JPH11219741A - Solder ball contact and solder ball connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To keep the height of a solder ball constant as to prevent ball shift and position a solder ball in a prescribed position. SOLUTION: A terminal part 3c of a contact 3 comprises a melting part 3d for installing a solder ball 5 by melting. On the melting face part of the melting part 3d is plated and the solder ball 5 is deposited by melting. The contact 3 is held in an insulator 1 and connected with a conductive part formed in a substrate in which the contact is mounted through the solder ball 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball contact for connecting between a conductive portion of a mounting board and a contact using a solder ball, and a solder ball connector.

[0002]

2. Description of the Related Art Conventionally, in a surface mount type connector (QFP type) mounted on a mounting board, as the pitch between a plurality of contacts becomes narrower, mounting becomes more difficult, and the limit of narrowing the pitch is generated. Was. That is, in the surface mount type connector, the terminal area needs to extend to the outside of the insulator, so that the mounting area increases.

[0003] For this reason, a BGA (ball-type) in which a plurality of terminal portions are arranged on the bottom surface of an insulator by employing solder balls.
(Grid array) type connectors are used. In a BGA type connector, a solder ball is interposed between a terminal portion of a contact and a conductive portion of a mounting board. Then, the terminal portion of the contact is connected to the conductive portion of the mounting board by reflowing the solder ball and fusing the solder ball.

[0004]

However, the BGA
In the connection method of the terminal part of the solder ball and the contact in the connector of the type, the solder ball is interposed between the contact and the mounting board, and the solder ball is fused by being reflowed. There is a problem that is collapsed.

Further, when the terminal portion of the contact and the conductive portion of the mounting board are aligned with each other via the solder ball, a solder ball shift occurs, so that the solder ball and the terminal portion cannot be reliably and predeterminedly positioned. There is a problem.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a solder ball contact in which a solder ball is directly mounted on a terminal portion to prevent displacement of the solder ball and to position the solder ball at a predetermined position. An object of the present invention is to provide a solder ball connector.

Another object of the present invention is to provide a solder ball contact and a solder ball connector whose height can be easily controlled by preventing the solder ball from being wetted (crushed) more than necessary.

Another object of the present invention is to provide a solder ball contact and a solder ball connector that have good self-alignment, can reduce the mounting area, and are excellent in mountability.

[0009]

According to the present invention, there is provided a terminal for connecting to a conductive portion provided on a mounting board,
In a conductive contact for connecting the terminal portion to the conductive portion via a solder ball, the terminal portion has a fusion portion for fusing and setting the solder ball, and a fusion surface of the fusion portion The upper surface is plated, and the solder ball is fused on the plating to obtain a solder ball contact.

Further, according to the present invention, there is provided an insulator, and a conductive contact which is connected to a conductive portion held on the insulator and provided on a mounting substrate via a solder ball, wherein the contact is provided by the insulator. And a contact portion extending from one end of the holding portion, and a terminal portion extending from the other end of the holding portion, wherein the terminal portion melts the solder ball. A solder ball having a fusion part to be attached and installed, wherein a plating is applied on a fusion surface of the fusion part, and the solder ball is fused on the plating. A connector is obtained.

Further, according to the present invention, in a conductive contact for connecting a terminal portion connected to a conductive portion provided on a mounting board to the conductive portion via a solder ball, the terminal portion is preferably a conductive contact. It has a fusion portion for fusing and setting the solder ball, and the fusion portion has a ball hole or a dent portion for positioning and setting the solder ball, and the ball hole or the dent portion has A solder ball contact wherein a part of the solder ball is fused.

Further, according to the present invention, a terminal portion connected to a conductive portion provided on a mounting board is opposed to the conductive portion by a conductive contact connected to the conductive portion via a solder ball. A resist is formed on a portion of the surface of the terminal portion excluding a fusion portion where the solder ball is fused and set, and the solder ball is formed on the exposed fusion portion except for the resist. Are soldered, thereby obtaining a solder ball contact.

Further, according to the present invention, there is provided a solder ball connector including an insulator, and a conductive contact connected via a solder ball to a conductive portion held on the insulator and provided on a mounting board. The contact faces the conductive portion in a solder ball connector having a holding portion held by the insulator, a contact portion extending from one end of the holding portion, and a terminal portion extending from the other end of the holding portion. A resist is formed on a portion of the surface of the terminal portion excluding a fusion portion where the solder ball is fused and set, and the solder ball is formed on the exposed fusion portion except for the resist. Are soldered to obtain a solder ball connector.

[0014]

According to the structure of the present invention, the displacement of the solder ball is prevented by forming the solder ball directly on the terminal portion, and the solder ball is connected to the mounting board at a predetermined position.

According to the configuration of the present invention, in positioning the solder ball, a hole is formed in the terminal portion of the connector or a recess is formed, and the solder ball is placed at that position.
Thereby, the position of the solder ball is determined, and the solder ball is aligned.

Further, according to the structure of the present invention, a resist is formed on the surface of the terminal portion except for a fused portion where the solder ball is fused and set. Except for the resist, a part of the solder ball is fused to the exposed fused portion.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a solder ball contact and a solder ball connector according to the present invention will be described with reference to the drawings. 1 and 2 show a first embodiment of a solder ball connector according to the present invention.

Referring to FIGS. 1 and 2, a solder ball connector is an insulator 1 made by resin molding.
The insulator 1 has a plurality of conductive contacts 3 in which two sets are assembled into one set of two rows at a predetermined interval in the longitudinal direction of the insulator 1, and a solder ball 5 provided on each of the contacts 3.

The insulator 1 has a main plate portion 1 having a flat plate shape.
1, the main plate 11 extends from the first surface 11a of the main plate 11 at right angles to the first surface, and is provided in two rows in the longitudinal direction of the main plate 11 at equal intervals. And a fitting portion 13 having a plate shape. Main plate 11
The fitting portion 13 and the fitting portion 13 are integrally formed at the same time when the insulator 1 is molded and processed with a resin material.

The insulator 1 has a first surface 11a
And a second surface 11 opposite to the first surface 11a.
b, a plurality of through holes 14 (see FIG. 1) penetrating therethrough. In the insulator 1, a plurality of through holes 14 are formed on both sides of the fitting portion 13 at equal intervals in the longitudinal direction.

Each contact 3 has a holding portion 3a (see FIG. 3) engaged with the main plate portion 11 in the through hole 14, and a contact portion extending from one end of the holding portion 3a to the first surface 11a. 3b and a terminal portion 3c bent from the other end of the holding portion 3a to the second surface 11b. As is clear from FIGS. 1 and 2, the terminal portions 3 c are bent from the through holes 14 formed on both sides of the pair of fitting portions 13 in opposite directions.

The contact portion 3b extends from the first surface 11a into a groove 13a formed on both vertical surfaces of the fitting portion 13. The terminal portion 3c is in contact with the first surface 11a and extends along the first surface 11a. Also, the terminal portion 3c
Has a fusion portion 3d for fusing the solder ball 5 at a tip end thereof, and the solder ball 5 is provided on a fusion surface of the fusion portion 3d.

As shown in FIG. 2, in the solder ball connector, the solder ball 5 is placed on a mounting board 20 such as a printed circuit board, with the second surface 11b of the main board 11 facing the conductive board. For example, it is mounted on a conductive portion such as a conductive pad (pad electrode) with its position being adjusted one to one. The solder ball 5 is fused by applying reflow to connect the fused portion 3d of the terminal portion 3c to the conductive portion, and the solder ball connector is mounted on the mounting board 2
Connected to 0.

FIG. 3 shows a state in the middle of the step of processing the contact 3 shown in FIG. 1 and FIG. The contact is formed by punching out the entire shape of the contact 3 using a conductive plate (not shown). At this time, the holding portion 3 of the contact 3
In a, a plurality of locking portions 3f protruding in the plate width direction are formed. A band-shaped carrier 43 is simultaneously punched out of the terminal portion 3c via the connecting portion 41. A plurality of pilot holes 45 are formed in the carrier 43 at predetermined intervals in the longitudinal direction at the same time as the carrier is punched. The pilot hole 45 serves to transport the contact 3 with the carrier 43 in a predetermined direction, transport the contact 3 to a plating tank, or move the contact 3 by engaging with a rotating pin of a transport device (not shown) when incorporating the contact 3 into the insulator 1. Fulfill.

After the contacts 3 are punched out and bent as described above, as shown in FIG. 4, spot plating is applied to the fused surfaces of the fused portions 3d of the plurality of contacts 3.
In this embodiment, first, the entire contact 3 is plated with nickel. The contact 3 is swung into the nickel liquid tank. Then, current is caused to flow through the contact 3 to deposit nickel plating. Next, as shown in FIG. 4, a predetermined position of the contact 3, that is, the fused portion 3d
Is spot-plated on the surface to be fused.

At this time, a stand (not shown) for pressing the contact 3 from below or a masking 51 is used. The masking 51 has the shape of the contact 3 and the shape conforming to the tip of the contact 3 with the carrier 43. After pressing down the contact 3, the nozzle 54 for discharging the plating solution is applied to the mask hole 51 a of the masking 51, and the plating solution flows out. In this way, plating is partially formed by passing a current through the contact 3. In this case, the contact 3 is bent and then plated on the fusion surface of the fusion portion 3d. However, the plating may be performed on the contrary and the bending may be performed in a later step.

FIG. 5 shows a state in which the holding portion 3a of the contact 3 is pressed into the through hole 14 of the insulator 1 and held on the insulator 1 on the left side of the paper, and the carrier 43 is connected to the holding portion 3a. Cutting section 44 with 41
(See FIG. 3). Also, in FIG.
The process of press-fitting the holding portion 3a of the contact 3 is indicated by the contact 3 with the carrier 43 on the right side of the drawing.

FIGS. 6 to 9 are views as seen from the state where the contact is held by the insulator and the carrier 43 is cut off by the cutting portion 44. FIG. FIG. 10 partially shows the terminal portion 3 c located on the first surface 11 a of the insulator 1.

Referring to FIG. 10, at a position where solder ball 5 is to be fused, metal plating A or solder (gold or solder plating) which is less likely to be wet by soldering by spot plating is used.
The terminal portions 3c around the metal plating A other than those provided with the metal plating A are covered with metal plating B such as nickel plating which is hard to be wet with solder. On the metal plating A, a solder ball 5 coated with a flux is mounted.

The solder balls 5 may be mounted after the flux is applied to the contacts 3. Immediately after the metal plating B (nickel plating) is applied, if the metal plating A (solder plating) is applied, the adhesion strength increases.
This is also true for gold plating.

Thereafter, the solder balls 5 are fused to the contacts 3 by performing reflow. The state after the solder balls 5 are fused is the solder ball connector shown in FIG. Since solder wetting is limited even when reflow is applied to the solder ball 5, the ball shape does not collapse due to surface tension of air, and the terminal portion 3c with the solder ball 5 can be formed.

FIG. 11 shows solder ball contacts 63 with a plurality of conductive mating carriers 43 incorporated in the mating solder ball connector to be fitted and connected to the solder ball connector shown in FIG. . FIG.
5 shows a solder ball connector shown in FIG. 5 and a mating solder ball connector fitted and connected to the solder ball connector.

Since the contact 63 shown in FIG. 11 differs from the contact 3 shown in FIG. 3 only in the contact portion 3b, the same portions are denoted by the same reference numerals, and are different in the following description of the contact 3. Descriptions other than the portions will be omitted.

The contact 3 shown in FIG. 11 shows a state in the process of processing the contact 3 shown in FIG. Referring to FIG. 11, contact portion 63a has an elastic force, and has a contact portion 63g that is bent in an arc shape at a tip portion. As shown in FIG. 12, the mating solder ball connector has an insulator 70, a plurality of conductive contacts 63 assembled to the insulator 70, and the solder balls 5 provided on the contacts 63.

The insulator 70 has a flat plate-shaped main plate portion 71, and extends from the first surface 71a of the main plate portion 71 so as to be erected at right angles to the first surface 71a and at equal intervals. It has a fitting portion 73 provided in two rows in the longitudinal direction of the main plate portion 71. Main plate 71
The fitting portion 73 and the fitting portion 73 are integrally formed at the same time when the insulator 70 is formed and processed with a resin material.

The insulator 70 has a first surface 71a.
And a second surface 71 opposite to the first surface 71a.
and a plurality of through holes 74 penetrating therethrough. The plurality of through-holes 74 are provided inside the fitting portion 73 and in the longitudinal direction in the partition portion 76 made of the same material as the insulator 1.
, Each pair is formed.

Each contact 63 includes a holding portion 3a engaged with the insulator 70 in the through hole 74 and a contact portion 6 extending from one end of the holding portion 3a onto the first surface 71a.
3b and a terminal portion 3c bent from the other end of the holding portion 3a to the second surface 71b. The terminal portions 3c are bent from the through holes 74 formed inside each of the pair of fitting portions 73 so as to be opposite to each other.

The contact portion 63b has a through hole 74 in the fitting portion 73.
The groove 75 is formed continuously with the groove 75. The contact portion 63b has an elastic force, and has a contact portion 63g that is bent in an arc shape at the tip portion so as to protrude in a direction opposite to each other. These contact portions 63g are portions that come into contact with the contact portions 3b of the contacts 3.

The terminal portion 3c has a tip 3d as a fusion portion 3d for fusing the solder ball 5, and the solder ball 5 is provided on a fusion surface of the fusion portion 3d. This mating solder ball connector is mounted with the solder balls 5 positioned one-to-one on the conductive portion of the mounting board with the second surface of the main plate portion facing the mounting board shown in FIG. . Then, by applying reflow, the solder balls 5 are fused and the contacts 63 are connected to the conductive portions.
A mating solder ball connector is connected to the mounting board.

The contact 63 is manufactured as follows.
The contact 63 is similar to that shown in FIG. 3 except that the contact 3b is bent and the contact 63b is further bent.
Is formed by bending. In addition, the step of spot-plating on the fusion surface of the fusion portion 3d of the solder ball 5 of the plurality of contacts 63 is performed in advance at a position where the solder ball 5 is to be fusion-bonded by the metal plating A or the solder which is less likely to be wet by the solder. (Gold or solder plating), and the periphery is covered with metal plating B which is hard to wet with solder.

FIGS. 13 to 20 show a second embodiment of a solder ball contact and a solder ball connector. The second embodiment is different from the solder ball contact 3 shown in FIG.
Since the configuration is similar to that of the embodiment,
The same parts are denoted by the same reference numerals as those of the solder ball connector in FIG. 1, and description thereof is omitted.

In the solder ball connector shown in FIG. 1, a pair of fitting portions 13 are provided. However, in the solder ball connector according to the second embodiment, one fitting portion 13 corresponds to the first fitting portion. It is provided on the surface 11a.

As shown in FIG. 15, each of the terminal portions 3c of the plurality of contacts 3 has a ball hole 3k for positioning and aligning the solder ball 5 in the fusion portion 3d. As shown in FIG. 16, solder balls 5 are provided in the ball holes 3k in a molten state. Solder ball 5
Are connected to the terminal 3c partially.

FIGS. 18A to 18C show a process of connecting the solder ball 5 to the ball hole 3k. First, the solder ball 5 is placed in the ball hole 3k as shown in FIG. Next, as shown in FIG. 18B, the ball holes 3k are aligned using, for example, a jig (not shown), or the ball holes 3k are formed by molding and aligned. Further, in the state of FIG.
As shown in (c), the position of the solder ball 5 is melted by reflow, and the fused portion 3 of the terminal portion 3c of the contact 3 is formed.
Connect to d.

FIG. 19 shows the contact 3 with the carrier 43 connected to the carrier 43. This configuration is substantially the same as the contact 3 shown in FIG.
The ball hole 3k can be formed at the same time when the shape of the contact 3 is punched.

FIG. 20 shows an embodiment in which a recessed portion 3j is formed in the fused portion 3d of the terminal portion 3c instead of the ball hole 3k. The solder balls 5 are placed on the recesses 3j, and are aligned with the recesses 3j using, for example, a jig or by forming the recesses 3j by molding. Further, a part of the solder ball 5 is melted by reflow, and is connected to the fused portion 3 d of the terminal 3 c of the contact 3.

Since the opposite side of the recess 3j is a projection, an additional hole 11e or a groove penetrating the first surface 11a and the second surface 11b of the main substrate 11 is formed.

Further, it can be said that the same configuration can be adopted in the mating solder ball connector to be fitted and connected to the solder ball connector by the above-described embodiment. Not even.

FIGS. 21 to 29 show a third embodiment of the solder ball contact and the solder ball connector according to the present invention. The solder ball contact employed in the third embodiment is the same as the solder ball contact 3 employed in FIGS. 1 to 9 in the description of the first embodiment.
Is adopted. The shape of the solder ball connector is the same as that shown in FIG. 1 in the description of the first embodiment.
A description will be given by using an insulator 1 having a configuration similar to that shown in FIGS.

Therefore, in the description of the third embodiment, the contacts 3 and the insulators 1 used in FIGS. 1 to 9 in the description of the first embodiment include:
The same reference numerals are given and the description of the configuration other than the main part of the invention is omitted.

As described in the first embodiment, the contact 3 is pressed into the insulator 1 and held. This state is almost the same as the state shown in FIGS. The difference of the third embodiment is that, as shown in FIG. 21, a terminal receiving groove 11g is formed in the second surface 11b of the main plate portion 11 in the insulator 1. The terminal receiving groove 11g is a through hole 14.
And the contact 3 is press-fitted into the insulator 1 and held in a position such that the terminal portion 3c and the second surface 11b are flush with each other. doing.

FIGS. 22 and 23 show a state after the contact 3 is pressed into the insulator 1 and held. Then, as shown in FIGS. 23 and 24, a strip-shaped resist 8 is formed on the exposed surface of the terminal portion 3c.
3 is given.

As shown in FIG. 25, the resist 83 is formed on the exposed surface of the terminal portion 3c by printing a resist mask 81 for printing with a squeegee 85 and then hardening by printing. Note that the resist 83 is formed in a portion of the terminal portion 3c other than the fusion surface of the fusion portion 3d.

On the fused surface of the fused portion 3d of the terminal portion 3c,
As shown in FIGS. 26 and 27, the solder ball 5 to which the flux is applied is mounted, and the solder ball 5 is connected to the fused portion 3d of the terminal portion 3c by applying reflow. The solder ball 5 remains in the shape of the solder ball 5 due to the surface tension of air even when reflow is performed. Also, since the area where the solder ball 5 is fused is constant,
It is easy to make the height dimension of the shape of the solder ball 5 uniform.

Further, as shown in FIG. 27, the solder balls 5 and the conductive portions of the mounting board 20 are aligned with each other, and are reflowed so that the solder balls 5 are fused to the conductive portions, and 20.

Except for the resist 83, the exposed fused portion 5d is formed in a direction perpendicular to the longitudinal direction of the terminal portion 3c and has a rectangular shape. As shown in FIG. May be such that the fusion surface of the fusion portion 3d exposed to fuse the solder ball 5 is formed in a circular shape. However, as shown in FIG. 29, when printing misalignment occurs, the fusing area S of the fusing portion 3d changes, so that it is necessary to set high printing accuracy.

Further, it is understood that the same configuration can be adopted in the mating solder ball connector to be fitted and connected to the solder ball connector by the above-described embodiment. I can do it.

[0058]

As described above, according to the embodiment of the present invention, according to the solder ball contact and the solder ball connector, the solder ball is provided on the terminal portion of the contact, and the solder ball is provided on the mounting substrate. Since the connector is connected, displacement of the solder ball can be prevented, and the solder ball can be positioned at a predetermined position.

Since the solder balls are not wetted more than necessary, the height can be easily controlled.

Further, it is possible to provide a solder ball connector and a solder ball connector having good self-alignment, a small mounting area, and excellent mountability.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of a solder ball connector according to the present invention.

FIG. 2 is a side view showing a state where the solder ball connector shown in FIG. 1 is mounted on a mounting board.

FIG. 3 is a perspective view showing a solder ball contact employed in the solder ball connector shown in FIG. 1 in a state where the solder ball contact is connected to a carrier during a processing step;

FIG. 4 is an explanatory view showing a means for attaching plating to a fused portion of a terminal portion of the contact shown in FIG. 1;

FIG. 5 is a cross-sectional view showing a state in which a contact is held by an insulator in the solder ball connector shown in FIG. 1 and a state in which the contact is being held;

FIG. 6 is a plan view of the solder ball connector shown in FIG. 1 in a state where contacts are held by insulators.

FIG. 7 is a side view of the solder ball connector shown in FIG. 1 with a contact held by an insulator.

FIG. 8 is a right side view of the solder ball connector shown in FIG. 7;

FIG. 9 is a bottom view of the solder ball connector shown in FIG. 1 in a state where contacts are held by insulators.

10 is a partial plan view illustrating a portion indicating a plating position applied to a terminal portion of a contact in the solder ball connector illustrated in FIG. 1;

FIG. 11 is a perspective view showing a solder ball contact employed in a mating solder ball connector to be fitted and connected to the solder ball connector shown in FIG. 1 in a state in the course of a processing step of being connected to a carrier; is there.

12 is a sectional view showing the solder ball connector shown in FIG. 1 and a mating solder ball connector fitted and connected to the solder ball connector.

FIG. 13 is a plan view showing a second embodiment of the solder ball connector of the present invention.

FIG. 14 is a side view showing a second embodiment of the solder ball connector of the present invention and showing a state before a solder ball is connected to a contact.

FIG. 15 is a bottom view of the solder ball connector shown in FIG. 14;

FIG. 16 is a side view showing a solder ball connector in a state where solder balls are connected to the contacts shown in FIG. 14;

FIG. 17 is a right side view of the solder ball connector shown in FIG. 16;

FIGS. 18A to 18C are cross-sectional views illustrating steps of connecting a solder ball to the contact shown in FIG.

FIG. 19 is a perspective view showing a contact with a carrier in a second embodiment of the solder ball connector of the present invention.

FIG. 20 is a sectional view showing another example of the contact and the insulator in the second embodiment of the solder ball connector of the present invention.

FIG. 21 shows a third embodiment of the solder ball connector of the present invention, showing a state where the contact is held by the insulator, a state where the contact is being held, and a state before the solder ball is connected. It is sectional drawing.

FIG. 22 is a bottom view of the solder ball connector shown in FIG. 21;

FIG. 23 is a cross-sectional view showing a state where resist is applied to the solder ball connector in a state where the contact shown in FIG. 21 is held by the insulator.

FIG. 24 is a bottom view showing a state before solder balls are connected to the solder ball connector shown in FIG. 23;

FIG. 25 is an explanatory view illustrating a step of forming a resist on the contact of the solder ball connector shown in FIG. 23;

FIG. 26 is a bottom view showing a state where solder balls are connected to the solder ball connector shown in FIG. 24;

FIG. 27 is a side view showing a state where the solder ball connector shown in FIG. 26 is mounted on a mounting board.

FIG. 28 is a bottom view showing a modification of the resist in the third embodiment of the solder ball connector of the present invention.

FIG. 29 is an explanatory diagram for explaining a deviation of a fusion area in a modification of the resist shown in FIG. 28;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulator 3, 63 Contact 3a Holding part 3b, 63b Contact part 3c Terminal part 3d Fused part 3k Ball hole 3j Depressed part 5 Solder ball 11 Main plate part 11a First surface 11b Second surface 11g Terminal accommodating groove 13 Fitting Part 14 through hole 20 mounting board 43 carrier 54 nozzle 63g contact part 81 resist A, B metal plating S fusion area

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI H01R 43/02 H01R 43/02 A (72) Inventor Kazuki Nishihigashi 1-21-2 Dogenzaka, Shibuya-ku, Tokyo Japan Aviation Electronics Industry Co., Ltd. In company

Claims (18)

[Claims] 1. A conductive contact having a terminal portion connected to a conductive portion provided on a mounting board and connecting the terminal portion to the conductive portion via a solder ball, wherein the terminal portion is It has a fusion part where the solder ball is fused and placed, and plating is applied on the fusion surface of the fusion part,
A solder ball contact, wherein the solder ball is fused on the plating. 2. The solder ball contact according to claim 1, wherein the plating applied to the fused surface is metal plating that is easily wettable with solder, and the other terminal portions are metal plated that is less likely to be soldered. A solder ball contact. 3. The solder ball contact according to claim 1, wherein the metal plating which is easily wettable with solder is solder plating or gold plating, and the metal plating which is less likely to be soldered to the terminal portion is nickel plating. A solder ball contact, characterized in that: 4. An insulator comprising: an insulator; and a conductive contact held by the insulator and provided on a mounting substrate and connected via a solder ball to the conductive portion, wherein the contact comprises: a holding portion held by the insulator; A solder ball connector having a contact portion extending from one end of the holding portion and a terminal portion extending from the other end of the holding portion, wherein the terminal portion is provided by fusing the solder ball. A solder ball connector having a bonding portion, wherein plating is performed on a fusion surface of the fusion portion, and the solder ball is fused on the plating. 5. The solder ball connector according to claim 4, wherein the plating applied to the fused surface is metal plating that is easily wettable with solder, and the other terminal portions are metal plated that is less likely to be soldered. A solder ball connector characterized by being made. 6. The solder ball connector according to claim 4, wherein the metal plating that is easily wettable by solder is solder plating or gold plating, and the other metal plating that is less likely to be soldered to the terminal portion is nickel plating. A solder ball connector, characterized in that: 7. The solder ball connector according to claim 4, wherein said insulator extends from a first surface of said main plate portion to said first surface of said main plate portion and is fitted to a mating connector. And a through hole penetrating between the first surface and a second surface opposite to the first surface, wherein the insulator has a through hole. The part is inserted into the through hole and is engaged with and held by the insulator, and the contact part is connected to the first part from one end of the holding part.
A solder ball connector, wherein the terminal portion is bent from the other end of the holding portion to the second surface. 8. A conductive contact for connecting a terminal portion connected to a conductive portion provided on a mounting board to the conductive portion via a solder ball, wherein the terminal portion is formed by fusing the solder ball. A ball hole for positioning and installing the solder ball, and a part of the solder ball is fused to the ball hole. A solder ball contact. 9. A conductive contact for connecting a terminal portion connected to a conductive portion provided on a mounting board to the conductive portion via a solder ball, wherein the terminal portion is formed by fusing the solder ball. A soldering portion for positioning and setting the solder ball in the welding portion, and a part of the solder ball is fused to the recessed portion. A solder ball contact. 10. A solder ball connector comprising: an insulator; and a conductive contact held by the insulator and connected to a conductive portion provided on a mounting board via a solder ball, wherein the contact is held by the insulator. A holding portion, a contact portion extending from one end of the holding portion, and a terminal portion extending from the other end of the holding portion, wherein the terminal portion includes the solder portion. It has a fusion part for fusing and setting the ball, and a ball hole for positioning and setting the solder ball is formed in the fusion part, and a part of the solder ball is fused in the ball hole. A solder ball connector characterized by being worn. 11. A solder ball connector comprising: an insulator; and a conductive contact held by the insulator and provided on a mounting board and connected via a solder ball, wherein the contact is held by the insulator. A holding portion, a contact portion extending from one end of the holding portion, and a terminal portion extending from the other end of the holding portion, wherein the terminal portion fuses the solder ball. A soldering portion for positioning and setting the solder ball in the welding portion, and a part of the solder ball is fused to the recessed portion. A solder ball connector. 12. The solder ball connector according to claim 10, wherein the insulator comprises: a main plate portion;
A fitting portion extending from the first surface of the main plate portion to the first surface and fitting to the mating connector; the insulator includes the first surface; A through-hole penetrating between a second surface opposite to the surface, wherein the holding portion is inserted into the through-hole and engaged with the insulator to be held; A portion extending from one end of the holding portion to the first surface and located at the fitting portion, and the terminal portion being bent from the other end of the holding portion to the second surface. Features solder ball connector. 13. A surface of the terminal section, wherein a terminal section connected to a conductive section provided on a mounting board is opposed to the conductive section at a conductive contact connected to the conductive section via a solder ball. A resist is formed in a portion except for a fusion portion where the solder ball is fused and set, and a part of the solder ball is fused to the exposed fusion portion except for the resist. A solder ball contact characterized by being made. 14. The solder ball contact according to claim 13, wherein the fused portion exposed except for the resist is formed in a direction orthogonal to a longitudinal direction of the terminal portion. contact. 15. A solder ball connector comprising: an insulator; and a conductive contact that is connected to a conductive portion provided on a mounting substrate and held on the insulator via a solder ball, wherein the contact is held by the insulator. Surface of the terminal portion facing the conductive portion in a solder ball connector having a holding portion, a contact portion extending from one end of the holding portion, and a terminal portion extending from the other end of the holding portion. A resist is formed in a portion except for a fusion portion where the solder ball is fused and set, and a part of the solder ball is fused to the exposed fusion portion except for the resist. A solder ball connector characterized by being made. 16. The solder ball connector according to claim 15, wherein said fused portion exposed except for said resist is formed in a direction orthogonal to a longitudinal direction of said terminal portion. connector. 17. The solder ball connector according to claim 15, wherein the insulator extends from a first surface of the main plate portion to the first surface of the main plate portion and is fitted to a mating connector. And a through hole penetrating between the first surface and a second surface opposite to the first surface, wherein the insulator has a through hole. The portion is inserted into the through hole and engaged with the insulator and held, and the contact portion extends from one end of the holding portion to the first surface and is located at the fitting portion, The terminal portion is bent from the other end of the holding portion to the second surface. 18. The solder ball connector according to claim 17, wherein the insulator has a terminal accommodating groove formed on the second surface for accommodating the terminal portion, and the second surface of the insulator is connected to the second surface of the insulator. A solder ball connector, wherein a surface of the terminal portion accommodated in the terminal accommodating groove is a same surface.