JPH1121602A - Manufacture of sheet member having fin, and manufacture of resin mold sheet member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of the sheet member to improve the heat radiation effect by the fins, to surely prevent detachment from the resin, and to easily form the fins. SOLUTION: A plurality of projecting bars 6 corresponding to fins 4 after the manufacture are formed on the surface of a main part 3A of the stock 1 which is a sintered body. The projecting bars 6 are thicker than the fins 4. The stock 1 is repressed, the projecting bars 6 are pressed during the repressing to obtain a sheet member in which the fins 4 are formed on the surface of a main part 3. The fins 4 are formed by pressing the projecting bars 6 of the stock 1 during the repressing, and by achieving the plastic flow. The fins 4 which is easily small in density become equal to the main part 3 in density through high working degree, and the heat radiation effect of the whole sheet member 2 is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a thin plate member having fins or a thin plate member molded with resin, such as a heat spreader or a heat sink to be mounted on an IC package.

[0002]

2. Description of the Related Art In recent years, high integration and diversification of ICs have been demanded in semiconductors.
In the C package, high functionality such as miniaturization, increase in capacity, reduction in thickness, increase in the number of pins, etc. has been remarkably progressing. With such advanced functions, the heat generation of the IC package also tends to increase steadily.
In the C package, the number of heat radiators such as a heat spreader is increased, and in the IC package having a heat value exceeding 10 W, the number of radiators such as a heat sink is further increased.

For example, the above-mentioned heat spreader is generally a square thin plate having a side of 25 to 45 mm and a thickness of about 0.5 to 1.0 mm, and is mounted on a substrate on which an IC is mounted, and molded with a resin. The IC package is configured. In the state of this IC package, the heat spreader has a surface exposed for heat radiation, and a fin for enhancing a heat radiation effect or a heat absorption effect is formed on the surface or the back surface buried in resin. In some cases, fins are formed on the back surface buried in resin. Further, a plurality of holes filled with the resin may be formed so as not to be separated from the resin. Such a heat spreader is conventionally manufactured by punching a metal plate made of copper or aluminum having high heat conductivity, and performing plastic working such as drawing and rolling. The heat sink is used by mounting it on an IC package equipped with a heat spreader to further enhance the heat dissipation of the heat spreader. In particular, when the height of the fin is relatively high, the fin is formed by cutting out the fin.

[0004]

By the way, as described above, the heat generation of IC packages has been increasing in recent years, and accordingly, the heat radiation effect of the heat spreader is naturally desired to be improved. For this purpose, measures have been taken to increase or lengthen the fins.However, to increase or lengthen the fins, it is difficult to perform the above-described plastic working, and it is costly to perform cutting. There was such a problem. Further, even when the holes are formed in order to prevent the heat spreader from being peeled off from the resin, the effect may not be sufficiently exerted when a strong force is applied. Therefore, the present invention is intended to further improve the heat radiation effect in a thin plate member having fins, such as a heat spreader or a heat sink, and to reliably prevent the thin plate member molded with the resin from peeling off from the resin. It is an object of the present invention to provide a manufacturing method that facilitates manufacturing of a member.

[0005]

According to the method of manufacturing a thin plate member having fins of the present invention, a green compact having a thin plate-shaped main portion and a built-up portion projecting from the main portion is manufactured.
After sintering the green compact to obtain a raw material that is a sintered body, the raw material is repressed, and at the time of the repressing, the overlay is compressed to form the fin. . In the present invention, the fins are formed by compressing the overlaid portion and plastically flowing, so that the same density as the main portion, that is, thermal conductivity is secured, and as a result, a thin plate member having a high heat radiation effect as a whole Can be obtained. In addition, since the prefabricated overlay is compressed, the amount of plastic deformation is small, and fins can be easily formed.

In forming a fin based on the above-described manufacturing method, if a build-up portion that can be a fin is formed in a trapezoidal shape, plastic flow is likely to occur and the fin can be easily formed. In addition, by making the build-up portion a trapezoid, when taking out the green compact from the molding die,
The build-up portion is less likely to be damaged or collapsed, and as a result, workability is improved. In addition, the build-up part,
According to the shape of the fin after manufacturing, and if formed in a thick ridge or a larger projection than the thickness of the desired size,
The fins after production are preferable in that the thickness of the ridges or the size of the projections are compressed, so that the working degree is increased and the density is secured. As a means for increasing the degree of processing in this way, a build-up portion may be formed on the opposite side of the formed fin portion. In this case, the build-up portion is pushed up and protruded toward the fin forming portion side, and the degree of processing is increased.
Further, by forming the built-up portion so as to gradually increase toward the center in the direction in which the fins are arranged in parallel, the workability of the central portion, which tends to be rough, is increased, and the density of the central portion is sufficiently ensured. Is done.

In the above manufacturing method, if a large number of fine irregularities are formed on at least one punch surface, which forms a surface at the time of re-pressing, by means such as electric discharge machining or shot blasting, the irregularities are regenerated. This is preferable because it is formed by being transferred to the main part or the fin at the time of pressurization, and the specific surface area of the thin plate member is increased, and as a result, heat radiation (heat absorption) is improved.

Further, according to the method of manufacturing a resin-molded thin plate member of the present invention, after sintering a green compact to obtain a material as a sintered body, the material is re-pressed. It is characterized in that it forms a latching meat portion for preventing slippage. According to the thin plate member obtained by the present invention,
Even if a force is applied in a direction in which the resin is separated from the resin in a state of being molded with the resin, the hook portion prevents the resin from coming off. Since the hooked portion is formed at the time of re-pressing in the sintering process, it can be easily formed without cutting or the like.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (1) First Embodiment Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. The first embodiment relates to a method of manufacturing a thin plate member having a square shape in plan view having fins on the surface of a thin plate-shaped main portion by sintering. Hereinafter, Examples 1 to 7 based on the first embodiment will be described.

Example 1-FIG. 1 FIG. 1A shows a raw material 1 which is a sintered body obtained by sintering a green compact.
This material 1 has a thin plate-shaped main portion 3A and a trapezoidal build-up portion 5 having an appropriate thickness and a substantially constant thickness is formed at the center of the surface of the main portion 3A. The thickness of the built-up portion 5 is appropriately set based on the pressure at the time of re-pressing later, the density of the material 1, and the like. Next, the material 1 is repressed by a repressing mold. Here, a coining die corresponding to a desired fin shape is formed on the punch surface of the upper punch of the repressing die. FIG. 1B shows a thin plate member 2 having fins obtained after re-pressing,
The thin plate member 2 having the fins has a configuration in which a plurality of fins 4 formed by the coining die extending parallel to each other in a direction perpendicular to the plane of the drawing in the drawing are provided on the surface of the main portion 3. . The fins 4 are formed by compression working of the overlaid portion 5 of the raw material 1 and plastic flow at the time of re-pressing.

According to the first embodiment, the fin 4 of the obtained thin plate member 2 having the fins
Is formed by plastic flow of the build-up portion 5. Since the built-up portion 5 is formed in a trapezoidal shape, plastic flow is likely to occur, so that the fins 4 can be easily formed. In addition, when forming the green compact, only the build-up portion 5 is formed, so that the configuration of the molding die is simplified, and the green compact is easy to handle, thereby improving workability.

[Example 2-FIG. 2] Next, Example 2 based on the first embodiment of the present invention will be described. FIG. 2 (a)
1 shows a raw material 1 which is a sintered body obtained by sintering a green compact. This material 1 has a plurality of ridges (build-up portions) 6 extending in parallel to each other in a direction perpendicular to the plane of the drawing in the drawing on the surface of the main portion 3A. Number of ridges 6,
The thickness and height are based on the fins of the thin plate member having the fins to be manufactured, but are larger than the desired dimensions of the fins. It is set appropriately based on the density and the like. Next, the material 1 is repressed by a repressing mold. Here, a coining die corresponding to a desired fin shape is formed on the punch surface of the upper punch of the repressing die. FIG. 2B shows a thin plate member 2 having fins obtained after re-pressing. The thin plate member 2 having fins is provided on a surface of a main part 3 by a plurality of fins 4 formed by the coining mold. Is provided. The fins 4 are formed when the ridges 6 of the raw material 1 are pressed and thinly compressed and plastically flow at the time of re-pressing.

Since the fins 4 of the thin plate member 2 having the fins according to the second embodiment are formed by plastic flow of the ridges 6 of the raw material 1 at the time of re-pressing, the working degree of the fins 4 at the time of re-pressing Is particularly high, and the density of the fins 4 is ensured to be equal to that of the main part 3. For this reason, the heat radiation effect of the entire thin plate member 2 having fins is greatly improved. Since the ridge 6 of the material 1 is larger in size than the fin 4, the fin 4
Compared to the case where the compact is formed to the same size as that described above, the compact is less likely to be damaged or collapsed, and as a result, the compact is easier to handle and the workability is improved.

Example 3 FIG. 3 Next, Example 3 based on the first embodiment of the present invention will be described. FIG. 3 (a)
1 shows a raw material 1 which is a sintered body obtained by sintering a green compact. This material 1 has a plurality of overlaid portions 5 formed on the surface of the main portion 3A and extending in parallel to each other in a direction orthogonal to the paper surface in the figure. Although the build-up portion 5 is lower than the height of the fin of the thin plate member having the fin to be manufactured, its cross-sectional area is sufficiently large, and its size depends on the pressure at the time of re-pressing and the density of the material 1 and the like. It is set appropriately on the basis of. Next, the material 1 is repressed by a repressing mold. Here, a coining die corresponding to a desired fin shape is formed on the punch surface of the upper punch of the repressing die. FIG.
(B) shows the thin plate member 2 having the fins obtained after the re-pressing.
Is provided with a plurality of fins 4 formed by the coining die on the surface thereof. The fin 4 has a sharp cross-sectional shape, and is formed by pressurizing and thinly compressing the overlaid portion 5 of the raw material 1 and reflowing when repressing.

According to the third embodiment, the fin 4 of the obtained thin plate member 2 having the fins
Is formed by plastic flow of the overlaid portion 5 of the fin 4 because the plastic flow is likely to occur.
Can be easily formed. Further, since the build-up portion 5 is thicker and lower than the fins 4, it is less likely to be damaged or collapsed as compared with the case where the fins 4 are formed to the same size, and the compact is handled more easily. It becomes easier and the workability is improved.

Example 4 FIG. 4 Next, Example 4 based on the first embodiment of the present invention will be described. FIG. 4 (a)
1 shows a raw material 1 which is a sintered body obtained by sintering a green compact. This material 1 has a built-up portion 5 having an appropriate thickness formed at the center of the back surface of the main portion 3A. The thickness of the built-up portion 5 is appropriately set based on the pressure at the time of re-pressing later, the density of the material 1, and the like. Next, the material 1 is repressed by a repressing mold. A coining die corresponding to a desired fin shape is formed on the punch surface of the upper punch of the repressing die. FIG.
(B) shows a thin plate member 2 having fins obtained after re-pressing. The thin plate member 2 having fins has a main portion 3 having a concave portion 3a for incorporating an IC on the back surface.
Has a plurality of fins 4 extending in parallel to each other in a direction perpendicular to the plane of the drawing.
The fins 4 plastically flow so that the meat corresponding to the meat portion (shown by the broken hatched portion in FIG. 4A) in which the overlay portion 5 of the raw material 1 and a part of the other portions are combined is pushed upward. It is formed by things.

According to the embodiment 4, the fins 4 of the obtained thin plate member 2 having the fins are formed by pressurizing the overlaid portion 5 of the raw material 1 and a part of the other portions to flow plastically. Therefore, the density of the fins 4 is ensured to be equal to that of the main part 3, and the heat radiation effect is improved. In addition, since no fins are formed on the raw material 1 which is a sintered body, only the overlaid portions 5 for forming the fins 4 are formed, so that the green compact is easy to handle and the workability is improved.

Example 5 FIG. 5 Next, Example 5 based on the first embodiment of the present invention will be described. FIG. 5 (a)
1 shows a raw material 1 which is a sintered body obtained by sintering a green compact. This material 1 has a plurality of raised ridges (build-up portions) 6 formed on the surface of a main portion 3A. These ridges 6
Extend parallel to each other in a direction perpendicular to the paper surface in the figure,
In addition, they are formed in a chevron shape as a whole such that the height increases toward the center in the left-right direction in the figure, and both are set higher than the desired height of the fin of the thin plate member having the fin to be manufactured. . Next, the material 1 is repressed by a repressing mold. Here, a coining die for forming a desired fin is formed on the punch surface of the upper punch of the repressing die. FIG. 5B shows a thin plate member 2 having fins obtained after re-pressing. The thin plate member 2 having fins is provided on a surface of the main part 3 by a plurality of fins 4 formed by the coining mold. Is provided. The fins 4 are formed by plastic flow when the ridges 6 of the raw material 1 are pressed in a direction in which the height is particularly reduced during re-pressing.

According to the fifth embodiment, since the height of the ridge 6 increases toward the center, the working ratio of the fin 4 at the center becomes particularly high. When forming a plurality of fins in parallel by powder molding, the density of the green compact becomes lower and coarser as it is closer to the center, but the center of the plurality of ridges 6 must be raised in advance as described above. As a result, the density is ensured by increasing the degree of processing in the central portion at the time of re-pressing, so that the overall density can be made uniform.
Therefore, the obtained thin plate member 2 having fins has a sufficient heat radiation effect.

Example 6-FIG. 6 Next, Example 6 based on the first embodiment of the present invention will be described. Example 6
Is a manufacturing example of a heat spreader molded into a resin to constitute an IC package. FIG. 6A shows a raw material 1 which is a sintered body obtained by sintering a green compact.
This material 1 is formed by forming a plurality of ridges (build-up portions) 6 having a uniform height on the surface of the main portion 3A. These ridges 6 extend parallel to each other in a direction perpendicular to the plane of the drawing. Here, in each of the ridges 6 of the raw material 1, the one at the end has a desired density due to the characteristics at the time of compacting, but is closer to the center than at the end. Density is coarse. Next, the material 1 is repressed by a repressing mold. Here, on the punch surface of the upper punch of the re-pressing die, a coining die for forming a fin in which the height of the ridge 6 decreases toward the center is formed. FIG. 6B shows the obtained heat spreader (thin plate member) 11. The heat spreader 11 has a plurality of fins 4 formed on the surface of the main part 3 by the coining mold. . The height of the fins 4 gradually decreases from the end to the center due to the re-pressing of the ridges 6. It is formed by being pressed and plastically flowing. FIG. 6C shows a state in which the obtained heat spreader 11 is molded into a resin M. In this case, the side on which the fins 4 are formed is molded into the resin M, and the plane side is flush with the surface of the resin M.

According to the sixth embodiment, the fin 4 at the center is
Since the working degree of the fins 4 is particularly high, the density of the fins 4 at the central portion thereof is compensated equivalently to that of the fins 4 at the end portions, so that the overall density of the fins 4 can be made uniform. Therefore, the obtained heat spreader 11 has a sufficient heat absorbing effect, that is, a heat radiating effect. Although the heat spreader 11 is molded on the resin M on the fin 4 side, the heat spreader 11 can also be used as a heat sink mounted on an IC package with the fin 4 side facing up.

Example 7-FIG. 7 Next, Example 7 based on the first embodiment of the present invention will be described. Example 7
This is also a manufacturing example of a heat spreader which is molded into the same resin as in the sixth embodiment to form an IC package.
FIG. 7A shows a raw material 1 which is a sintered body obtained by sintering a green compact. This material 1 is formed with a trapezoidal build-up portion 5 having an appropriate thickness and a substantially constant thickness in the center of the surface of the main portion 3A, and a plurality of uniform heights on the lower surface periphery. The ridges (build-up portions) 6 are formed. The ridges 6 extend in parallel to each other in a direction perpendicular to the plane of the drawing. Next, the material 1 is repressed by a repressing mold. Here, a coining die corresponding to a desired fin shape is formed on the punch surface of the upper punch of the repressing die. In addition, a coining die corresponding to a fin shape formed in a concave portion formed in a central portion and a lower surface is formed on a punch surface of the lower punch. FIG. 7B shows the obtained heat spreader 11.
1 has a plurality of fins 4 formed by the coining mold on the surface of the main part 3, and a concave part 15 is formed in the center part on the back surface, and the fins 4 are formed on the end part. It has become. The fins 4 on the front side are formed by compressing the overlaid portion 5 of the raw material 1 and plastically flowing when repressing. In the fins 4 on the lower surface side, the ridges 6 are thinly compressed, and the inner fins 4 are also compressed in height.
Each is formed by the plastic flow of the ridge 6 by the compression working. FIG. 7C shows the obtained heat spreader 11.
Is molded in a resin M. in this case,
The side on which the fins 4 on the back side are formed is molded with resin,
The peripheral surface of the main portion 3 is flush with the surface of the resin M.

According to the seventh embodiment, the fins 4 on the back side that are buried in the resin M have a high degree of processing due to the compression processing of the protruding ridges 6 and have a higher density than the inner fins 4 where the density tends to be coarse. The density is made uniform by reducing the height. Further, since the fins 4 are also formed on the upper surface, the obtained heat spreader 11 can effectively absorb the heat from the IC by the fins 4 on the back surface and the heat radiation by the fins 4 on the front surface.

The first embodiment described with reference to Examples 1 to 7 is an example embodying the present invention. In the present invention, a fin is formed by repressing a material which is a sintered body. The embodiment is not limited to the above embodiments.

(2) Second Embodiment Next, a second embodiment of the present invention will be described. Second
The embodiment of the present invention relates to a method of manufacturing by sintering a heat spreader provided with a retaining means from a resin to be molded when incorporated as an IC package. Hereinafter, an embodiment based on the second embodiment will be described. Examples 1 to 6 will be described.

Example 1-FIG. 8 FIG. 8 (a) shows the heat spreader 11 of Example 1, and the heat spreader 11 is formed by sintering a green compact obtained by compacting a raw material powder. And repressurizing the material. The heat spreader 11 is formed in a thin plate shape, and has a plurality of retaining holes 12 penetrating in the thickness direction at appropriate locations. The retaining hole 12 is formed at the time of compacting, has a circular cross section, and has a tapered shape whose diameter increases toward the surface 13 (upper side in the figure). By forming the retaining hole 12, a hook portion 14 is formed around the retaining hole 12.

FIG. 8 (b) shows a state in which the heat spreader 11 is molded with resin M as an IC package. Only the surface 13 of the heat spreader 11 is exposed and the retaining hole 12 is filled with resin M. I have. In this state, since the hook portion 14 hits the resin M filled in the retaining hole 12, the movement of the heat spreader 11 toward the front surface 13 is restricted. Therefore, the heat spreader 11 is sufficiently prevented from falling out of the resin M.

Embodiment 2 FIG. 9 FIG. 9A shows a heat spreader 11 according to Embodiment 2. The heat spreader 11 has a recess 15 for incorporating an IC in the center of the back surface, and a step portion 16 and a slope 17 formed at both ends of the front surface 13, respectively. Step 16
The slope 17 is formed by coining when the material is repressurized. The stepped portion 16 is formed, so that the hooking portion 14 having a rectangular cross section is provided below the stepped portion 16.
Is formed, while the slope 17 is formed,
Under the slope 17, a hook portion 14 having a trapezoidal cross section is formed.

FIG. 9B shows a state in which the heat spreader 11 is molded with resin M as an IC package. Only the surface 13 of the heat spreader 11 is exposed, and the resin M is filled above the step portion 16 and the slope 17 in a state flush with the surface 13 of the heat spreader 11. In this state, each of the hook portions 14, 14 hits the resin M in the upper portion of the step portion 16 and the inclined surface 17, and
The movement of the heat spreader 11 toward the front surface 13 is restricted. Therefore, the heat spreader 11 is sufficiently prevented from falling out of the resin M.

[Embodiment 3-FIG. 10] FIG. 10 (a) shows a heat spreader 11 according to Embodiment 3, in which a plurality of retaining holes 22 penetrating in the thickness direction are formed. ing. This retaining hole 22 is
The one on the left side in the figure has a circular cross section, and has a barrel shape that gradually increases in diameter in the axial direction from the upper and lower openings, and the flesh portions of the opening peripheral edges on the front side and the back side are , And the hooking portion 14 protruding inside the retaining hole 22. In order to exert the retaining function, it is also possible to form the retaining meat portion 14 only on the back surface side, like the retaining hole 22 on the right side in the drawing. In order to form such a retaining hole 22, a round hole 22a having a uniform diameter corresponding to the retaining hole 22 is formed at the time of molding the green compact 11A, as shown in FIG. Upper and lower punches 30 having ring-shaped projections 30a
By pressurizing the peripheral portion of the opening of the round hole 22a, it is formed by plastic deformation. The meat portions at the peripheral edges of the openings on the front side and the back side formed by the re-pressing in this manner serve as the hooking meat portions 14 protruding inside the retaining holes 22.

FIG. 10C shows a state in which the heat spreader 11 is molded with a resin M as an IC package. The heat spreader 11 has only the surface 13 exposed, and the retaining holes 22 are filled with resin M. In this state, the engaging meat portion 14 hits the resin M, and the movement of the heat spreader 11 toward the front surface 13 is regulated, whereby the heat spreader 11 is sufficiently prevented from coming off.

Fourth Embodiment FIG. 11 FIG. 11A shows a heat spreader 11 according to a fourth embodiment. The heat spreader 11 has a plurality of convex portions 24 protruding on the back surface side. A sharp concave portion 24a is formed at the center of the lower end face of each of the convex portions 24. Further, the peripheral portion of the convex portion 24 is formed with a latch meat portion 14 which protrudes in the surface direction of the heat spreader 11 and spreads in a skirt shape. To manufacture such a heat spreader 11, first, as shown in FIG. 11B, a material 11 having a convex portion 25 corresponding to the convex portion 24 is used.
A is obtained by sintering.
Repressurize as shown in (c). At the time of this re-pressing, the convex portion 2 of the female die 26a of the lower punch 26 having a width larger than the convex portion 25 is formed.
5 is inserted, and the concave portion 24a and the hook portion 14 are formed by coining with the lower punch 26.

FIG. 11D shows a state where the heat spreader 11 is molded with the resin M as an IC package, and only the surface 13 of the heat spreader 11 is exposed flush with the resin M. In this state, the hook portion 14 hits the resin M, so that the movement of the heat spreader 11 toward the front surface 13 is restricted, and the heat spreader 11 is sufficiently prevented from coming off.

Fifth Embodiment FIG. 12 FIG. 12D shows a heat spreader 11 according to a fifth embodiment. The heat spreader 11 has a plurality of convex portions 40 protruding on the back surface side. These convex portions 40 have a circular cross section and have a barrel shape having a gradually increasing diameter from the upper and lower ends toward the center in the axial direction.
It has been. In order to manufacture such a heat spreader 11, first, a material 11A having a convex portion 41 corresponding to the convex portion 40 as shown in FIG. 12A is obtained by sintering. It is set in the re-pressing die shown in (b). In this re-pressing die, upper and lower punches 51 and 52 are arranged in a die 50.
A female mold 52a having a larger diameter than the convex portion 41 and a shorter axial length is formed. The protrusion 41 is provided in the female mold 52a.
And the upper and lower punches 51 and 52 compress the material 11A. As shown in FIG. 12 (c), when the raw material 11A is re-pressed, the convex portion 41 collapses due to plastic flow and becomes a barrel shape.

The heat spreader 11 thus obtained is molded with a resin M on the side of the convex portion 40 as an IC package as shown in FIG. Again,
Only the surface 13 is exposed flush with the resin. In this state, the hook portion 14 hits the resin M, so that the movement of the heat spreader 11 toward the front surface 13 is restricted, and the heat spreader 11 is sufficiently prevented from coming off.

Embodiment 6-FIG. 13 FIG. 13 (a) shows a heat spreader 11 according to Embodiment 6, in which a concave portion 15 for incorporating an IC is formed at the center of the back surface. The edge portions 20 projecting to the rear surface side are formed at both end portions. As shown in FIG. 13B, a plurality of cutouts 21 are formed in the edge portions 20 and open to the rear surface side. Notch 21
Has a trapezoidal shape gradually narrowing from the surface 13 side toward the opening, and thereby a triangular hook portion 14 is formed on both sides of the notch 21. The hanging meat portion 14 is formed by coining when the material is repressurized. For this purpose, for example, a mere rectangular notch is formed as a counterpart to the notch 21 at the time of green compacting, and at the time of re-pressing, the meat at the open end of the notch is pressed from the opening side. , Formed by plastic flow.

FIG. 13C shows a state in which the heat spreader 11 is molded with a resin M as an IC package. Only the surface 13 of the heat spreader 11 is exposed, and the notch 21 is filled with the resin M. In this state, the hook portion 1 is attached to the resin M filled in the notch 21.
4, the movement of the heat spreader 11 toward the front surface 13 is restricted. Therefore, the heat spreader 11 is sufficiently prevented from falling out of the resin M.

The second embodiment described with reference to Examples 1 to 6 is an example embodying the present invention, and the present invention relates to a latch meat in which the heat spreader is securely prevented from falling out of the resin. The configuration is not limited to the above embodiments as long as the configuration has a portion.

[0039]

As described above, in the method for manufacturing a thin plate member having fins according to the present invention, the fins after manufacturing are formed by compressing the build-up portion and plastically flowing. As a result, a thin plate member with high heat dissipation effect can be obtained as a whole, and the prefabricated portion is compressed, so plastic flow easily occurs and fins are easily formed. (Claim 1). In addition, by forming the build-up portion that can be a fin into a trapezoidal shape, plastic flow is likely to occur and the fin can be easily formed, and the compact can be easily handled to improve workability. (Claim 2). In addition, the degree of processing of the fins after manufacture is increased, and the density of the fins is easily ensured (claims 3 and 4). further,
Since the built-up portion is formed so as to gradually increase toward the center in the direction in which the fins are arranged in parallel, the working ratio of the central portion, which tends to be rough, is increased, and the density of the central portion is sufficiently ensured. 5). Further, according to the thin plate member obtained by the method of manufacturing a resin molded thin plate member of the present invention, even if a force is applied in a direction in which the resin molded thin plate member is peeled off from the resin in a state where the thin plate member is molded with the resin, the thinning member is pulled out of the resin. Is reliably prevented, and the hooked portion is formed at the time of re-pressing in the sintering step, so that it can be formed easily without cutting or the like (claim 6).

[Brief description of the drawings]

FIG. 1 is a diagram showing a manufacturing process of a thin plate member having fins of Example 1 according to a first embodiment of the present invention,
(A) is a sectional view of a material, and (b) is a sectional view of a thin plate member having a manufactured fin.

FIG. 2 is a diagram showing a manufacturing process of a thin plate member having fins of Example 2 according to the first embodiment of the present invention,
(A) is a sectional view of a material, and (b) is a sectional view of a thin plate member having a manufactured fin.

FIG. 3 is a diagram showing a manufacturing process of a thin plate member having fins of Example 3 according to the first embodiment of the present invention,
(A) is a sectional view of a material, and (b) is a sectional view of a thin plate member having a manufactured fin.

FIG. 4 is a diagram showing a manufacturing process of a thin plate member having fins of Example 4 according to the first embodiment of the present invention,
(A) is a sectional view of a material, and (b) is a sectional view of a thin plate member having a manufactured fin.

FIG. 5 is a diagram showing a manufacturing process of a thin plate member having fins of Example 5 according to the first embodiment of the present invention,
(A) is a sectional view of a material, and (b) is a sectional view of a thin plate member having a manufactured fin.

FIG. 6 is a view showing a process of manufacturing the heat spreader of Example 6 according to the first embodiment of the present invention, in which (a) is a cross-sectional view of the material, (b) is a cross-sectional view of the manufactured heat spreader, and (c). FIG. 4 is a cross-sectional view of a state where the heat spreader is molded into a resin.

FIG. 7 is a view showing a process of manufacturing the heat spreader of Example 7 according to the first embodiment of the present invention, in which (a) is a cross-sectional view of the material, (b) is a cross-sectional view of the manufactured heat spreader, and (c). FIG. 4 is a cross-sectional view of a state where the heat spreader is molded into a resin.

FIG. 8 is an explanatory view of Example 1 according to the second embodiment of the present invention, in which (a) a cross-sectional view of a heat spreader,
(B) It is sectional drawing of the state in which the heat spreader was molded with resin.

FIG. 9 is an explanatory view of Example 2 according to the second embodiment of the present invention, in which (a) a cross-sectional view of a heat spreader,
(B) It is sectional drawing of the state in which the heat spreader was molded with resin.

FIG. 10 is an explanatory view of Example 3 according to the second embodiment of the present invention, in which (a) a cross-sectional view of a heat spreader,
(B) is a cross-sectional view of a step of repressing the heat spreader, and (c) is a cross-sectional view of a state in which the heat spreader is molded with resin.

FIG. 11 is an explanatory view of Example 4 according to the second embodiment of the present invention, in which (a) a cross-sectional view of a heat spreader,
(B) is a cross-sectional view of the material, (c) is a cross-sectional view of a state in which the material is pressed again to form a hook portion, and (d) is a cross-sectional view of a state in which the heat spreader is molded with resin.

FIG. 12 is an explanatory view of Example 5 according to the second embodiment of the present invention, in which (a) a cross-sectional view of a material, (b) a cross-sectional view of a state in which the material is set in a re-pressing die, c) a cross-sectional view of a state in which the material is repressed to form a hook portion, (d) a cross-sectional view of a heat spreader, and (e) a cross-sectional view of a state in which the heat spreader is molded with resin.

FIG. 13 is an explanatory view of Example 6 according to the second embodiment of the present invention, in which (a) a cross-sectional view of a heat spreader,
FIG. 2B is a partial perspective view of the heat spreader, and FIG. 2C is a cross-sectional view of a state where the heat spreader is molded with resin.

[Explanation of symbols]

1, 11A: material, 2: thin plate member having fins, 3: thin plate member having fins or main part of heat spreader, 3A: main part of material, 4: heat dissipation fins, 5: build-up part, 6: convex stripes ( 11) heat spreader (thin plate member), 14: hooking portion, M: resin.

Claims (6)

[Claims] 1. A method for manufacturing a thin plate member having fins, comprising: manufacturing a green compact having a thin plate-shaped main portion and a built-up portion protruding from the main portion; A thin plate member having fins, characterized in that after sintering to obtain a material that is a sintered body, the material is repressed, and at the time of repressing, the overlaid portion is compressed to form the fin. Manufacturing method. 2. The method for manufacturing a thin plate member having fins according to claim 1, wherein the build-up portion is formed in a trapezoidal shape. 3. The fin according to claim 1, wherein the build-up portion is formed in a ridge or a protrusion that conforms to the shape of the fin after manufacture and is larger than a desired dimension. The manufacturing method of the thin plate member which has. 4. The method according to claim 1, wherein the built-up portion is formed on a side opposite to a portion where the fin is formed after the manufacture. 5. The method for manufacturing a thin plate member having fins according to claim 1, wherein the build-up portion is formed so as to become gradually higher toward the center of the fins in the parallel direction. 6. A method of manufacturing a thin plate member in which a resin is molded in a state where a surface is exposed, comprising: sintering a green compact to obtain a material as a sintered body; A method of manufacturing a resin molded thin plate member, further comprising forming a hook portion for preventing the resin from coming off from the resin at the time of re-pressing.