes 9 of the printed wiring board 8 and the matrix-shaped electrode portions formed on the semiconductor chip 10 are connected via gold bumps KB or the like. It is electrically connected.

The upper part of the semiconductor chip 10 mounted on the surface of the printed wiring board 8 is sealed with a mold resin 11 to form a package. Here, in the semiconductor device 1 a, the semiconductor chip 10, the mold resin 11 serving as a package, and the printed wiring board 8 have the same size, that is, the end faces of all sides of the mold resin 11 and the respective sides of the printed wiring board 2. The end face and the end faces of all sides of the semiconductor chip 10 have a structure in which the end faces coincide.

Next, the manufacturing process of the semiconductor device 1a will be described.

First, as shown in FIG. 11, a semiconductor wafer (chip group) on which a plurality of semiconductor chips 10 are formed
W itself is mounted on the printed wiring board 8, and the respective semiconductor chips 10 of the semiconductor wafer W and the electrodes 9 (FIG. 10) of the printed wiring board 8 are electrically connected by crimping via gold bumps KB. .

Thereafter, the surface of the printed wiring board 8 with the semiconductor wafer W mounted thereon is molded resin 11 (FIG. 1).
0). Next, for example, a so-called street of the semiconductor wafer W, which is a linear boundary line of the individual semiconductor chips 10, is cut in a dice shape together with the printed wiring board 8 and the mold resin 11 by a dicer or the like, thereby forming the semiconductor device 1 a. (FIG. 10) is formed.

Therefore, the semiconductor device 1 a
1 has a structure in which the end faces of all sides, the end faces of the respective sides of the printed wiring board 8, and the end faces of all the sides of the semiconductor chip 10 match.

Further, the semiconductor device 1a includes the semiconductor chip 1
However, since the end face of No. 0 is exposed, the cut surface is locally heated by the dicer, so that the adhesion between the semiconductor chip 10 and the mold resin is further improved by melting and solidification, and the moisture resistance and the like are improved. Product reliability can be improved.

After the package 11 is formed, the above-mentioned solder bumps are attached to the electrodes 9a formed on the back surface of the printed wiring board 8 and electrically connected to form the semiconductor device 1a.

Thus, in the second embodiment, the printed wiring board 2 does not require a space for punching with a die such as a punch, and the printed wiring board 8 and the semiconductor chip 10 can be made the same size. Therefore, the size of the semiconductor device 1 can be significantly reduced.

Further, since the molding of all the semiconductor chips 10 formed on the semiconductor wafer W can be performed at once, the manufacturing efficiency can be greatly improved.

Furthermore, in the second embodiment, the solder bumps are attached after the semiconductor wafer W is cut by the dicer, but for example, as shown in FIG. Then, after attaching the solder bump B, cutting with a dicer may be performed.

Although the invention made by the inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the scope of the invention. Needless to say, it can be changed.

For example, in the first and second embodiments, when a plurality of the same semiconductor devices such as a memory module are used, an arbitrary plurality of semiconductor chips and molding resin are cut without cutting the individual semiconductor devices. Instead, they may be formed as one semiconductor device in a continuous state.

Each semiconductor chip, printed wiring board and mold resin were cut in a dice pattern to form respective semiconductor devices. For example, as shown in FIG.
The printed wiring board 2 and the molding resin 7 are cut by the above-described dicer or the like so that two semiconductor chips are connected to each other to form a single semiconductor device 1b, thereby reducing the mounting space. Can be.

In the first and second embodiments,
Although a semiconductor device is cut by a dicer, any cutting device that does not require a punching space or the like in a printed wiring board when cutting a laser, a water jet, or a router R as shown in FIG. 14 may be used.

Further, by using the water jetter, the cutting powder adhering to the product at the time of cutting can be removed while cutting, and the working efficiency can be improved.

According to the first and second embodiments, B
Although the GA type semiconductor device has been described, the CSP (Ch
ip Size Package) or MCM (Multi
If the semiconductor device is a surface-mount type semiconductor device in which a semiconductor chip is mounted on the surface of a printed wiring board such as an iChip Module, the package can be reduced in size and the mounting area can be significantly reduced.

[0062]

Advantageous effects obtained by typical ones of the inventions disclosed by the present application will be briefly described as follows.
It is as follows.

(1) According to the present invention, the size of the package can be reduced, so that the semiconductor device itself can be reduced in size.

(2) Further, according to the present invention, by cutting with a dicer, a space or the like punched out by a die on the printed wiring board becomes unnecessary, so that the printed wiring board on which the semiconductor chip is mounted can be significantly reduced. it can.

(3) Further, in the present invention, according to the above (1) and (2), the mounting area can be reduced, and the mounting board can be mounted at a high density.

(4) Further, according to the present invention, since a plurality of semiconductor chips are collectively sealed with resin, a semiconductor device can be manufactured efficiently.

[Brief description of the drawings]

FIG. 1 is a sectional view of a semiconductor device according to a first embodiment of the present invention;

FIG. 2 is an explanatory diagram of a manufacturing process of the semiconductor device according to the first embodiment of the present invention;

FIG. 3 is an explanatory diagram of a manufacturing process of the semiconductor device according to the first embodiment of the present invention;

FIG. 4 is an explanatory diagram of a manufacturing process of the semiconductor device according to the first embodiment of the present invention;

FIG. 5 is an explanatory diagram of the manufacturing process of the semiconductor device according to the first embodiment of the present invention.

FIG. 6 is an explanatory diagram of the manufacturing process of the semiconductor device according to the first embodiment of the present invention.

FIGS. 7 (a) and 7 (b) are explanatory views of a manufacturing process of a semiconductor device according to another embodiment of the present invention.

FIGS. 8A and 8B are explanatory views of a manufacturing process of a semiconductor device according to another embodiment of the present invention.

FIGS. 9A and 9B are explanatory views of a manufacturing process of a semiconductor device according to another embodiment of the present invention.

FIG. 10 is a sectional view of a semiconductor device according to a second embodiment of the present invention;

FIG. 11 is an explanatory diagram of the manufacturing process of the semiconductor device according to the second embodiment of the present invention.

FIG. 12 is an explanatory diagram of a manufacturing process of a semiconductor device according to another embodiment of the present invention.

FIG. 13 is an explanatory diagram of a semiconductor device according to another embodiment of the present invention.

FIG. 14 is an explanatory diagram of a manufacturing process of a semiconductor device according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 1a Semiconductor device 1b Semiconductor device 2 Printed wiring board 3, 3a electrode 4 Semiconductor chip 4a electrode 5 Adhesive material 6 Bonding wire 7 Mold resin 8 Printed wiring board 9, 9a electrode 10 Semiconductor chip 11 Mold resin B Solder ball (external Terminal) BL Blade KB Gold Bump W Semiconductor Wafer (Chip Group) R Router

Claims (6)

[Claims] 1. A semiconductor device comprising a package in which external terminals are provided on a back surface of a printed wiring board, a semiconductor chip is mounted on a surface of the printed wiring board, and the semiconductor chip is sealed with a resin, A semiconductor device having a structure in which one end face of the printed wiring board and one end face of the package coincide with each other. 2. A semiconductor device having a package in which external terminals are provided on a back surface of a printed wiring board, a semiconductor chip is mounted on a surface of the printed wiring board, and the semiconductor chip is sealed with a resin, A semiconductor device having a structure in which one end face of the printed wiring board, one end face of the package, and one end face of the semiconductor chip coincide with each other. A step of preparing an individual semiconductor chip and a printed wiring board on which a predetermined number of said semiconductor chips are mounted; mounting said semiconductor chip on said printed wiring board; Electrically connecting the electrode portion of the semiconductor chip, and after electrically connecting the electrode portion of the printed wiring board and the electrode portion of the semiconductor chip, collectively connecting all the semiconductor chips A method of manufacturing a semiconductor device, comprising: a step of sealing with a resin; and a step of cutting together the resin and the printed wiring board with which the semiconductor chip is sealed to form individual packages. . 4. The method for manufacturing a semiconductor device according to claim 3, wherein the cutting of the resin and the printed wiring board is performed by a dicer. 5. A step of preparing a chip group having at least two adjacent semiconductor chips and a printed wiring board on which the chip group is mounted; and mounting the chip group on the printed wiring board, wherein the printed wiring is provided. Electrically connecting the electrode section of the substrate and the electrode section formed on each of the semiconductor chips in the chip group; and electrically connecting the electrode section of the printed wiring board and the electrode section of the chip group. After performing, a step of sealing the chip group with a resin, and a step of cutting the chip group sealed with the resin together with the resin and the printed wiring board to form individual packages. A method of manufacturing a semiconductor device, comprising: 6. The method of manufacturing a semiconductor device according to claim 5, wherein said chip group, said resin, and said printed wiring board are cut by a dicer.