JPH11217423A - Curable resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a curable resin composition excellent in thermal shock resistance and pressure cooker test resistance and capable of long-term storage by incorporating a compound having at least two epoxy groups and a latent epoxy resin curing agent. SOLUTION: The epoxy compound used is usually one having an epoxy equivalent of 100-4,000. It is desirable that this composition contains, in addition, a carboxyl-containing photopolymerizable compound. It is suitable that it contains further a photopolymerizable compound having a photopolymerizable double bond. When a carboxyl-containing photopolymerizable compound or other photopolymerizable compounds are used, it is desirable to add a photopolymerization initiator. The latent epoxy-curing agent used is exemplified by a dispersion type, a thermally decomposable type, a photodecomposable type, an encapsulated type, or a microencapsulated type. The amount of the latent epoxy curing agent used is desirably 0.5-10 wt.% based on the total amount of the epoxy compound and the photopolymerizable compound.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a curable resin composition,
In particular, it relates to a curable resin composition for sealing electronic parts. More specifically, by using a reaction that completely cures by heating by including a latent epoxy curing agent, a curing type for sealing electronic components that has excellent properties such as thermal shock resistance, moisture resistance, and electrical insulation. The present invention relates to a resin composition.

[0002]

2. Description of the Related Art In recent years, with the rapid development of the electronics industry, demand for electronic components for OA equipment, automobiles and the like has increased rapidly, and their reliability has been demanded. Along with this, there has been a demand for higher performance of sealants for electronic components. Conventionally, a thermosetting resin such as epoxy or epoxyphenol has been used as a sealant for electronic parts. However, these thermosetting resins do not sufficiently satisfy the requirements of high reliability in terms of reduced moisture resistance due to generation of pinholes due to volatilization of the solvent during curing, and fragility of thermal shock. In addition, there is a disadvantage that the curing time is long, the cost is increased due to a decrease in productivity, and the use of a solvent is unsanitary. On the other hand, in recent years, development of an ultraviolet curable resin having no solvent and excellent in rapid curability has been promoted.

[0003]

The ultraviolet-curable resin is excellent in various properties such as quick-curing property, adhesive property, electric insulation property and solvent resistance. At present, the testability is not sufficient, and it has not been put to practical use in terms of reliability. In addition, the storage stability of the resin before the effect was poor, and it was difficult to use.

[0004]

Means for Solving the Problems Accordingly, the present inventors have:
Extensive research was conducted to obtain a curable resin composition with excellent thermal shock resistance, pressure cooker testability, and various properties such as adhesion, electrical insulation, and solvent resistance. By compounding an epoxy curing agent,
The present inventors have found that a curable resin composition having excellent thermal shock resistance and pressure cooker testability and capable of being stored for a long period of time can be obtained.

That is, the present invention is a curable resin composition comprising a compound having at least two epoxy groups in a molecule and a latent epoxy resin curing agent.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The epoxy compound (A) having at least two epoxy groups used in the present invention is an epoxy compound having two or more epoxy groups in one molecule and having an epoxy equivalent of 100 to 100. 4000, preferably 100 to 1,000.

Representative compounds are bisphenol-type epoxy resins such as diglycidyl ethers such as bisphenol A, bisphenol F, and bisphenyl A halides, and novolak-type epoxy resins such as polyglycidyl ethers such as phenol novolak and cresol novolak. Polyglycidyl ethers of polyhydric phenols, ethylene glycol,
Propylene glycol, neopentyl glycol, 1,
Examples include polyglycidyl ethers of dihydric or higher polyhydric alcohols such as 4-butanediol, 1,6-hexanediol, and trimethylolpropane. These epoxy compounds can be used alone or in combination of two or more.

Further, an epoxy group is added to the molecule of allyl glycidyl ether, phenyl glycidyl ether or the like.
It is also possible to use a plurality of epoxy compounds in combination. Among these epoxy compounds having at least two epoxy groups, preferred epoxy compounds include:
Bisphenol A type epoxy compounds, phenol novolak type polyepoxy compounds, cresol novolak type polyepoxy compounds and the like can be mentioned.

In the present invention, it is preferable to use a photopolymerizable compound (B) having a carboxyl group in combination. As the photopolymerizable compound (B) having a carboxyl group, for example,
(I) unsaturated carboxylic compounds such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid and fumaric acid;
(II) There is a compound represented by the following general formula (I). (CH ₃ CC (R1) -COO) m (R2) -A- (R3)-(COOH) n (I) (wherein, R 1 represents hydrogen or a methyl group, and R 2 and R
3 represents an aliphatic, aromatic or alicyclic residue, A represents an ester bond, and m and n each represent a positive integer of 1 to 3. )

In the general formula (I), R2 is preferably a divalent to tetravalent hydrocarbon group having 2 to 10 carbon atoms, or a hydroxyl group-containing hydrocarbon group, and R3 is preferably 2 to 10 carbon atoms. A divalent to tetravalent aliphatic polybasic acid residue, a C6 to C15 divalent aromatic polybasic acid residue, or a C6 to C10 divalent tetravalent It is preferably an alicyclic polybasic acid residue.

The compound represented by the general formula (I) includes
For example, there are the following compounds. Examples of the compound where m = 1 and n = 1 include, for example, mono (meth) acryloyloxyethyl succinate (acryloyloxyethyl ester) and methacryloyloxyethyl ester. Hereinafter, it is abbreviated similarly. ), Mono (meth) acryloyloxyethyl phthalate, mono (meth) acryloyloxyethyl maleate, tetra (mono) acryloyloxyethyl tetrahydrophthalate, mono (meth) acryloyloxyethyl ethyl hexahydrophthalate, Endobicyclo (2
• 2.1) -5-heptene-2,3-dicarboxylic acid mono (meth) acryloyloxyethyl ester, tetrahydrophthalic acid mono-2- (meth) acryloyloxy-1- (phenoxymethyl) ethyl ester, phthalic acid Mono-2-hydroxy-3- (meth) acryloyloxypropyl ester, mono-2-hydroxy-succinate
3- (meth) acryloyloxypropyl ester and the like.

Examples of the compound where m = 1 and n = 2 include trimellitic acid mono-2- (meth) acryloyloxyethyl ester. Examples of the compound with m = 1 and m = 3 include pyromellitic acid mono-2- (meth) acryloyloxyethyl ester.

Examples of the compound having m = 2 and n = 1 include mono- [2,3-bis (meth) acryloyloxyisopropyl] phthalate and mono- [2,3-bis (methyltetrahydrophthalate). Examples thereof include (meth) acryloyloxyisopropyl] ester, mono- [2,3-bis (meth) acryloyloxyisopropyl] tetrahydrophthalate, and mono- [2,3-bis (meth) acryloyloxyisopropyl succinate).

Examples of the compound in which m = 2 and n = 2 include, for example, trimellitic acid mono- [4,5-bis (meth) acryloyloxyneopentyl] ester and trimellitic acid mono- [3,4-bis ( (Meth) acryloyloxyisobutyl] ester. Examples of the compound having m = 3 and n = 2 include trimellitic acid mono- [3,4,5
-Tris (meth) acryloyloxyneopentyl] ester;

Examples of the compound where m = 3 and n = 3 include mono- [3,4,5-tris (meth) acryloyloxyneobenyl] pyromellitic acid ester. As the photopolymerizable compound (B) having a carboxyl group, (II) is particularly preferable among the aforementioned compounds. These photopolymerizable compounds (B) having a carboxyl group are used alone or in combination of two or more, and in combination with one or more of other photopolymerizable compounds (C) described later. Is preferred.

A photopolymerizable compound (B) having a carboxyl group and a photopolymerizable compound (B) containing at least one carboxyl group in a molecule occupied by other photopolymerizable compounds.
Is 10 to 90% by weight. The compounding amount is 10
When the amount is less than the weight%, the curability of the obtained resin composition is remarkably inferior.

The photopolymerizable compound (C) is a photopolymerizable compound having one or more photopolymerizable double bonds in the molecule. Examples of the photopolymerizable compound having one photopolymerizable double bond in the molecule include (I) methyl (meth) acrylate, ethyl (meth) acrylate,
n- and 1-propyl (meth) acrylate, n-,
sec- and t-butyl (meth) acrylate, 2-
Alkyl (meth) acrylates such as ethylhexyl (meth) acrylate and lauryl (meth) acrylate, hydroxyalkyl (meth) acrylates such as 2-hydroxyethyl (meth) acrylate, or polyethylene glycol mono (meth) acrylate and polypropylene glycol mono Polyoxyalkylene glycol mono (meth) acrylates such as (meth) acrylate, heterocyclic-containing (meth) acrylates such as tetrahydrofurfuryl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate (Meth) acrylates such as aminoalkyl (meth) acrylates, alicyclic-containing (meth) acrylates such as isobornyl (meth) acrylate, and phenoxyethyl acrylate Tri b carboxyethyl acrylate,
(II) mono (meth) acrylates of alkylene oxide adducts of bisphenol A, such as ethylene oxide and propylene oxide adducts of bisphenol A;
(III) a compound obtained by reacting a diisocyanate compound and one or more alcoholic hydroxyl group-containing compounds in advance with a terminal isocyanate group-containing compound, and further reacting an alcoholic hydroxyl group-containing (meth) acrylate with one compound in a molecule obtained by reacting the compound. Urethane-modified mono (meth) acrylates having a (meth) acryloyloxy group, (IV) epoxy mono (meth) obtained by reacting a compound having one or more epoxy groups in a molecule with acrylic acid or methacrylic acid A) acrylates, and (V) acrylic acid or methacrylic acid as a carboxylic acid component, and an oligoester mono (meth) acrylate obtained by reacting a polyhydric carboxylic acid with a dihydric or higher polyhydric alcohol as an alcohol component. Kind.

Examples of the photopolymerizable compound having two photopolymerizable double bonds in the molecule include (I) ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,4 -Alkylene glycol di (meth) acrylates such as butanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol Di (meta)
Polyoxyalkylene glycol di (meth) such as acrylate, dipropylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, and polypropylene glycol di (meth) acrylate
Acrylates, (II) ethylene oxide of bisphenol A and di (meth) acrylates of alkylene oxide adducts of bisphenol A such as adducts of propylene oxide, (III) diisocyanate compounds and two or more alcoholic hydroxyl group-containing compounds are prepared in advance. The compound having a terminal isocyanate group obtained by the reaction is further reacted with an alcoholic hydroxyl group-containing (meth) acrylate, and the resulting molecule contains two (meth) acryloyloxy groups in the molecule. Acrylates, (IV) epoxy di (meth) acrylates obtained by reacting a compound having two or more epoxy groups in the molecule with acrylic acid and / or methacrylic acid, (V)
Oligoester di (meth) acrylates obtained by reacting acrylic acid or methacrylic acid as a carboxylic acid component and a polyhydric carboxylic acid with a dihydric or higher polyhydric alcohol as an alcohol component are exemplified.

Examples of the photopolymerizable compound having three or more photopolymerizable double bonds in the molecule include (I) trimethylolpropane tri (meth) acrylate, trimethylolethane tri (meth) acrylate, penta Poly (meth) acrylates of a tri- or higher aliphatic polyhydric alcohol such as erythritol tetra (meth) acrylate, and a terminal isocyanate group obtained by previously reacting (II) a diisocyanate compound with three or more alcoholic hydroxyl group-containing compounds Urethane-modified poly (meth) acrylates having three or more (meth) acryloyloxy groups in the molecule obtained by further reacting an alcoholic hydroxyl group-containing (meth) acrylate with the containing compound, (III)
There are epoxy poly (meth) acrylates obtained by reacting a compound having three or more epoxy groups in a molecule with acrylic acid and / or methacrylic acid.

Heat shock resistance, pressure cooker resistance
In order to obtain a curable resin composition having excellent testability, it is preferable that at least one component of the photopolymerizable compound (C) has a glass transition temperature of a homopolymer of −40 ° C. or lower. Examples of the photopolymerizable compound having a glass transition temperature of the homopolymer of −40 ° C. or lower include, for example, n-propyl acrylate, n-butyl acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, n-decyl methacrylate, n- Dotesyl methacrylate, n-octadecyl methacrylate, 2-methoxyethyl acrylate, 3-methoxypropyl acrylate, 3-methoxybutyl acrylate, 2-ethoxymethyl acrylate, 3-ethoxypropyl acrylate, diethylene glycol mono 2-ethylhexyl ether monoacrylate, Examples include 6-cyano-3-thiahexyl acrylate, 3-thiabutyl acrylate, 4-thiahexyl acrylate, and 3-thiapentyl acrylate.

The amount of the photopolymerizable compound having a glass transition temperature of the homopolymer of -40 ° C. or lower in the photopolymerizable compound (C) is 5 to 5% based on the total amount of the photopolymerizable compound (C). 100% by weight, preferably 10 to 100%
% By weight. When the amount is less than 5% by weight, it is difficult to obtain a cured product excellent in thermal shock resistance and pressure cooker testability.

Epoxy compound (A) used in the present invention
And the mixture ratio of the above-mentioned photopolymerizable compound (B) having a carboxyl group and another photopolymerizable compound (C) is as follows: epoxy compound (A): photopolymerizable compound [(B) + (C)] = 10:90 to 90:10 (weight ratio), more preferably epoxy compound (A): photopolymerizable compound [(B) + (C)] = 2
0:80 to 80:20 (weight ratio). When the blending amount of the epoxy compound (A) is less than 10% by weight, the reaction between the photopolymerizable compound (B) having a carboxyl group and the epoxy compound (A) becomes substantially too fast, and the adhesiveness, heat resistance, etc. It is difficult to obtain an excellent cured product. When the amount of the epoxy compound (A) exceeds 90% by weight, the viscosity of the curable resin composition becomes high, the handleability is poor, and the advantage of the curing reaction by actinic rays is obtained.
That is, the quick curing property cannot be utilized.

In the present invention, when a photopolymerizable compound (B) having a carboxyl group or another photopolymerizable compound (C) is used, it is preferable to add a photopolymerization initiator (D). Examples of the photopolymerization initiator (D) include ketanols such as benzyldimethylketanol, benzoin methyl ether, benzien ether, benzoin, α-
Benzoins such as methylbenzoin, anthraquinones such as 9,10-anthraquinone, 1-chloroanthraquinone and 2-ethylanthraquinone, benzophenone, p-chlorobenzophenone, p-dimethylaminobenzophenone, 3,3 ′, 4,4′- Propiophenones such as tetra- (t-butyneperoxycarbonyl) benzophenones, 2-hydroxy-2-methylpropiophenone and 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropiophenone; Suberones such as dibenzosuberone; sulfur-containing compounds such as diphenyl disulfide, tetramethylthiuram disulfide and thioxanthone; and dyes such as methylene blue, eosin and fluorescein.
Used in combination of more than one species.

The amount of the polymerization initiator is preferably 0.05 to 20% by weight, more preferably the total amount of the epoxy compound (A) and the photopolymerizable compound (B + C).
0.5 to 10% by weight. If the amount of the polymerization initiator is less than 0.05% by weight, the curability of the unirradiated portion of the ultraviolet ray is reduced, and it is difficult to obtain a completely cured product. When the amount of the polymerization initiator exceeds 20% by weight, storage stability is poor.

The latent epoxy curing agent (E) used in the present invention includes, for example, BF3 complexes, imidazole derivatives, dicyan and its derivatives, organic acid hydrazites, diaminomaleonitrile and its derivatives as dispersion-type curing agents , Melamine and its derivatives, polyamides and the like. Further, there are amine imide as a thermal decomposition type curing agent, and aromatic diazonium salt, diallyl iodonium salt, triallylsulfonium salt, triallyl selenium salt and the like as photodecomposition type curing agents. Further, as the molecular sieve, there is an encapsulating hardener, a microencapsulated hardener in which imidazole or the like is wrapped in a film as fine oil droplets.

These latent type epoxy curing agents exhibit an activity as an epoxy curing agent for the first time by an external stimulus such as temperature (heat), light, etc., have a low activity when stored at room temperature, and are different from ordinary epoxy curing agents. In comparison, long-term storage at room temperature becomes possible.

The compounding amount of the latent epoxy curing agent is preferably 0.5 to 10% by weight, more preferably 1 to 5% by weight, based on the total amount of the epoxy compound (A) and the photopolymerizable compound (B + C). % By weight. If the amount of the latent epoxy curing agent is less than 0.5% by weight, the curability is remarkably reduced, and a completely cured product is difficult to obtain. 10% by weight
When it exceeds, the storage stability is poor.

In the present invention, when it is necessary to accelerate the reaction between the epoxy group and the carboxyl group, the addition of a reaction accelerator is effective. Examples of the reaction accelerator include imidazoles such as 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, benzyldimethylamine, triethanolamine, N, N
Tertiary amines such as -dimethylaminoethanol, N, N-diethylaminoethanol, N, N-dipropylaminoethanol, and tertiary amines such as triacetate and tribenzoate of tridimethylaminomethylphenol; Used alone or in combination of two or more.

In the present invention, the addition amount of these reaction accelerators is 0.05 to 5% by weight, preferably 0.1%, based on the total amount of the epoxy compound (A) and the photopolymerizable compound.
~ 3.5% by weight.

The curable resin composition used in the present invention is easily produced by stirring and mixing at room temperature or, if necessary, while heating. Known thermal polymerization such as hydroquinone, hydroquinone monomethyl ether, 1-butyl-catechol, p-benzoquinone, 2,5-t-butyl-hydroquinone, and phenothiazine to prevent thermal polymerization during production and dark reaction during storage. It is desirable to add an inhibitor. The addition amount is 0.001 to 0.1% by weight based on the photopolymerizable compound used in the present invention.
0.001 to 0.05% by weight.

The curable resin composition used in the present invention includes:
In addition to the above additives, various additives such as known coloring agents, surface smoothing agents, defoaming agents, fillers, dispersants, coupling agents, and flame retardants can be added as necessary.

The method for curing the curable resin composition of the present invention comprises:
First, by irradiation with actinic light, a photopolymerizable compound (B) having a carboxyl group or a mixture of (B) and another photopolymerizable compound (C) is polymerized to form a carboxyl group-containing polymer, and then heated. It comprises two steps of reacting the epoxy compound (A) with the carboxyl group contained in the polymer to completely cure it.

As a method for sealing an electronic component using the curable resin composition of the present invention, there are general sealing methods such as a dipping method, a potting method using a dispenser, and a dripping method.

[0034] There is no particular restriction on the photopolymerization reaction conditions, preferably integrated light amount 100mJ / m2 ~5000mJ / m ^2. The thermosetting reaction conditions include a temperature of 80 to 250.
At 300C, 1 to 300 minutes are preferred.

The curable resin composition of the present invention is irradiated with an actinic ray such as an ultraviolet ray or an electron beam to induce a polymerization reaction.
Light sources used for UV irradiation include sunlight, chemical lanap, low-pressure mercury lamp, high-pressure mercury lamp, carbon arc lamp,
Xenon lamps, metal halide lamps and the like are used. When irradiating with an electron beam, a photoinitiator is not necessarily required.

As a heat source used for heating, for example,
Known heating methods such as infrared heater, hot air heating, and high frequency heating are used. In addition, heat generated by a light source used for ultraviolet irradiation can be used.

[0037]

EXAMPLES The present invention will now be described in more detail with reference to examples, but the present invention is not limited to these examples. In the examples, parts and% indicate parts by weight and% by weight, respectively. The resin properties of the curable resin composition and the performance of the cured product were measured by the following methods.

1) Viscosity: Measured at 25 ° C. using a Brookfield viscometer according to JIS K6901. 2) Thixotropic degree: Using a Brookfield viscometer according to JIS K6901, 2 ° C at 25 ° C. p. The value of the ratio of the viscosities measured in m was calculated. 3) Hardness: Pencil hardness was measured. 4) Thermal shock resistance: Using a test piece dip-coated with a hybrid IC, at -55 ° C for 30 minutes to 125 ° C,
After repeating the heat cycle for 30 minutes 300 times, the presence or absence of a change in appearance was visually observed. Furthermore, hybrid IC
Between silver and palladium conductors printed on the board (1 mm)
Was measured after applying a voltage of 500 V for 1 minute. 5) Pressure cooker test resistance: 121 ° C.
The appearance and visual observation of the test piece left for 300 hours in an environment of 2 atm and 100% RH were measured, and the insulation resistance value after the test piece was left for 2 hours at room temperature was measured.

Example 1 Epicoat 5 which is a bisphenol A type epoxy compound
050 (manufactured by Yuka Shell Epoxy) 100 parts, 2-
Acryloyloxyethyl hexahydrophthalic acid 50
Parts, 104 parts of triloxyethyl acrylate, and 34 parts of diethylene glycol mono-2-ethylhexyl ether monoacrylate having a homopolymer having a glass transition temperature of -65 ° C were charged into a stirring vessel, mixed and stirred at 80 ° C, and mixed with a transparent resin composition ( 1) was obtained. This resin composition (1) 1
With respect to 00 parts, 3,3 ', 4,
1 part of 4'tetra (t-butylperoxycarbonyl) benzophenone, 1 part of benzyldimethyl ketal, 2 parts of 2-methylimidazole microencapsulation curing agent as a latent epoxy curing agent, and silane coupling agent 1 as various additives Parts, 0.1 part of a silane-based antifoaming agent, 0.2 part of a coloring agent, and 0.5 part of a dispersant, to obtain a resin composition (2). For 100 parts of this resin composition (2),
32 parts of talc as a filler and Sb2O as a flame retardant
31.5 parts are blended and dispersed to obtain a curable resin composition (a)
I got Next, the hybrid IC was dip-coated with the curable resin composition (a), irradiated with ultraviolet rays of 2000 mJ / m ² , and then heated and cured at 150 ° C. for 30 minutes to obtain a sealed hybrid IC. Table 1 shows the resin properties of the obtained curable resin composition and the properties of the cured product. Next, the thermal shock resistance and the pressure cooker test resistance of the obtained encapsulated hybrid IC were measured.

[0040]

[Table 1]

Examples 2 and 3 In Example 2, the other photopolymerizable compound (c) of the curable resin composition (a) of Example 1 was changed to only 136 parts of diethylene glycol mono-2-ethylhexyl ether monoacrylate. In Example 3, the curable resin composition (b) obtained in Example 3 was obtained by converting trioxyethyl acrylate, which is one component of the photopolymerizable compound (c) of the curable resin composition (a) of Example 1, to tetrahydroxyfurfuryl acrylate 78. Thus, a curable resin composition (c) changed to parts was obtained. Then, the hybrid IC was cured in the same manner as in Example 1 to obtain a curable resin composition (b).
(C) After each dip coating, 2000 mJ /
Irradiation with ultraviolet rays of m ^{2 was performed} , followed by heating at 150 ° C. for 30 minutes to cure, thereby obtaining a sealed hybrid IC. Table 2 shows the properties of each resin and the properties of the cured product. Next, the thermal shock resistance and the pressure cooker test resistance of the obtained sealed hybrid IC were measured.

[0042]

[Table 2]

Tables 3 and 4 show the basic resin compositions of Examples 1, 2 and 3, and the results of measurement of thermal shock resistance and pressure cooker test resistance.

[0044]

[Table 3]

[0045]

[Table 4]

[0046]

Advantageous effects of the present invention are as follows. (1) Since a latent epoxy curing agent is blended, the curability is excellent and the storage stability is excellent. Furthermore, since there is no need to add a curing agent at the time of use, workability is excellent. (2) The resin composition of the present invention is cured by heating to obtain a completely cured resin even in a thick portion or a light-shielded portion where actinic rays such as ultraviolet rays are hardly irradiated. In addition, it has a rapid curing property which is a feature of the ultraviolet curing resin. (3) Since the resin composition of the present invention loses the fluidity of the resin within a very short time due to irradiation of ultraviolet rays even when a large amount of filler is blended or in a thick part, The process can be moved to the process, and a great improvement in productivity can be achieved as compared with a conventional thermosetting resin or a combination resin of ultraviolet ray and thermosetting. (4) The resin composition of the present invention is extremely excellent in resistance to pressure, cooker and test, and various plastics,
Excellent adhesion to ceramic and glass metal. (5) Epoxy compound (A) and photopolymerizable compound ((B)
And (C)) have good compatibility, and the viscosity of the resin composition can be freely adjusted. The curable resin composition of the present invention takes advantage of such advantages to provide ICs, LSIs, diodes, thyristors, hybrid ICs, resistors, capacitors, light emitting diodes, liquid crystal display elements, optical sensors, pressure sensors, temperature sensors, and the like. Used for sealing and coating of electronic parts and optoelectronic parts. It can also be used in fields such as paint applications, ink applications, and adhesive applications.

Claims (1)

[Claims] 1. A curable resin composition comprising a compound having at least two epoxy groups in a molecule and a latent epoxy resin curing agent.