JPH11207608A - Upper surface plate elevating and lowering mechanism in surface grinding device - Google Patents

Upper surface plate elevating and lowering mechanism in surface grinding device

Info

Publication number
JPH11207608A
JPH11207608A JP2509498A JP2509498A JPH11207608A JP H11207608 A JPH11207608 A JP H11207608A JP 2509498 A JP2509498 A JP 2509498A JP 2509498 A JP2509498 A JP 2509498A JP H11207608 A JPH11207608 A JP H11207608A
Authority
JP
Japan
Prior art keywords
platen
surface plate
support frame
load
lowering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2509498A
Other languages
Japanese (ja)
Inventor
Shiro Furusawa
澤 四 郎 古
Yoshihiro Nakajo
條 吉 広 中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Priority to JP2509498A priority Critical patent/JPH11207608A/en
Priority to EP99300410A priority patent/EP0931624A3/en
Publication of JPH11207608A publication Critical patent/JPH11207608A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • B24B37/345Feeding, loading or unloading work specially adapted to lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10Single-purpose machines or devices
    • B24B7/16Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PROBLEM TO BE SOLVED: To easily and accurately elevate/lower an upper surface plate and stop the upper surface plate at a fixed location by a small elevating/lowering mechanism, even if the gross weight is large, by normally energizing a surface plate supporting frame supporting the upper surface plate upward by air cylinders for receiving load. SOLUTION: A surface plate supporting frame 5 supports on a base member 12 which is freely rotatably mounted at one end of a machine body 1 by a bearing 11 so that the frame 5 may freely elevate/lower by an elevating/lowering mechanism 10. The elevating/lowering mechanism 10 is provided with a plurality of air cylinders 15 for receiving load which normally energize the surface plate supporting frame 5 upward and partially support a part of load of an upper surface plate assembly 3A including the surface plate supporting frame 5 and the upper surface plate. The plurality of air cylinders 15 normally support about 1/3 to 2/3 of load of the upper surface plate assembly 3A, for instance, and the remaining load is supported by a servo motor 16. As a result, the elevating/lowering mechanism 10 can be miniaturized, and the elevating/lowering and stopping at a fixed location of the upper plate assembly 3A can be easily and accurately performed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、キャリヤに保持さ
れたワークの両面を上下の定盤により研磨する平面研磨
装置において、ワークのローディング・アンローディン
グ時や研磨加工時等に上定盤を昇降させるための昇降機
構に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat surface polishing apparatus for polishing both sides of a work held by a carrier using upper and lower platens, and raising and lowering the upper platen at the time of loading / unloading and polishing of the work. The present invention relates to an elevating mechanism for causing the lifting mechanism.

【0002】[0002]

【従来の技術】ラッピングマシンやポリッシングマシン
等の平面研磨装置は、同軸状に位置してそれぞれ駆動回
転自在の太陽歯車と内歯歯車及び上下の定盤を備え、上
記太陽歯車と内歯歯車とに噛合して遊星運動するキャリ
ヤに保持させた半導体ウエハ等のワークを、上下の定盤
で両側から挟んで研磨加工するものである。
2. Description of the Related Art A planar polishing apparatus such as a lapping machine or a polishing machine includes a sun gear, an internal gear, and upper and lower stools which are rotatably driven and rotatable coaxially. A work such as a semiconductor wafer held by a carrier that is in planetary motion by meshing with a workpiece is polished by sandwiching the work from both sides between upper and lower platens.

【0003】このような平面研磨装置においては、ワー
クのローディング・アンローディング時や研磨加工時等
に上定盤を昇降させる場合、エアシリンダか又はサーボ
モータを単独で使用することによってその昇降を行うよ
うにしていた。
In such a flat surface polishing apparatus, when the upper surface plate is raised and lowered during loading / unloading of a work or polishing, etc., the lifting and lowering is performed by using an air cylinder or a servomotor alone. Was like that.

【0004】しかし、このようにエアシリンダ又はサー
ボモータを単独で使用する方法は、上定盤が数十Kg〜
数百Kgといったように比較的軽量である場合には特に
問題ないが、研磨精度の向上と共に構造が複雑化し、上
定盤とこれを支持する支持フレームや駆動機構等の関連
機構を含めた上定盤アセンブリの総重量が数トン〜10
トンにも達する近年の研磨装置においては、この上定盤
アセンブリをエアシリンダ又はサーボモータ単独で昇降
させるの非常に困難である。即ち、エアシリンダを単独
で使用する方法は、エアシリンダが大形化するだけでな
く、エアの圧縮性等のために上定盤アセンブリを定位置
に正確に停止させることが困難であり、一方、サーボモ
ータを単独で使用する方法では、上定盤アセンブリの重
量が大きいために大形で高価なサーボモータを使用しな
ければならなくなり、その制御装置を含めて昇降機構が
非常に大がかりなものになってしまう。
[0004] However, the method of using the air cylinder or the servomotor alone as described above requires an upper surface plate of several tens of kilograms.
There is no problem in the case of a relatively light weight such as several hundred kg, but the structure becomes complicated with the improvement of the polishing accuracy, and the upper platen and a supporting frame supporting the platen and related mechanisms such as a driving mechanism are included. Total weight of surface plate assembly is several tons to 10
It is very difficult for a recent polishing apparatus to reach tons to raise and lower this upper platen assembly by an air cylinder or a servomotor alone. That is, the method of using the air cylinder alone not only makes the air cylinder large, but also it is difficult to accurately stop the upper platen assembly at a fixed position due to air compressibility and the like. In the method using the servo motor alone, the large weight of the upper surface plate assembly necessitates the use of a large and expensive servo motor, and the lifting mechanism including its control device is very large. Become.

【0005】[0005]

【発明が解決しようとする課題】本発明の技術的課題
は、関連機器を含めた上定盤の総重量が大きい場合で
も、この上定盤を小形の昇降機構によって簡単且つ精度
良く昇降及び定位置停止させることが可能な上定盤昇降
機構を提供することにある。
The technical problem of the present invention is that even when the total weight of the upper stool including related equipment is large, the upper stool can be easily and accurately moved up and down by a small lifting mechanism. An object of the present invention is to provide an upper platen elevating mechanism capable of stopping a position.

【0006】[0006]

【課題を解決するための手段】上記課題を解決するた
め、本発明の昇降機構は、上定盤を支持する定盤支持フ
レームを荷重受け用のエアシリンダで常時上方に向けて
付勢することにより、該エアシリンダで上定盤と定盤支
持フレームとを含む上定盤アセンブリの荷重の一部を部
分的に支持させ、その状態で該上定盤アセンブリをサー
ボモータにより昇降させるように構成したことを特徴と
するものである。
In order to solve the above-mentioned problems, a lifting mechanism according to the present invention is characterized in that a platen supporting frame for supporting an upper platen is constantly urged upward by a load receiving air cylinder. Thus, a part of the load of the upper stool assembly including the upper stool and the stool support frame is partially supported by the air cylinder, and the upper stool assembly is moved up and down by a servomotor in that state. It is characterized by having done.

【0007】この構成により本発明においては、小形の
エアシリンダとサーボモータを使用することが可能とな
って昇降機構を小形化することができ、しかも、小形の
サーボモータによって上定盤アセンブリの昇降と定位置
停止とを簡単且つ精度良く行うことができる。
According to the present invention, a small air cylinder and a servomotor can be used in the present invention, so that the lifting mechanism can be downsized. In addition, the small servomotor can be used to raise and lower the upper platen assembly. And the fixed position stop can be performed easily and accurately.

【0008】本発明の好ましい1つの実施態様によれ
ば、上記荷重受け用のエアシリンダが複数設けられてい
て、それらの配列中心に上記サーボモータの駆動軸が配
設されている。
According to a preferred embodiment of the present invention, a plurality of the load receiving air cylinders are provided, and a drive shaft of the servo motor is provided at the center of the arrangement.

【0009】本発明の具体的な実施態様によれば、上記
定盤支持フレームが、機体に設けたベース部材上にガイ
ド機構を介して片持ち梁状で昇降自在なるように支持さ
れると共に、これらのベース部材と定盤支持フレームと
の間に上記荷重受け用のエアシリンダが設置されてい
る。
According to a specific embodiment of the present invention, the platen support frame is supported on a base member provided on the fuselage in a cantilever manner via a guide mechanism so as to be vertically movable. The air cylinder for receiving the load is provided between the base member and the platen support frame.

【0010】本発明のより具体的な実施態様によれば、
上記ベース部材が機体に対して回転自在となっていて、
該ベース部材を介して上記定盤支持フレームがワークの
研磨位置とアンローディング位置との間で旋回自在に構
成されている。
According to a more specific embodiment of the present invention,
The base member is rotatable with respect to the fuselage,
The platen support frame is configured to be pivotable between a polishing position and an unloading position of the work via the base member.

【0011】[0011]

【発明の実施の形態】図1は本発明の上定盤昇降機構を
適用した平面研磨装置の一例を示すもので、1は機体、
2は該機体1上に回転自在に配設されて図示しない駆動
源に連結された下定盤、3は該下定盤2の上方に同軸状
に位置する上定盤であって、該上定盤3は、機体1に基
端部を片持ち梁状に支持されて水平に延びる定盤支持フ
レーム5の先端に回転自在に取り付けられ、上定盤駆動
用のサーボモータ6により、該定盤支持フレーム5の内
部に設けられた伝動機構を介して駆動されるようになっ
ている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an example of a planar polishing apparatus to which an upper platen lifting mechanism according to the present invention is applied.
Reference numeral 2 denotes a lower platen rotatably disposed on the body 1 and connected to a drive source (not shown). Reference numeral 3 denotes an upper platen coaxially located above the lower platen 2. The base plate 3 is rotatably mounted on the tip of a platen support frame 5 which has a base end supported in a cantilever shape and extends horizontally, and is supported by a servomotor 6 for driving the upper platen. It is driven via a transmission mechanism provided inside the frame 5.

【0012】また、上記下定盤2の中央部と外周部とに
はそれぞれ太陽歯車7と内歯歯車8とが同軸状に配設さ
れると共に、これらの太陽歯車7及び内歯歯車8に噛合
して太陽歯車7の回りを遊星運動する複数のキャリヤ9
が配設され、各キャリヤ9に保持された半導体ウエハや
磁気ディスク基板等のワーク4を上下の定盤により両側
から挟んで研磨するように構成されている。
A sun gear 7 and an internal gear 8 are coaxially disposed at the center and the outer periphery of the lower platen 2, respectively, and mesh with the sun gear 7 and the internal gear 8. Carriers 9 that make planetary motion around sun gear 7
Are arranged, and the work 4 such as a semiconductor wafer or a magnetic disk substrate held by each carrier 9 is polished by being sandwiched between upper and lower platens from both sides.

【0013】上記定盤支持フレーム5は、図2からも分
かるように、機体1の一端にベアリング11で回転自在
に取り付けられたベース部材12上に、昇降機構10に
より昇降自在なるように支持されている。
As can be seen from FIG. 2, the base plate supporting frame 5 is supported by a lifting mechanism 10 on a base member 12 rotatably mounted on one end of the body 1 with a bearing 11 so as to be movable up and down. ing.

【0014】上記昇降機構10は、上記定盤支持フレー
ム5の昇降を案内するガイド機構14と、該定盤支持フ
レーム5を常時上方に向けて付勢することにより、該定
盤支持フレーム5と上定盤3とを含む上定盤アセンブリ
3Aの荷重の一部を部分的に支える荷重受け用の複数の
エアシリンダ15と、該エアシリンダ15で荷重の一部
を支えられた上記定盤支持フレーム5を昇降及び定位置
停止させるための昇降用サーボモータ16とを含んでい
る。
The elevating mechanism 10 includes a guide mechanism 14 for guiding the elevating and lowering of the platen support frame 5 and a platen supporting frame 5 by constantly urging the platen supporting frame 5 upward. A plurality of load receiving air cylinders 15 partially supporting a part of the load of the upper platen assembly 3A including the upper platen 3, and the platen support supported by the air cylinders 15 partially. A lifting / lowering servomotor 16 for lifting / lowering the frame 5 and stopping at a fixed position.

【0015】上記ガイド機構14は、ベース部材12上
に立設する第1軸18の外周に軸線方向に形成されたリ
ニアガイド19と、定盤支持フレーム5の下面に固定さ
れて上記第1軸18と嵌合し合う第2軸20の内面に形
成された、上記リニアガイド19に嵌合するスライド部
材21とで構成されている。しかし、ガイド機構14の
構成はこのようなものに限定されず、定盤支持フレーム
5を上下方向に直線的に案内し得るものであれば、その
他の構成であっても良い。
The guide mechanism 14 includes a linear guide 19 formed on an outer periphery of a first shaft 18 erected on the base member 12 in the axial direction, and a first shaft fixed to the lower surface of the platen support frame 5. And a slide member 21 formed on the inner surface of the second shaft 20 to be fitted to the linear guide 19. However, the configuration of the guide mechanism 14 is not limited to such a configuration, and any other configuration may be used as long as it can linearly guide the platen support frame 5 in the vertical direction.

【0016】また、上記エアシリンダ15は、上記第1
軸18の内底部に正3角形の各頂点に位置するように3
つ設けられ、そのロッド15aが第2軸20と一体のフ
レーム部材20aに連結されており、一方、上記昇降用
サーボモータ16は、上記3つのエアシリンダ15の配
列中心上に位置するように機体1に取り付けられ、その
出力軸16aが上記フレーム部材20aに連結されてい
る。
The air cylinder 15 is provided with the first cylinder.
At the inner bottom of the shaft 18, three
And the rod 15a is connected to a frame member 20a integral with the second shaft 20. On the other hand, the servomotor 16 for raising and lowering the airframe is positioned on the center of the arrangement of the three air cylinders 15. 1 and its output shaft 16a is connected to the frame member 20a.

【0017】上記3つのエアシリンダ15は、例えば上
定盤アセンブリ3Aの荷重(6〜10トン程度)の約1
/2〜2/3程度を常時支持するように制御され、残り
の荷重をサーボモータ16が支持する。これにより、エ
アシリンダ又はサーボモータをそれぞれ単独で使用する
場合よりは小形のエアシリンダ15及びサーボモータ1
6を使用することが可能となり、昇降機構10を小形化
することができるばかりでなく、小形のサーボモータ1
6とその制御機構とを使用して上定盤アセンブリ3Aの
昇降と定位置での停止とを、簡単且つ精度良く行うこと
ができる。
The three air cylinders 15 are, for example, about one load (about 6 to 10 tons) of the upper platen assembly 3A.
The servomotor 16 is controlled to always support about / 2 to 2/3, and the servomotor 16 supports the remaining load. This makes it possible to reduce the size of the air cylinder 15 and the servo motor 1 compared to when the air cylinder or the servo motor is used alone.
6 can be used, and not only can the lifting mechanism 10 be miniaturized, but also the small servomotor 1 can be used.
6 and its control mechanism, it is possible to easily and accurately move the upper platen assembly 3A up and down and stop at a fixed position.

【0018】また、上記定盤支持フレーム5は、上記ベ
ース部材12と、機体1に取り付けられた旋回用のサー
ボモータ23と、該サーボモータ23の出力軸に取り付
けられた歯車24と、ベース部材12の外周の一部に部
分的に形成されたギヤ部12aとからなる旋回機構22
を介して、図3に示すように、研磨位置Aとワーク4の
アンローディング位置Bとの間を旋回させ得るようにな
っている。
The base plate supporting frame 5 includes the base member 12, a servomotor 23 for turning mounted on the body 1, a gear 24 mounted on an output shaft of the servomotor 23, and a base member. Turning mechanism 22 including a gear portion 12a partially formed on a part of the outer periphery of
As shown in FIG. 3, the workpiece 4 can be turned between the polishing position A and the unloading position B of the work 4.

【0019】上記上定盤3は、作業面の各ワーク4との
対応位置に吸着孔を有し、研磨が終了したワーク4をバ
キュームチャックして持ち上げられるようになってお
り、ワーク4を吸着した状態で上記アンローディング位
置Bに旋回したあと、この位置でアンローデング手段2
6によりワーク4を順次取り出されるように構成されて
いる。
The upper surface plate 3 has a suction hole at a position corresponding to each work 4 on the work surface, so that the work 4 after polishing is vacuum chucked and can be lifted. After turning to the unloading position B in this state, the unloading means 2
6, the workpieces 4 are sequentially taken out.

【0020】また、上記研磨装置は、未加工ワーク4を
搬入するためのローディング手段27を有し、上定盤3
が上記アンローディング位置Bに旋回して加工済ワーク
が取り出されている間に、未加工ワークを下定盤2上の
各キャリヤ9に供給できるようになっている。
Further, the polishing apparatus has loading means 27 for carrying in the unprocessed work 4,
Can be supplied to the respective carriers 9 on the lower platen 2 while the workpiece is taken out by turning to the unloading position B.

【0021】なお、上記バキュームチャック手段やロー
デング手段27あるいはアンローデング手段26につい
ては、公知のものを使用することができるので、ここで
はそれらの構成について特に言及はしない。
As the vacuum chuck means, loading means 27 or unloading means 26, known ones can be used, and their constructions are not specifically mentioned here.

【0022】上記構成を有する平面研磨装置において、
上定盤3が上昇した状態で下定盤2上の各キャリヤ9に
供給されたワーク4は、上記上定盤3の下降により上下
の定盤2,3間に両側から挟持され、回転するこれらの
定盤2,3によりその両面が研磨加工される。このとき
各キャリヤ9は、太陽歯車7及び内歯歯車8に駆動され
て太陽歯車7の回りを遊星運動する。また、上定盤3を
加工位置まで下降させる動作は、昇降機構10における
昇降用サーボモータ16により定盤支持フレーム5を介
して行われ、加工中における加工圧の付加は、定盤支持
フレーム5に設けた別の加圧用シリンダ(図示せず)に
より行われる。
In the planar polishing apparatus having the above configuration,
The work 4 supplied to each carrier 9 on the lower stool 2 with the upper stool 3 raised is sandwiched between the upper and lower stools 2 and 3 by the lowering of the upper stool 3 and rotated. Both surfaces are polished by the platens 2 and 3. At this time, each carrier 9 is driven by the sun gear 7 and the internal gear 8 to perform planetary motion around the sun gear 7. The operation of lowering the upper platen 3 to the processing position is performed by the lifting servomotor 16 in the lifting mechanism 10 via the platen support frame 5. This is performed by another pressurizing cylinder (not shown) provided in the above.

【0023】上記ワーク4の研磨が終了して上下の定盤
2,3が決められた回転位置に停止すると、上定盤3が
加工済ワーク4を吸着したまま昇降用サーボモータ16
によりガイド機構14に案内されて所定の高さまで上昇
すると共に、旋回機構8によりアンローディング位置B
に旋回し、この位置でアンローデング手段26により加
工済ワーク4が取り出される。このとき、下定盤2上の
各キャリヤ9には、ローデング手段27によって未加工
ワークが供給される。
When the polishing of the work 4 is completed and the upper and lower stools 2 and 3 are stopped at the predetermined rotation positions, the upper and lower stools 3 hold the processed work 4 and the lifting servo motor 16
Is guided by the guide mechanism 14 to ascend to a predetermined height, and the turning mechanism 8 causes the unloading position B
And the unloaded means 26 takes out the processed work 4 at this position. At this time, the unprocessed work is supplied to each carrier 9 on the lower platen 2 by the loading means 27.

【0024】加工済ワークの取り出しと未加工ワークの
供給とが終了すると、上定盤3は下定盤2の真上の位置
に旋回したあと、昇降用サーボモータ16により下降
し、再びワーク4の研磨が行われる。
When the removal of the processed work and the supply of the unprocessed work are completed, the upper surface plate 3 is turned to a position immediately above the lower surface plate 2 and then lowered by the servomotor 16 for lifting and lowering the work 4 again. Polishing is performed.

【0025】上記上定盤3の昇降は、昇降機構10にお
ける荷重受け用のエアシリンダ15で上定盤アセンブリ
3Aの荷重の一部を部分的に支持させ、負荷荷重を減少
させた状態でサーボモータ16により行われるため、上
定盤アセンブリ3Aが数トン〜10トンといったように
非常に大重量であっても、小形のサーボモータ16とそ
の制御機構とを使用して、該上定盤3を簡単に昇降させ
ることができると同時に、それを決められた位置に確実
且つ正確に停止させることができる。
The upper platen 3 is lifted and lowered by partially supporting a part of the load of the upper platen assembly 3A by the load receiving air cylinder 15 of the lifting mechanism 10, and the servo is performed in a state where the load is reduced. Since the upper platen assembly 3A is very heavy, such as several tons to ten tons, it is driven by the motor 16 and the upper platen 3 is controlled by using a small servomotor 16 and its control mechanism. Can be easily raised and lowered, and at the same time, it can be reliably and accurately stopped at a predetermined position.

【0026】[0026]

【発明の効果】このように本発明の昇降機構によれば、
上定盤の総重量が大きい場合でも、この上定盤を小形の
昇降機構によって簡単且つ精度良く昇降及び定位置停止
させることができる。
As described above, according to the lifting mechanism of the present invention,
Even when the total weight of the upper stool is large, the upper stool can be easily moved up and down and stopped at a fixed position by a small lifting mechanism.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る昇降機構を用いた研磨装置の一実
施例を示す側面図である。
FIG. 1 is a side view showing one embodiment of a polishing apparatus using a lifting mechanism according to the present invention.

【図2】図2の要部拡大断面図である。FIG. 2 is an enlarged sectional view of a main part of FIG.

【図3】図1の要部平面図である。FIG. 3 is a plan view of a main part of FIG. 1;

【符号の説明】[Explanation of symbols]

1 機体 2 下定盤 3 上定盤 3A 上定盤ア
センブリ 4 ワーク 5 定盤支持フ
レーム 9 キャリヤ 10 昇降機構 12 ベース部材 14 ガイド機構 15 エアシリンダ 16 昇降用サー
ボモータ 16a 出力軸 22 旋回機構
DESCRIPTION OF SYMBOLS 1 Airframe 2 Lower surface plate 3 Upper surface plate 3A Upper surface plate assembly 4 Work 5 Surface plate support frame 9 Carrier 10 Lifting mechanism 12 Base member 14 Guide mechanism 15 Air cylinder 16 Lifting servomotor 16a Output shaft 22 Rotating mechanism

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】キャリヤに保持されたワークの両面を上下
の定盤により研磨する平面研磨装置における、上定盤を
昇降及び定位置停止させるための昇降機構であって、 上記上定盤を支持する定盤支持フレームの昇降を案内す
るガイド機構と、 上記定盤支持フレームを常時上方に向けて付勢すること
により、該定盤支持フレームと上定盤とを含む上定盤ア
センブリの荷重の一部を部分的に支える荷重受け用のエ
アシリンダと、 上記エアシリンダで荷重の一部を支えられた状態の上記
上定盤アセンブリを昇降させる昇降用サーボモータと、
を有することを特徴とする平面研磨装置における上定盤
昇降機構。
An elevation mechanism for raising and lowering an upper surface plate and stopping at a fixed position in a plane polishing apparatus for polishing both surfaces of a work held by a carrier with upper and lower surface plates, wherein the upper surface plate is supported. A guide mechanism for guiding the lifting and lowering of the platen support frame, and by constantly urging the platen support frame upward to reduce the load of the upper platen assembly including the platen support frame and the upper platen. A load receiving air cylinder that partially supports the part, a lifting servomotor that lifts and lowers the upper platen assembly in a state where a part of the load is supported by the air cylinder,
An upper platen lifting / lowering mechanism in a planar polishing apparatus, comprising:
【請求項2】請求項1に記載の上定盤昇降機構におい
て、上記荷重受け用のエアシリンダを3角形の各頂点に
位置するように3つ設け、それらの配列中心に上記サー
ボモータの出力軸を配設したことを特徴とするもの。
2. The upper platen elevating mechanism according to claim 1, wherein three of said load receiving air cylinders are provided at respective vertices of a triangle, and the output of said servomotor is provided at the center of their arrangement. It is characterized by having a shaft.
【請求項3】請求項1又は2に記載の上定盤昇降機構に
おいて、上記定盤支持フレームが、機体に設けたベース
部材上に片持ち梁状に支持されると共に、該定盤支持フ
レームの先端部に上定盤が取り付けられ、該定盤支持フ
レームとベース部材との間に上記ガイド機構と荷重受け
用のエアシリンダとが設けられていることを特徴とする
もの。
3. The upper platen lifting mechanism according to claim 1, wherein the platen support frame is supported in a cantilever shape on a base member provided on an airframe, and the platen support frame. An upper platen is attached to a tip of the base plate, and the guide mechanism and an air cylinder for receiving a load are provided between the platen support frame and the base member.
【請求項4】請求項3に記載の上定盤昇降機構におい
て、上記ベース部材が機体に対して回転自在であると共
に、該ベース部材を回転させるための駆動手段が設けら
れることにより、上記定盤支持フレームがワークの加工
位置とアンローディング位置との間で旋回自在であるこ
とを特徴とするもの。
4. The upper platen elevating mechanism according to claim 3, wherein the base member is rotatable with respect to the body, and a driving means for rotating the base member is provided. The board support frame is pivotable between a workpiece processing position and an unloading position.
JP2509498A 1998-01-22 1998-01-22 Upper surface plate elevating and lowering mechanism in surface grinding device Pending JPH11207608A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2509498A JPH11207608A (en) 1998-01-22 1998-01-22 Upper surface plate elevating and lowering mechanism in surface grinding device
EP99300410A EP0931624A3 (en) 1998-01-22 1999-01-20 Surface polishing apparatus with upper surface plate elevating mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2509498A JPH11207608A (en) 1998-01-22 1998-01-22 Upper surface plate elevating and lowering mechanism in surface grinding device

Publications (1)

Publication Number Publication Date
JPH11207608A true JPH11207608A (en) 1999-08-03

Family

ID=12156351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2509498A Pending JPH11207608A (en) 1998-01-22 1998-01-22 Upper surface plate elevating and lowering mechanism in surface grinding device

Country Status (2)

Country Link
EP (1) EP0931624A3 (en)
JP (1) JPH11207608A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101572103B1 (en) * 2014-09-11 2015-12-04 주식회사 엘지실트론 An apparatus for polishing a wafer
CN106406032B (en) * 2015-07-29 2018-03-30 上海微电子装备(集团)股份有限公司 A kind of six degree of freedom adjusting apparatus of heavily loaded Substrate table
CN111037385A (en) * 2019-12-26 2020-04-21 涡阳县幸福门业有限公司 Timber sand light soot blower
CN114888717A (en) * 2022-04-17 2022-08-12 北京特思迪设备制造有限公司 Lifting support device for outer ring of grinding machine

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2603041A (en) * 1945-09-27 1952-07-15 Alfred J Bowen Surface grinder
CH684321A5 (en) * 1988-04-07 1994-08-31 Arthur Werner Staehli Device on a double disk.
US5036625A (en) * 1988-12-07 1991-08-06 Anatoly Gosis Lapping plate for a lapping and polishing machine

Also Published As

Publication number Publication date
EP0931624A3 (en) 2000-11-08
EP0931624A2 (en) 1999-07-28

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